JP2006277641A - Ic chip interior sheet - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an IC chip interior sheet with a flat sheet surface which can be manufactured without damaging an IC chip and without passing through a complicated manufacturing process. <P>SOLUTION: In the IC chip interior sheet 1, an IC chip inlet sheet 5 is laminated between surface and rear coating layers 2 and 3 made of paper bases through an adhesive layer 4. In the paper base constituting at least one of the coating layers 2 and 3 between the surface and rear coating layers 2 and 3, a thickness deformation ratio is ≥20% when compressive stress is 2.0 MPa and in addition, thickness deformation value is ≥0.1 mm in a compression test in a thickness direction. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to an IC chip interior sheet having a structure in which an IC chip inlet sheet is laminated between front and back coating layers made of a paper substrate, and can be used as a generally used non-contact type IC tag, IC card or the like.

  Conventionally, magnetic cards and bar codes using magnetic characteristics have been used as information recording media, but the capacity of the recording media is limited. Therefore, in recent years, IC (Integrated Circuit) has attracted attention as a large-capacity variable information recording medium. For example, an IC tag (next-generation barcode, wireless IC chip, wireless IC tag, IC label, non-contact) IC cards, electronic tags, non-contact type IC tags, smart tags, RFID (Radio Frequency Identification) tags, etc., and so on). This IC tag is a component (an “IC chip inlet sheet”) in which an antenna circuit for obtaining power and signals from the outside and a wireless IC chip as an information recording medium are coupled based on the principle of electromagnetic induction by electromagnetic waves and microwaves. Information communication recording is possible without contact. In this IC chip inlet sheet, for example, an antenna circuit is formed on the insulating base material surface of polyethylene terephthalate (PET) by a copper etching method or a silver paste screen printing method, and an anisotropic conductive resin is interposed on the circuit board. It is created by mounting an IC chip. Usually, this IC chip inlet sheet is generally coated with a synthetic resin or laminated with a synthetic resin and used as a tag or a card.

  On the other hand, if this IC chip inlet sheet is attached to paper products such as gift certificates, tickets, securities, and tags for assembly parts, forgery prevention, distribution route recording, delivery / inventory management, and the like can be performed. As a method of attaching an IC chip inlet sheet to a paper product, there is a method of directly attaching the IC chip inlet sheet to a paper base material. However, this method has a problem of security such that the IC chip inlet sheet is dropped or easily replaced.

  As a method of attaching an IC chip inlet sheet to a paper product without causing such a security problem, there is a method of installing an IC chip inlet sheet in a paper product. A method is disclosed in which an IC chip inlet sheet is sandwiched between a first layer and a second layer of a two-layer paper making, and the paper layers of the first layer and the second layer are compressed and embedded.

By the way, not only a paper product but the method of laminating an IC chip inlet sheet between two sheets via an adhesive layer is known as a general method for embedding an IC chip inlet sheet in an IC tag. . However, since the thickness of the IC chip is 0.15 mm to 0.60 mm, a protrusion due to the thickness of the IC chip is formed on the surface of the IC tag in which the IC chip is embedded, and the flatness is deteriorated. If an external force is applied to the part, there is a risk that the IC chip is destroyed. Therefore, as a method for interiorizing an IC chip inlet sheet while solving such a problem, Patent Document 2 discloses a method for covering an IC chip inlet sheet by sandwiching the IC chip inlet sheet with a covering layer on the front and back sides together with a spacer sheet. .
JP 2004-102353 A JP 2003-346111 A

  However, when an IC chip inlet sheet is embedded in a paper product by the method disclosed in Patent Document 1, it passes through a paper making process, that is, a pressing, drying, and finishing (calendering) process. Further, there is a possibility that the IC chip is destroyed by the pressure at the time of calendar processing, and there is a problem in the yield of the product. A method of bypassing the calendar process is also conceivable, but it is not common in normal paper machine operations.

  On the other hand, when the method disclosed in Patent Document 2 is applied and an IC chip inlet sheet is embedded in a paper product using the sheet as a paper base material, the surface becomes flat, and therefore the IC chip is less likely to be destroyed. Depending on the type of IC chip, the spacer sheet also needs to be changed in a complicated manner, and the manufacturing process becomes complicated by increasing the number of steps for inserting the spacer sheet, which may increase the manufacturing cost.

  An object of the present invention is to provide an IC chip interior sheet which has a flat sheet surface and can be manufactured without being broken and without undergoing complicated manufacturing processes.

  To achieve the above object, the invention according to claim 1 is an IC chip interior sheet in which an IC chip inlet sheet is laminated via an adhesive layer between front and back coating layers made of a paper base material, Among the front and back coating layers, the paper base material constituting at least one of the coating layers has a thickness deformation rate of 20% or more when the compression stress is 2.0 MPa in a compression test in the thickness direction, The thickness deformation amount is 0.1 mm or more.

  In the invention according to the first aspect, in the compression test in the thickness direction, the thickness deformation rate when the compressive stress is 2.0 MPa is 20% or more, and the thickness deformation amount is 0.1 mm or more. The coating layer made of the paper base material is deformed, the thickness of the IC chip is absorbed, and the sheet surface becomes flat.

  According to the present invention, in the compression test in the thickness direction, the thickness deformation rate when the compressive stress is 2.0 MPa is 20% or more, and the thickness deformation amount is 0.1 mm or more. Since the thickness of the IC chip is absorbed by the covering layer, the IC chip interior sheet having a flat sheet surface can be obtained without breaking the IC chip and without undergoing a complicated manufacturing process. it can.

Hereinafter, an example of an embodiment of an IC chip interior sheet according to the present invention will be described.
FIG. 1 is a schematic sectional view showing an example of an embodiment of an IC chip interior sheet according to the present invention.

  In an IC chip interior sheet 1 shown in FIG. 1, an IC chip inlet sheet 5 is laminated via an adhesive layer 4 between front and back coating layers 2 and 3 made of a paper base material. Here, the IC chip inlet sheet 5 is configured by mounting an IC chip 7 on an antenna sheet 6 and is mounted so that the IC chip 7 is on the coating layer 2 side.

  The paper base material constituting the coating layers 2 and 3 can be appropriately selected depending on the thickness of the IC chip interior sheet 1, but at least on the side where the convex portion 8 is formed by the thickness of the IC chip 7. As the paper base material of the coating layer 2, the thickness deformation rate when the compressive stress is 2.0 MPa is 20% or more and the thickness deformation amount is 0.1 mm or more in the compression test in the thickness direction. A paper substrate is selected. Here, the thickness deformation amount is a reduction amount (mm) of the paper thickness when a compression stress of 2.0 MPa is applied in the thickness direction of the paper using a compression tester specified in JIS B 7733. The thickness deformation rate is a value (%) obtained by dividing the amount of compressive deformation by the thickness before the test.

  When the compression deformation rate of the paper base material is less than 20%, the coating layer 2 (and the coating layer 3) is used to absorb the convex portions 8 formed by the thickness of the IC chip 7 of 0.15 mm to 0.60 mm. ) Must be thickened, which is disadvantageous in terms of cost. Further, when the amount of compressive deformation of the paper base material is less than 0.1 mm, the convex portion 8 formed by the thickness of the IC chip 7 cannot be absorbed, and the convex portion is formed on the surface of the IC chip interior sheet 1. The part 8 protrudes and flatness is impaired. Therefore, if it is attempted to smooth the protrusion on the surface of the sheet in post-processing, the pressure applied to the IC chip 7 increases, which is not preferable because the IC chip 7 is destroyed.

  Examples of the paper base material constituting the coating layer 2 (and the coating layer 3) include a natural paper that has been moderately beaten or a paper sheet made of a raw material in which one or more synthetic fibers are mixed. The stretched paper produced by shrinkage treatment by a shrinkage imparting device as described in Table No. 11-509276 is excellent in both the thickness compression deformation rate and the amount of compression deformation. Can be used.

  In addition to this, as a paper substrate constituting the coating layer 2 (and the coating layer 3), for example, stretched paper obtained by a method as described in JP-A-2004-3071 has a thickness of Since both the compression deformation rate and the amount of compression deformation are excellent, this can be suitably used. Here, the stretched paper will be specifically described. This stretched paper is made of natural pulp that has been moderately beaten, or wet paper in which the moisture content of a paper sheet made from a raw material mixed with one or more synthetic fibers is adjusted to 20% to 50% on the roll circumference. Provided with a pair of press rolls consisting of a hard roll provided with grooves along the circumferential direction at predetermined intervals in the width direction of the roll and a soft roll with a flat roll peripheral surface, and the peripheral speed of the hard roll under pressure On the other hand, it is obtained by passing the paper through a shrinkage imparting device in which the peripheral speed of the soft roll is slowed to rotate and shrinking the web, and drying it after the treatment. In the shrinkage imparting device, the grooves along the circumferential direction of the hard roll have a width of 0.3 mm to 1.5 mm and a depth of 0.5 mm to 2 at intervals of 0.5 mm to 3.0 mm in the roll width direction. 0.0 mm is preferred. The linear pressure between the hard roll and the soft roll is preferably in the range of 100 N / cm, and the peripheral speed of the soft roll is in the range of 50% to 95% with respect to the peripheral speed of the hard roll. Is preferred.

  The natural pulp is not particularly limited as long as it is a normal papermaking raw material such as wood pulp using conifers and hardwoods, non-wood pulp such as kenaf and pagas, waste paper pulp, etc. The use of wood pulp is preferred. The beating degree of this wood pulp is preferably CSF 250 to 450 ml, more preferably CSF 300 to 450 ml, in view of compression characteristics, strength, papermaking properties and the like.

  Examples of the synthetic fiber mixed with the natural pulp include polyvinyl alcohol (for example, vinylon), polyamide (for example, nylon), polyethylene, polyester, and the like. 5% or more and less than 30% is preferable, and the kind thereof is appropriately selected so as to satisfy the characteristics required as a base material.

  Although the thickness of the coating layers 2 and 3 can be changed according to the application of the IC chip inlet sheet 5, it is preferably 0.30 mm to 1.0 mm. Further, as described above, at least the paper base of the coating layer 2 has a thickness deformation rate of 20% or more and a thickness deformation amount when the compressive stress is 2.0 MPa in the compression test in the thickness direction. A paper substrate that is 0.1 mm or greater is selected. And as the paper base of the covering layer 2, when the IC chip inlet sheet 5 including the IC chip 7 is sandwiched and laminated, the convex part 8 formed by the IC chip 7 is absorbed, and In order to further prevent damage to the IC chip 7 due to pressurization, in the compression test in the thickness direction, the thickness deformation rate when the compressive stress is 2.0 MPa is 25% or more, and the thickness deformation More preferably, a paper substrate is selected whose amount is 0.15 mm or more.

  On the other hand, as the paper base of the covering layer 3, the same paper base as the covering layer 2 may be selected, but the covering layer 3 has a thickness of 0.02 mm to 0.04 mm. Since it is on the sheet 6 side and does not have the convex portion 8, it is not particularly limited to the same paper substrate as the coating layer 2, and can be appropriately selected according to the purpose of use of the IC chip interior sheet 1. .

  As a method of sandwiching the IC chip inlet sheet 5 between the coating layers 2 and 3 through the adhesive layer 4, a laminating machine such as extrusion lamination, hot melt lamination, wet lamination or dry lamination can be used. It is. The adhesive constituting the adhesive layer 4 is, for example, in extrusion lamination, a low density polyethylene resin (LDPE), a high density polyethylene resin (HDPE), a linear low density polyethylene resin (L-LDPE), a polypropylene resin (PP ), Ethylene / vinyl acetate copolymer resin (EVA), ethylene / ethyl acrylate copolymer resin (EEA), ionomer resin, and the like. In hot melt lamination, for example, ethylene / vinyl acetate copolymer is used. A hot melt adhesive obtained by mixing a polymer, an ethylene ethyl acrylate copolymer, polyethylene, butyl rubber, or the like with a tackifier such as rosin, xylene resin, terpene resin, or styrene resin can be used. More specifically, before laminating the coating layer 3 with the adhesive, a certain interval is provided so that the surface of the coating layer 3 and the surface of the IC chip inlet sheet 5 on the antenna sheet 6 side are aligned. A device for supplying the IC chip inlet sheet 5 is provided, and the device is completed by laminating with the coating layer 2 through the laminating adhesive. The laminating method and the adhesive are not particularly limited to those described above, but it is preferable to laminate the LDPE so as to have a thickness of 10 μm to 40 μm in consideration of cost, versatility, adhesiveness, and the like. .

  In this way, the IC chip inlet sheet 5 sandwiched between the covering layers 2 and 3 is formed of the antenna sheet 6 in which an antenna (not shown) and a circuit (not shown) are formed on an insulating base film. The IC chip 7 is mounted on the circuit. The IC chip inlet sheet 5 can be a non-contact type called a “wireless IC tag” that is generally commercially available, and the type thereof is not particularly limited.

  EXAMPLES Hereinafter, although an Example demonstrates this invention in detail, this invention is not limited by this. Here, the IC chip interior sheets of the following examples and comparative examples have the laminated structure shown in FIG. 1, and the constituent elements will be described using the reference numerals shown in FIG.

[Example 1]
Paper made from 100% softwood bleached kraft pulp (NBKP) beaten in 350ml CSF, adjusted to a moisture content of 35% and shrunk to a basis weight of 275g / m ² , 0.48mm thick stretched paper (trade name) : WV275, manufactured by Nippon Paper Industries Co., Ltd.). In the compression test in the thickness direction, the stretched paper 1 having the coating layers 2 and 3 had a compressive deformation rate and a compressive deformation amount of 25% and 0.12 mm, respectively, at a compressive stress of 2.0 Mpa. . A commercially available inlet (trade name; Tag-it, manufactured by Texas Instruments, Inc., 13.56 MHz, IC chip thickness 0.25 mm) is used as an internal chip, that is, the IC chip inlet sheet 5. Is pasted on the surface of the coating layer 3, LDPE (trade name; Mirason 11P, manufactured by Mitsui Chemicals, thickness 30 μm) is extruded with an extrusion laminator, sand-laminated with the coating layer 2, and the IC chip interior sheet 1 It was.

[Example 2]
As a base material of the coating layers 2 and 3, in a compression test in a thickness direction of 200 g / m ² , a thickness of 0.40 mm using 100% hardwood bleached kraft pulp (LBKP) as a raw material, a compressive stress of 2.0 MPa The IC chip interior sheet 1 was obtained in the same manner as in Example 1 except that the resin-impregnated kraft paper having a compression deformation rate and a compression deformation amount of 30% and 0.12 mm, respectively, was used.

[Example 3]
As a base material of the covering layer 3, in a compression test in a basis weight of 200 g / m ² , a thickness of 0.30 mm, and a thickness direction, the compressive deformation rate and the compressive deformation amount at a compressive stress of 2.0 Mpa are respectively 22%. An IC chip interior sheet 1 was obtained in the same manner as in Example 1 except that a paper cup base paper having a thickness of 0.08 mm was used. At this time, the IC chip inlet sheet 5 is housed so that the convex portion 8 formed by the thickness of the IC chip 7 is on the coating layer 2 side.

[Comparative Example 1]
As a base material for the coating layers 2 and 3, in a compression test in a basis weight of 200 g / m ² , a thickness of 0.30 mm, and a thickness direction, the compressive deformation rate and the compressive deformation amount when the compressive stress is 2.0 Mpa, respectively. An IC chip interior sheet 1 was obtained in the same manner as in Example 1 except that 22% and 0.08 mm paper cup base paper were used.

[Comparative Example 2]
As the base material of the coating layer 2, the compressive deformation rate and the compressive deformation amount when the compressive stress is 2.0 Mpa in the compression test in the basis weight of 100 g / m ² , thickness of 0.15 mm, and thickness are 50%, respectively. An IC chip interior sheet 1 was obtained in the same manner as in Comparative Example 1 except that kraft paper for wrapping paper having a thickness of 0.08 mm was used. At this time, the IC chip inlet sheet 5 is internally provided such that the convex portion 8 formed by the IC chip 7 is on the coating layer 2 side.

With respect to the IC chip interior sheets 1 obtained in Examples 1 to 3 and Comparative Examples 1 and 2, the ink inking property on the surface of the coating layer by the RI printing test and the communication characteristics before and after the printing test were evaluated. The evaluation results are shown in Table 1.

  The criteria for each evaluation are as follows.

RI printing test JIS K 5701 was followed. Using a RI-II type printing tester (Meiji Seisakusho), 0.5 ml of magenta sheet-fed process ink (trade name; TK High Echo Red MZ, manufactured by Toyo Ink Manufacturing Co., Ltd.) is supplied to perform one-color solid printing. The visual evaluation was made according to the following criteria.

○… There are no protrusions on the surface, and there is no problem with uniform ink deposition. ×… Projection by IC chips is seen on the sheet surface, and the ink deposition around it is poor.

Communication characteristic test Using a midrange reader / writer (RI-K10-001A) manufactured by Texas Instruments, the communication characteristic before and after the printing test was evaluated at a communication distance of 2 cm as follows.

○… Communication possible ×… Communication impossible

As is clear from Table 1, the IC chip interior sheet 1 obtained in the example was a flat sheet having no protrusion on the sheet surface. This is because the convex portion 8 due to the thickness of the IC chip 7 can be absorbed by the coating layer 2. For this reason, information can be written on the surface of the sheet without problems by printing or the like, and the IC chip inlet sheet 5 is protected from external pressure when used as a printing process or tag or card. It can be seen that the function does not deteriorate.

It is a schematic sectional drawing which shows an example of embodiment of the IC chip interior sheet which concerns on this invention.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 IC chip interior sheet 2,3 Coating layer 4 Adhesive layer 5 IC chip inlet sheet 6 Antenna sheet 7 IC chip 8 Convex part

Claims (1)

An IC chip interior sheet in which an IC chip inlet sheet is laminated via an adhesive layer between front and back coating layers made of a paper base material,
Among the front and back coating layers, the paper base material constituting at least one of the coating layers has a thickness deformation rate of 20% or more when the compression stress is 2.0 MPa in a compression test in the thickness direction, An IC chip interior sheet, wherein the thickness deformation amount is 0.1 mm or more.

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