CN1384979A - Method for production of chip-card type portable storage medium - Google Patents

Method for production of chip-card type portable storage medium Download PDF

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Publication number
CN1384979A
CN1384979A CN00803573A CN00803573A CN1384979A CN 1384979 A CN1384979 A CN 1384979A CN 00803573 A CN00803573 A CN 00803573A CN 00803573 A CN00803573 A CN 00803573A CN 1384979 A CN1384979 A CN 1384979A
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CN
China
Prior art keywords
chip
storage medium
join domain
cavity
integrated circuit
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Pending
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CN00803573A
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Chinese (zh)
Inventor
P·帕特里斯
O·布鲁尼特
D·埃尔巴兹
B·卡尔瓦斯
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Gemplus SA
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Gemplus SA
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Publication of CN1384979A publication Critical patent/CN1384979A/en
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    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07743—External electrical contacts
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Abstract

The invention relates to a method for the production of chip-card type portable storage media comprising flush contact pads on a substrate in addition to an integrated circuit chip accommodated in a cavity formed in said media and provided with contact studs that are electrically connected to the flush contact pads. The inventive method includes a stage in which the contact pads are produced and another stage in which the substrate elements are installed and the integrated circuit chip is placed into the cavity. According to the invention, during the stage in which the contact pads are produced, conductive material is imprinted on the first surface of an adhesive dielectric film (100). In the installation stage, the second surface of the adhesive dielectric film is fixed in said cavity. The invention can be used in the production of chip card modules and chip cards.

Description

Be used to produce the method for chip-card type portable storage medium
The present invention relates to be used to make method with the type portable storage medium that flushes contact.The present invention can be applied to the medium of smart card type.
Current, smart card is used to carry out various operations more and more, for example banking operation, phone and traffic operation or various identifying operation.
The contact smart card has and the metalized portion of the flush of block, and this is that universal standard ISO7816 stipulates.
These metalized portion are intended to be used for realize contacting so that the mode of electricity consumption transmits data with the read head of reader.
According to current production method, smart card is a kind of thin portable object, and its size is a standard.Common standard ISO 7810 is long corresponding to 85mm, the card of the wide and reference format that 0.76mm is thick of 54mmm.
Have the some kinds of methods of making smart card.Wherein main method is wherein used the conventional method assembling based on assemble integrated circuit (IC) chip in being called as the subassembly of micromodule.
Conventional method shown in Figure 1 comprises integrated circuit (IC) chip 20 is set, and makes its active surface with contact pad 22 up, bonding then integrated circuit (IC) chip 20, and relative one side is bonded on the insulation support plate 28.Insulation board 28 itself is set on the contact grid of being made by nickel plating or gold-plated copper metallic plate 24.In insulation board 28, form connecting line well 21, and utilize line 26 that the contact pad 22 of chip 20 and the contact area of metal grate 24 are linked to each other by means of described connection well 21.At last, last, based on the potting resin 30 protection chip 20 and the soldered wires 26 of epoxy resin.Then, cut formed module, and be inserted in the cavity of ready-made card body.
The shortcoming of this method is the expense height.This is because copper, nickel and gold metallization have increased the cost of card greatly.In addition, manufacturing step is too many.
This is because of a large amount of manufacturing step of this Technology Need, and this also makes manufacturing cost increase.
Therefore, one object of the present invention is to provide a kind of type portable storage medium that can mass-produced smart card type with low cost.
The objective of the invention is on big as far as possible degree, reduce the manufacturing cost of smart card, and can produce in a large number.
For this purpose, the present invention proposes not use conventional insulation to support, and replaces insulation to support with the sticky stuff that insulate, and described insulation sticky stuff is used as the fixture that supports simultaneously when the join domain that integrated circuit (IC) chip is inserted on the support membrane.
Therefore, the object of the present invention is to provide a kind of manufacture method of type portable storage medium of the smart card type with join domain that flushes of by substrate supports, integrated circuit (IC) chip is set in the cavity that forms in the support, the connection pads that it has and the join domain that flushes is electrically connected, described method comprise the step of producing described join domain and described substrate element and integrated circuit (IC) chip are assemblied in step in the cavity; It is characterized in that;
-the step that forms join domain realizes by means of printing conductive material on first of stickiness dielectric film, and
-installation step is undertaken by second face of stickiness dielectric film is fixed in the described cavity.
According to another feature of the present invention, printing material is a kind of conductive ink.
The step of assembling in cavity comprises at first thereby adhesive film is formed the step of the stickiness substrate that is supporting join domain and as adhesive glue the stickiness substrate is bonded in step on the edge of cavity with second of described stickiness substrate around the printing figures cutting.
Adhesive film has by the second surface of also protecting as the band that supports, so that make it possible to print continuously the figure that constitutes join domain on described film.
Described adhesive film is activable.
Film with sticky stuff can thermal activation, and comprises improved PES (polyethylene) class, improved PU (polyurethane) class, or improved PP (polypropylene) class, perhaps copolyamide or phenolic plastics.
Described film with sticky stuff has the thermosetting state.
Support belt is a kind of by based on the cellulose or the plastics, particularly paper of no stickiness with scribble the band that the material of the PET of silicon is made.
The boundary belt of film is by cut, makes to reserve the zone that is used for chip, and be used for being electrically connected and be used for keeping a rigid frame around join domain when band is removed that described framework was removed before being assemblied in the cavity to element.
Described method comprises connection pads is connected to step on the join domain of figure of the printing on the adhesive film.
According to an embodiment, when integrated circuit (IC) chip is placed on second the same side with film, realize by the thickness of adhesive film in the connection pads and the electrical connection between the join domain of chip.
On the connection pads of chip, be formed with conductive bumps.
Connection pads and the electrical connection between the join domain in integrated circuit (IC) chip can get up to realize by means of the conductive stud in the thickness that is set at adhesive film.
The setting of described conductive bumps in the thickness of dielectric film realizes by means of integrated circuit (IC) chip is exerted pressure.
The setting of described conductive bumps in the thickness of dielectric film also helps to carry out by the heating adhesive film.
According to another embodiment, integrated circuit (IC) chip is made its connection pads above the join domain of printing by so directed, thus be implemented in chip connection pads and; Electrical connection between the join domain.
According to a kind of remodeling, described method is included in and forms perforate in the adhesive film thickness relative with join domain so that expose the step of join domain.
In this case, utilize electroconductive resin to realize in the connection pads and the electrical connection between the join domain of chip, described electroconductive resin is applied in the connection pads on described chip in the described perforate.
According to an embodiment, before being included in and connecting, described method on adhesive film, carries the step of integrated circuit (IC) chip, so that form micromodule.
The step of the different printing figures on the cutting film was carried out before or after being transported to integrated circuit (IC) chip on the substrate.
The described step that the stickiness substrate of integrated circuit (IC) chip and printing is assembled in the open-ended cavity that forms in support comprises:
By carry out hot pressing on substrate micromodule is transported in the cavity, so that the bottom surface of substrate is bonded on the wall of cavity, join domain is placed in the outside of cavity, and integrated circuit (IC) chip is placed in the inboard of cavity.
According to another embodiment, integrated circuit (IC) chip is at first placed the bottom of cavity fully, makes the opening of its active one side towards cavity, then,
-stickiness substrate is carried like this, make the join domain of printing face toward the connection pads of integrated circuit (IC) chip, described conveying comprises hot molding, so that can realize the electrical connection between the connection pads of join domain and chip simultaneously and the bottom surface of adhesive film is fixed on the cavity wall.
Integrated circuit (IC) chip also can be sealed in the protection resin with being electrically connected of join domain.
Another object of the present invention is to provide a kind of portable supporting module of smart card type, and it has first join domain that is carrying by substrate film, and wherein substrate is a kind of emplastic, and wherein said join domain is a kind of printed conductive material.
Described portable supporting module also has second the integrated circuit (IC) chip that is fixed to described substrate film.
Another object of the present invention is, a kind of type portable storage medium that comprises the smart card type of described module is provided.
Other purpose of the present invention and advantage will be read following nonrestrictive explanation in conjunction with the drawings and be learnt, wherein:
Fig. 1 is the sectional view of method of the manufacturing smart card of the expression routine that illustrated;
Fig. 2,3A, 3B represent to represent the manufacturing of continuous micromodule according to the figure band of method production of the present invention that described figure band is represented with the form of sectional view, top view and bottom view;
Fig. 4 is the Fig. 2 according to first embodiment production of the Connection Step of manufacture method of the present invention, 3A, the sectional view of the micromodule of the figure band shown in the 3B;
Fig. 5 is the sectional view according to the another kind of micromodule of second embodiment production;
Fig. 6 A-6C represents the substrate of the another kind of micromodule that the 3rd method of attachment of the present invention is produced, and described substrate is represented with sectional view, bottom view and bottom view respectively;
Fig. 7 is the sectional view of micromodule of executing the substrate of Fig. 6 A-6C that example produces according to the 3rd of the Connection Step of manufacture method of the present invention;
Fig. 8 is the sectional view of smart card that comprises the micromodule of Fig. 4;
Fig. 9 is the sectional view that comprises according to the smart card of the substrate of Fig. 4;
Figure 10 is the sectional view of smart card that comprises the micromodule of Fig. 5;
Figure 11 is the sectional view that comprises the smart card of Fig. 7 micromodule;
The method that Fig. 2,3A, 3B schematically represent to be intended to produce continuously micromodule with the form of sectional view, top view and the bottom view of figure band respectively.Described band comprises insulating material 100, and described insulating material is being supported by protective material 110, and is described protective layer used in driving continuously to its reinforcing and to it.
In fact, insulating material 100 is quite meticulous and soft, therefore must be by the stronger materials for support of rigidity, so that can be driven continuously.Described insulating material 100 is used to form the support of micromodule.Its details illustrates below.
It is wide that protective material 110 cans be compared to insulating material 100 most, and have hole 111, evenly distributes along its long limit, in its one or both sides.These holes 111 are used for the system drive figure band that has gear by a kind of, are with conveying (AST) automatically.Use the design of AST to determine that the size of the substrate of micromodule makes it possible to have little spacing, for example, the distance between two figures 150 can be 9.5mm.
Can also use the rolling conveying system to carry the figure band; wherein utilize the indicating device figure to replace the hole; described indicating device figure is printed on the protective material 110 when being imprinted on figure 150 on the insulating material 100, and its effect is to make it possible to utilize the Optical devices location.
According to a feature of the present invention, the step of producing micromodule comprises, at first on described being with, more particularly, on the end face that does not have protective material 110 coverings of insulating material 100, utilizes the conductive ink printing to form figure 150.Described each figure 150 comprises the join domain 151 that is used to connect termination portion.These join domain 151 close enoughs make it possible to fully realize being electrically connected with the relevant connection pads of integrated circuit (IC) chip.Its thickness is generally about 10mm.
The printing that is used to form the conductive ink of join domain 151 can realize according to different known technologies.Thereby, can utilize pad printing, skew printing, ink jet printing, silk screen printing or use the technology such as sprinkling printing of mask.
Different printing technologies makes it possible to utilize different types of conductive ink.Thereby conductive ink can comprise dissolving China ink, and it contains the fluoropolymer resin that utilizes the solvent solubilising with conductive filler, and its evaporation by solvent obtains.Described printing ink can also be the heat-set ink of one or both compositions, and the printing ink of polymerization under UV irradiation is used for the mixture or the metal alloy of the cream of brazing.
Therefore, described figure band makes it possible to make micromodule by the figure 150 that repeats on tape to print continuously with being transported to the integrated circuit (IC) chip that goes up and be connected with each figure.
It seems that from the viewpoint that the remainder that makes printing figures 150 and band separates the figure 150 of each printing can be cut in the front and back that chip is carried.Thereby the acquisition dielectric substrate is formed for the support of the previous termination portion of printing that comprises join domain 151.
In fact, just insulating material 100 forms the main support of integrated circuit (IC) chip.
Described insulating material 100 also has stickiness.This binding material for example can recover stickiness at a certain temperature.Also can for example exert pressure, make it recover stickiness with other method.
The end face of the binding material 100 of insulation is supporting the join domain of printing 151, is intended to flush with the surface engagement of smart card, and its bottom surface has stickiness when stickiness is recovered, make it possible to micromodule is fixed on the body of card.
During printing join domain 151, perhaps by during the conveying system drive pattern band, there is the bottom surface of stickiness also to be protected the protection of material 110, it is too fast to prevent that it from activating in manufacture process.
Sticky stuff 100 for example is improved PES (polyethylene) class, improved PU (polyurethane) class, or improved PP (polypropylene) class, perhaps copolyamide or phenolic plastics.Preferably do not have stickiness at ambient temperature, thereby make it possible to and conventional the same processing of plastic plate.The thermoplastic material that also can comprise some.
In another example, the sticky stuff 100 of use is a kind of thermoplastic reaction glue of non-self-adhesion, is provided by Beiersdorf company, and label is TESA 8420.It mainly contains phenolic resins and nitrile rubber.Can only have thermoplastic property, and be the thermoplastic state according to temperature.Preferably the material of thermal activation has irreversible state (or reactiveness) again after activation.
The thickness of hot sticky film 100 is quite thin, thereby it does not have enough rigidity, does not support just can not be driven.Described thickness be preferably in 30 and 60mm between.
Protective material 110 can comprise paper, cardboard or PET plastics, and coated a spot of silicon.It has enough rigidity makes the figure band to be driven.
But, for the bottom surface of the sticky stuff 100 of handling insulation, mainly be to carry integrated circuit (IC) chip to join domain by the thickness of film 100 thereon, need to remove part or all of protective material 110.
In fact, remove protective material 110 the pick of, mainly remove the part that is positioned at zone 113, it is preserved for carrying and being connected integrated circuit (IC) chip.This is the reason of described material along line 112 line; for being used for chip, carries reserve area 113; and have certain rigid for the framework 114 that keeps rigidity makes the figure band, and, stop it to activate prematurely in order to protect the sticky stuff of thermal activation simultaneously.
In a step that comprises the described method that forms micromodule, integrated circuit (IC) chip is transferred just its connection pads is connected on the join domain 151 of previous printing.
Integrated circuit (IC) chip can be transferred according to different fixed forms.
First method, as shown in Figure 4, the stickiness that is included in thermal activation supports 100 bottom surface and carries chip 20, makes the active surface with connection pads 210 of chip 20 towards the bottom surface of supporting.
In this case, before integrated circuit (IC) chip 200 is transferred, on its connection pads 200, form conductive bumps 220.These projectioies 220 preferably are embedded in the thickness of stickiness substrate 100 of thermal activation, thereby make and realize being electrically connected between the connection pads of chip 200 and relative join domain 151.
Conductive bumps 220 preferably is formed the geometry at the slightly pointed edge of tool, for example form conical so that sticky stuff 100 more easily by thermal activation.The meticulous softness of this sticky stuff has the characteristic of easy perforation.
Projection 220 for example is formed by depositing metal, perhaps by screen printed conductive ink, perhaps forms by the coating that generates non-oxidizable electrolysis class.In this case, projection 220 thickness determined like this, makes it be equal to or slightly less than the thickness sum of substrate of the sticky stuff 100 of the thickness of join domain 151 of printing and thermal activation.Therefore, its thickness be preferably in 40 and 50mm between.
In order to help projection 220 to pass the thickness of substrate, the element that be transferred is applied a little pressure.Then, can utilize hot pressing to the substrate localized heating, mainly by the chip in the zone that is preserved for carrying in the chip, thereby make the sticky stuff activation in this zone, not only help to make projection to pass the thickness of substrate, also help chip 200 to be fixed on the substrate 100 by adhesion.
By means of this chip carrying method, can be with a kind of or realize the electrical connection of chip and fixing with identical operations.In addition, in support 200, insert projection 220 and guarantee to keep reliably chip.
A kind of remodeling of this first carrying method as shown in Figure 5.This remodeling is included on the end face of the substrate 100 that is supporting the previous join domain of printing 151 the fixing means conveying chip 230 according to " upset " cake core.
In this case, the projection 232 that forms on the connection pads of chip 230 has the thickness that is equal to or slightly less than join domain 151.
In order to make projection pass join domain easily, the conveying of chip is preferably undertaken by hot pressing.Make the conductive ink that constitutes join domain 151 softening by heating.
When hot press operation finishes, the assembly of the interconnection of acquisition is cooled off at ambient temperature, thereby make conductive ink recover solid-state and original shape.In this case, preferably with protection resin 235 protection chips 20 and electrical connection.
Chip also can be transferred on the print conductive inks that just forms, and the online drying of carrying out.
Be used to carry another kind of method such as Fig. 6 A-6C and shown in Figure 7 of chip.In this case, before the conveying chip, in the thickness of the adhesive film 100 that insulate, face toward the previous join domain of printing 151 formation apertures 130, so that join domain is exposed.
This operation comprises by draw carving, or by laser engraving or remove sticky stuff by any other method and form perforate 130, preferably do not destroy join domain 151.
The back of chip 250 is being transferred facing on the one side that stickiness is arranged of join domain.
At a kind of diverse ways that is used for carrying chip that has just illustrated, chip and electrical connection thereof can be encapsulated in the insulating resin, so that protect it not to be subjected to the influence of outside weather or mechanical aspects.
Fig. 8 schematically represents the sectional view according to the storage medium of the smart card with the contact portion of flushing of first embodiment.
This embodiment is included in the cavity that the opens wide 310 interior micromodule M1 that obtain according to first embodiment shown in Figure 4 that carry in the card body 300.
The end face of module M1 is confirmed as being intended to and blocks the surface that 300 surface engagement flushes.Join domain 151 for example is formed according to iso standard, and as the contact that is used to visit smart card.
Card body 300 is formed according to conventional method, for example by injected plastic in mould.Cavity 310 is by body grinds or by forming by injection molding during fabrication, this is a less expensive to blocking.
Cavity 310 has the geometry that is suitable for micromodule.For example can be star or bowl-type, have two flat end P1 and P2, perhaps be bowl-type with a flat end and oblique wall.
In Fig. 8, shown card is to have two flat bowl-types.In this case, first flat P11 is formed for supporting the substrate 100 of MMM, and its degree of depth is corresponding to the thickness of substrate 100.The part of second flat P2 is used to receive the part of the micromodule MI that comprises integrated circuit (IC) chip 200 that may be coated with the protection resin.
Before inserting micromodule M1, remove the framework of the protective material that when making micromodule, keeps at last.Then, heating is passed through by local activation in the position of the framework of the bottom surface of the substrate 100 of micromodule, thereby makes it have stickiness.
By hot pressing, micromodule M1 is transported on the cavity 310, makes the bottom surface that has a substrate 100 of stickiness by heating be bonded on first flat end P1, so that stuck-module.Therefore, substrate 100 has dual-use function; It when module is inserted cavity 300, also is used for fixing module as the support of module.
In a kind of distortion, also can be arranged on module in the molding space of card body, and directly be fixed on the card body.
Fig. 9 schematically represents the sectional view with the smart card that flushes contact according to the embodiment manufacturing of remodeling shown in Figure 4.
In this remodeling, module MP1 does not comprise chip.Form in the cavity 310 that opens wide that is preserved for module MP1 in card body 300, integrated circuit (IC) chip 200 is placed in the bottom of cavity.
Printed the also support that stickiness is arranged 100 of the module of well cutting in advance and carried like this, make the join domain of printing 151 be positioned at the opposite side of the connection pads of integrated circuit (IC) chip 200.
Described conveying comprises hot rolling, make can to realize electrical connection between the connection pads on join domain 151 and the chip 200 simultaneously by means of conductive bumps 220, and the stickiness of utilizing heating to produce is fixed to the bottom surface of supporting 100 on the wall of cavity.
Figure 10 schematically represents to have according to the embodiment of remodeling shown in Figure 5 the sectional view of the smart card that flushes contact, comprising the micromodule M2 that obtains according to the embodiment of remodeling shown in Figure 5.In this remodeling, after removing any protection framework of original reservation, utilize hot rolling micromodule M2 to be transported in the cavity 410 of card body 400, described hot pressing makes supports 100 bottom surface activation, thereby has stickiness.Heat-press step realizes that by means of instrument 430 shape of its shape and cavity 410 adapts.
Under the situation of this remodeling, the instrument 430 that is used for hot pressing preferably has groove 431, is intended to be used to protect the chip 230 of micromodule.In case module M2 is fixed in the cavity 410, chip also can be encapsulated in the protection resin 420.
Figure 11 schematically represents to have the sectional view of the smart card that flushes contact according to the embodiment of second remodeling, the micromodule M2 that obtains comprising the embodiment according to remodeling shown in Figure 7.In this case, according to aforesaid method, promptly the instrument that adapts by means of the shape of its shape and cavity 510 is transported to micromodule M3 in the cavity 510 of card body 500.
Comprise less step according to the method that is used to make smart card of the present invention, and do not use the high material of any cost.In addition, the film in support and connection zone can be fixed on micromodule in the cavity of card body and not use viscose.Thereby, be greatly diminished according to the micromodule of method production of the present invention and the manufacturing cost of smart card.
When application was of the present invention, binding material can mechanically be strengthened, and especially utilizes the reinforcing fibre of glass fibre manufacturing to strengthen.

Claims (26)

1. the manufacture method of the type portable storage medium of the smart card type with join domain that flushes of by substrate supports, integrated circuit (IC) chip is set in the cavity that forms in the support, the connection pads that it has and the join domain that flushes is electrically connected, described method comprise the step of producing described join domain and described substrate element and integrated circuit (IC) chip are assemblied in step in the cavity; It is characterized in that;
-the step that forms join domain (150) realizes by means of going up the printing conductive material first of stickiness dielectric film (100), and
-installation step is undertaken by second face of stickiness dielectric film (100) is fixed in the described cavity.
2. the method that is used to make storage medium as claimed in claim 1 is characterized in that, printing material is a kind of conductive ink.
3. the method that is used to make storage medium as claimed in claim 1 or 2, it is characterized in that, thereby the step of assembling in cavity comprises at first adhesive film is formed the step of the stickiness substrate that is supporting join domain and as adhesive glue the stickiness substrate is bonded in step on the edge of cavity with second of described stickiness substrate around the printing figures cutting.
4. as claim 1 or the 2 or 3 described methods that are used to make storage medium, it is characterized in that adhesive film has by the second surface of also protecting as the band (110) that supports, so that make it possible on described film, print continuously the figure that constitutes join domain.
5. as the described method that is used to make storage medium of any one claim of front, it is characterized in that described adhesive film is activable.
6. the method that is used to make storage medium as claimed in claim 5 is characterized in that, the film with sticky stuff can thermal activation, and comprises improved PE (polyethylene) class, improved PU (polyurethane) class, or improved PP (polypropylene) class.
7. the method that is used to make storage medium as claimed in claim 6 is characterized in that, described film with sticky stuff has the thermosetting state.
8. the method that is used to make storage medium as claimed in claim 4 is characterized in that, support belt (110) is the band that the material of a kind of paper that scribbles silicon or PET is made.
9. as any one described method that is used to make storage medium of claim 4 to 6; it is characterized in that; the boundary belt of film is by cut; make and reserve the zone that is used for chip; and be used for being electrically connected and when band is removed, be used for keeping a rigid frame around join domain, described framework was removed before being assemblied in element in the cavity.
10. as the described method that is used to make storage medium of any one claim of front, it is characterized in that described method comprises connection pads is connected to step on the join domain of the figure of printing on the adhesive film.
11. the method that is used to make storage medium as claimed in claim 10, it is characterized in that, when integrated circuit (IC) chip is placed on second the same side with film, realize by the thickness of adhesive film in the connection pads and the electrical connection between the join domain of chip.
12. as the described method that is used to make storage medium of any one claim of front, it is characterized in that, on the connection pads of chip, be formed with conductive bumps.
13. as claim 11 or the 12 described methods that are used to make storage medium, it is characterized in that, can get up to realize by means of the conductive stud in the thickness that is set at adhesive film in the connection pads and the electrical connection between the join domain of integrated circuit (IC) chip.
14., it is characterized in that the setting of described conductive bumps in the thickness of dielectric film realizes by means of integrated circuit (IC) chip is exerted pressure as any one described method that is used to make storage medium of claim 10 to 13.
15., it is characterized in that the setting of described conductive bumps in the thickness of dielectric film also helps to carry out by the heating adhesive film as any one described method that is used to make storage medium of claim 11 to 14.
16. as any one described method that is used to make storage medium of claim 10 to 14, it is characterized in that, integrated circuit (IC) chip is made its connection pads above the join domain of printing, thereby is implemented in the connection pads of chip and the electrical connection between the join domain by directed like this.
17., it is characterized in that described method is included in and forms perforate in the adhesive film thickness relative with join domain so that expose the step of join domain as any one described method that is used to make storage medium of claim 8 to 14.
18. as the described method that is used to make storage medium of any one claim of front, it is characterized in that, connection pads and the electrical connection between the join domain at chip utilize electroconductive resin to realize, described electroconductive resin is applied in the connection pads on described chip in the described perforate.
19. as the described method that is used to make storage medium of any one claim of front, it is characterized in that, on adhesive film, carry the step of integrated circuit (IC) chip before described method is included in and connects, so that form micromodule.
20., it is characterized in that the step of the different printing figures on the cutting film was carried out as the described method that is used to make storage medium of any one claim of front before or after being transported on the substrate to integrated circuit (IC) chip.
21., it is characterized in that the described step that the stickiness substrate of integrated circuit (IC) chip and printing is assembled in the open-ended cavity that forms comprises as claim 6 or the 20 described methods that are used to make storage medium in support:
By carry out hot pressing on substrate micromodule is transported in the cavity, so that the bottom surface of substrate is bonded on the wall of cavity, join domain is placed in the outside of cavity, and integrated circuit (IC) chip is placed in the inboard of cavity.
22. as any one described method that is used to make storage medium of claim 1 to 16, it is characterized in that,
-integrated circuit (IC) chip is at first placed the bottom of cavity fully, makes the opening of its active one side towards cavity, then,
-stickiness substrate is carried like this, make the join domain of printing face toward the connection pads of integrated circuit (IC) chip, described conveying comprises hot molding, so that can realize the electrical connection between the connection pads of join domain and chip simultaneously and the bottom surface of adhesive film is fixed on the cavity wall.
23., it is characterized in that integrated circuit (IC) chip also can be sealed in the protection resin with being electrically connected of join domain as the described method that is used to make storage medium of any one claim of front.
24. the portable supporting module of a smart card type, it has first join domain that is carrying by substrate film, and wherein substrate is a kind of emplastic, and wherein said join domain is a kind of printed conductive material.
25. portable supporting module as claimed in claim 24 is characterized in that, described portable supporting module also has second the integrated circuit (IC) chip that is fixed to described substrate film.
26. the type portable storage medium of a smart card type is characterized in that it comprises described module.
CN00803573A 1999-02-08 2000-01-24 Method for production of chip-card type portable storage medium Pending CN1384979A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
FR99/01454 1999-02-08
FR9901454A FR2789505B1 (en) 1999-02-08 1999-02-08 METHOD FOR MANUFACTURING SMART CARD PORTABLE STORAGE MEDIUM

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CN105702658A (en) * 2014-11-12 2016-06-22 矽品精密工业股份有限公司 Semiconductor package and fabrication method thereof

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DE10208168C1 (en) * 2002-02-26 2003-08-14 Infineon Technologies Ag Data card has cover, which presses substrate and components down into recess and along its base, when attached
FR2846446B1 (en) * 2002-10-28 2005-02-18 Oberthur Card Syst Sa CHIP CARD COMPRISING A DISENGANT COMPONENT AND A METHOD OF MANUFACTURE

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DE3123198C2 (en) * 1980-12-08 1993-10-07 Gao Ges Automation Org Carrier elements for an IC chip
DE3639630A1 (en) * 1986-11-20 1988-06-01 Gao Ges Automation Org DATA CARRIER WITH INTEGRATED CIRCUIT AND METHOD FOR PRODUCING THE SAME
FR2684471B1 (en) * 1991-12-02 1994-03-04 Solaic METHOD FOR MANUFACTURING A MEMORY CARD AND MEMORY CARD THUS OBTAINED.
DE19713641A1 (en) * 1997-04-02 1998-10-08 Ods Gmbh & Co Kg Mini chip card and process for its manufacture

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105702658A (en) * 2014-11-12 2016-06-22 矽品精密工业股份有限公司 Semiconductor package and fabrication method thereof
CN105702658B (en) * 2014-11-12 2019-04-05 矽品精密工业股份有限公司 Semiconductor package and fabrication method thereof

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EP1153432A1 (en) 2001-11-14

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