JP2009048661A - Method for manufacturing ic card - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an IC card manufacturing method for obtaining an IC card with excellent quality without any crack on the cross section of the IC card when manufacturing the IC card by punching with a punch and a die. <P>SOLUTION: The IC card manufacturing method is designed for manufacturing the IC card with an IC module enclosed between a first sheet having an image formable image reception layer and a second sheet having a writable writing layer, by punching with the use of the die having a hole part with the shape of the IC card and the removable punch to be fitted to the hole part of the die. The first sheet having the elastic modulus of 100-200 N/mm<SP>2</SP>at ordinary temperature is positioned on the side of the die. The second sheet having the elastic modulus of 1,000-5,000 N/mm<SP>2</SP>at ordinary temperature is positioned on the side of the punch. Then, the IC card is punched. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention relates to an IC card manufacturing method for punching an IC card from an IC card sheet having an IC module.

  As identification cards (ID cards) such as identification cards and credit cards, cards that store data using a magnetic recording method have been widely used. In this magnetic recording system card, the data can be rewritten relatively easily, so that data tampering prevention is not sufficient, and the data in the magnetic recording system is susceptible to external influences, so the data is destroyed. There was a problem that data could not be sufficiently protected. In view of this, an IC card has been proposed in which a memory composed of an IC chip and a microcomputer for controlling the memory are incorporated in the card, data can be stored in the memory, and data can be read as needed. It is widespread.

  This IC card has an IC chip inside, and is configured to exchange data with an external device via an internal loop antenna or an electrical contact provided on the surface.

  A device that uses radio waves with a loop antenna or the like, or a device that sends and receives signals to the outside by other means is called a non-contact type, and a device that uses electrical contacts is called a contact type. .

  Here, an outline of a method for manufacturing a non-contact type IC card will be described with reference to FIG. 4A is an exploded perspective view of the IC card sheet, FIG. 4B is an enlarged perspective view of the IC module, and FIG. 4C is a perspective view showing a state in which the IC card is punched from the IC card sheet.

  In FIG. 4A, 3 indicates an IC card sheet for an IC card. The IC card sheet 3 includes a core sheet 303 in which at least one IC module 302 is aligned and pasted on a core sheet base material 302a, a first sheet 301 bonded to the upper side of the core sheet 303, and a core sheet. And a second sheet 304 bonded to the lower side of 303. Reference numeral 301 a denotes an IC card pattern provided on the first sheet 301.

  In FIG. 4B, the IC module 302 has an IC chip 302b and a loop antenna 302c.

  In FIG. 4C, reference numeral 1 denotes an IC card punched out from the IC card sheet 3 in accordance with the pattern 301a.

  The IC card sheet 3 may be manufactured for each IC module 302, or a core sheet 303 having a plurality of IC modules 302 is continuously provided between the belt-shaped first sheet and the second sheet. The IC card sheet 3 may be sandwiched and manufactured into a strip shape and cut into a single IC card sheet 3 having a plurality of IC modules 302. The IC card sheet 3 may be appropriately selected according to a manufacturing apparatus.

In punching the IC card 1, punching devices in which a punch or die has an inclination angle are described in Patent Documents 1 and 2 below so that punching resistance can be reduced and generated noise can be reduced. .
JP 7-328999 A JP-A-7-329000

  Although an IC card is manufactured as described above, conventionally, the first sheet and the second sheet are often made of the same material and physical properties. Therefore, the IC card is manufactured by transporting the IC card with the sheet surface facing upward when the IC card is damaged and punching out from the upper surface side by punching.

  However, recent IC cards have a first sheet provided with an image-receiving layer capable of forming images such as characters and face photographs, and a transparent protective layer provided on the second sheet for image protection. Since there is a possible writing layer, the material and physical properties of both sheets are different. In such a case, it has been found that the cross section of the punched IC card may crack depending on which side of the sheet is punched.

  The present invention has been made through research and development from such a viewpoint, and an IC card in which an IC module is sealed between a first sheet having an image receiving layer and a second sheet having a writing layer, IC card of good quality without cracks in the cross section of the IC card when manufactured by punching with a die having an IC card shape hole and a punch that is removably fitted into the hole of the die. It is an object of the present invention to provide an IC card manufacturing method and an IC card manufacturing apparatus.

  The above object can be achieved by any of the following means.

An IC card manufacturing method according to the present invention includes an IC card in which an IC module is sealed between a first sheet having an image-receiving layer capable of forming an image and a second sheet having a writable writing layer. A method of manufacturing an IC card manufactured by punching with a die having a hole portion of a shape and a punch that is removably fitted into the hole portion of the die, and having an elastic modulus of 100 to 200 N / mm ^{2 at} room temperature comprising a first sheet is positioned on a side of the die, and a second sheet made of an elastic modulus of 1000~5000N / mm ² at room temperature is located on the side of the punch, and characterized in that punching out the IC card Is doing .

A method of manufacturing a C card according to a reference example includes an IC card in which an IC module is sealed between a first sheet having an image-receiving layer capable of forming an image and a second sheet having a writable writing layer. An IC card manufacturing method for punching and manufacturing a die having a hole having a shape and a punch that is removably fitted into the hole of the die, wherein the first sheet is positioned on the punch side. is allowed to cool, and, after the second sheet has been heated by the position on the side of the die, it is characterized by punching out the IC card.

An IC card manufacturing apparatus according to the present invention manufactures an IC card in which an IC module is enclosed between a first sheet having an image-receiving layer capable of forming an image and a second sheet having a writing layer capable of writing. A die having an IC card-shaped hole and a punch that is removably fitted into the hole of the die, and has an elastic modulus of 100 to 200 N / mm ^{2 at} room temperature. a first sheet made of is positioned on a side of the die, and a second sheet made of an elastic modulus of 1000~5000N / mm ² at room temperature is located on the side of the punch, characterized by punching out the IC card It is said .

The C card manufacturing apparatus according to the reference example is an IC card for manufacturing an IC card in which an IC module is sealed between a first sheet having an image-receiving layer capable of forming an image and a second sheet having a writing layer capable of writing. A die having an IC card-shaped hole, a punch that is removably fitted into the hole of the die, and a heating unit that heats the die-side surface of the IC card. When it is characterized by comprising a cooling means for cooling the punch-side surface of the IC card.

  According to the IC card manufacturing method and IC card manufacturing apparatus of the present invention, an IC card in which an IC module is sealed between a first sheet having an image receiving layer and a second sheet having a writing layer is used. When manufacturing by punching with a die having a hole of the shape and a punch that is removably fitted into the hole of the die, a cross-section of the IC card is not cracked and a good quality IC card is obtained. There is an effect that is.

  Embodiments relating to a method for manufacturing an IC card and a manufacturing apparatus for the same according to the present invention will be described below in detail with reference to the drawings.

  First, an example of a general IC card sheet manufacturing apparatus will be described with reference to FIGS.

FIG. 1 is a schematic diagram showing an example of an IC card sheet manufacturing apparatus.
The IC card sheet manufacturing apparatus includes a supply unit 6 for a first sheet 301 wound up in a roll attached to the upper side of the core sheet 303 and a second sheet 304 wound up in a roll attached to the lower side. , Having a sticking part 7 for sticking the first sheet 301 and the second sheet 304 to the core sheet 303, and a cutting part 8 for cutting the banded IC card sheet into a predetermined size. .

  The supply unit 6 includes a first supply unit 6 a that supplies the first sheet 301 to the sticking unit 7, and a second supply unit 6 b that supplies the second sheet 304 to the sticking unit 7. The first supply unit 6a includes a first sheet 301, a guide roller 602a for supplying the first sheet 301 to the sticking unit 7, a driving roller 603a, and a hot melt adhesive 604a on the first sheet 301. And a hot melt applicator coater 605a for coating with a predetermined thickness.

  The second supply unit 6b includes a second sheet 304, a guide roller 602b for supplying the second sheet 304 to the adhering unit 7, a driving roller 603b, and a hot melt adhesive 604b on the second sheet 304. And a hot melt applicator coater 605b for coating with a predetermined thickness.

  The first sheet 301 is provided with an image receiving layer on which a character or face photograph image serving as personal identification information is printed by a sublimation thermal transfer method, a melt thermal transfer method, or an ink jet method, and further, actinic ray curing. A transparent protective layer made of resin and protecting the image receiving layer is formed.

The second sheet 304 is formed with a writable writing layer.
The first sheet 301 to which the adhesive is applied and the second sheet 304 are supplied to the sticking unit 7 in a state of facing each other while being separated. At a position where the first sheet 301 and the second sheet 304 are spaced apart and face each other, a core sheet 303 to which at least one IC module is attached is supplied from a core sheet supply unit (not shown). The core sheet 303 may be supplied in sheet form or roll form.

  The sticking unit 7 includes a temperature-controlled room 701 and a plurality of pressing rolls 702a and 702b that press the first sheet 301 and the second sheet 304. The belt-like IC card sheet 4 in the state where the core sheet 303 is sandwiched between the first sheet 301 and the second sheet 304 is manufactured by the pressing rolls 702a and 702b.

  The cutting unit 8 includes a driving roller 801 and a cutting blade 802 provided so as to be movable in the vertical direction (the arrow direction in the drawing). The band-shaped IC card sheet 4 sent from the sticking unit 7 by the driving roller 801 is cut into a predetermined size, and the single-wafer IC card sheet 3 is manufactured.

  Here, as a base material of the core sheet 303 to which the IC module 302 in the present invention is attached, for example, polyester resins such as polyethylene terephthalate, polybutylene terephthalate, polyethylene terephthalate / isophthalate copolymer, polyethylene, polypropylene, polymethylpentene Polyolefin resins such as polyvinyl fluoride, polyvinylidene fluoride, polytetrafluoroethylene, polytetrafluoroethylene resins such as ethylene-tetrafluoroethylene copolymer, polyamides such as nylon 6 and nylon 6.6, polyvinyl chloride , Vinyl chloride / vinyl acetate copolymer, ethylene / vinyl acetate copolymer, ethylene / vinyl alcohol copolymer, vinyl polymer such as polyvinyl alcohol and vinylon, biodegradable aliphatic polyester, biodegradable polycarbonate Biodegradable resins such as biodegradable polylactic acid, biodegradable polyvinyl alcohol, biodegradable cellulose acetate, and biodegradable polycaprolactone, cellulose resins such as cellulose triacetate and cellophane, methyl polymethacrylate, Acrylic resin such as ethyl polymethacrylate, polyethyl acrylate, polybutyl acrylate, synthetic resin sheet such as polystyrene, polycarbonate, polyarylate, polyimide, paper such as fine paper, thin paper, glassine paper, sulfate paper, Single layer bodies, such as metal foil, or these laminated bodies of two or more layers are mentioned.

The thickness of the base material is 30 to 300 μm, desirably 50 to 200 μm.
Further, an easy-contact process may be performed on the base material for post-processing to improve adhesion, and an antistatic process may be performed for chip protection. Specifically, U2 series, U4 series, UL series manufactured by Teijin DuPont Films, Ltd., Chrisper G series manufactured by Toyobo Co., Ltd., E00 series, E20 series, E22 series, X20 series, E40 series manufactured by Toray Industries, Inc. E60 series and QE series can be preferably used.

In order to form a face image of the card user, the first sheet 301 in the present invention may be provided with a cushion layer in addition to the image receiving layer. An image element is provided on the surface of the personal authentication card substrate, and at least one selected from an authentication identification image such as a face image, an attribute information image, and format printing may be provided, and there is no printed portion at all. The image receiving layer provided on the first sheet member, which may be a white card, can be formed of a binder and various additives.

  The image-receiving layer in the present invention forms a gradation information-containing image by a sublimation type thermal transfer method and also forms a character information-containing image by a sublimation type thermal transfer method or a melt type thermal transfer method. The adhesion of the hot-melt ink must be good as well as the dyeability of the sublimable dye. In order to impart such special properties to the image receiving layer, as described later, it is necessary to appropriately adjust the binder, various additives, and their blending amounts.

Hereinafter, the components forming the image receiving layer will be described in detail.
As the binder for the image receiving layer in the present invention, a conventionally known binder for a sublimation type thermal transfer recording image receiving layer can be appropriately used. As the main binder, various binders such as vinyl chloride resin, polyester resin, polycarbonate resin, acrylic resin, polystyrene resin, polyvinyl acetal resin, and polyvinyl butyral resin can be used.

  However, if there is a practical requirement for the image formed by the present invention (for example, a predetermined heat resistance is required for the issued ID card), the binder is made to satisfy such requirement. It is necessary to consider the type or combination. Taking heat resistance of the image as an example, if heat resistance of 60 ° C. or higher is required, it is preferable to use a binder having a Tg of 60 ° C. or higher in consideration of bleeding of the sublimable dye.

  Moreover, when forming an image receiving layer, it may be preferable to contain a metal ion containing compound as needed, for example. This is particularly the case when the heat transfer compound reacts with the metal ion-containing compound to form a chelate.

Examples of the metal ions constituting the metal ion-containing compound include divalent and polyvalent metals belonging to Groups I to VIII of the periodic table. Among them, Al, Co, Cr, Cu, Fe, Mg , Mn, Mo, Ni, Sn, Ti, Zn and the like are preferable, and Ni, Cu, Co, Cr, Zn and the like are particularly preferable. As the compound containing these metal ions, inorganic or organic salts of the metal and complexes of the metal are preferable. When a specific example is given, the complex represented by the following general formula containing Ni2 +, Cu2 +, Co2 +, Cr2 + and Zn2 + is preferably used.
[M (Q1) k (Q2) m (Q3) n] p + p (L−)
In the formula, M represents a metal ion, Q1, Q2, and Q3 each represent a coordination compound capable of coordinating with the metal ion represented by M. Examples of these coordination compounds include “chelate chemistry (5 ) (Nanedo) "can be selected from the coordination compounds. Particularly preferable examples include a coordination compound having at least one amino group coordinated to a metal, and more specifically, ethylenediamine and derivatives thereof, glycinamide and derivatives thereof, picolinamide and derivatives thereof. It is done. L is a counter anion capable of forming a complex, and examples include inorganic compound anions such as Cr, SO ₄ , ClO ₄ , and organic compound anions such as benzenesulfonic acid derivatives and alkylsulfonic acid derivatives, and tetraphenylboron is particularly preferable. Anions and derivatives thereof, and alkylbenzene sulfonate anions and derivatives thereof. k represents an integer of 1, 2 or 3, m represents 1, 2 or 0, and n represents 1 or 0. These are compounds in which the complex represented by the above general formula is tetradentate or hexadentate. It is determined by the coordination or by the number of ligands of Q1, Q2 and Q3. p represents 1, 2 or 3.

Examples of this type of metal ion-containing compound include those exemplified in US Pat. No. 4,987,049. When the metal ion-containing compound is added, the addition amount is preferably 0.5 to 20 g / m ^{2 and} more preferably ¹ to 15 g / m ² with respect to the image receiving layer.

  Further, it is preferable to add a release agent to the image receiving layer. As an effective mold release agent, those compatible with the binder to be used are preferable, and specifically, modified silicone oil and modified silicone polymer are typical, for example, amino-modified silicone oil, epoxy-modified silicone oil, polyester-modified silicone. Examples thereof include oil, acrylic-modified silicone resin, urethane-modified silicone resin and the like. Of these, the polyester-modified silicone oil is particularly excellent in that it prevents fusion with the ink sheet but does not hinder the secondary processability of the image receiving layer. The secondary processability of the image-receiving layer refers to a writing property with magic ink, a laminating property that causes a problem when protecting a formed image, and the like. In addition, fine particles such as silica are also effective as a release agent. When secondary workability is not a problem, the use of a curable silicone compound is also effective as a measure for preventing fusion. Ultraviolet curable silicone, reaction curable silicone, and the like are available, and a great mold release effect can be expected.

  The image-receiving layer in the present invention is a coating method in which an image-receiving layer coating solution prepared by dispersing or dissolving the forming component in a solvent is prepared, and the image-receiving layer coating solution is applied to the surface of the support and dried. Can be manufactured by.

  The thickness of the image receiving layer formed on the surface of the support is generally 1 to 50 μm, preferably about 2 to 10 μm. In the present invention, a cushion layer or a barrier layer may be provided between the support and the image receiving layer. When the cushion layer is provided, there is little noise, and an image corresponding to the image information can be transferred and recorded with good reproducibility. Examples of the material constituting the cushion layer include urethane resin, acrylic resin, ethylene resin, polypropylene resin, butadiene rubber, epoxy resin, and photocurable resin described in Japanese Patent Application No. 2001-16934. The thickness of the cushion layer is usually 1 to 50 μm, preferably 3 to 30 μm.

  An information carrier comprising a format print represents an information carrier provided with at least one selected from a plurality of identification information and book information. Specifically, a ruled line, a company name, a card name, and notes Indicates the issuer's phone number.

  For the formation of an information carrier consisting of format printing, use the “lithographic printing technology”, “new printing technology overview”, “offset printing technology”, “plate making / printing slightly understandable picture book” published by Japan Printing Technology Association, etc. It can be formed using the general inks described, and is formed of ink such as carbon in photocurable ink, oil-soluble ink, solvent-type ink and the like. In some cases, watermark printing, holograms, fine patterns, etc. may be employed to prevent visual counterfeiting, and the printed material, hologram, barcode, matte pattern, fine pattern, background pattern, uneven pattern may be used as the forgery / alteration prevention layer. Selected timely, visible light absorbing color material, ultraviolet absorber, infrared absorber, fluorescent whitening material, metal deposition layer, glass deposition layer, bead layer, optical change element layer, pearl ink layer, neighboring pigment layer, It is also possible to provide the front sheet by printing or the like from the antistatic layer or the like.

  As a material for forming the cushion layer of the present invention, photocurable resins and polyolefins described in Japanese Patent Application No. 2001-1693 are preferable. For example, polyethylene, polypropylene, ethylene-vinyl acetate copolymer, ethylene-ethyl acrylate copolymer, styrene-butadiene-styrene block copolymer, styrene-isoprene-styrene block copolymer, styrene-ethylene-butadiene-styrene block A copolymer, a styrene-hydrogenated isoprene-styrene block copolymer, a polybutadiene having flexibility and low thermal conductivity is suitable.

  The material for forming the cushion layer of the present invention is preferably polyolefin. For example, polyethylene, polypropylene, ethylene-vinyl acetate copolymer, ethylene-ethyl acrylate copolymer, styrene-butadiene-styrene block copolymer, styrene-isoprene-styrene block copolymer, styrene-ethylene-butadiene-styrene A block copolymer, a styrene-hydrogenated isoprene-styrene block copolymer, a polybutadiene, and a photocurable resin layer having flexibility and low thermal conductivity are suitable. Specifically, a cushion layer described in Japanese Patent Application No. 2001-16934 can be used.

  The cushion layer in the present invention is not particularly limited as long as it has a cushion layer between the image receiving layer and the electronic component, but the second sheet member of another support substantially the same as the base body or It is particularly preferable that the first and second sheet members are formed by being coated or bonded to each other.

  The second sheet 304 is provided with a writing layer. The writing layer is a layer that allows writing on the back surface of the ID card. As such a writing layer, for example, inorganic fine powders such as calcium carbonate, talc, diatomaceous earth, titanium oxide, and barium sulfate are included in a film of a thermoplastic resin (polyolefins such as polyethylene and various copolymers). Can be formed. It can be formed with a “writing layer” described in JP-A-1-205155.

  The hot melt adhesive can be used without any particular limitation. For example, the hot melt disclosed in JP-A No. 2000-36026, JP-A No. 2000-211985, JP-A No. 2000-212278, JP-A No. 2000-21855, etc. An adhesive is mentioned. Moreover, although the case where a hot melt adhesive is used is shown in this figure, other adhesives can also be used. For example, an epoxy-based two-liquid mixed type, Japanese Patent Application Laid-Open Nos. 10-316959 and 11-5964 The photocurable adhesive etc. which are indicated by the gazette are mentioned.

FIG. 2 is a schematic perspective view of the punched portion of the IC card.
The IC card sheet 3 is placed on the carriage 11 and moves from the right to the left, passes through the position detection unit 12, and is punched out by the punching unit 13.

  In the punching portion 13, the punch 13a is inserted into the die 13b, and the IC card sheets 3 are punched by the number in the direction orthogonal to the conveying direction, and the punched individual IC cards 1 are stacked below. Then, the IC card sheet 3 from which all the IC cards 1 are punched is conveyed leftward.

  Note that this punching mechanism is a mechanism called “dropping-out”. However, it has a knockout that faces the punch and is biased in the direction of the punch, and has a mechanism called pushback in which the IC card descends with the knockout when the punch descends during punching, and the IC card rises with the knockout when the punch rises It may be used. As a result, the punched IC card returns to the position of the IC card sheet, and is separated and integrated in a process downstream from the punched portion.

  Further, in the IC card manufactured in this way, the sheet surface on which the IC chip is located is inferior in flatness and is not preferable for printing. Therefore, it is desirable to print the face photograph so that the face photograph does not overlap with the IC chip in the thickness direction.

  When printing a face photograph or the like, the planarity of the peripheral portion of the IC chip constituting the IC module is preferably within ± 10 μm.

  An IC card is manufactured as described above. As described in “Problems to be Solved by the Invention”, a method for preventing a cross section of a punched IC card from cracking will be described below.

  When an IC card having a first sheet having an image receiving layer and a second sheet having a writing layer is punched by a punch and a die, the first sheet is positioned on the punch side as a result of the experiment, and the second sheet is It was found that when placed on the die side, the second sheet was easily cracked.

Assuming this cause, it is as follows. It was found that the first sheet and the second sheet had different elastic moduli, and the second sheet had a higher elastic modulus than the first sheet. Then, when the first sheet is positioned on the punch side and the second sheet is positioned on the die side and punched out, the first sheet having a low elastic modulus has a higher ductility and is only stretched by the punch. The second sheet having a high elastic modulus has a low ductility and is initially stretched by the die. However, the second sheet is sheared on the way, and at this time, the cross section of the second sheet seems to crack.

  As a result, when the second sheet having a high elastic modulus is positioned on the punch side and the first sheet having a low elastic modulus is positioned on the die side, the cross section of the second sheet is also applied to the cross section of the first sheet. It was found that there was no crack.

  That is, the second sheet having the writing layer is positioned on the punch side, and the first sheet having the image receiving layer is positioned on the die side and punched out, so that the IC card of good quality can be obtained without cracks in the cross section. Was found to be obtained.

The elastic modulus of the first sheet is 100-200 N / m ^{m 2} at normal temperature, the elastic modulus of the second sheet is 1000~5000N / ^m m ² at room temperature.

For reasons of manufacturing processes, it may be necessary to place the first sheet on the punch side and the second sheet on the die side for punching. In such a case, the surface on the punch side of the IC card may be cooled by a predetermined cooling means, and the die side surface of the IC card may be heated by a predetermined heating means. That is, it is possible to increase the elastic modulus of the first sheet by cooling the surface of the punch-side from 100 N / m m ² to 600N / m m ^2, the second by heating the surface of the die-side it is possible to lower the elastic modulus of the sheet from 1000 N / m ^{m 2} to 400N / ^m m ^2. Thus, contrary to the above, the elastic modulus of the first sheet is higher than that of the second sheet. Therefore, the first sheet having the image receiving layer is positioned on the punch side, and the first sheet having the writing layer is provided. Even if the second sheet is placed on the die side and punched out, a good quality IC card can be obtained without cracks in the cross section.

  The elastic modulus was measured by applying an image receiving layer and a writing layer to the polypropylene film, peeling the polypropylene film after the application, and measuring using an elastic modulus measuring instrument.

  Next, FIG. 3 shows a sectional view of the punch and die. 3A is a diagram of a conventional punch and die, and FIG. 3B is a diagram of a punch and die in the present invention.

  As shown in FIG. 3A, the cutting edge angle θ of the conventional punch 33a has angles of 15 °, 30 °, 45 °, 60 °. Reference numeral 33b denotes a die.

  In addition, as described in Patent Documents 1 and 2, there is a type in which the punch blade edge is not the same height along the periphery but has an inclination, and the punch gradually bites in during punching. It was.

  However, in order to prevent cracks in the cross section of the IC card as described above, it has been found that cracks are less likely to occur when considering the shape of the punch.

  That is, as shown in FIG. 3B, by setting the blade edge angle θ of the punch 23a to 80 to 90 ° and forming a shape having a flat flat portion 23a1 connected to the blade edge, cracks are less likely to occur. It was.

  Further, it was found that the moving speed (m / min) of the punch 23a with respect to the die 23b also has an influence. As a result of experiments, the probability of crack occurrence is 1% at 2.5 m / min, 5% or less at 5.0 m / min, 20% at 7.0 m / min, 40% at 8.0 m / min, 10.0 m It was 90% at / min. Thereby, in the manufacturing process, the moving speed of the punch with respect to the die is preferably 2.5 m / min or more and 7.0 m / min or less. That is, if it is 2.5 m / min or less, the production efficiency is too low, and if it is 7.0 m / min or more, cracks are generated too much.

  Although the IC card described above is a non-contact type, the same applies to the contact type.

It is a schematic diagram which shows an example of the manufacturing apparatus of an IC card sheet. It is a schematic perspective view of the punching part of an IC card. It is sectional drawing of a punch and die | dye. It is the schematic which shows the manufacturing method of an IC card sheet.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 IC card 3 IC card sheet 13a, 23a Punch 23a Flat part 13b, 23b Die 301 1st sheet 302 IC module 302b IC chip 303 Core sheet 304 2nd sheet 604b Hot melt adhesive

Claims (11)

An IC card in which an IC module is sealed between a first sheet having an image-receiving layer capable of forming an image and a second sheet having a writable writing layer, a die having a hole in the shape of the IC card, and the die A manufacturing method of an IC card manufactured by punching with a punch that is removably fitted into a hole of a die,
A first sheet made of an elastic modulus of 100-200 N / mm ² at room temperature is located on the side of the die, position the second sheet made of an elastic modulus of 1000~5000N / mm ² at room temperature on a side of the punch An IC card manufacturing method, wherein the IC card is punched out.   2. The IC card manufacturing method according to claim 1, wherein the punch has a cutting edge with an angle of 80 degrees or more and 90 degrees or less and has a flat flat portion connected to the cutting edge. 3. The IC card manufacturing method according to claim 1, wherein the punch is moved at a speed of 2.5 m / min to 7.0 m / min with respect to the die. It said first sheet, sublimation thermal transfer method, according to any one of claim 1 to 3, characterized in that printing melt thermal transfer method or by an inkjet method an image of a character or a face photograph to be personally identifiable information IC card manufacturing method. IC card manufacturing method according to any one of claims 1-4, characterized by applying a hot melt adhesive between said first sheet and said second sheet. IC card manufacturing method according to any one of claim 1 to 5, characterized in that providing a transparent protective layer for protecting the image receiving layer consists of actinic radiation curable resin. The IC card according to any one of claims 1 to 6 , wherein the IC chip constituting the IC module and the portion where the face image is formed are arranged so as not to overlap in the thickness direction. Production method. 8. The IC card manufacturing according to claim 1, wherein the planarity of the peripheral portion of the IC chip constituting the IC module in the first sheet is formed within ± 10 μm. 9. Method. The IC card is an IC card manufacturing method according to any one of claims 1-8, characterized in that the non-contact type. The image receiving layer includes a binder made of a vinyl chloride resin, a polyester resin, a polycarbonate resin, an acrylic resin, a polystyrene resin, a polyvinyl acetal resin, or a polyvinyl butyral resin. The manufacturing method of IC card any one of these. The method of manufacturing an IC card according to claim 1, wherein the image receiving layer has a thickness of 2 to 10 μm.

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