CN108480853A - A kind of cutting method and application method of bonding high temperature dwell cuticula - Google Patents
A kind of cutting method and application method of bonding high temperature dwell cuticula Download PDFInfo
- Publication number
- CN108480853A CN108480853A CN201810170598.7A CN201810170598A CN108480853A CN 108480853 A CN108480853 A CN 108480853A CN 201810170598 A CN201810170598 A CN 201810170598A CN 108480853 A CN108480853 A CN 108480853A
- Authority
- CN
- China
- Prior art keywords
- high temperature
- temperature dwell
- cuticula
- dwell cuticula
- scribing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/70—Auxiliary operations or equipment
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/70—Auxiliary operations or equipment
- B23K26/702—Auxiliary equipment
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B26—HAND CUTTING TOOLS; CUTTING; SEVERING
- B26D—CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
- B26D1/00—Cutting through work characterised by the nature or movement of the cutting member or particular materials not otherwise provided for; Apparatus or machines therefor; Cutting members therefor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
- H01L21/4814—Conductive parts
- H01L21/4885—Wire-like parts or pins
Abstract
A kind of cutting method and application method of bonding high temperature dwell cuticula, are related to integrated antenna package technical field, a kind of to be bonded the cutting method for using high temperature dwell cuticula,（1）Prepare one piece of smooth sheet iron；（2）The blue film of scribing is entirely affixed on sheet iron；（3）The high temperature dwell cuticula that need to be cut entirely is affixed on the blue film of scribing；（4）The sheet iron for posting blue film and high temperature dwell cuticula is placed in scribing machine to wait at scribing；（5）It adjusts the position of scribing machine knife blade or the parameter of scribing machine is set；（6）High temperature dwell cuticula is cut into the square of 1.5*1.5mm or 2.0*2.0mm.A kind of application method of bonding high temperature dwell cuticula,（1）Groove is checked before patch（2）The high temperature dwell cuticula of well cutting is placed in the groove of heating bottom plate of integrated circuit；（3）High temperature dwell cuticula is entirely affixed on groove.Present invention segmentation film method is easy to operate, and speed is fast；It is good to cut film effect, flash is not present, the problems such as cause not of uniform size.
Description
Technical field
The present invention relates to the cutting methods and application method of a kind of bonding high temperature dwell cuticula, belong to integrated antenna package skill
Art field.
Background technology
Before integrated antenna package process is bonded operation, since there are gaps to lead to key between lead frame and equipment bay
Product quality is affected and causes the output capacity of equipment low when conjunction, so needing to carry out in the heat block groove of bonding pedestal
Pad pasting is widely used in bond sequence SOP16-8R (60*60), on the areas SOP8-8R (60*60) Deng little PAD product.Past uses
Film is cut manually, is had the following disadvantages：
1, cutting speed is slow, and a film is cut into the blockage of 1.5mm ~ 3.0mm or so by palpus manual method, it usually needs flower
Take 30 minutes to 1 hours；
2, cutting effect is poor, square only 2mm that must be cut out or so, can not grasp its size, cause not of uniform size, blade abrasion manually
Square edge is caused to have flash.
3, the loss of high temperature dwell cuticula is big, cuts a film in manual methods, it will usually have 20% ~ 40% area that can not use.
While not simply failing to squeeze ball in terms of other, improve in terms of not viscous an etc. weldering, and reduce machine UPH, effect
It cannot meet the requirements.In addition, when processing small PAD products, it is same difficult；It can not be added not against pad pasting in actual production
Work.In view of this, the applicant specializes in this, develops a kind of cutting method of bonding high temperature dwell cuticula and make
With method, thus this case generates.
Invention content
In order to solve drawbacks described above existing in the prior art, the object of the present invention is to provide a kind of easy to operate, speed
Soon, the cutting method and application method of film effect good bonding high temperature dwell cuticula are cut, to achieve the goals above, the present invention adopts
The technical solution taken is as follows：
A kind of cutting method of bonding high temperature dwell cuticula, includes the following steps：
Step（1）Prepare one piece of smooth sheet iron；
Step（2）The blue film of scribing is entirely affixed on sheet iron；
Step（3）The high temperature dwell cuticula that need to be cut entirely is affixed on the blue film of scribing；
Step（4）The sheet iron for posting blue film and high temperature dwell cuticula is placed in scribing machine to wait at scribing；
Step（5）It adjusts the position of scribing machine knife blade or the parameter of scribing machine is set；
Step（6）High temperature dwell cuticula is cut into the square of 1.5*1.5mm or 2.0*2.0mm.
The indigo plant film uses SPV-225RB indigo plant films, specification 230mm*100mm.
The step（5）In, setting cutting stepping rate 90+/- 5mm/s, cutting ruler modest ability * wide 1-2mm.
The scribing machine is mechanical scribing machine, laser scribing means or laser scribing machine.
A kind of application method of bonding high temperature dwell cuticula, includes the following steps：
Step（1）Check that groove, retaining groove are smooth clean before patch；
Step（2）By the high temperature dwell cuticula of well cutting with tweezers select suitable size be placed on integrated circuit heating bottom plate it is recessed
In slot；
Step（3）High temperature dwell cuticula is entirely affixed on groove.
The high temperature protection membrane area pasted is not more than groove area.
The present invention can realize following technique effect：
（1）Easy to operate, speed is fast；
（2）It is good to cut film effect, flash is not present, the problems such as cause not of uniform size；
（3）The specification of various models can be cut into according to demand；
（4）The loss of high temperature dwell cuticula is small, except edge part exceptionally can all use；
（5）Bonding spherical shape after pad pasting is uniform in size, undeformed, to ensure that product quality provides solid foundation；
（6）So that bonding wire pulling force, solder joint thrust is increased, and is extended the downtime after pad pasting, is welded from considerably increasing
Stability, improve the quality and performance of product.
Description of the drawings
Fig. 1 is high temperature dwell cuticula, blue film and the sheet iron combination diagram after the cutting of the present embodiment cutting method；
Fig. 2 is the solder joint spherical shape schematic diagram for not using the present embodiment to cut film and method for adhering film；
Fig. 3 is the solder joint spherical shape schematic diagram that film and method for adhering film are cut using the present embodiment.
Mark explanation：Sheet iron 1, blue film 2, high temperature dwell cuticula 3 encapsulate IC chip 4, bond ball 5.
Specific implementation mode
In order to make the attainable technique effect of technological means and its institute of the present invention, more perfect exposure can be become apparent from,
One embodiment is hereby provided, and is described in detail as follows in conjunction with attached drawing：
As shown in FIG. 1, FIG. 1 is high temperature dwell cuticula 3, blue film 2 and the combinations of sheet iron 1 after cutting method of the present invention cutting to show
It is intended to, a kind of bonding cutting method of high temperature dwell cuticula 3 of the present embodiment includes the following steps：
Step（1）Prepare one piece of smooth sheet iron 1；
Step（2）The blue film 2 of scribing is entirely affixed on sheet iron 1；
Step（3）The high temperature dwell cuticula 3 that need to be cut entirely is affixed on the blue film 2 of scribing；
Step（4）The sheet iron 1 for posting blue film 2 and high temperature dwell cuticula 3 is placed in scribing machine to wait at scribing；
Step（5）It adjusts the position of scribing machine knife blade or the parameter of scribing machine is set；
Step（6）High temperature dwell cuticula 3 is cut into the square of 1.5*1.5mm or 2.0*2.0mm.
Blue film 2 is using SPV-225RB indigo plants film 2, specification 230mm*100mm.
Step（5）In, setting cutting stepping rate 90+/- 5mm/s, cutting ruler modest ability * wide 1-2mm.
Scribing machine is mechanical scribing machine, laser scribing means or laser scribing machine.
A kind of bonding application method of high temperature dwell cuticula 3 of the present embodiment, includes the following steps：
Step（1）Check that groove, retaining groove are smooth clean before patch；
Step（2）Suitable size is selected to be placed on integrated circuit dedicated heating bottom with tweezers the high temperature dwell cuticula 3 of well cutting
In the groove of plate；
Step（3）High temperature dwell cuticula 3 is entirely affixed on groove.
3 area of high temperature dwell cuticula pasted is not more than groove area.
Points for attention when pad pasting：
1, being checked before patch must be smooth clean in groove.
2, position need to be put just when pad pasting.
3, the membrane area pasted is not greater than groove area.
4, the film pasted must keep smooth surrounding to develop.
5, heat block has just removed in this way before pad pasting, need to be operated after its cooling, prevent from scalding.
Using push-and-pull force tester：Daye Serise 4000 to before pad pasting and after pad pasting bonding wire and solder joint carry out pulling force respectively
Test and thrust test, and the downtime of the encapsulation integrated circuit before statistics pad pasting and after pad pasting respectively, obtain following table
As a result：
It is using the method pad pasting of the present embodiment and without the method pad pasting using the present embodiment, effect in actual production below
Fruit contrast table：
As seen from the above table, clearly using the effect after the method pad pasting of the present embodiment in actual production, when disorderly closedown
Between at least increase by 30 minutes, be pad pasting before 10 times or more；Bonding wire pulling force greatly increases simultaneously, is 3 times or more before pad pasting；
Solder joint thrust greatly increases, and is 1.6 times before pad pasting.
As shown in Figures 2 and 3, Fig. 2 is the solder joint spherical shape schematic diagram for not using the present embodiment to cut film and method for adhering film, and Fig. 3 is to use
The present embodiment cuts the solder joint spherical shape schematic diagram of film and method for adhering film, and from actual effect, the bonding spherical shape size after pad pasting is equal
It is even, undeformed, to ensure that product quality provides solid foundation.
To the technical solution of the present embodiment, the stability of welding is considerably increased, the quality and performance of product are improved.
In conclusion the present embodiment is easy to operate, speed is fast；It is good to cut film effect, flash is not present, the problems such as cause not of uniform size；
The specification of various models can be cut into according to demand；High temperature dwell cuticula 3 be lost it is small, except edge part exceptionally can all use.
The above content is combine the preferred embodiment of the present invention to made by provided technical solution further specifically
It is bright, and it cannot be said that the present invention specific implementation be confined to it is above-mentioned these explanation, for the common skill of the technical field of the invention
For art personnel, without departing from the inventive concept of the premise, a number of simple deductions or replacements can also be made, all should be considered as
It belongs to the scope of protection of the present invention.
Claims (6)
1. a kind of cutting method of bonding high temperature dwell cuticula, which is characterized in that include the following steps：
Step（1）Prepare one piece of smooth sheet iron；
Step（2）The blue film of scribing is entirely affixed on sheet iron；
Step（3）The high temperature dwell cuticula that need to be cut entirely is affixed on the blue film of scribing；
Step（4）The sheet iron for posting blue film and high temperature dwell cuticula is placed in scribing machine to wait at scribing；
Step（5）It adjusts the position of scribing machine knife blade or the parameter of scribing machine is set；
Step（6）High temperature dwell cuticula is cut into the square of 1.5*1.5mm or 2.0*2.0mm.
2. a kind of cutting method of bonding high temperature dwell cuticula as described in claim 1, it is characterised in that：The indigo plant film uses
SPV-225RB indigo plant films.
3. a kind of cutting method of bonding high temperature dwell cuticula as described in claim 1, it is characterised in that：The step（5）
In, setting cutting stepping rate 90+/- 5mm/s, cutting ruler modest ability * wide 1-2mm.
4. a kind of cutting method of bonding high temperature dwell cuticula as described in claim 1, it is characterised in that：The scribing machine is
Mechanical scribing machine, laser scribing means or laser scribing machine.
5. a kind of application method of bonding high temperature dwell cuticula, which is characterized in that include the following steps：
Step（1）Check that groove, retaining groove are smooth clean before patch；
Step（2）By the high temperature dwell cuticula of well cutting with tweezers select suitable size be placed on integrated circuit heating bottom plate it is recessed
In slot；
Step（3）High temperature dwell cuticula is entirely affixed on groove.
6. a kind of application method of bonding high temperature dwell cuticula as claimed in claim 5, it is characterised in that：The high temperature dwell pasted
Cuticula area is not more than groove area.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810170598.7A CN108480853A (en) | 2018-03-01 | 2018-03-01 | A kind of cutting method and application method of bonding high temperature dwell cuticula |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810170598.7A CN108480853A (en) | 2018-03-01 | 2018-03-01 | A kind of cutting method and application method of bonding high temperature dwell cuticula |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN108480853A true CN108480853A (en) | 2018-09-04 |
Family
ID=63340872
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810170598.7A Pending CN108480853A (en) | 2018-03-01 | 2018-03-01 | A kind of cutting method and application method of bonding high temperature dwell cuticula |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN108480853A (en) |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4034142B2 (en) * | 2002-08-06 | 2008-01-16 | 株式会社半導体エネルギー研究所 | Flow sensor |
| CN101835865A (en) * | 2007-12-03 | 2010-09-15 | Lg化学株式会社 | Dicing die bonding film and dicing method |
| CN202736909U (en) * | 2012-08-31 | 2013-02-13 | 天水华天科技股份有限公司 | Pagoda type IC chip stacking package piece of lead wire frame |
| CN102983108A (en) * | 2012-11-27 | 2013-03-20 | 杭州士兰集成电路有限公司 | Packaging structure and packaging technology |
| CN103337483A (en) * | 2013-05-14 | 2013-10-02 | 天水华天科技股份有限公司 | Ultrathin VSOP (very thin small outline package) packaging part and production method thereof |
| CN103811537A (en) * | 2014-03-05 | 2014-05-21 | 上海新储集成电路有限公司 | Large-size wafer and preparation method thereof |
| CN106670735A (en) * | 2016-08-31 | 2017-05-17 | 北京时代民芯科技有限公司 | High-precision welding piece cutting method |
-
2018
- 2018-03-01 CN CN201810170598.7A patent/CN108480853A/en active Pending
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4034142B2 (en) * | 2002-08-06 | 2008-01-16 | 株式会社半導体エネルギー研究所 | Flow sensor |
| CN101835865A (en) * | 2007-12-03 | 2010-09-15 | Lg化学株式会社 | Dicing die bonding film and dicing method |
| CN202736909U (en) * | 2012-08-31 | 2013-02-13 | 天水华天科技股份有限公司 | Pagoda type IC chip stacking package piece of lead wire frame |
| CN102983108A (en) * | 2012-11-27 | 2013-03-20 | 杭州士兰集成电路有限公司 | Packaging structure and packaging technology |
| CN103337483A (en) * | 2013-05-14 | 2013-10-02 | 天水华天科技股份有限公司 | Ultrathin VSOP (very thin small outline package) packaging part and production method thereof |
| CN103811537A (en) * | 2014-03-05 | 2014-05-21 | 上海新储集成电路有限公司 | Large-size wafer and preparation method thereof |
| CN106670735A (en) * | 2016-08-31 | 2017-05-17 | 北京时代民芯科技有限公司 | High-precision welding piece cutting method |
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| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20180904 |