JP2008087825A - Molded body for packaging material, and its manufacturing method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To obtain a molded body for a packaging material which is made of a paper, is excellent in production efficiency, has a high degree of freedom for molding, has beautiful appearance, and has no possibility of breaking an IC chip in the original paper for molding processing even when press molding is performed by heating and pressing by the same method as the conventional original paper for molding processing. <P>SOLUTION: The molded body for the packaging material is obtained by press molding of the original paper for molding processing in which the IC chip is placed between a substrate paper and a covering paper to make their laminate. In the molded body for the packaging material, the substrate paper satisfies the following four conditions (1)-(4). (1) The tensile strength (JIS-P8113) is ≥2.0 kN/m. (2) The breaking elongation (JIS-P8113) is ≥1.5%. (3) The critical compression stress defined by the following equation is in a range of 1-10 MPa. The critical compression stress=A/B, wherein A is the compression strength by JIS-P8126, and B is an area of loading part of a test sample when the compression strength is measured, respectively. (4) The amount of compression deformation when a compression stress of 20 kgf/cm<SP>2</SP>is applied in the thickness direction is ≥10%. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to a paper packaging container provided with a non-contact IC chip, various molded articles for packaging materials such as cushioning materials, and a method for producing the same.

In recent years, various types of information have been written on various packaging materials such as packaging boxes for storing products, packaging containers such as packaging trays, and cushioning materials for the purpose of product logistics management and theft and counterfeiting prevention. What attached | subjected the type | formula IC chip (henceforth IC chip) is used widely.
As such a packaging container, for example, there is one in which a label-like IC chip is attached to a packaging box made of cardboard (Patent Document 1).
Thus, a carton-like packaging container made of a paper material such as cardboard is widely used because of its low cost, but has a problem that its shape is limited. Moreover, since it is necessary to affix a label-shaped IC chip to a packaging container separately, there existed a problem in productivity at the point that the number of processes increased. Furthermore, there is a possibility that the IC chip is not integrated with the container and peels off. Further, the location of the IC chip is easily understood from the appearance, and can be peeled off artificially, which may cause forgery or the like.
Japanese Patent Laid-Open No. 2003-11945 (Patent Document 2) exists as a container in which an IC chip is mounted on a tray-like container obtained by press-molding a substrate such as paper or film. Such a container has the advantage that the IC chip is present inside the base material constituting the container, so that the IC chip does not fall off and is not visible from the outside, so that forgery is difficult. Further, when paper is used as a base material, it is also useful in terms of obtaining a container that is easy to dispose of, that is, has a low environmental load at the time of disposal.
However, when manufacturing such a press-molded container using paper as a base material, it is necessary to use a press-molding method by heating and pressurization. However, since a general paper material is not sufficiently plastic, it can be obtained by press molding. There are limitations on the shape that can be obtained, and it is difficult to obtain a smooth appearance.
Furthermore, when the base material in which the IC chip exists inside the base material is press-molded, general paper cannot be said to have sufficient buffering properties, and the IC chip may be damaged by pressurization during press molding. It was. In particular, when a molded container having a complicated shape is obtained, there is a tendency to increase the pressure and temperature during molding, so that the possibility of breakage is increased.
In addition, the method of mounting an IC chip on a molded container that has been press-molded in advance by sticking or the like has a problem of inferior production efficiency.

Japanese Patent Laid-Open No. 2001-240046 JP 2003-11945 A JP 2002-201598 A

  The present invention is made of paper, is easy to dispose, has excellent production efficiency, has a high degree of freedom in molding, has a beautiful appearance, and is press-molded by heat and pressure in the same manner as a conventional base paper. Another object of the present invention is to obtain a molded body for packaging material in which the IC chip in the base paper for forming is not damaged.

A first aspect of the present invention is a molded body for packaging material obtained by press molding a forming base paper in which an IC chip is sandwiched and laminated between a base paper and a coated paper, the base paper However, it is a molded article for packaging material that satisfies the following four conditions (1) to (4).
(1) Tensile strength (JIS-P8113) is 2.0 kN / m or more.
(2) Elongation at break (JIS-P8113) is 1.5% or more.
(3) The critical compressive stress defined by the following formula is in the range of 1 to 10 MPa.
Critical compressive stress = A / B
However, A is the compressive strength according to JIS-P8126,
B shows the load part area of the test piece at the time of compressive strength measurement, respectively.
(4) The amount of compressive deformation when a compressive stress of 20 kgf / cm ² is applied in the thickness direction is 10% or more.

  2nd of this invention is a molded object for packaging materials as described in 1st of this invention containing mechanical pulp as raw material pulp of the said base paper.

3rd of this invention is the molded object for packaging materials obtained by press-molding the shaping | molding base paper in which the IC chip was pinched | interposed and laminated | stacked between base paper and covering paper, Comprising: The said base paper but dense layer of density 0.7~0.9g / cm ^3, and has a low density layer of density 0.2~0.65g / cm ^3, a basis weight is 100 to 500 g / m ^2, overall This is a molded article for packaging material, the density of which is mainly 0.4 to 0.7 g / cm ³ and the low density layer is mainly composed of pulp selected from at least one of mechanical pulp, curled fiber, and mercerized pulp. .

  According to the fourth aspect of the present invention, a base paper, an IC chip-supporting tape, and a coated paper are successively laminated in this order from the respective windings and bonded, and a forming base paper obtained by pasting is blanked to obtain a blank. It is a manufacturing method of the molded object for packaging materials described in any one of 1st-3rd of this invention which makes it a sheet | seat and press-molds this blank sheet.

  According to the present invention, it is made of paper, has a low environmental impact at the time of disposal, is excellent in production efficiency, has a high degree of freedom in molding, has a beautiful appearance, and is press-molded by heat and pressure in the same manner as conventional molding paper. However, it has become possible to obtain a molded body for packaging material in which the IC chip in the base paper for molding is not damaged.

The present invention will be specifically described below.
First, the pulp constituting the base paper in the present invention will be described below.
As natural pulp fiber, wood fiber (chemical pulp, mechanical pulp), non-wood fiber, waste paper pulp and the like are arbitrarily used as necessary. Among the wood fibers, examples of chemical pulp include kraft pulp and sulfite pulp. These pulps may be unbleached or bleached. Examples of mechanical pulp include groundwood pulp (GP), refiner groundwood pulp (RGP), and thermomechanical pulp (TMP) obtained by heating and refining wood chips.
Of these mechanical pulps, TMP is optimal in terms of the bulkiness and strength of the sheet. In addition, as TMP, C-TMP which refines under pressure after chemically processing a wood chip | tip, BC-TMP etc. which performed the bleaching process etc. shall be included. Moreover, among these wood fiber pulps, a pulp having a long fiber length obtained from conifers is preferably used in order to improve the stretchability and strength of the base paper.

Non-wood fibers include bast fibers such as mulberry, kenaf and jute, seed hair fibers such as cotton and cotton linter, leaf fibers such as manila hemp and sisal hemp, and stem fibers such as bamboo and bagasse. A kind etc. can be used arbitrarily as needed. In particular, Kozo, Mitsumata, Kenaf, Manila hemp, sisal hemp, cotton, cotton linter and the like are preferably used because they have a long fiber length and can improve the stretchability and strength of the base paper of the present invention.
In the present invention, various types of used paper pulp can be used as necessary.

The above various pulp fibers can be used alone or in combination of two or more.
Moreover, a synthetic resin fiber can be mixed as needed in the range which does not impair the effect of this invention.

The base paper used for the packaging material molded body of the present invention composed of the above pulp fibers has a tensile strength (JIS-P8113) of 2.0 kN / m or more (preferably 5.0 kN / m or more) and breakage. The elongation (JIS-P8113) is preferably 1.5% or more. In the present invention, the tensile strength and elongation at break adopt values in the width direction.
If the tensile strength of the base paper is lower than 2.0 kN / m, or the elongation at break is lower than 1.5%, the stretchability is low, and it is unsuitable because it breaks during press molding.
In order to control the tensile strength and elongation at break in the above ranges, in the case of a single layer, NBKP is used for one part of the pulp, or the amount of the paper strength enhancer is adjusted, or the paper It can be controlled by a known method such as a method in which a layer is formed in multiple layers and NBKP is used in at least one layer or a paper strength enhancer is blended.

When a flat base paper is press-molded, if the molded body has a curved portion with a large distortion, it is necessary to form a folded wrinkle on the curved portion to absorb the distortion. At this time, the folded wrinkle portion is folded in the plane direction like an accordion to form irregularities, and then the irregularities are compressed in the thickness direction by pressing.
For this reason, in order to obtain good press formability, it is preferable that the critical compressive stress of the base paper is in the range of 1 to 10 MPa and the compressibility in the thickness direction is in the range of 10% or more.
In addition, the compression rate in this invention shows the compression rate of the thickness direction when a compressive stress with a load of 20 kgf / cm ² is applied. When the limit compressive stress exceeds 10 MPa, the folded wrinkle portion is not sufficiently folded, and when the compression rate is lower than 10%, the compression molding of the folded wrinkle portion becomes insufficient, and good moldability cannot be obtained.

In order for the critical compressive stress and the compressibility in the thickness direction to fall within the above ranges, it is necessary to lower the base paper density. To that end, it is preferable to use rigid pulp fibers. In general, a pulp sheet is beaten (a mechanical external force is applied to the pulp fiber to fibrillate a part of the cell wall of the fiber) to obtain a paper sheet having a uniform texture. It is necessary to keep beating lightly in order to maintain rigidity.
As the degree of beating, for example, in the case of chemical pulp, the freeness (Tappi T-227 Canadian standard type) is 500 mlcsf or more, in the case of mechanical pulp, 180 mlcsf or more, in the case of hemp pulp or kenaf pulp, 500 mlcsf or more, and in the case of corrugated used paper pulp, 500 mlcsf or more. Those are preferred. In addition, various refiners used conventionally can be used suitably for beating of pulp fiber.

  In addition, a foaming agent may be added during papermaking of the base paper to lower the density within a range not impairing the effects of the present invention. Examples of the foaming agent include thermally expandable microcapsules in which a low boiling point solvent is enclosed in microcapsules. In addition, a light inorganic pigment such as a shirasu balloon can be added to lower the density.

As papermaking chemicals added to the stock to make the base paper of the present invention, the same sizing agent, paper strength agent, yield improver, etc. as used in normal papermaking are used as necessary. can do. These papermaking chemicals can also be added by spraying between paper layers during the papermaking process, or by coating on the surface of the base paper during or after papermaking.
In addition, the same filler as that used in ordinary papermaking at the time of papermaking can be added in any combination as necessary.

Furthermore, additive agents for papermaking such as dyes, pH adjusters, slime control agents, antifoaming agents, and stickers can be appropriately used depending on the application.
The pH at the time of papermaking according to the present invention can be arbitrarily selected between about 4.5, which is acidic papermaking, and about 6-8, which is neutral papermaking.

Paper stock made of the above materials is made by a conventional method. The paper machine to be used is not particularly limited, and any type of paper machine conventionally used can be appropriately selected. Also in drying, any type of dryer conventionally used can be appropriately selected and is not particularly limited.
In the present invention, the base paper obtained from the paper making process may be a single layer or a two or more layered paper.
According to the method described above, paper satisfying the requirements (1) to (4) of the present invention can be produced. However, in order to balance strength, elongation, rigidity, and compression rate formation, kraft pulp or high-quality waste paper is mainly used. between the two outer layers of density 0.7~0.9g / cm ³ to have a middle layer of a density 0.2~0.65g / cm ³ consisting mainly of mechanical pulp, density 0.4~0.7g Most preferably, a multi-layer paper of / cm ³ is used.

In addition, 200-600 g / m < ² > is suitable for the basic weight of the base paper of this invention, and 240-500 g / m < ² > is still more preferable. If it is less than 200 g / m ² , there is a possibility that sufficient strength will not be exhibited in the molded product obtained after press molding, and there is a problem that the IC chip tends to be damaged during press molding because of poor buffering properties. On the other hand, if it exceeds 600 g / m ² , the moldability of the folded wrinkle portion during press molding is lowered, which is not preferable.

  Further, the thickness of the base paper of the present invention is preferably 350 to 900 μm, and more preferably 400 to 800 μm. If the thickness is less than 350 μm, the buffer and heat insulation properties are poor, and the IC chip may be damaged by heat and pressure during press molding. On the other hand, if it exceeds 900 μm, the suitability for forming such as the forming property of the folded wrinkled part during press forming is unfavorable.

Base paper packaging for molded body in the present invention has a density comprises a low density layer of 0.2~0.65g / cm ^3, a high density layer of density 0.7~0.9g / cm ³ 2 It is preferable to use a paper having a multi-layer or more multi-layer paper and an overall density of 0.4 to 0.7 g / cm ³ .

  The above multi-layer paper only needs to have one low-density layer and one high-density layer. More preferably, both the outer layers on the front and back sides are both high-density layers, and the middle layer, which is a low-density layer, is sandwiched between them. This is more effective in obtaining a bulky and stiff base paper.

Paper, stiffness S of sheet paperboard or the like, when the sheet was considered cantilever, S = E · I / B · W = E · T 3/12 · W, (E: Young's modulus MPa, I: Cross section secondary moment N · cm ² , B: sample width mm, W: sample mass kg, T: sample thickness mm). That is, it can be considered that the stiffness S is proportional to the cube of the Young's modulus and the sheet thickness.

Furthermore, the stiffness of a multi-layered sheet such as paperboard is determined by Tappi Nov, 1963, Vol. 46, no. 11 A.E. T.A. According to Luey, the stiffness value of each layer is obtained from the Young's modulus of each layer and the second moment of section similarly using the above formula, and the stiffness value of the entire sheet is obtained by the sum of the stiffness values of each layer.
Based on this concept, the distance from the center of the paper thickness is far, that is, the thicker the paper thickness, the higher the rigidity, so the middle layer may be bulky. Further, since the stiffness is indicated by the product of the cube of the thickness and the Young's modulus, the higher the Young's modulus is, the more effective the stiffness is.

For this reason, the density of the middle layer is preferably 0.2 to 0.65 g / cm ³ . More preferably, it is 0.3-0.6 g / cm < ³ >.
If the density of the middle layer is less than 0.2 g / cm ³ , the interlayer strength is drastically reduced. If the density exceeds 0.65 g / cm ³ , the density of the entire base paper is 0.4 to 0.7 g / cm ^3. Is difficult.
Moreover, it is preferable that the density of an outer layer is 0.7-0.9 g / cm < ³ >. If it is less than 0.7 g / cm ³ , the Young's modulus of the outer layer decreases, and the rigidity of the present invention cannot be expected to improve. Further, when the density exceeds 0.9 g / cm ³ , the outer layer surface of the base paper becomes too tight, so that it is practically difficult to obtain a higher density layer at the paper making stage. Moldability is not accompanied.

There are no particular restrictions on the type of pulp used in the high-density layer, but it is particularly desirable to increase the beating degree of N-material (coniferous) pulp such as NUKP and NBKP so as not to lose rigidity. In addition, in order to make this invention effective, it is preferable that the basic weight of the outer layer made into the high-density layer is 15-100 g / m < ² >. That is, if it is less than 15 g / m ² , it is difficult to obtain a layer having a high Young's modulus, and papermaking itself is difficult. On the other hand, when the outer layer exceeds 100 g / m ² , the basis weight of the low density layer is relatively reduced, so that the density of the whole base paper is increased, and it is difficult to make the range from 0.4 to 0.7 g / cm ^3. It is.
The production of the multi-layer paper as the base paper of the present invention is performed using a multi-layer paper former as in the production of general paperboard.

In the present invention, the pulp used as the low density layer is preferably a pulp having a freeness in the range of 200 to 650 ml in the re-disaggregation state according to the Canadian standard form of JIS-P8121. If the freeness is less than 200 ml, the pulp fibers are poorly drained, so that the squeezed sheet tends to have a dense structure, making it difficult to obtain a low-density paper layer structure. On the other hand, if the freeness exceeds 650 ml, the sheet becomes too low in density, and delamination occurs during the pressing process during paper making, and balloon-like swelling tends to occur. In addition, the stock which shows 200-650 ml freeness in a re-disaggregation state can be 250-700 ml by Canadian standard type freeness irrespective of the pulp raw material used.
Further, measuring the freeness of the used pulp by re-disaggregating the base paper is effective for grasping necessary pulp characteristics from a product exhibiting good operability in a single hour.

The pulp raw material used for the low-density layer can be arbitrarily selected, but it is preferable that the pulp raw material is easy to obtain a low-density paper layer. Specifically, mechanical pulp is mentioned as such a pulp. Mechanical pulp includes GP, TMP, RGP and the like, and TMP and RGP are particularly preferable. Among them, those using radiata pine, Southern pine, Douglas fir, etc. as raw materials can obtain a low-density paper layer due to the rigidity of the fibers and are difficult to deform, and there is little decrease in density during press molding. Therefore, it is particularly preferable.
In the present invention, pulp that has been partially chemically treated, such as pulp obtained by adding chemicals during mechanical crushing or pulp that has undergone a bleaching step, is also handled as mechanical pulp. Furthermore, the thing which gave the density reduction characteristic to the pulp by chemical processing, such as mercerized pulp and a curled fiber, can also be used conveniently.
In the present invention, the above-described pulp is mainly used to constitute the low-density layer, but in addition, chemical pulp made from commonly used wood, or chemical pulp made from various non-wood materials, etc. It is also possible to mix and use as appropriate.
In any case, in the present invention, various pulps are selected so that the density of the low density layer is 0.2 g / cm ³ or more and less than 0.7 g / cm ^3, and a plurality of types are blended as necessary. It is desirable to use it.
In the present invention, it is more desirable that at least one of mechanical pulp, mercerized pulp, and curled fiber is contained in 50% or more of the total pulp of the base paper.

Next, the coated paper used in the present invention will be described.
The coated paper is used for the purpose of covering and concealing the IC chip on the base paper, and a general paper material can be appropriately selected and used, but the tensile strength (JIS-P8113) can be used. ) Is 2.0 kN / m or more, and the elongation at break (JIS-P8113) is 1.5% or more, it is desirable from the viewpoint of press molding suitability because it is laminated with a base paper to form a processed base paper. For example, specifically, paper having good extensibility such as kraft stretched paper is preferably used.
The basis weight of the coated paper is desirably 60 g / m ² or more. If it is less than 60 g / m ² , there is a possibility that it may be difficult to conceal the IC chip. Further, there is a possibility that a problem that the IC chip is damaged by heating and pressurizing during press molding may occur.

Note that as the coated paper, it is possible to use a base paper having the above-described characteristics.
In the present invention, a forming base paper in which an IC chip is sandwiched and laminated between two base papers is excellent in shock-absorbing property and heat insulating property. It is most desirable because of its excellent rigidity and shape stability.

<Configuration of base paper for forming>
Next, a method for producing a forming base paper from the base paper described above will be described.
The forming base paper used in the present invention is characterized in that an IC chip is sandwiched and laminated between the base paper and the covering paper (see FIG. 1).
The IC chip may be fixed between the base paper and the coated paper laminated by any means. For example, it can be bonded to a coated paper that is fixed to a base paper with an adhesive and further coated with an adhesive.
Adhesives used for fixing the IC chip to the base paper and bonding the base paper to the coated paper include water-soluble adhesives such as polyvinyl alcohol, starch and sodium alginate, polyurethane adhesives, poly Use chloroprene adhesives, SBR adhesives, epoxy adhesives, vinyl adhesives, phenoxy resin adhesives, polyester adhesives, polysulfone adhesives, hot melt adhesives, etc. alone or in combination. Is possible.

<IC chip>
The IC chip used in the present invention is a fine and thin IC chip having a memory and an antenna wiring, and is brought into contact with an external device such as a reader / writer so that a non-contact method of radio waves, electrostatic coupling, electromagnetic waves, etc. Therefore, information can be exchanged between the antenna and the external device.
The smaller IC chip used in the present invention is easier to conceal, and it is less likely to be damaged by the influence of distortion during press molding. Specifically, one having a side of 5 mm or less can be suitably used. In particular, it is preferable to use a small one having a side of 0.5 mm or less.
Further, it is preferable to use an IC chip having a thickness of 0.1 to 200 μm, more preferably 0.1 to 100 μm. When the thickness exceeds 200 μm, it is not preferable because only the portion becomes excessively thick when sandwiched between base papers. Further, it is not preferable because the IC chip is easily damaged when the forming base paper is pressed. Further, it is technically difficult to manufacture an IC chip having a thickness of 0.1 μm or less at present.

<IC chip support tape>
In the forming base paper used in the present invention, the IC chip may be fixed between two base papers by any means such as adhesion. However, it is actually difficult to arrange and fix individual IC chips uniformly between base papers.
Therefore, when manufacturing the forming base paper by fixing the IC chip between the base papers, the IC chip is previously supported on a tape such as paper or film in consideration of the accuracy of the product, workability and productivity. It is further desirable to use an IC chip carrying tape.
Specifically, the IC chip carrying tape is one in which an IC chip is fixed to a tape carrier by means such as adhesion (see FIG. 2).
As the material of the tape, films of various resins such as polypropylene, polyester, polyvinyl chloride, and polycarbonate can be used. Besides the film, it is also possible to use a tape made of paper, synthetic paper, or non-woven fabric. It is also possible to use a tape obtained by laminating these plural materials.
Among these, a tape made of a film material, particularly a tape made of a polyester film material can be suitably used for reasons such as heat resistance and strength.
Such a film material tape may be used as it is, and can be subjected to corona discharge treatment, primer treatment, or the like, if necessary. It is also possible to provide an external antenna by providing a conductive layer pattern on the surface by metal deposition or the like and connecting it to an IC chip. By providing such an external antenna layer on the tape, it is possible to increase the information transmission distance by the IC chip.
There is no restriction | limiting in particular about the width | variety of a tape, Although it can select suitably according to the magnitude | size of the IC chip to carry | support, it is preferable to set it as 1-5 mm in width.
Moreover, the thickness of a tape can use 10-100 micrometers suitably. Those having a thickness exceeding 100 μm are uneconomical because they are thicker than necessary. Those having a thickness of less than 10 μm are not preferable because the tape becomes difficult to handle due to the decrease in tensile strength and rigidity, and the workability deteriorates.
An IC chip carrying tape is a tape in which the above-described IC chip is fixed to such a tape by means such as adhesion.

<Method of manufacturing base paper for forming>
The forming base paper of the present invention is one in which an IC chip is sandwiched and laminated between a base paper and a coated paper.
As these manufacturing methods, for example, as shown in FIG. 3, the IC chip (p) is supplied from the supply device (s) onto the base paper continuously supplied from the base paper roll (6). If necessary, fix it with the above-mentioned adhesive, and apply the adhesive to the coated paper that is continuously supplied from the coated paper roll (7). The method of pasting by the combined roll (t) is mentioned.
Next, a method for producing a forming base paper using an IC chip carrying tape will be described.
In this method, as shown in FIG. 4, the webs continuously fed from the base paper roll (6), the coated paper roll (7), and the IC chip carrying tape roll (8) are laminated, It is the method of applying the above-mentioned adhesive and bonding these with the bonding roll (t).
A plurality of IC chip-carrying tapes can be bonded in the winding width direction.
In this manufacturing method, it is possible to easily obtain a forming base paper in which IC chips are arranged at a constant width and interval between base paper layers. Therefore, in a subsequent punching and press forming process, the manufacturing base paper is placed at a fixed position. It is particularly preferable because it is easy to perform punching and press molding with the IC chip disposed.
FIG. 5 is an explanatory plan view of such a forming base paper at the time of punching. In FIG. 5, the IC chip (p) carried on the IC chip carrying tape (5) is positioned at the center of the blank sheet (9) punched from the forming base paper flowing in the direction of the arrow. Matching is done.
Note that the alignment of the IC chip at the time of bonding can be performed by image reading. In addition, the IC chip carrying tape can be provided with a mark that can be used for alignment in the bonding process. Visible light or invisible light, or marks readable by means such as transmitting light can be provided at equal intervals on the tape itself. Such a mark makes it easier to align the IC chip when bonding.

Next, press forming of the forming base paper and the molded body for packaging material will be described.
<About molding method>
(1) Moisture adjustment of base paper As a manufacturing method of the buffer material of the present invention, the base paper for molding is punched into a blank sheet, ruled lines are put in necessary places, the blank sheet is sandwiched between press dies composed of a male die and a female die, and heated. Then, a manufacturing method called press molding (drawing) is performed by pressurizing and molding.
At this time, it is preferable to adjust the moisture of the base paper for the buffer material in advance by adjusting the humidity. The moisture content of the base paper is preferably in the range of 10 to 20%, preferably 11 to 17%, more preferably 12 to 15%, and most preferably 12.5 to 14.5%. The water content of the base paper refers to the mass% of water with respect to the absolute dry mass of all pulp in the base paper. When the moisture content of the base paper is within this preferred range, plasticization of the base paper for the buffer material occurs, the formability is improved, and the breakage of the paper layer during molding is reduced. As a result, it is possible to obtain a cushioning material having a greater depth, a smooth and beautiful appearance, and a high rigidity. If the moisture content of the base paper is less than 10%, sufficient rigidity cannot be obtained in the molded product, and if it exceeds 20%, blisters are generated on the base paper and the paper layer of the base paper is peeled off. It takes a long time to produce a problem such as a decrease in productivity, which is not preferable.

(2) Molding method Next, a process for producing a molded body for packaging molding material from a blank sheet will be described.
In the present invention, press molding is performed by a pair of press dies. The pair of heating press molds are a convex mold having a convex shape corresponding to the inner volume of the molded product and a concave mold having a concave shape corresponding to the outer shape of the molded product. The pair of pressing dies can press the molded body for packaging material by moving at least one of the dies in the front-rear or up-down direction (see FIG. 6).
In addition, these press dies can be formed in a shape that is appropriately provided with a clearance so as not to press only the portion where the IC chip is arranged, if necessary. Since the IC chip used in the present invention is extremely small as compared with the entire molded body, even if a part of the IC chip is not pressurized, it can be molded without any problem (see FIG. 9).

In the present invention, at the time of pressing, it is preferable to heat either or both of the blank sheet and the pressing mold. Since the base paper and the coated paper are laminated, and the IC chip exists between them, the base paper of the present invention has excellent heat insulation and buffering properties so as not to break the IC chip. It is also possible to heat only the side mold.
As a heating method of the blank sheet, any means such as high frequency heating, hot air heating, infrared heating, etc. is used.
Further, as the mold heating means, the press mold is generally provided with an electrothermal heating device and heated, but it can be heated by applying a high frequency by providing a high frequency oscillator. Moreover, both can also be used together.

  Further, the heating temperature at the time of molding is preferably in the range where the processed base paper is 100 to 150 ° C, more preferably 110 to 140 ° C. If it is less than 100 ° C., it takes time for molding and productivity is lowered. On the other hand, if it exceeds 150 ° C., blisters are likely to occur especially when the moisture of the base paper is high, and the IC chip may be damaged.

  The molded body for packaging material that has been press-molded may be removed from the mold and air-cooled, but in order to improve dimensional stability, the high-temperature buffer material may be fixed and cooled for a certain period of time in the cooling mold. preferable.

  As a material for the heating press mold, a known material such as aluminum or an aluminum-based alloy can be appropriately selected and used.

  As a method of operating the mold, a conventionally known mechanism such as a hydraulic pressure, an air pressure, a cam mechanism, or the like can be appropriately employed. As a method of controlling the clearance between the upper die and the lower die at the time of press molding, in the case of hydraulic pressure or air pressure, each pressure can be controlled by computer control according to the thickness of the molded product. Further, the position of the stopper can be controlled. In the case of the cam mechanism, it can be controlled by a pre-designed cam shape and mold lowering speed.

The pressure during press molding is preferably in the range of 10 to 100 kgf / cm ² . If the pressure is lower than 10 kgf / cm ^2, the compression deformation of the ruled line portion may be insufficient, and if it exceeds 100 kgf / cm ² , the paper layer of the folded wrinkle portion may be destroyed. This is not preferable because the possibility of breakage increases.
About the press time at the time of press molding, the range of 2-30 seconds is preferable from the point of a moldability and workability | operativity.

<Base paper characteristics under high temperature and high humidity>
Under high-temperature and high-humidity conditions, such as during press molding, the breaking strength (tensile strength) of the forming base paper becomes weak and breaks with a small force. Further, under high humidity conditions, the higher the temperature, the smaller the elongation at break, that is, the tendency to break easily. For this reason, the tensile properties of the base paper at high temperatures and high humidity are important requirements for drawability, but it is difficult to measure the temperature and moisture of the paper during actual forming. Also, it is not easy to measure the tensile properties of paper under high temperature and high humidity.

However, as a result of research, the present inventors have found that a molded base paper obtained by laminating a base paper satisfying the following conditions under the conditions of a temperature of 23 ° C. and a water content of 14% by mass is high temperature and high humidity. It has been found that it is suitable for draw forming below.
(1) Longitudinal breaking elongation (JIS-P8113) is 2%, more preferably 3% or more.
(2) The tensile modulus in the longitudinal direction is in the range of 1000 to 2000 MPa, more preferably 1200 to 1800 MPa.
The moisture content in the paper refers to a value obtained by dividing the moisture mass in the paper by the total mass of the paper (pulp + additive + moisture) at the time of measuring elongation and elastic modulus.
In addition, the said measurement is a measurement in the state of the base paper in which a coating layer does not exist.

If the elongation at break in the vertical direction at the temperature of 23 ° C. and the moisture content in the paper is less than 2.0% is less than 2.0%, there is a possibility that the film may break due to low stretchability during press forming. There is.
In addition, when the tensile elastic modulus at a temperature of 23 ° C. and a moisture content in the paper of 14% by mass is within the range of 2500 MPa or less, the fluidity of the pulp fiber of the base paper is enhanced, and the paper layer breakage of the folded wrinkle portion during molding is reduced. As a result, a molded body having high strength can be obtained. When the tensile elastic modulus is less than 1000 MPa, there is a possibility that the problem of insufficient rigidity of the buffer material may occur.

<Packaging material>
The molded body for packaging material in the present invention is a shape that can be formed by drawing (press-molding) one forming base paper with a pair of convex and concave press dies, and stores products. It refers to packaging containers such as packaging trays used for packaging, or cushioning materials and other materials used as various packaging materials. The shape is arbitrarily determined according to the purpose, such as a bowl shape or a tray shape.
FIG. 7 is a perspective view showing an example of the molded article for packaging material of the present invention, and FIG. 8 is a sectional view thereof.
Moreover, FIG. 9 is sectional drawing which shows the other example of the molded object for packaging materials of this invention. This is obtained by manufacturing using a die having a shape in which a clearance is provided in that portion so as not to apply pressure to the portion where the IC chip is arranged during press molding.

  In addition, the molded body for packaging material obtained by press-molding the above-mentioned paper base has a smooth surface and more flexibility in shape than those using base paper such as ordinary paper and paperboard. It is possible to obtain a material having high rigidity and excellent shape stability.

Hereinafter, the present invention will be described more specifically with reference to examples.
<Example 1>
Using a disc refiner, commercial NBKP was beaten to 550 mlcsf (Tappi T-227 Canadian standard type), radialatapine TMP was beaten to 300 mlcsf, and commercial NUKP was beaten to 550 mlcsf.
These were a stock, first layer NBKP40g / m ² using a multi Extract alignment paper machine, the second layer TMP260g / m ^2, the third layer NUKP50g / paperboard 350 g / ^{m 2} consisting of three layers of m ² Paper making was performed to obtain a base paper 1. The base paper was measured for tensile strength, elongation at break, critical compressive stress, and amount of compressive deformation in the thickness direction by the measurement method described later (see Table 1).
The base paper 1 is used as a base paper and a covering paper, and an IC chip carrying tape (a 2 mm-wide conductive vapor deposition film serving as an external antenna layer is intermittently provided between the two sheets at the center. Applying 25 gwet / m ² of vinyl acetate adhesive with a non-contact IC chip mounted every 200 mm on a polyester tape with a width of 4 mm and a thickness of 30 μm. As a result, a molded base paper was obtained.
The molded base paper is adjusted with water vapor to moisture of 12.5% in the paper, punched out so that the IC chip is in the center of the blank sheet, and simultaneously provided with a stamp to form a blank sheet of a predetermined shape, The blank sheet is heat-pressed at 130 ° C. and 35 kg / cm ² with a male / female uneven mold using a test press molding machine (manufactured by Daiichi Koki) to obtain a molded article for packaging material. It was.
In addition, the shape of the molded object for packaging materials was made into FIG. The size of the molded body for packaging material was a substantially square shape having a bottom surface of 7 cm × 7 cm, an upper opening portion of 8 cm × 8 cm, a flange width of 1 cm, and a side surface height of 2.5 cm. In addition, the blank sheet | seat for obtaining this molded object for packaging materials is a substantially square.
Further, the position of the IC chip was arranged at the center of the bottom surface of the packaging material molded body.

<Example 2>
The first layer NBKP40g / m ^2, the second layer TMP200g / m ^2, the third layer NUKP40g / paperboard 280 g / ^{m 2} consisting of three layers of m ² and papermaking to yield a substrate sheet 2 (see Table 1 ).
Except using the said base paper 2 as a base paper and a covering paper, it carried out similarly to Example 1, and obtained the molded object for packaging materials of this invention.

<Example 3>
Example 1 except that the base paper 1 used in Example 1 was laminated and bonded with bleached kraft stretched paper (made by Oji Paper Co., Ltd .; basis weight 75 g / m ² ) as a coated paper, to obtain a molded base paper. In the same manner as above, a molded article for packaging material was obtained.

<Comparative Example 1>
Packaging as in Example 1 except that a commercially available K liner (trade name NRK280, made by Oji Paper; basis weight 280 g / m ²⁾ was laminated and bonded to obtain a base paper for processing as a base paper and coated paper. A molded body for the material was obtained.

[Evaluation methods]
The base paper obtained by the said Example and the comparative example, the shaping | molding base paper, and the molded object for packaging materials were evaluated with the following method. The results are shown in Tables 1 and 2.
(1) Density of each paper layer The base papers obtained in Examples and Comparative Examples were peeled from each other layer by the delamination method described in the peel strength test method for the paperboard making layer of JIS-P8139, The thickness (mm) and basis weight (g / m ² ) of each layer are determined. In addition, since the thickness of each peeled layer is fluffed by peeling and becomes thicker than the actual thickness, the correction factor value is calculated by the following method, the thickness value of each layer after peeling is corrected, and each layer The density of is calculated.
Correction factor value = total thickness before peeling / total value of each layer after peeling Peeling of each layer is difficult with the delamination method described in the peeling strength test method for the paper-sheet laminated layer of JIS-P8139 In such a case, the multi-layered sheet sample is immersed in warm water at 60 ° C. for 1 hour and then separated into a surface layer, a middle layer and a back layer. Each peeled layer is dried to determine the thickness (mm) and basis weight (g / m ² ). Thereafter, the correction factor value is similarly calculated to correct the thickness of each peeled layer, and the density of each layer is calculated.

(2) Tensile strength After conditioning the specimens of the base papers and coated papers of the Examples and Comparative Examples to a width of 15 mm and a length of 250 mm under conditions of 23 ° C. and 50% RH for 24 hours or more. Using a strograph M2 type testing machine (manufactured by Toyo Seiki Seisakusho), measurement was performed at a tensile speed of 20 mm / min according to JIS-P8113.

(3) Elongation after breakage After conditioning the base paper and the coated paper of Examples and Comparative Examples to a width of 15 mm and a length of 250 mm, the specimen was conditioned at 23 ° C. and 50% RH for 24 hours or more. Using a strograph M2 type testing machine (manufactured by Toyo Seiki Seisakusho), measurement was performed at a tensile speed of 20 mm / min according to JIS-P8113.

(4) Critical compressive stress A test piece obtained by cutting the base paper obtained in Examples and Comparative Examples into a width of 12.7 mm and a length of 152.4 mm in the flow direction and the width direction, respectively, at 23 ° C. and 50% RH. Measure the compressive strength A in accordance with JIS-P-8126 using a digital ring crush tester X-1104 (manufactured by Orientec), and further adjust the load partial area of the test piece when measuring the compressive strength. B was calculated and calculated from the following formula.
Critical compressive stress = A / B
Where critical compressive stress unit: MPa
Compressive strength unit: N
Area of load part of test piece = thickness of test piece (mm) × 152.4 mm
(The thickness of the test piece is a value measured according to JIS-P8118 for a sample conditioned for 24 hours or more under the conditions of 23 ° C. and 50% RH)

(5) Amount of compressive deformation A test piece obtained by cutting the base paper obtained in Examples and Comparative Examples into 50 mm × 50 mm was conditioned at 23 ° C. and 50% RH for 24 hours or more, and then a strograph M2 type test Using a machine (Toyo Seiki Seisakusho), compress one test piece in the thickness direction at a compression rate of 1.0 mm / min, draw a stress-strain curve, and compress the amount (strain amount) at a compressive stress of 20 kgf / cm ² ) Was measured.

(6) Formability The presence or absence of cracks and breaks on the paper layer surface of the press-molded molded article for packaging material was evaluated. A paper layer without cracking or paper breakage was marked with ◯, and a crack or breakage at one location was marked with x.

(7) IC chip operation investigation When the press molded packaging material is brought close to the reading part of the IC chip reader device (manufactured by Hitachi Kokusai Electric Co., Ltd.) up to 50 mm, the one that operates the reader device does not operate. The thing was made into x.

It is sectional drawing of a shaping | molding process base paper. It is sectional drawing of an IC chip carrying | support tape. It is a schematic diagram of the manufacturing method of a shaping | molding process base paper. It is a schematic diagram of the manufacturing method of a shaping | molding process base paper. It is a plane explanatory view at the time of punching. It is explanatory drawing of a press molding process. It is a perspective view of the molded object for packaging materials of this invention. It is sectional drawing of the molded object for packaging materials of this invention. It is sectional drawing of the molded object for packaging materials of this invention.

Explanation of symbols

  1: base paper for processing, 2: base paper, 3: coated paper, 4: adhesive layer, 5: IC chip carrying tape, 6: base paper roll, 7: coated paper roll, 8: IC chip carrying tape roll , 9: blank sheet, 10: molded article for packaging material, p: IC chip, q: external antenna layer, r: film layer, s: IC chip supply device, t: bonding roll, u: convex mold, v: Concave

Claims (4)

A molded article for packaging material obtained by press-molding a forming base paper in which an IC chip is sandwiched and laminated between a base paper and a coated paper, wherein the base paper is the following (1) A molded body for packaging material, which satisfies the four conditions (4) to (4).
(1) Tensile strength (JIS-P8113) is 2.0 kN / m or more.
(2) Elongation at break (JIS-P8113) is 1.5% or more.
(3) The critical compressive stress defined by the following formula is in the range of 1 to 10 MPa.
Critical compressive stress = A / B
However, A is the compressive strength according to JIS-P8126,
B shows the load part area of the test piece at the time of compressive strength measurement, respectively.
(4) The amount of compressive deformation when a compressive stress of 20 kgf / cm ² is applied in the thickness direction is 10% or more.   The molded article for packaging material according to claim 1, wherein mechanical pulp is included as a raw material pulp of the base paper. A molded article for packaging material obtained by press-molding a forming base paper in which an IC chip is sandwiched and laminated between a base paper and a coated paper, and the base paper has a density of 0.7 to dense layer of 0.9 g / cm ^3, and has a low density layer of density 0.2~0.65g / cm ^3, a basis weight is 100 to 500 g / m ^2, the total density of from 0.4 to 0 .7g / cm ^3, and the low-density layer is mechanical pulp, curled fibers, and packaging materials for moldings, characterized in that as a major component, a pulp selected from at least one of mercerized pulp.   The base paper, IC chip carrier tape and coated paper are successively laminated in this order from each winding, and the base paper obtained by pasting is made into a blank sheet by punching, and the blank sheet is pressed The manufacturing method of the molded object for packaging materials described in any one of Claims 1-3 characterized by the above-mentioned.

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