JP2008106417A - Paper having enclosed ic tag - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide paper having an enclosed IC tag, which exhibits good adhesiveness between an IC tag inlet and paper layers and good appearance without faults such as unevenness. <P>SOLUTION: The paper having an enclosed IC tag is prepared by enclosing a non-contact IC tag inlet installed with at least an IC chip and an antenna on a base material between paper layers during paper making. The surface of the base material of the IC tag inlet has a wet tension of ≥45 mN/m measured according to JIS K 6768. It is preferable to coat the base material surface of the IC tag inlet with a hydrophilic material or to treat the surface with plasma or corona discharge. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to an IC tag-made paper in which an IC tag inlet of a non-contact type in which an IC chip and an antenna are installed on a substrate is made between paper layers.

  Regarding a wireless communication element (RFID: Radio Frequency IDentification, the contactless IC tag inlet of the present invention corresponds to this) that holds information electronically and transmits information in a contactless manner by wireless communication with an external device. “RFID tag for applying information to an object and its application” Journal of Information Processing Society of Japan, Vol. 40, No. 8, p846-850 (August 1999), has begun to be applied.

  The individual recognition method using the wireless communication element has advantages such as relatively large data storage capacity compared to the conventional bar code, and no influence of design restrictions or surface contamination due to information transmission by electromagnetic induction. is there.

  In particular, a non-contact type IC tag inlet with an IC chip and an antenna is built in a thin sheet-like recording medium such as paper, so-called IC that can hold electronic information in addition to visual and visual recording information. Tag paper has been widely used as an interface between humans and digital data, for example, as shown in Patent Document 1 and the like.

  However, when the IC tag inlet is incorporated in a thin sheet-like recording medium such as paper, it has the following problems. That is, (1) if the plate-like IC tag inlet is inserted in a state that is not parallel to the front and back surfaces of the paper, breakage of the paper, dropout of the IC tag inlet, poor appearance, etc. occur. Inserting an IC tag inlet during papermaking causes comet defects, papermaking irregularities, paper layer destruction, etc. on the paper surface. (3) When the paper is folded, the IC tag inlet and the paper are separated, resulting in paper breakage, IC tag Inlet dropping occurs. (4) In particular, when an IC tag inlet is present in the image area, the image is adversely affected by the color of the IC tag inlet built-in portion, light reflection, or the like.

  In response to the above problems, as a method for producing a paper IC tag, there has been proposed a method in which an adhesive layer is provided on the front and back surfaces of an IC tag inlet, and a card paper is adhered thereon (for example, a patent). References 2, 3). Usually, the structure when the IC tag inlet is encapsulated in the paper in this way is as follows: surface substrate / adhesive (adhesive) / IC tag inlet / adhesive (adhesive) / surface substrate. Many layers are required. For this reason, there are problems that not only the number of manufacturing processes is large, but the processing is very complicated and the cost is increased.

As another method, a method of embedding an IC tag inlet between paper layers of a paper base material has been proposed (for example, Patent Documents 4 and 5). The IC tag inlet is built into the base material by making it between the paper layers during the paper making process in a paper machine, etc., and saves the processing work for attaching or sandwiching the inlet to the paper. Furthermore, there is an advantage that the inlet can be built in parallel to the front and back surfaces of the paper. However, this method causes problems such as swelling in the IC tag inlet portion or a gap between the IC tag inlet and the paper layer when the IC tag paper is folded.

  Furthermore, for example, Patent Document 6 describes a method in which a water-soluble sheet having a larger surface than an IC tag inlet is bonded in advance, and the water-soluble sheet is embedded in a liquid or semi-liquid paper. Has been. However, with this method, the IC tag inlet can be built in parallel to the front and back surfaces of the paper, but comet defects and papermaking irregularities occur, and further, when the paper is bent, the IC tag inlet and the paper are dissociated. It was.

  Patent Document 7 discloses a technique for hydrophilizing the substrate surface of the IC tag inlet, but the paper layer may be crushed during the paper making process, which is insufficient.

JP 2002-175355 A JP 2002-342728 A JP 2003-85518 A JP 2002-298118 A JP 2004-102353 A JP 2002-120475 A JP 2004-124308 A

When the IC tag inlet is made into the paper layer, the paper making is performed until the pulp fiber dispersed in a large amount of water in a slurry state is formed on the web until the paper layer sheet is formed. In this case, the moisture content in the paper layer sheet before being dehydrated by a press roll is as high as 70 to 90%. For this reason, the familiarity between the IC tag inlet and the water greatly affects the engraving state.
Furthermore, if the paper layer shrinks during drying in the engraving process or in the subsequent processing process, the paper layer shrinks if the IC tag inlet and the paper layer have good adhesion. However, if the adhesion is poor, as a result of the shrinkage of the paper layer, unevenness is noticeable, resulting in a large defect in appearance.
However, IC tag inlets that are generally used at present are manufactured by procedures such as metal deposition / etching for antenna formation and IC chip mounting, but the surface is a process that takes into account the degree of familiarity with water. In order to produce a good IC tag, improvement was necessary.
The present invention improves the surface wettability of the IC tag inlet, which is a problem of these technologies, so that the adhesion between the IC tag inlet and the paper layer is good, and the appearance is also good without defects such as irregularities. The purpose is to provide paper.

As a result of intensive studies by the inventor, by setting the critical surface tension of the substrate surface of the IC tag inlet to 45 mN / m, not only the wettability of the substrate surface of the IC tag inlet to water is improved, but also pulp fibers, etc. It has been found that the adhesion with the can be improved significantly.
Therefore, the above object of the present invention is achieved by the following configuration.

1. In an IC tag paper made by embedding a non-contact type IC tag inlet having at least an IC chip and an antenna on a base material between paper layers, JIS K 6768 on the surface of the base material of the IC tag inlet IC tag paper imprinting paper characterized by having a wetting tension of 45 mN / m or more evaluated according to the above.

2. 2. The IC tag paper imprinted according to claim 1, wherein the substrate of the IC tag inlet is formed by applying a hydrophilic substance on the surface.

3. The IC tag paper-making paper according to claim 1, wherein the surface of the base material of the IC tag inlet is subjected to plasma treatment.

4). The IC tag paper-imprinted paper according to claim 1, wherein the substrate of the IC tag inlet is subjected to corona discharge treatment on the surface.

According to the present invention, a radio communication element (RFID) tag can be stably embedded in a support, thickness unevenness and surface defects can be reduced, and adhesion between the RFID tag and a paper layer is good, and appearance defects are not produced during papermaking. It was possible to provide a paper support for recording which does not occur.

Details of the present invention will be described below.
One feature of the recording paper support of the present invention is that the paper support includes a wireless communication element capable of wireless communication.

  As a wireless communication element capable of wireless communication that can be used in the present invention, a tag type transponder of a communication module such as an IC module with a non-contact communication type antenna coil such as RFID can be cited.

An example of the configuration of the IC tag inlet according to the present invention is described in JP-A-2004-124308.
In the IC tag inlet, an electronic circuit such as an IC chip functioning as a memory, an antenna, a tuning capacitor, and the like are connected and arranged on a base material such as a film via wiring. In this manner, by connecting the IC chip and the antenna, wireless communication with a communication device called a writer or a reader can be performed, and product information or the like can be written to or read from the IC chip. The maximum capacity that can be recorded on an IC chip is several tens of kilobytes, and the recording capacity is about 100 times. As the antenna, an electromagnetic induction type that can be wirelessly communicated by winding a conducting wire in a coil shape, or a radio wave type that connects a pole-shaped antenna to an IC chip can be used.

For the base material of the IC tag, a plastic film is mainly used. For example, polyethylene terephthalate, acrylonitrile-butadiene-styrene resin, epoxy resin, phenol resin, or the like can be used. All of these resins are excellent in durability in order to provide the base material with insulation and heat resistance and at the same time protect the IC chip which is not durable against moisture.
Although the thickness of the base material of the IC tag is not particularly limited, it is preferably 10 μm to 200 μm, more preferably 30 μm to 100 μm in consideration of the appearance of the product.

  The IC tag inlet is available as a commercial product, and examples thereof include OMRON V720 series and V750 series.

  In the present invention, the method for disposing the IC tag inlet in the paper support is not particularly limited, but an example thereof will be described below.

For example, in a paper support production line, pulp fibers dispersed in water can be separately separated by at least two meshes (wires) and then bonded together in a wet paper state, dehydrated and dried. it can. The sheeting can be performed not only in two layers but also in three or more layers, and size pressing can be performed as necessary. In any case, the IC tag inlet can be enclosed between the paper layers by inserting the individual IC tag inlets so as to be sandwiched between the wet papers immediately before the wet papers are put together.
However, when making paper using a circular multi-cylinder paper machine that normally makes laminated paper, an IC tag is inserted between the paper layers from below the wet paper web. It will fall. At that time, if the IC tag inlet is pressed against the wet paper in order to prevent the IC tag inlet from falling, the wet paper layer is destroyed and the surface of the paper-making paper portion including the IC tag inlet is not smooth. Problems occur.

  Therefore, it is preferable to insert the IC tag inlet from the upper part of the wet paper. Also, from the IC tag inlet insertion position to the making section of the multilayer paper machine (the place where the wet paper and the wet paper are bonded), It is preferable that an IC tag inlet exists above. That is, in the present invention, a combination of one or more of on-top (short mesh) paper machine, circular mesh paper machine, and long mesh paper machine, for example, long mesh and long mesh, long mesh and short mesh, long mesh and By using a combination paper machine such as a circular net, an IC tag inlet is installed (inserted) on the surface of the wet paper from above the wet paper formed on the paper, and then formed on another paper net. The wet paper can be made together to obtain IC tag paper. Further, by increasing the number of combinations of these paper machines, it is possible to produce a multilayer laminated paper having three or more layers.

The material of the pulp that can be used for the laminated paper is not particularly limited, and LBKP, NBKP, mechanical pulp, waste paper, and the like can be used. Moreover, beating conditions are not limited, and the freeness can be used as long as the freeness is 200 to 550 ml.
For example, the papermaking can be performed by the above-described method, but the pulp used for each paper layer is not particularly limited, and may be the same material and freeness, or may be different. Similarly, even in the case of three or more layers of laminated paper, the material and drainage may be the same or different in each layer.
Furthermore, in the present invention, a filler and a sizing agent can be added to the paper layer as necessary. Although the kind of filler is not specifically limited, For example, calcium carbonate, talc, titanium oxide, kaolin clay, etc. can be used. Similarly, the sizing agent is not particularly limited, and examples thereof include rosin series, modified rosin series, alkyl ketene dimer, styrene series, styrene-acrylic series, alkenyl succinic series, and olefin series. As additives, fluorescent dyes, colorants, pH adjusters, sulfuric acid bands, yield improvers, and the like can be used as appropriate in the stock.

  Adhesion between wet papers is possible by applying pressure with a nip roll, but by spraying a paper strength enhancer on the inner surface to be attached by spraying or adding it to the stock, It is also possible to further improve the adhesion to the paper layer. The type of the paper strength enhancer is not particularly limited. Examples thereof include acrylic acid esters and polyamide epichlorohydrin.

  Any means can be used for installing (inserting) the individual IC tag inlet from above the wet paper web. For example, the IC tag inlet is inserted from above between the papermaking nets. It is preferable to install a device that can be placed one by one on the wet paper and automatically insert individual IC tag inlets at regular intervals or regular intervals. In addition, by attaching various sensors to the above-described apparatus, it is possible to selectively insert into a designated place, for example, a depression on a wet paper web formed on a papermaking net.

In the present invention, the surface tension of the surface of the IC tag inlet is preferably 45 mN / m or more.
That is, in the present invention, the object of the present application can be achieved by improving the surface wettability of the IC tag inlet and adjusting it within a specified range.

  The method for improving the surface wettability of the IC tag inlet is not particularly limited, and examples thereof include a method of coating a hydrophilic substance on the surface and a method of modifying the surface.

Examples of hydrophilic substances include natural polymers (for example, agar, starch derivatives, vegetable galactomannans, gelatin, etc.), hydrophilic synthetic resins (for example, polyacrylamide, polyvinyl alcohol, etc.), and latex having hydrophilic components. (For example, copolymer latex having at least ethylene and acrylic acid or methacrylic acid as constituents, styrene-butadiene, styrene-acryl, vinyl acetate-acryl, ethylene-vinyl acetate, butadiene-methyl methacrylate Polymers and latexes of carboxy-modified copolymers thereof can be preferably used.
Further, the surface treatment methods are roughly divided into two methods, and the following treatment methods are preferable. One is, for example, chemical treatment using chemicals such as acid, alkali, oxidant, and the other is, for example, ozone treatment, plasma treatment, corona discharge treatment, flame treatment, glow discharge treatment, It is a physical treatment such as ultraviolet treatment.
The corona discharge treatment method, which is a physical treatment method, is generally used as a surface treatment method for a film base material in particular. However, the surface modification is performed by the oxidizing action of ozone generated secondary by discharge. . In the case of IC tag inlet processing, discharge may be concentrated on the metal antenna portion on the IC tag inlet, and the IC tag inlet base material may be damaged. Therefore, the discharge amount needs to be adjusted optimally.
The plasma treatment is a surface treatment method in which a plasma gas obtained by activating a gas with a high frequency transmitter is applied to a polymer surface to cause a chemical reaction to generate a functional group. Due to the treatment with gas, it is possible to treat only the very surface layer of the base material, and there is almost no charge damage to the IC tag inlet such as unipolar discharge or scorching of the base material. Furthermore, since various functional groups can be generated by selecting various gases to be activated, an optimal treatment effect can be selected, which is more preferable.

  In the present invention, it is preferable that the wetting tension of the surface of the IC tag inlet base material with improved surface wettability is equal to or higher than the surface tension of the stock liquid. It is preferable that the wetting tension on the surface of the IC tag inlet substrate is 45 mN / m or more, more preferably 50 mN / m or more. The wetting tension can be measured by a method defined in JIS.

  As a method for improving the surface wettability of the IC tag inlet and adjusting the surface tension within the range defined in the present invention, it is possible to select the hydrophilic substance or the surface treatment method.

  By using the IC tag inlet with improved surface wettability obtained by the above method, it can be stably incorporated in the paper, thickness unevenness and surface defects are reduced, and the adhesion between the IC tag inlet and the paper layer is improved. A recording paper support containing improved wireless communication elements can be provided.

Further, the IC tag inlet paper of the present invention is used as a paper support for various recording papers and label papers such as offset printing paper, ink jet recording paper, electrophotographic recording paper, thermal recording paper, pressure sensitive recording paper, etc. It is also possible.

  Examples of the main body shape of the IC tag inlet according to the present invention include a label shape, a card shape, a coin shape, and a stick shape. In the present invention, it is preferable to provide an opening in the substrate while avoiding the antenna and IC chip of the IC tag inlet. By providing the opening, adhesion to pulp fibers and the like is improved.

  As described above, in order to produce the IC tag paper-making paper of the present invention, the IC tag inlet is subjected to the surface wettability improving treatment and then installed (inserted) on the wet paper surface. In addition, IC tag paper can be constructed by making wet paper from the opposite side so as to sandwich the IC tag inlet, but it is possible to make 3 or more wet paper layers. is there.

  Examples of the present invention will be specifically described below, but the embodiments of the present invention are not limited thereto. In the examples, “parts” means “parts by mass” unless otherwise specified.

<< Production of IC tag inlet in the present invention >>
Various surface treatments are performed on the base material of the IC tag inlet having a card size (96 mm × 55 mm) and a thickness of 0.1 mm having the IC chip and the antenna connected and installed. IC tag inlets 1 to 11 were produced.

In the production of each IC tag inlet, the surface wettability can be improved by appropriately adjusting the amount and type of hydrophilic functional groups of the acrylate-acrylic acid latex component to be coated on the surface of the IC tag inlet substrate. Or by adjusting the irradiation intensity when performing plasma treatment using nitrogen gas as a medium in an Axis plasma processing apparatus, or when performing corona discharge treatment in a corona surface treatment apparatus manufactured by Kasuga Electric Co., Ltd. The amount of corona discharge was appropriately adjusted to obtain a desired surface wetting tension.

<Preparation of IC tag paper>
The raw materials for papermaking are 100 parts by weight of bleached hardwood LBKP beaten to a Canadian standard freeness of 400 ml, 20 parts by weight of light calcium carbonate, 0.015 parts of alkyl ketene dimer, 0.5 parts by weight of cationized starch, and enhanced wet paper strength. As an agent, 2 parts by weight of polyamide / epichlorohydrin was added, and finally water was added to prepare a 1% concentration.

For the production of IC tag paper, a combination of a long paper machine and a circular paper machine with a structure in which a wet paper made of a round net is made on a wet paper formed on a long net. The paper making speed was 50 m / min. After the papermaking raw material is made on a wire of a long web paper machine so that the basis weight after drying is 100 g / m ² , an individual IC tag inlet is placed on the wet paper, and the IC On the tag inlet, the papermaking raw material taken up on the wire of a circular net paper machine was overlaid so that the basis weight after drying was 100 g / m ² . Then, after dehydrating through a wet press at a linear pressure of 50 kg / cm, drying was performed at 110 ° C., thereby producing IC tag papers embedded in Examples 1 to 6 and Comparative Examples 1 to 5 incorporating IC tag inlets. .

<Evaluation of IC tag paper>
Each of the following evaluations was performed on the IC tag paper made as described above.

<Evaluation of adhesion between IC tag inlet and paper layer>
The adhesion between the IC tag inlet and the paper layer was evaluated according to the following criteria by the degree of peeling when both were peeled by hand.
A: High adhesion between IC tag inlet and paper layer, and does not peel off easily.
○: Slightly easy to peel off, but practically no problem.
X: It peels off easily.

<Appearance evaluation>
The unevenness of the IC tag inlet paper making part was visually evaluated.
(Double-circle): Unevenness is not seen at all.
○: Slight irregularities are observed, but there is no practical problem.
X: A large unevenness | corrugation is seen in the whole IC tag inlet engraving part.

  The results obtained as described above are shown in Table 2.

  As is apparent from Table 2, the IC tag paper with the IC tag inlets of Examples 1 to 6 having the characteristics defined in the present invention has a wetting tension of less than 45 mN / m on the surface of the IC tag inlet. Compared with Comparative Examples 1 to 5, the adhesion between the IC tag inlet and the paper layer is good, the appearance is less likely to have irregularities such as wrinkles and undulations, and the paper layer is completely broken during engraving. It can be seen that the operability is also excellent.

Claims (4)

In an IC tag paper made by embedding a non-contact type IC tag inlet having at least an IC chip and an antenna on a base material between paper layers, JIS K 6768 on the surface of the base material of the IC tag inlet IC tag paper imprinting paper characterized by having a wetting tension of 45 mN / m or more evaluated according to the above. 2. The IC tag paper-imprinted paper according to claim 1, wherein the substrate of the IC tag inlet is formed by applying a hydrophilic substance on the surface. The IC tag paper-making paper according to claim 1, wherein the surface of the base material of the IC tag inlet is subjected to plasma treatment. The IC tag paper-imprinted paper according to claim 1, wherein the substrate of the IC tag inlet is subjected to corona discharge treatment on the surface.