CN102983108A - Packaging structure and packaging technology - Google Patents
Packaging structure and packaging technology Download PDFInfo
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- CN102983108A CN102983108A CN2012104993669A CN201210499366A CN102983108A CN 102983108 A CN102983108 A CN 102983108A CN 2012104993669 A CN2012104993669 A CN 2012104993669A CN 201210499366 A CN201210499366 A CN 201210499366A CN 102983108 A CN102983108 A CN 102983108A
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- rubber film
- insulated rubber
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
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Abstract
The invention discloses a packaging technology, which comprises the following steps: pasting a blue film on a wafer ring of a wafer scriber; pasting an insulated adhesive film on the blue film; cutting the insulated adhesive film into a plurality of insulated adhesive film blocks; separating the insulated adhesive film blocks from the blue film; filling the separated insulated adhesive film blocks on a carrier; and loading a chip on the insulated adhesive film blocks on the carrier. The invention further discloses a packaging and cutting structure which comprises the insulated adhesive film blocks, a packaging and cutting technology to prepare the packaging and cutting structure and a packaging structure formed by the packaging technology. The packaging technology can conveniently control the sizes of the insulated adhesive film blocks and improve the insulation effect of the insulated adhesive film blocks.
Description
Technical field
The present invention relates to semiconductor package and semiconductor process techniques field, particularly relate to a kind of encapsulating structure and packaging technology.
Background technology
In semiconductor package process, for making chip and carrier or other chip chamber realize the bonding of position but during the blocking-up that needs simultaneously to be electrically connected with carrier or other chip chamber, need by the insulated rubber film piece chip attach to carrier or other chip surface.
The size of insulated rubber film piece and thickness are the key technical indexes of weighing insulating capacity, and traditional insulated rubber film piece has two kinds of cuttings and assembly model.
Pattern one: insulated rubber film is sticked on the UV(ultraviolet light) on the film, then the disk of scribing does not stick on the insulated rubber film, size according to chip is carried out scribing to described insulated rubber film and described disk simultaneously, disk is cut into some chips, insulated rubber film is cut into the some insulated rubber film pieces with the chip size same size, and the insulated rubber film piece sticks to chip back.After the scribing disk is placed on the special-purpose UV irradiation unit together with insulated rubber film and UV film and shines, reduce viscosity between UV film and insulated rubber film, provide process conditions for follow-up chip separates with the UV film in the load operation with the insulated rubber film piece.During load, the chip that loader is stained with the back side insulated rubber film piece is contained on the corresponding carrier after the UV film is drawn.The defective of this pattern: need to use special-purpose UV film and UV irradiation apparatus, cost is higher; The insulated rubber film piece cannot be greater than chip size, and insulation effect reduces; Insulated rubber film piece thickness is fixed, and can't superpose the effect of reinforced insulation; Because the disk back side all adheres to insulated rubber film, so the insulated rubber film piece under the ink dot chip is wasted on the disk.
Pattern two: the coil type structure that insulated rubber film is customized in advance one fixed width, append the winding transmission and cut off the insulated rubber film piece that structure cuts into insulated rubber film in the rectangle of certain-length at loader, then use special suction means that the insulated rubber film piece is sticked on carrier surface.Then fill the action of getting chip, with adhesive die attachment on the insulated rubber film piece.The defective of this pattern: need the device outside the supplements on loading device; The width of insulated rubber film is fixed, if need to change width, need to change the insulated rubber film of other width specifications, and the diversity of chip size is brought very high cost to the insulated rubber film manufacturer.
Therefore, how to provide a kind of encapsulating structure and packaging technology, can control easily the size of insulated rubber film piece, improve the insulation effect of insulated rubber film piece, become the problem that those skilled in the art need to solve.
Summary of the invention
The object of the invention is to, a kind of encapsulating structure and packaging technology are provided, can control easily the size of insulated rubber film piece, improve the insulation effect of insulated rubber film piece.
For solving the problems of the technologies described above, the invention provides a kind of encapsulating structure, comprising:
The disk ring of scribing machine;
Blue film, described blue film sticks on the described disk ring;
Insulated rubber film, described insulated rubber film stick on the described blue film, have some insulated rubber film pieces that formed by the scribing machine cutting on the described insulated rubber film.
Further, the cross sectional dimensions of described insulated rubber film is more than or equal to 20cm * 20cm.
Further, the present invention also provides a kind of encapsulation cutting technique, comprising:
Blue film is sticked on the disk ring of scribing machine;
Insulated rubber film is sticked on the described blue film;
Described insulated rubber film is cut into some insulated rubber film pieces.
Further, the cross sectional dimensions of described insulated rubber film is more than or equal to 20cm * 20cm.
Further, the present invention also provides a kind of encapsulating structure, comprising:
Carrier;
Sticked on the insulated rubber film piece that the insulated rubber film on the disk ring of scribing machine forms through the scribing machine cutting by logical blue toner, described insulated rubber film piece is positioned on the described carrier;
Chip, described chip are positioned on the described insulated rubber film piece.
Further, the cross sectional dimensions of described insulated rubber film piece is more than or equal to the cross sectional dimensions of described chip.
Further, described insulated rubber film piece is one deck, or the stacked placement of two the above insulated rubber film pieces.
Further, the present invention also provides a kind of packaging technology, comprising:
Blue film is sticked on the disk ring of scribing machine;
Insulated rubber film is sticked on the described blue film;
Described insulated rubber film is cut into some insulated rubber film pieces;
Described insulated rubber film piece is separated from blue film;
The described insulated rubber film that separates is packaged on a carrier;
One chip is loaded on the described insulated rubber film piece on the described carrier.
Further, described insulated rubber film piece is one deck.
Further, the stacked placement of two the above insulated rubber film pieces.
Further, described chip is loaded on the described insulated rubber film piece of top layer.
Further, by loader described insulated rubber film piece is separated from blue film, separation process comprises:
The recognition system of loader recognizes the described insulated rubber film piece that needs separation;
The thimble system of loader will need the described insulated rubber film piece jack-up of separating;
The absorption Load System of loader is drawn the described insulated rubber film piece of jack-up, and described thimble system returns initial position.
Further, the cross sectional dimensions of described insulated rubber film piece is more than or equal to the cross sectional dimensions of described chip.
Further, the cross sectional dimensions of described insulated rubber film is more than or equal to 20cm * 20cm.
Compared with prior art, encapsulating structure provided by the invention and packaging technology have the following advantages:
1, encapsulating structure provided by the invention and packaging technology, by blue film being sticked on the disk ring of scribing machine, again insulated rubber film is sticked on the described blue film, then described insulated rubber film is cut into some insulated rubber film pieces, compared with prior art, when this packaging technology is cut described insulated rubber film, there is not disk on the described insulated rubber film, so can control easily the size of described insulated rubber film piece, make the size of described insulated rubber film piece can be greater than the size of chip, with when described chip being loaded on the described insulated rubber film piece, can make described chip around have more a part of described insulated rubber film piece, thereby avoided the side electric leakage of described chip, improved the insulating properties of described insulated rubber film piece; And this packaging technology adopts conventional scribing machine can realize described insulated rubber film cutting, and is economical, convenient, saves cost.
2, encapsulating structure provided by the invention and packaging technology, described insulated rubber film sticks on the described disk ring by described blue film, so that follow-up described insulated rubber film piece can be avoided UV-irradiation when blue film separates, can directly by loader described insulated rubber film piece be taken off from blue film, and described insulated rubber film is packaged on a carrier, processing step is simple, and is economical, convenient.
3, encapsulating structure provided by the invention and packaging technology, owing to do not have disk on the described insulated rubber film, so after described insulated rubber film is cut into some insulated rubber film pieces, can be with two stacked being placed on the described carrier of the above insulated rubber film piece, described chip is placed on the stacked described insulated rubber film piece again, method by stacked described insulated rubber film piece increases completely cutting off between described carrier and the described chip, thereby do not needing to change in the situation of thicker described insulated rubber film piece, can improve as required insulating properties between described carrier and the described chip, technique is simple, and saves cost.
Description of drawings
Fig. 1 is the flow chart of encapsulation cutting technique in one embodiment of the invention;
Fig. 2 a-Fig. 2 d is the schematic diagram of encapsulation cutting technique in one embodiment of the invention;
Fig. 3 is the flow chart of packaging technology in one embodiment of the invention;
Fig. 4 a-Fig. 4 f is the schematic diagram of packaging technology in one embodiment of the invention;
Fig. 5 is the schematic diagram of packaging technology in another embodiment of the present invention.
Embodiment
Below in conjunction with schematic diagram encapsulating structure of the present invention and packaging technology are described in more detail, the preferred embodiments of the present invention have wherein been represented, should be appreciated that those skilled in the art can revise the present invention described here, and still realize advantageous effects of the present invention.Therefore, following description is appreciated that extensively knowing for those skilled in the art, and not as limitation of the present invention.
For clear, whole features of practical embodiments are not described.In the following description, be not described in detail known function and structure, the confusion because they can make the present invention owing to unnecessary details.Will be understood that in the exploitation of any practical embodiments, must make a large amount of implementation details to realize developer's specific objective, for example according to relevant system or relevant commercial restriction, change into another embodiment by an embodiment.In addition, will be understood that this development may be complicated and time-consuming, but only be routine work to those skilled in the art.
In the following passage, with way of example the present invention is described more specifically with reference to accompanying drawing.According to the following describes and claims, advantages and features of the invention will be clearer.It should be noted that accompanying drawing all adopts very the form of simplifying and all uses non-accurately ratio, only in order to convenient, the purpose of the aid illustration embodiment of the invention lucidly.
Core concept of the present invention is, a kind of encapsulation cutting structure is provided, the disk ring that comprises scribing machine, blue film sticks on the described disk ring, insulated rubber film sticks on the described blue film, has some insulated rubber film pieces that formed by the scribing machine cutting on the described insulated rubber film, wherein, described insulated rubber film directly sticks on the described blue film, does not paste disk on the described insulated rubber film.
Further, in conjunction with above-mentioned encapsulation cutting structure, the present invention also provides a kind of encapsulation cutting technique, comprising:
Step S11 sticks on blue film on the disk ring of scribing machine;
Step S12 sticks on insulated rubber film on the described blue film;
Step S13 is cut into some insulated rubber film pieces with described insulated rubber film.
Further, in conjunction with above-mentioned encapsulation cutting structure, the present invention also provides a kind of encapsulating structure, comprising: carrier, and described insulated rubber film piece, described insulated rubber film piece is positioned on the described carrier, and chip, described chip are positioned on the described insulated rubber film piece.
Further, in conjunction with above-mentioned encapsulating structure, the present invention also provides a kind of packaging technology, comprising:
Step S21 sticks on blue film on the disk ring of scribing machine;
Step S22 sticks on insulated rubber film on the described blue film;
Step S23 is cut into some insulated rubber film pieces with described insulated rubber film;
Step S24 separates described insulated rubber film piece from blue film;
Step S25, the described insulated rubber film that separates is packaged on a carrier;
Step S26 is loaded into a chip on the described insulated rubber film piece on the described carrier.
Below enumerate several embodiment of described encapsulating structure and packaging technology, to clearly demonstrate content of the present invention, will be clear that, content of the present invention is not restricted to following examples, and the improvement of other routine techniques means by those of ordinary skills is also within thought range of the present invention.
[the first embodiment]
Specify encapsulation cutting structure and encapsulation cutting technique in the present embodiment below in conjunction with Fig. 1 and Fig. 2 a-Fig. 2 d.Wherein, Fig. 1 is the flow chart of encapsulation cutting technique in one embodiment of the invention, and Fig. 2 a-Fig. 2 d is the schematic diagram of encapsulation cutting technique in one embodiment of the invention.
At first, carry out step S11, blue film 102 is sticked on the disk ring 101 of scribing machine, wherein, blue film 102 can be common blue film, and scribing machine can be common scribing machine.
Then, carry out step S12, insulated rubber film 103 is sticked on the described blue film 102, form the structure shown in Fig. 2 a, Fig. 2 b is that Fig. 2 a is along the profile of cutting line A-A'.Wherein, described insulated rubber film 103 is extensive size, and with convenient cutting, better, the cross sectional dimensions of described insulated rubber film 103 is conducive to make the insulated rubber film piece of cutting abundant to satisfy the needs of chip more than or equal to 20cm * 20cm.
Then, carry out step S13, described insulated rubber film 103 is cut into some insulated rubber film pieces 104, form the structure shown in Fig. 2 c, the structure shown in Fig. 2 c is the encapsulation cutting structure, and Fig. 2 d is that Fig. 2 c is along the profile of cutting line B-B '.Because described insulated rubber film piece 104 is directly to cut into slices on slicing machine, in the encapsulation cutting structure, the size of described insulated rubber film piece 104 can be cut at slicing machine as required.
Specify encapsulating structure and packaging technology in the present embodiment below in conjunction with Fig. 3 and Fig. 4 a-Fig. 4 f.Wherein, Fig. 3 is the flow chart of packaging technology in one embodiment of the invention, and Fig. 4 a-Fig. 4 f is the schematic diagram of packaging technology in one embodiment of the invention.In the present embodiment, the described insulated rubber film piece 104 in the described encapsulating structure is one deck.
As shown in Figure 3, packaging technology is that packaging technology is carried out first step S21 ~ step S23 on the basis of encapsulation cutting technique, wherein, step S21 ~ step S23 with encapsulate cutting technique step S11 ~ step S13 is identical.
Then, carry out step S24, described insulated rubber film piece 104 is separated from blue film 102.In the present embodiment, by loader described insulated rubber film piece 104 is separated from blue film 102.Because in the present embodiment, described insulated rubber film piece 104 directly sticks on the blue film 102, and having avoided being attached to needs irradiation to separate on the UV film, directly can realize described insulated rubber film piece 104 is separated from blue film 102 by loader, simple and convenient, save technological process.Wherein, separation process comprises:
The recognition system 105 of loader recognizes the described insulated rubber film piece 104 that needs separation, and is located, shown in Fig. 4 a;
The thimble system 106 of loader will need described insulated rubber film piece 104 jack-up of separating, shown in Fig. 4 b;
The absorption Load System 107 of loader is drawn the described insulated rubber film piece 104 of jack-up, and described thimble system 106 returns initial positions, so that the described insulated rubber film piece 104 that needs to separate separates from described blue film 102, shown in Fig. 4 c.Because described blue film 102 is not cut in step S23 fully, so when described thimble system 106 returns initial position, described blue film 102 also restores to the original state, and drawn by described absorption Load System 107 by the described insulated rubber film piece 104 of jack-up, there is a difference in height in described blue film 102 with the described insulated rubber film piece 104 of being drawn, and the described insulated rubber film piece 104 of being drawn is separated with described blue film 102.
Subsequently, carry out step S25, the described insulated rubber film piece 104 that separates is contained on the carrier 108.Because in the present embodiment, described insulated rubber film piece 104 was realized with separating by loader of described blue film 102, so utilization is drawn Load System 107 described insulated rubber film piece 104 is contained on the carrier 108, shown in Fig. 4 d, form the structure shown in Fig. 4 e.
At last, carry out step S26, because in the present embodiment, described insulated rubber film piece 104 in the described encapsulating structure is one deck, so, after described carrier 108 loads a described insulated rubber film piece 104, a chip 109 is loaded on the described insulated rubber film piece 104 on the described carrier 108, shown in Fig. 4 f.Better, the cross sectional dimensions of described insulated rubber film piece 104 is more than or equal to the cross sectional dimensions of described chip 109, can make described chip 109 around have more a part of described insulated rubber film piece 104, thereby avoided the side electric leakage of described chip 109, improved the insulating properties of described chip 109 and described carrier 108.
[the second embodiment]
Below please refer to Fig. 5 and specify described encapsulating structure, wherein, Fig. 5 is the schematic diagram of packaging technology in another embodiment of the present invention.The second embodiment is on the basis of the first embodiment, and difference is, two the above insulated rubber film piece 104 stacked placements in the described encapsulating structure of the second embodiment.
In the present embodiment, described packaging technology is after step S25, repeating step S24 and step S25, with two the above insulated rubber film pieces, 104 stacked being placed on the described carrier 108, and described chip 109 is loaded on the described insulated rubber film piece 104 of top layer, as shown in Figure 5, method by stacked described insulated rubber film piece 104 increases completely cutting off between described carrier 108 and the described chip 109, thereby do not needing to change in the situation of thicker described insulated rubber film piece 104, can improve as required insulating properties between described carrier 108 and the described chip 109, technique is simple, and saves cost.Wherein, the number of stacked described insulated rubber film piece 104 does not limit, and quantity is more, and insulating properties is better between described carrier 108 and the described chip 109, as being 3 layers, 5 layers, 10 layers etc., makes the stacked of the different numbers of plies according to the requirement of insulating properties.
In sum, the invention provides a kind of encapsulation cutting structure, the disk ring that comprises scribing machine, blue film sticks on the described disk ring, insulated rubber film sticks on the described blue film, has some insulated rubber film pieces that formed by the scribing machine cutting on the described insulated rubber film, wherein, described insulated rubber film directly sticks on the described blue film, does not paste disk on the described insulated rubber film.Compared with prior art, the present invention has the following advantages:
1, encapsulating structure provided by the invention and packaging technology, by blue film being sticked on the disk ring of scribing machine, again insulated rubber film is sticked on the described blue film, then described insulated rubber film is cut into some insulated rubber film pieces, compared with prior art, when this packaging technology is cut described insulated rubber film, there is not disk on the described insulated rubber film, so can control easily the size of described insulated rubber film piece, make the size of described insulated rubber film piece can be greater than the size of chip, with when described chip being loaded on the described insulated rubber film piece, can make described chip around have more a part of described insulated rubber film piece, thereby avoided the side electric leakage of described chip, improved the insulating properties of described insulated rubber film piece; And this packaging technology adopts conventional scribing machine can realize described insulated rubber film cutting, and is economical, convenient, saves cost.
2, encapsulating structure provided by the invention and packaging technology, described insulated rubber film sticks on the described disk ring by described blue film, so that follow-up described insulated rubber film piece can be avoided UV-irradiation when blue film separates, can directly by loader described insulated rubber film piece be taken off from blue film, and described insulated rubber film is packaged on a carrier, processing step is simple, and is economical, convenient.
3, encapsulating structure provided by the invention and packaging technology, owing to do not have disk on the described insulated rubber film, so after described insulated rubber film is cut into some insulated rubber film pieces, can be with two stacked being placed on the described carrier of the above insulated rubber film piece, described chip is placed on the stacked described insulated rubber film piece again, method by stacked described insulated rubber film piece increases completely cutting off between described carrier and the described chip, thereby do not needing to change in the situation of thicker described insulated rubber film piece, can improve as required insulating properties between described carrier and the described chip, technique is simple, and saves cost.
Obviously, those skilled in the art can carry out various changes and modification to the present invention and not break away from the spirit and scope of the present invention.Like this, if of the present invention these are revised and modification belongs within the scope of claim of the present invention and equivalent technologies thereof, then the present invention also is intended to comprise these changes and modification interior.
Claims (14)
1. one kind encapsulates cutting structure, comprising:
The disk ring of scribing machine;
Blue film, described blue film sticks on the described disk ring;
Insulated rubber film, described insulated rubber film stick on the described blue film, have some insulated rubber film pieces that formed by the scribing machine cutting on the described insulated rubber film.
2. encapsulation cutting structure as claimed in claim 1 is characterized in that, the cross sectional dimensions of described insulated rubber film is more than or equal to 20cm * 20cm.
3. one kind encapsulates cutting technique, comprising:
Blue film is sticked on the disk ring of scribing machine;
Insulated rubber film is sticked on the described blue film;
Described insulated rubber film is cut into some insulated rubber film pieces.
4. encapsulation cutting technique as claimed in claim 3 is characterized in that, the cross sectional dimensions of described insulated rubber film is more than or equal to 20cm * 20cm.
5. encapsulating structure comprises:
Carrier;
Sticked on the insulated rubber film piece that the insulated rubber film on the disk ring of scribing machine forms through the scribing machine cutting by logical blue toner, described insulated rubber film piece is positioned on the described carrier;
Chip, described chip are positioned on the described insulated rubber film piece.
6. encapsulating structure as claimed in claim 5 is characterized in that, the cross sectional dimensions of described insulated rubber film piece is more than or equal to the cross sectional dimensions of described chip.
7. such as the described encapsulating structure of any one among the claim 5-6, it is characterized in that described insulated rubber film piece is one deck, or the stacked placement of two the above insulated rubber film pieces.
8. packaging technology comprises:
Blue film is sticked on the disk ring of scribing machine;
Insulated rubber film is sticked on the described blue film;
Described insulated rubber film is cut into some insulated rubber film pieces;
Described insulated rubber film piece is separated from blue film;
The described insulated rubber film that separates is packaged on a carrier;
One chip is loaded on the described insulated rubber film piece on the described carrier.
9. packaging technology as claimed in claim 8 is characterized in that, described insulated rubber film piece is one deck.
10. packaging technology as claimed in claim 8 is characterized in that, the stacked placement of two the above insulated rubber film pieces.
11. packaging technology as claimed in claim 10 is characterized in that, described chip is loaded on the described insulated rubber film piece of top layer.
12., it is characterized in that by loader described insulated rubber film piece is separated from blue film, separation process comprises such as the described packaging technology of any one among the claim 8-11:
The recognition system of loader recognizes the described insulated rubber film piece that needs separation;
The thimble system of loader will need the described insulated rubber film piece jack-up of separating;
The absorption Load System of loader is drawn the described insulated rubber film piece of jack-up, and described thimble system returns initial position.
13. such as the described packaging technology of any one among the claim 8-11, it is characterized in that the cross sectional dimensions of described insulated rubber film piece is more than or equal to the cross sectional dimensions of described chip.
14. such as the described packaging technology of any one among the claim 8-11, it is characterized in that the cross sectional dimensions of described insulated rubber film is more than or equal to 20cm * 20cm.
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| CN201210499366.9A CN102983108B (en) | 2012-11-27 | 2012-11-27 | Encapsulating structure and packaging technology |
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| CN201210499366.9A CN102983108B (en) | 2012-11-27 | 2012-11-27 | Encapsulating structure and packaging technology |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN105390403A (en) * | 2015-10-13 | 2016-03-09 | 中国电子科技集团公司第五十四研究所 | Substrate chamber filling method in manufacture of low-temperature co-fired ceramic (LTCC) thick-film mixed substrate |
| CN108480853A (en) * | 2018-03-01 | 2018-09-04 | 浙江华越芯装电子股份有限公司 | A kind of cutting method and application method of bonding high temperature dwell cuticula |
| CN108648999A (en) * | 2018-05-08 | 2018-10-12 | 广西桂芯半导体科技有限公司 | Method for packing semiconductor |
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| CN202021640U (en) * | 2011-03-07 | 2011-11-02 | 苏州鼎旺科技有限公司 | Cutting clamp of optical filter for optical communication |
| CN102431951A (en) * | 2011-12-31 | 2012-05-02 | 天水华天科技股份有限公司 | Double-carrier and double-MEMS (micro-electro-mechanical systems) device package and production method thereof |
| CN202917467U (en) * | 2012-11-27 | 2013-05-01 | 杭州士兰集成电路有限公司 | Packaging cutting structure and packaging structure |
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| CN101694838A (en) * | 2009-10-17 | 2010-04-14 | 天水华天科技股份有限公司 | Packaging part with double flat surfaces and no pins and production method thereof |
| CN202021640U (en) * | 2011-03-07 | 2011-11-02 | 苏州鼎旺科技有限公司 | Cutting clamp of optical filter for optical communication |
| CN102431951A (en) * | 2011-12-31 | 2012-05-02 | 天水华天科技股份有限公司 | Double-carrier and double-MEMS (micro-electro-mechanical systems) device package and production method thereof |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN105390403A (en) * | 2015-10-13 | 2016-03-09 | 中国电子科技集团公司第五十四研究所 | Substrate chamber filling method in manufacture of low-temperature co-fired ceramic (LTCC) thick-film mixed substrate |
| CN105390403B (en) * | 2015-10-13 | 2017-10-20 | 中国电子科技集团公司第五十四研究所 | A kind of substrate cavity fill method in LTCC thick films electric hybrid board manufacture |
| CN108480853A (en) * | 2018-03-01 | 2018-09-04 | 浙江华越芯装电子股份有限公司 | A kind of cutting method and application method of bonding high temperature dwell cuticula |
| CN108648999A (en) * | 2018-05-08 | 2018-10-12 | 广西桂芯半导体科技有限公司 | Method for packing semiconductor |
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| CN102983108B (en) | 2016-01-20 |
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Effective date of registration: 20170113 Address after: Jintang County of Chengdu City, Sichuan province 610400 Huai Town, core Road No. 9 (Chengdu - ABA Industrial Development Zone) Patentee after: Chengdu jeakco science and Technology Co Ltd Address before: Hangzhou City, Zhejiang Province, Zhejiang Province, Hangzhou 310018 (Xiasha) No. 10 East Road, economic and Technological Development Zone No. 308 Patentee before: Hangzhou Silan Integrated Circuit Co., Ltd. |