CN103065184A - Manufacture method for double-chip subscriber identity module (SIM) cards - Google Patents

Abstract

The invention relates to a manufacture method for double-chip subscriber identity module (SIM) cards. The manufacture method comprises the following steps of printing, compositing, laminating, punching, back gluing chips, milling grooves and packing chips. Compared with the prior art, the manufacture method has the advantages of improving production efficiency, reducing cost and reject ratio and the like.

Description

A kind of manufacture method of dual chip SIM card

Technical field

The present invention relates to a kind of manufacture method of SIM card, especially relate to a kind of manufacture method of dual chip SIM card.

Background technology

The utilization amount of present SIM card is very huge, whenever be only in the use amount of commercial communication industry and cross hundred million, traditional SIM card is at chip of a card base encapsulation, the client only breaks down lesser calorie off with the fingers and thumb after buying SIM card, insert in the mobile phone and use, it is discarded to block basic remainder, therefore do not cause very large waste to the utilization factor of blocking base is high, there is demand in a large amount of clients both at home and abroad of modern society to the multi-chip SIM card simultaneously, from reducing the demand of cost and environmental protection, we propose two chips of card base encapsulation at a SIM card in addition.

Summary of the invention

Purpose of the present invention is exactly the manufacture method that provides a kind of in order to overcome the defective that above-mentioned prior art exists and enhance productivity, reduce the dual chip SIM card of cost and rejection rate.

Purpose of the present invention can be achieved through the following technical solutions:

A kind of manufacture method of dual chip SIM card is characterized in that, may further comprise the steps:

1) printing;

2) compound;

3) lamination;

4) die-cut;

5) chip gum;

6) Xi Cao;

7) chip package.

Described printing may further comprise the steps:

Mode with front printing or mirror image printing is printed on required printing surface on the packing general-purpose plastics material.

Described general-purpose plastics material is PET or PETG.

Described compound may further comprise the steps:

If adopt the front mode of printing, compound tense printing surface surface respectively is covered with the wear-resisting film of layer of transparent, is filled with one to three layer of encapsulant layer between two-layer printing surface;

If adopt the mirror image mode of printing, compound tense is directly filled one to three layer of packed layer material between two-layer printing surface.

Described lamination may further comprise the steps:

With the material after compound, send into laminating apparatus and carry out lamination, set temperature, appropriateness, the pressure of the bonding needs of different materials, opened into greatly card.

Described die-cut may further comprise the steps:

The large card of opening into of lamination gained is sent into die cutting device, punch out standard compliant card, gained is the card base.

Described chip gum may further comprise the steps:

Every row is packaged with a plurality of chips on the chip carrier band, simultaneously, the chip back is provided with package adhesive tape, impact the pad pasting that to meet die size by cross cutting corresponding chip back position on adhesive tape, pass through simultaneously abutted equipment, pad pasting is sticked in the chip back, finish chip and encapsulate gum at carrier band.

Described Xi Cao may further comprise the steps:

The card base of die-cut gained is put into Xi Cao equipment, and the physical parameter of corresponding chip polish dead slot.

Described chip package may further comprise the steps:

Chip is done physical isolation by air cushion, send into package interface, insert in the dead slot of card base, through hot pressing and colding pressing, enable simultaneously multi-chip test, increase one group of multi-direction measuring head newly at the chip testing track, carry out two-way chip testing, at last encapsulation firmly.

Compared with prior art, the present invention has the production automation that can realize the type smart card, enhances productivity, and reduces cost and rejection rate.

Embodiment

The present invention is described in detail below in conjunction with specific embodiment.

Embodiment

When encapsulating traditional single-chip SIM card, encapsulate simultaneously an other SIM card chip.

In actual production, use the antifriction encapsulation technology of card face, use the air cushion isolation, make the multi-chip SIM card in process, carry out physical isolation, prevent the friction between chip and the card, cause chip to damage and block the reduction of face quality.

Use the multi-chip test technology that testing apparatus is transformed, increase one group of multi-direction measuring head newly at the chip testing track, can carry out two-way chip testing, improve testing efficiency 45%, prevented simultaneously the damage to the card face.

In addition, Zai Xi Cao and chip package stage, can pass through reforming equipment, increase the production line of working simultaneously, enhance productivity.

Concrete steps are as follows:

The first step, printing is printed on required printing surface on the materials such as PET or PETG in the mode of front printing or mirror image printing;

Second step, compound substance adopts the material of described positive printing, respectively covers the layer of transparent film at the skin of two-layer printing surface, is filled with according to actual needs one to three layer of encapsulant layer between two-layer printing surface;

Adopt the material of described minute surface printing, between two-layer printing surface, be filled with one to three layer of packed layer material, be used for filling the printing surface bottom;

In the 3rd step, lamination with described compound substance, is sent into laminating apparatus and is carried out lamination, sets temperature, appropriateness, the pressure of the bonding needs of different materials, and gained is partly for opening into greatly card material;

The 4th step, die-cut, lamination gained large open into card material send into die cutting device, punch out the card that meets standard or actual demand, gained is basic for card;

The 5th step, the chip gum, every row is packaged with a plurality of chips on the chip carrier band, simultaneously, the chip back is provided with package adhesive tape, impacts the pad pasting that to meet die size by cross cutting corresponding chip back position on adhesive tape, passes through simultaneously abutted equipment, pad pasting is sticked in the chip back, finish chip and on carrier band, encapsulate gum;

The 6th step ， Xi Cao puts into Xi Cao equipment with the card base of die-cut gained, and the physical parameter of corresponding chip polish dead slot;

The 7th step, chip package, described chip is done physical isolation by air cushion, send into package interface, insert in the described dead slot, through hot pressing and colding pressing, enable simultaneously multi-chip test, increase one group of multi-direction measuring head newly at the chip testing track, carry out two-way chip testing, at last encapsulation firmly.

Claims (9)

1. the manufacture method of a dual chip SIM card is characterized in that, may further comprise the steps:

1) printing;

2) compound;

3) lamination;

4) die-cut;

5) chip gum;

6) Xi Cao;

7) chip package.

2. the manufacture method of a kind of dual chip SIM card according to claim 1 is characterized in that, described printing may further comprise the steps:

Mode with front printing or mirror image printing is printed on required printing surface on the packing general-purpose plastics material.

3. the manufacture method of a kind of dual chip SIM card according to claim 2 is characterized in that, described general-purpose plastics material is PET or PETG.

4. the manufacture method of a kind of dual chip SIM card according to claim 2 is characterized in that, described compound may further comprise the steps:

If adopt the front mode of printing, compound tense printing surface surface respectively is covered with the wear-resisting film of layer of transparent, is filled with one to three layer of encapsulant layer between two-layer printing surface;

If adopt the mirror image mode of printing, compound tense is directly filled one to three layer of packed layer material between two-layer printing surface.

5. the manufacture method of a kind of dual chip SIM card according to claim 4 is characterized in that, described lamination may further comprise the steps:

With the material after compound, send into laminating apparatus and carry out lamination, set temperature, appropriateness, the pressure of the bonding needs of different materials, opened into greatly card.

6. the manufacture method of a kind of dual chip SIM card according to claim 5 is characterized in that, described die-cut may further comprise the steps:

The large card of opening into of lamination gained is sent into die cutting device, punch out standard compliant card, gained is the card base.

7. the manufacture method of a kind of dual chip SIM card according to claim 6 is characterized in that, described chip gum may further comprise the steps:

Every row is packaged with a plurality of chips on the chip carrier band, simultaneously, the chip back is provided with package adhesive tape, impact the pad pasting that to meet die size by cross cutting corresponding chip back position on adhesive tape, pass through simultaneously abutted equipment, pad pasting is sticked in the chip back, finish chip and encapsulate gum at carrier band.

8. the manufacture method of a kind of dual chip SIM card according to claim 7 is characterized in that, described Xi Cao may further comprise the steps:

The card base of die-cut gained is put into Xi Cao equipment, and the physical parameter of corresponding chip polish dead slot.

9. the manufacture method of a kind of dual chip SIM card according to claim 8 is characterized in that, described chip package may further comprise the steps:

Chip is done physical isolation by air cushion, send into package interface, insert in the dead slot of card base, through hot pressing and colding pressing, enable simultaneously multi-chip test, increase one group of multi-direction measuring head newly at the chip testing track, carry out two-way chip testing, at last encapsulation firmly.