JP2007098581A - Molding paper and paper molded article - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide molding paper capable of being molded into a paper molded article having an IC chip inlet sheet mounted therein and capable of preventing the falling or repapering of the IC chip inlet sheet, and the paper molded article molded from the molding paper. <P>SOLUTION: The molding paper is constituted by laminating base materials 2 and 3 comprising stretched paper and laminating the IC chip inlet sheet 5 to the base materials 2 and 3 through an adhesive layer 4. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to a paper molded product in which an IC chip inlet sheet is installed, and a molded paper capable of molding the paper molded product.

  Conventionally, magnetic cards and bar codes using magnetic characteristics have been used as information recording media, but the capacity of the recording media is limited. In recent years, IC (Integrated Circuit) has attracted attention as a large-capacity variable information recording medium. For example, IC tags (next-generation barcodes, wireless IC chips, wireless IC tags, IC labels, non-contact IC cards) , Electronic tags, non-contact type IC tags, smart tags, RFID (Radio Frequency Identification) tags, and the like). This IC tag is a component in which an antenna circuit for obtaining power and a signal from the outside and a wireless IC chip that is an information recording medium are combined based on the principle of electromagnetic induction by electromagnetic waves and microwaves (referred to as an “IC chip inlet sheet”). Information communication recording is possible without contact. In this IC chip inlet sheet, for example, an antenna circuit is formed on the surface of an insulating base material of polyethylene terephthalate (PET) by a copper etching method or a silver paste screen printing method, and an anisotropic conductive resin is applied to the circuit board. Via an IC chip. Normally, this IC chip inlet sheet is generally used as a tag or card by being coated with a synthetic resin or bonded to a synthetic resin film.

  On the other hand, if this IC chip inlet sheet is attached to paper products such as gift certificates, tickets, securities, and tags for assembly parts, forgery prevention, distribution route recording, delivery / inventory management, and the like can be performed. As a method for attaching an IC chip inlet sheet to a paper product, there is a method in which a sheet-like inlet is directly attached to a paper substrate. In this method, the IC chip inlet sheet is dropped or easily attached by a third party. There are security issues.

As a method of attaching an IC chip inlet sheet to a paper product without causing such a security problem, there is a method of installing an IC chip inlet sheet in a paper product. It is disclosed that an IC chip inlet sheet is sandwiched between a first layer and a second layer of a two-layer paper making, and the first and second paper layers are compressed and embedded.
JP 2004-102353 A

  However, a sheet with an IC chip inlet sheet manufactured by the method disclosed in Patent Document 1 can be applied to a flat paper product such as a gift certificate or a ticket, but a paper plate, a paper cup, etc. It cannot be molded into a three-dimensional paper molding. A three-dimensional paper molded product having an IC chip inlet sheet can be obtained by directly attaching an IC chip inlet sheet to a molded paper molded product. As described above, an IC chip inlet can be obtained. There is a security problem that the sheet is dropped or easily replaced by a third party.

  The present invention can be molded into a paper molded product with an IC chip inlet sheet and can prevent the IC chip inlet sheet from falling off or being replaced, and a paper molded from the molded paper. The object is to provide a molded product.

  In order to solve the above-mentioned problem, the invention according to claim 1 is characterized in that two or more base materials made of stretched paper are laminated, and an IC chip inlet sheet is laminated between the layers via an adhesive layer. And

  The invention according to claim 2 is obtained by molding a molding paper in which two or more base materials made of stretched paper are laminated and an IC chip inlet sheet is laminated between the layers via an adhesive layer. And

  According to the present invention, since the base material is made of stretched paper and has high stretch characteristics in both the longitudinal direction and the transverse direction, for example, to a three-dimensional paper molding such as a paper container. This processing can be performed by continuous molding without pretreatment such as ruled line insertion. Thus, it is possible to obtain a paper molded product in which the IC chip inlet sheet is embedded. In this paper molded product, the IC chip inlet sheet is located between the base materials made of laminated stretched paper. So it will not fall out. Further, since the IC chip inlet sheet cannot be replaced or removed unless the laminated base material is peeled off, it is possible to prevent the IC chip inlet sheet from being replaced or removed for the purpose of counterfeiting.

Hereinafter, an example of an embodiment of a molding paper according to the present invention and a paper molded product molded from the molding paper will be described.
FIG. 1 is a cross-sectional view showing an example of an embodiment of a molded paper according to the present invention.

  The molding paper 1 of this example is formed by laminating base materials 2 and 3 made of stretched paper, and an IC chip inlet sheet 5 is laminated between the layers via an adhesive layer 4.

  The stretched paper forming the base materials 2 and 3 is a paper having a high elongation property in both the longitudinal direction and the transverse direction. As the stretched paper, the tensile breaking elongation defined in JIS P 8113 is longitudinal. Any of the lateral directions is preferably 10% or more of paper, and particularly preferably 14% or more and 55% or less of paper. When the tensile elongation at break exceeds 55%, the reduction in paper stiffness becomes remarkable, which is not preferable as a molded paper. There are no particular restrictions on the basis weight, paper thickness and other qualities.

  The stretchable paper used for the base materials 2 and 3 is, for example, a paper sheet made of a natural pulp that has been moderately beaten or a raw material in which one or more synthetic fibers are mixed. Since stretched paper produced by shrinkage treatment using a shrinkage imparting device as described in the Japanese Patent Publication has high tensile elongation at break, it can be suitably used.

  Further, as stretched paper, stretched paper obtained by the method described in Japanese Patent Application Laid-Open No. 2004-3071 has high tensile elongation at break, and thus can be suitably used. Here, the stretched paper will be specifically described. This stretched paper is made of natural pulp that has been moderately beaten, or wet paper in which the moisture content of a paper sheet made from a raw material in which one or more synthetic fibers are mixed is adjusted to 20 to 50%. Comprising a pair of press rolls comprising a hard roll provided with grooves along the direction at a predetermined interval in the width direction of the roll and a soft roll having a flat roll peripheral surface, and the peripheral speed of the hard roll under pressure On the other hand, it is obtained by passing the paper through a shrinkage imparting device which is rotated at a lower peripheral speed of the soft roll to shrink the paper web and drying it after the treatment. In the shrinkage imparting device, the grooves along the circumferential direction of the hard roll have a width of 0.3 mm to 1.5 mm and a depth of 0.5 mm to 2 at intervals of 0.5 mm to 3.0 mm in the roll width direction. 0.0 mm is preferred. The linear pressure between the hard roll and the soft roll is preferably in the range of 100 to 700 N / cm, and the peripheral speed of the soft roll is preferably in the range of 50 to 95% with respect to the peripheral speed of the hard roll. .

  The natural pulp is not particularly limited as long as it is a normal papermaking raw material such as wood pulp using conifers or hardwoods, non-wood pulp such as kenaf or bagasse, and waste paper pulp. The use of pulp is preferred. The beating degree of the wood pulp is Canadian standard freeness (CSF) of 200 to 500 ml, more preferably CSF of 250 to 450 ml, in consideration of compression characteristics, strength, papermaking properties and the like.

  Examples of the synthetic fiber mixed with the natural pulp include polyvinyl alcohol (for example, vinylon), polyamide (for example, nylon), polyethylene, polyester, and the like. In consideration, 5% by weight or more and less than 30% by weight is preferable, and the kind thereof is appropriately selected so as to satisfy the characteristics required as a substrate.

  Although the thickness of the base materials 2 and 3 can be changed according to the use of the molding paper 1, it is preferably 0.30 mm to 1.0 mm.

  The means for laminating the substrates 2 and 3 and further laminating the IC chip inlet sheet 5 between the layers via the adhesive layer 4 is not particularly limited. For example, the substrates 2 and 3 are formed by an extrusion laminator. A method of inserting the IC chip inlet sheet 5 when sandwiching the substrate can be mentioned. Such a method is preferable because a stretched paper laminate having a strong adhesive force can be obtained. At that time, as a method of inserting the IC chip inlet sheet 5, a method of sticking the IC chip inlet sheet 5 coated with an adhesive to the substrate 2 or the substrate 3 at equal intervals is suitable.

  In the sandwich laminate, the substrate 2 and 3 can be subjected to corona treatment in order to obtain a laminate having stronger adhesive strength. For the protection of the IC chip inlet sheet 5 and the safety of the work. It is essential that the IC chip inlet sheet 5 is attached to the substrates 2 and 3 after the corona treatment.

  The resin that can be used in the sandwich laminate, that is, the resin that forms the adhesive layer 4 is not particularly limited, and a commonly used low-density polyethylene resin, high-density polyethylene resin, linear low-density polyethylene resin, polypropylene resin, and the like are appropriately selected. Can be used.

  In the present invention, the thickness of the adhesive layer 4 is preferably close to the thickness of the IC chip from the viewpoint of protecting the IC chip. However, increasing the resin film thickness may be undesirable from both an environmental and economic point of view. From such a viewpoint, the thickness of the adhesive layer 4 is preferably 20 to 50 μm in the present invention.

  The method of laminating the base materials 2 and 3 and further laminating the IC chip inlet sheet 5 between the layers via the adhesive layer 4 is not limited to the above method. For example, hot melt Known techniques such as lamination, wet lamination, and dry lamination can be used. Also in this case, there is no particular limitation on the selection of the adhesive and the like.

  However, as a method of laminating the substrates 2 and 3 and further laminating the IC chip inlet sheet 5 between the layers via the adhesive layer 4, it does not become an obstacle to molding into a paper molded product. It is preferable that For example, a method of sanding the IC chip inlet sheet 5 placed on a roll-shaped tape while feeding between the base materials 2 and 3 is conceivable. In this method, the IC chip inlet sheet 5 is placed. Any extra tape parts will also be sanded. This tape part becomes a hindrance to the molding without following the deformation of the stretched paper at the time of molding into a paper molded product, so that it can be converted into a paper molded product such as a paper container as in the present invention. It is not preferable as a method of inserting the IC chip inlet sheet 5 into the molding paper 1 for the purpose of molding.

  Next, a paper molded product molded from the molding paper 1 will be described. FIG. 2 is a schematic cross-sectional view showing a paper container as a paper molding formed from the molding paper shown in FIG.

  In the molding paper 1, since the base materials 2 and 3 are made of stretched paper and have high elongation characteristics in both the vertical direction and the horizontal direction, by molding this, FIG. As shown, a paper container 6 as a paper molded product in which the IC chip inlet sheet 5 is housed can be obtained. In this example, the paper container 6 has a round plate shape, and the IC chip inlet sheet 5 is housed in a bottom portion 6a having a circular shape in plan view.

  As a method of molding the paper container 6 as a paper molded product from the molding paper 1, known means such as normal press molding, pressure molding, vacuum molding and the like can be used. Among these molding methods, since the pressure mold and the vacuum molding are only one of the male and female molds, the IC chip inlet sheet 5 is not broken by compression during molding.

  On the other hand, in the molding of stretched paper, the press molding is better than the compressed air molding or the vacuum molding, but the molded product finishes better, but because the male and female molds are completely compressed, the IC chip inlet sheet 5 is destroyed during molding. May happen. Therefore, in press molding, in order to prevent the IC chip inlet sheet 5 from being broken, it is preferable to perform molding using the press molding machine shown in FIGS. 3 and 4 are explanatory views showing a process of molding the paper container shown in FIG. 2 using a press molding machine. In the figure, 7 indicates a press molding machine, and this press molding machine 7 is a press mold. 8, a male mold 9 and a female mold 10, a spring 11, and a clamp 12 for fixing the molding paper 1.

  A recess 13 is provided at the bottom of the female mold 10 of the press die 8 so that the bottom of the female mold 10 does not contact the male mold 9. Thereby, when the paper container 6 is molded, the IC chip inlet sheet 5 housed in the bottom portion 6 a can be prevented from being broken by the male mold 9 and the female mold 10.

  The recess 13 provided at the bottom of the female mold 10 is formed over substantially the entire bottom of the circular shape of the female mold 10, and almost the entire bottom of the female mold 10 is the male mold 9. To avoid contact. The reason why the recess 13 is formed over substantially the entire bottom of the female mold 10 so that almost the entire bottom of the female mold 10 does not contact the male mold 9 is as follows. That is, if the concave portion 13 is provided only in the portion corresponding to the IC chip inlet sheet 5 and the female mold 10 and the male die 9 are not in contact with each other only in the area of this portion, the molded product is formed in the concave portion 13. Only the corresponding part may loosen or become wrinkled. Further, in the press molding machine 7, the feeding of the molding paper 1 can be adjusted in accordance with the size of the press mold 8. However, since a slight deviation always occurs, In order to prevent destruction of the IC chip inlet sheet 5, it is desirable to provide a portion where the male die 9 and the female die 10 do not contact with each other in as wide an area as possible. For these reasons, the recess 13 is formed over substantially the entire bottom of the female mold 10.

  The process of molding the molding paper 1 into the paper container 6 using the press molding machine 7 will be described. As shown in FIG. 3, the molding paper 1 is set between the male mold 9 and the female mold 10. After that, the male mold 9 is brought close to the female mold 10. As the male mold 9 and the female mold 10 approach each other, the molding paper 1 is strongly fixed by the clamp 12. Furthermore, when the male mold 9 and the female mold 10 approach each other and the male mold 9 starts to push the molding paper 1 into the female mold 10, molding is started. At this time, since the molding paper 1 is fixed by the clamp 12, the molding paper 1 is stretched because there is little dragging of the molding paper 1 by the male mold 9. 4. Finally, as shown in FIG. 4, the male mold 9 and the female mold 10 are pushed in until they hit, but at this time, the IC chip inlet sheet 5 does not hit the female mold 10 and therefore does not break. . Further, since the molding paper 1 is fixed by the clamp 12 and is molded in a state where the molding paper 1 is stretched, a molded product free from slack and wrinkles can be obtained even in such a mold.

  In the present invention, a mold having any shape can be used as long as it is a shape that can be molded with stretched paper, instead of the mold having the shape as shown in FIGS. 3 and 4. When using a shape other than the mold, it is desirable to design the mold in the same manner.

  Hereinafter, the present invention will be specifically described by way of examples, but the present invention is not limited thereto. Formed sheets of the following examples and comparative examples have the laminated structure shown in FIG. 1, and the components will be described using the reference numerals shown in FIG.

[Example 1]
[Sandwich Laminate] The stretch paper used for lamination is a paper sheet made of softwood bleached kraft pulp (NBKP) as a raw material, and has a basis weight of 275 g / m ² and a tensile elongation at break specified in JIS P 8113 of 30 in the longitudinal direction. % Stretched paper (base material 2) with a transverse direction of 15% and a stretched paper with a basis weight of 100 g / m ² and a tensile breaking elongation as defined in JIS P 8113 of 30% in the longitudinal direction and 15% in the transverse direction (base Material 3) was used. A low-density polyethylene resin was used for the sandwich laminate, and the base material 2 and the base material 3 were bonded by an adhesive laminator 30 having a resin thickness of 30 μm using an extrusion laminator. When the base material 2 and the base material 3 are extruded and sandwich lamination is performed with a laminator, an IC chip inlet sheet 5 (18 mm × 32 mm) having IC chips mounted at intervals of 250 mm is pasted on the base material 2 with an adhesive. A molded paper was obtained.

[Molding Test] In Example 1, molding was performed using the press molding machine 7 shown in FIGS. 3 and 4 for molding a round dish-shaped paper container 6 having an opening diameter of 170 mm, a bottom diameter of 130 mm, and a depth of 25 mm. went. For the molding, a male and female pair of press dies 8 are used, but the bottom portion of the female die 10 is provided with a recess 13 so that there is no portion in contact with the male die 9 and is open. The paper feed was adjusted in advance to be 250 mm. Under these molding conditions, 100 paper containers 6 in which the IC chip inlet sheet 5 was housed were molded as paper moldings.

[Example 2]
[Molding test] A concave portion 14 having a long side of 150 mm, a short side of 100 mm, and a depth of 20 mm, which is obtained by extruding and laminating polypropylene resin to the surface of the molding paper of Example 1 on the substrate 2 side. Using the mold 15 shown in FIG. 5 having pressure, air-pressure molding was performed, and 100 paper moldings with the IC chip inlet sheet 5 incorporated therein were molded.

[Reading test]
In Examples 1 and 2, it was evaluated before and after molding whether an IC chip can be read at a communication distance of 2 cm using a Texas Instruments midrange reader / writer (RI-K10-001A). , 2 had no problem in reading the IC chip.

[Comparative Example 1]
[Laminate] The tensile elongation at break specified in JIS P 8113 is 30% in the vertical direction and 15% in the horizontal direction at a basis weight of 275 g / m ² applied to a paper sheet made of softwood bleached kraft pulp (NBKP) as a raw material. An IC chip inlet sheet (18 mm × 32 mm) in which IC chips were mounted at equal intervals of 250 mm was attached to stretched paper with an adhesive. A low-density polyethylene resin was applied to this with an extrusion laminator at 50 μm to obtain a processing base paper used for molding.

[Molding test] Using the press molding machine 7 shown in FIGS. 3 and 4 for molding a round dish-shaped paper container having an opening diameter of 170 mm, a bottom diameter of 130 mm, and a depth of 25 mm in the same manner as in Example 1. Molding was performed to mold 100 paper containers with IC chip inlet sheets as paper moldings.

  Many of the processing base papers used for molding the paper container of Comparative Example 1 destroyed the IC chip by pressing the cooling roll and the pressure roll during lamination. The paper container of Comparative Example 1 also has a poor appearance because the IC chip inlet sheet is only covered with a transparent resin.

Sectional drawing which shows an example of embodiment of the molding paper which concerns on this invention. FIG. 2 is a schematic cross-sectional view showing a paper container as a paper molded product molded from the molding paper shown in FIG. 1. Explanatory drawing which shows the process of shape | molding the paper container shown in FIG. 2 using a press molding machine. Explanatory drawing which shows the process of shape | molding the paper container shown in FIG. 2 using a press molding machine. The perspective view which shows the metal mold | die used for the pneumatic molding in Example 2. FIG.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Molding paper 2,3 Base material 4 Adhesive layer 5 IC chip inlet sheet 6 Paper container 6a Bottom part 7 Press molding machine 8 Press die 9 Male die 10 Female die 11 Spring 12 Clamp 13 Recessed portion 14 Recessed portion 15 Mold

Claims (2)

  A molded paper comprising two or more layers of base materials made of stretched paper, and an IC chip inlet sheet laminated between the layers through an adhesive layer.   A paper-molded product obtained by molding a molding paper in which two or more base materials made of stretched paper are laminated and an IC chip inlet sheet is laminated between the layers through an adhesive layer .

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