JP2010189801A - Method for manufacturing paper with embedded ic tag inlet - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a technique for manufacturing paper with embedded IC tag inlets which has no corrugation or drying unevenness on the paper surface caused by drying shrinkage and gives smoothness in the drying step. <P>SOLUTION: The method for manufacturing paper with IC tag inlets embedded which contains an IC tag inlet 2 having an IC chip 2c and an antenna 2b in the paper contains at least the step in which the laminate is held between surfaces warmed through a net and get warmed and pressured until water content of the laminate becomes 8 mass% or below after the IC tag inlet having the IC chip and the antenna is inserted between two wet paper sheets of obtained by being embedded through a screen and the laminate is obtained. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to a method for producing an IC tag inlet paper that is obtained by embedding a non-contact type IC tag inlet in paper.

  An IC tag has an IC chip and an antenna, and normally starts operating as a device capable of reading and writing a large amount of information by operating with a radio wave or magnetic field generated from a reader or writer without incorporating a battery. . The memory capacity of an IC chip is several tens of kilobytes at maximum, which is more than a two-dimensional barcode, and data can be read and written even if the chip is in a cardboard box or a few meters away from the chip. It can be carried out.

  By using IC tags, a system that optimizes the information that was managed with discrete barcodes at the parts manufacturer, manufacturing, wholesale, and retail stages as a whole will be built. It is said that it will be relieved. In addition, in the fields of medical care, food, education, lending / borrowing / collection management at libraries, entrance / exit management at offices, publishing, etc., new services using IC tags are becoming a means to be born.

  An IC tag is usually configured by attaching a thin inlet formed by arranging at least an IC chip and an antenna on a base material such as a plastic film, to a mount, or by coating with resin or sandwiching between papers.

  As such an IC tag, a technique is disclosed in which an inlet is held on an adhesive surface of tack paper, the adhesive surface is exposed from an opening of the inlet, and the IC tag is attached to a target article (for example, Patent Document 1). reference). According to this technique, there is an advantage that only one contact layer is required as compared with the case where an adhesive layer for the mount and an adhesive layer for the object are separately provided on the front and back of the inlet, respectively.

  Further, a technique has been proposed in which the film constituting the inlet is made water-soluble, and this inlet is laminated with two films or wet paper (for example, see Patent Document 2).

  On the other hand, a technique has been proposed in which a large number of IC chips with antennas are carried along the longitudinal direction of a strip called a thread, and the thread is combined between two paper layers (for example, Patent Document 3, 4). Further, a technique for combining individual inlets between two paper layers instead of threads has been proposed (see, for example, Patent Documents 5 to 7).

JP 2002-342728 A Japanese Patent Laid-Open No. 2001-134734 JP 2004-139405 A JP 2005-171396 A Japanese Unexamined Patent Publication No. 2007-122222 JP 2008-077155 A JP 2008-248448

  However, in the case of the techniques described in Patent Documents 1 and 2, since it is necessary to use tack paper having an adhesive layer or to use a water-soluble film as a film constituting the inlet, the cost increases and the production efficiency deteriorates.

  In the case of the techniques described in Patent Documents 3 and 4, since the thread to be made into the paper layer is a continuous roll, the product size of the paper to be made is the size of the IC chip or antenna carried on the thread. In addition, there is an inconvenience that they are determined by the interval at which these are arranged in the thread. Therefore, in order to change the product size of the engraved paper, it is necessary to change the size of the antenna in the sled and the installation interval, which is very impractical and impractical.

  Furthermore, all of the techniques described in Patent Documents 3 to 7 are for threading a thread or an inlet into a paper layer. However, when the IC tag inlet paper is dried using a commonly used multi-cylinder dryer, Since the escape of steam is inhibited at the tag inlet insertion portion, a difference in drying speed occurs between the insertion portion and the non-insertion portion. Further, since the IC tag inlet is present in the paper, the substrate film of the IC tag inlet is softened by the drying heat when the drying proceeds. For this reason, the completed paper sheet may be deformed by the IC tag inlet and the entire sheet may be wavy.

  Further, when the calendar process is performed for the purpose of imparting printability, there is a problem that the IC chip is broken or the IC chip is marked on the calendar roll by a high linear pressure applied during the calendar process. For this reason, it was not possible to calendar the IC tag inlet paper.

  Further, when a Yankee dryer that imparts gloss by transferring the mirror surface of the cylinder in the drying process is used, the steam generated between the IC tag inlet and the cylinder is shown in FIG. 5 by the IC tag inlet. Prevents obstruction of the paper from coming out of the paper, resulting in poor drying and uneven gloss.

  Therefore, an object of the present invention is to provide a technique for producing smoothness in a drying process without producing undulation or drying unevenness of the paper surface due to drying shrinkage when producing IC tag inlet paper.

  As a result of examining the above-mentioned problems, the inventors do not cause unevenness in the appearance and do not cause unevenness of drying by drying in a state of being nipped by a plurality of layers of mesh when drying a wet paper incorporating an IC tag inlet. I found.

  Accordingly, the present invention relates to a method of manufacturing an IC tag inlet paper that contains an IC tag inlet having an IC chip and an antenna in the paper, and includes at least two wet papers obtained by papermaking on a papermaking net. After an IC tag inlet having an IC chip and an antenna is inserted between papers to obtain a laminate, the laminate is sandwiched between surfaces heated via a mesh, and the moisture content of the laminate The method for producing the IC tag inlet paper-making paper, comprising a step of heating and pressurizing until the content becomes 8% by mass or less.

  The network is preferably a metal sheet or a synthetic resin sheet.

  According to the present invention, after IC tag inlets are combined between wet papers, they are dried in a state where they are nipped by a mesh body, and there is no deformation in the appearance, and there is no drying unevenness. Paper can be obtained.

It is a top view which shows an example of an IC tag inlet. It is a conceptual diagram which shows an example of the drying method of the IC tag inlet paper of this invention. It is a conceptual diagram which shows an example of the paper machine which manufactures an IC tag inlet paper. It is a figure which shows the cross section of a direction perpendicular | vertical to the plane of IC tag papermaking paper. It is a conceptual diagram which shows the omission of water vapor | steam when an IC tag inlet papermaking paper is dried with a Yankee dryer. It is a conceptual diagram which shows another example of the drying method of the IC tag inlet paper of this invention.

In the present invention, a laminate obtained by inserting an IC tag inlet between wet papers obtained by papermaking with a papermaking net is added via a mesh (mesh) until the water content is 8% by mass or less. It is characterized in that it is nipped on a warm surface and dried.
In the present invention, since heating is performed in a state where a mesh (mesh) having high vapor permeability is in contact with both surfaces of the laminate, water vapor is released from both surfaces of the laminate. For this reason, even when the IC tag inlet is inserted, water vapor escapes without being disturbed by the IC tag inlet during drying, and there is no difference in drying speed between the insertion portion and the non-insertion portion of the IC tag inlet.

  In the present invention, since the heat of the heated surface is transmitted to the wet paper via a mesh (mesh), it is preferable that the material of the mesh is made of metal, but the mesh that is in direct contact with the wet paper is used. The body can be made of heat-resistant nylon. In the present invention, instead of the mesh that is in direct contact with the wet paper, cast paper, felt for papermaking, etc. can be used in addition to the mesh as long as the water vapor permeability is good and the smoothness is high. However, cast paper requires higher water resistance for repeated use, and felt is not preferred because of poor heat conductivity for drying.

The mesh (mesh) is preferably 300 mesh or more because the surface property is transferred to paper. Further, the nip pressure may be 0.2 MPa or more so that the entire processing surface is in close contact, but in order to improve the transfer of the mesh surface, it is desirable to nip at a higher pressure. In this invention, since it dries in the nipped state, it has the effect of suppressing the drying shrinkage of paper and the deformation | transformation (waves) of the base film of an IC tag inlet.
In the present invention, it is preferable that five or more layers of the mesh body (mesh) are stacked in order to release the generated vapor. When there are few reticulate bodies (mesh), the generated steam is difficult to escape and drying does not proceed.

  In the present invention, the apparatus is not limited as long as it is nipped on a heated surface such as a hot plate through a mesh (mesh) until the wet paper is dried. For example, an application of a conde belt dryer device can be considered. In a general Conde belt dryer, one side has a heated metal belt and the other has a cooled metal belt and a wire mesh. To apply this to the present invention, as shown in FIG. 6, a wire mesh belt may be stacked on a metal belt heated on both sides.

<IC tag inlet>
The IC tag inlet has an IC chip and an antenna, and usually has a flat plate shape. The IC tag inlet in the present invention refers to a thin inlet in which at least an IC chip and an antenna are arranged on a substrate such as a plastic film, and includes those in which this inlet is attached to a mount or a resin coating.

  The IC chip of the IC tag inlet and the antenna are connected, and by communicating wirelessly with a communication device such as a reader or a writer, product information stored in the IC chip can be read or written to the IC chip. Usually, the maximum capacity that can be recorded on an IC chip is several tens of kilobytes, and the recording capacity is about 100 times that of a barcode. As the antenna, an electromagnetic induction type in which a conducting wire is wound in a coil shape so that wireless communication can be used, or a pole type antenna connected to an IC chip can be used.

  The IC tag inlet can be manufactured, for example, as follows. First, after sticking aluminum foil on a roll-shaped film base material, an antenna pattern is created by an etching process. As another method for creating an antenna, a conductive paste to be an antenna pattern can be printed on a film. After the antenna pattern is created, an inlet can be obtained by bonding an IC chip on the film with an adhesive or the like. These series of steps are performed on a roll-shaped film and then cut into individual inlet pieces.

  As the film substrate, a plastic film is mainly used. For example, polyethylene terephthalate, acrylonitrile-butadiene-styrene resin, epoxy resin, phenol resin, or the like can be used. Any of these resins can provide an insulating material and heat resistance to the base material and at the same time protect an IC chip having no water resistance, so that a resin having excellent water resistance can be used. Although the thickness of a film base material is not specifically limited, In consideration of the external appearance of goods, it is preferable that it is 10 micrometers-200 micrometers, More preferably, it is 30 micrometers-80 micrometers.

  FIG. 1 is a plan view showing an example of an IC tag. In this figure, an antenna 2b is formed so as to surround a peripheral portion on a rectangular film substrate 2a, and an IC chip 2c is disposed on the film substrate 2a so as to be connected to the antenna 2b. The inlet 2 is configured.

<Incorporating IC tags>
The method for making the IC tag into the paper layer is not particularly limited. For example, a general multilayer paper machine can be used, and the IC tag can be sandwiched between a plurality of wet papers.
In particular, a method in which the surfaces of wet paper sheets that have been made using two paper machines are made to face each other, an IC tag is placed on one wet paper sheet in this state, and then the wet paper sheets are combined and dried. Is preferred. When the same paper stock is used as each wet paper, when each wet paper is combined, it is integrated into one paper layer. In addition, when different paper materials are used for each wet paper, when each wet paper is combined, it becomes a two-layer paper layer, and the IC tag is engraved between each paper layer. "Incorporate in".

  Note that three or more paper layers may be formed by combining three or more wet paper sheets. In this case, the IC tag is in one of the paper layers or between two adjacent paper layers. The point that the inlet is drawn is the same as above.

  FIG. 4 shows a cross section in a direction perpendicular to the plane of the IC tag inlet paper. The IC tag inlet 11 is incorporated in the paper layer. Since the paper layers are wet papers 12a and 12b made of the same paper material, the paper layers appear to be composed of a single paper layer as a whole after drying.

The material of the pulp used for the paper layer (wet paper) is not particularly limited, and LBKP, NBKP, mechanical pulp, waste paper, and the like can be used. Further, the beating conditions are not limited, and any freeness of 200 to 550 ml can be used.
The pulp used for the two (or more) wet papers laminated to form the paper layer may be the same material and freeness, or may be different. The same applies to the case of wet paper made of three or more layers of wet paper.

Furthermore, in the present invention, a filler and a sizing agent can be added to the paper layer (wet paper) as necessary. Although the kind of filler is not specifically limited, For example, calcium carbonate, talc, titanium oxide, kaolin, clay, etc. can be used. Similarly, the sizing agent is not particularly limited, and examples thereof include rosin type, modified rosin type, alkyl ketene dimer, styrene type, styrene-acrylic type, alkenyl succinic acid type, and olefin type. In addition, fluorescent dyes, colorants, PH preparation agents, sulfuric acid bands, yield improvers, etc. can be used as appropriate as additives in the stock. An IC tag inlet is placed on the surface of the wet paper, and is separated on top of it. After the wet paper webs are superposed, they are dehydrated by nip rolls and then dried by the means of the present invention.

  Moreover, normal size press can also be performed with respect to the obtained paper layer. Although the kind of chemical | medical agent used for a size press is not specifically limited, As an example, starch, oxidized starch, cationized starch, phosphorylated ester starch, polyvinyl alcohol, carboxymethylcellulose, etc. can be mention | raise | lifted.

  By applying an adhesive layer on the surface of the IC tag inlet paper made as described above, it can be used as a label. Further, by providing a coating layer on the surface, various recording aptitudes such as offset printing aptitude, thermal transfer recording aptitude, ink jet recording aptitude, and thermal recording aptitude can be imparted.

<Incorporation of IC tag inlet using a general multilayer paper machine>
Next, an example of making an IC tag inlet using a general multilayer paper machine will be described. As the multilayer paper machine, one having two circular mesh (wire) cylinders in parallel and a felt belt moving on each cylinder is used. Then, the pulp fibers dispersed in water are drawn from a tank for storing the stock with a cylinder, a first wet paper is formed on the lower surface of the felt, and an IC tag inlet is placed on the lower surface of the first wet paper. Thereafter, the second wet paper is put on the lower surface of the first wet paper and the IC tag inlet by a cylinder having a tank, and dehydrated and dried. This method is exemplified in FIG. 1 of JP-A-2002-298118, for example.

  However, in this method, since the IC tag is placed on the lower surface of the wet paper, the IC tag may fall during the making. Further, when the IC tag inlet is pressed against the wet paper so that it does not fall, the wet paper layer is destroyed, and the surface of the paper to be engraved in the portion including the IC tag inlet may not be smooth. Therefore, it is preferable to use the following paper machine.

<IC tag making using a paper machine with each wet paper surface facing>
In order to solve the above problem in a general multilayer paper machine, it is necessary to place an IC tag inlet on the upper surface of the wet paper and then put another wet paper on top of it. Therefore, after combining the circular net and the long net, placing the IC tag inlet on the first wet paper drawn on the upper surface of the long net, the second made by the circular net having a tank. It is also possible to use a multi-layer paper machine designed to make the lower surface of the wet paper into the surface of the first wet paper. In addition, after combining two circular cylinders and turning the first wet paper drawn by one of the circular nets so that the surface of the wet paper is up, and placing the IC tag inlet on it It is also possible to use a multilayer paper machine designed so that the lower surface of the second wet paper sheet made by a circular net is made on the upper surface of the wet paper sheet.

  Further, as shown in FIG. 3, a paper machine with a slanted long net can be used. The IC tag inlets can be placed one by one on the wet paper using a predetermined insertion machine. With these paper machines, the IC tag inlet can be drawn into the paper layer without dropping. Moreover, in these paper machines, it is also possible to make a multilayer laminated paper in which the number of wire parts is further increased and three or more wet paper sheets are laminated.

  EXAMPLES Hereinafter, although an Example demonstrates this invention further in full detail, this invention is not limited by these. Further, “parts” and “%” shown in the examples indicate parts by weight and% by weight unless otherwise specified.

(Manufacture of a laminated body in which IC tag inlet is made on wet paper)
The paper stock for papermaking is 100 parts of LBKP with a freeness of 400 ml, 20 parts of light calcium carbonate, 0.015 part of alkyl ketene dimer, 0.5 part of cationized starch, and polyamide epichlorohydrin 2 as a wet paper strength enhancer. Part was added, and water was further added to prepare a 1% concentration (paper concentration).
An amount of paper slurry of 100 g / m ² after drying was stirred and dehydrated with a 250 mm × 250 mm square hand machine, and then coated. Two wet paper sheets were prepared, five IC tag inlets (manufactured by Kofu Form Printing Co., Ltd., 13.56 MHz) were arranged on one wet paper sheet, and the other wet paper sheet was stacked. This was pressed to obtain a laminate having a moisture content of about 72%.

[Example 1]
Five sheets of 210 mm x 240 mm 80 mesh metal mesh are stacked on a 250 mm x 250 mm metal plate, and a 500 mesh screen (α mesh, 5S-2424, Mesh Co., Ltd.) of the same size is placed on it. Two sets were prepared. The laminate was cut into a size of 210 mm × 240 mm with a 500 mesh screen on the inside, and dried for 20 minutes while pressing at 0.4 MPa with a press machine heated to 100 ° C.

[Example 2]
Example 1 was repeated except that the press pressure was 0.2 MPa.

[Example 3]
The same procedure as in Example 1 was performed except that a commercially available inkjet cast coated paper (product name :) was used instead of the 500 mesh screen.

[Example 4]
Two sets of two metal plates of 210 mm x 240 mm on a 250 mm x 250 mm metal plate overlapped on each other were prepared. The IC tag inlet inserted wet paper sheet cut into a size of 210 mm × 240 mm was sandwiched and dried for 20 minutes while being pressurized at 0.4 MPa with a press machine heated to 100 ° C.

[Comparative Example 1]
The IC tag inlet-inserted wet paper sheet was dried by passing it through a drum dryer (JAPO Corporation MR-3D) at 110 ° C. for 6 passes for Comparative Example 1.

[Comparative Example 2]
An IC tag-inserted wet paper sheet was directly sandwiched between two 250 mm × 250 mm metal plates and pressed at 0.4 MPa for 20 minutes with a press machine heated to 100 ° C. The wet paper sheet could not be dried because the vapor did not escape.

The following evaluation was performed about the obtained Example and the comparative example sample, and it put together in the table | surface.
(Smoothness) JAPAN TAPPI Paper Pulp Test Method No.5-2: 2000 (Paper and Paperboard-Smoothness and Air Permeability Test Method-Part 2: Oken Method) Measure smoothness with Oken type smoothness tester did. Smoothness is so high that a numerical value is large.

(Reading) Reading of the IC tag inlet was evaluated by a reader / writer (TR-3 manufactured by TAKAYA). Of the five sheets inserted into the wet paper, all five sheets were readable, and one sheet was unreadable.

(Appearance) The appearance of the paper was evaluated.
○: Wrinkles are not seen in the paper layer.
×: Wrinkles are seen in the paper layer where the IC tag is engraved

<Evaluation>
The obtained results are shown in Table 1.

  As is clear from Table 1, in each example, both the reading and appearance of the IC tag were excellent. In Examples 1 and 2, the IC tag inlet did not get wrinkled because it was dried while being nipped. High smoothness was also obtained, and in particular, Example 1 having a high nip pressure was better. Judging from the smoothness obtained in Example 2 and Example 3, the effect of the present invention can be expected to be 0.2 MPa or more. In Example 4, since the surface of the completed insertion paper was transferring the surface of the mesh in contact with the IC tag inlet insertion wet paper sheet, the smoothness was slightly low. The reason why high smoothness was not obtained in Example 3 using the cast paper having the most excellent surface property was that the cast paper used for the test was poor in water resistance, so it was partly taken in the cast paper coating layer. This is because of the occurrence.

  On the other hand, in Comparative Example 1 which is close to the drying method in a normal paper machine, smoothness was not obtained only by drying. Further, the paper was wavy because the IC tag inlet was wrinkled due to shrinkage of the paper and softening of the film during drying. Since Comparative Example 2 did not proceed with drying, it can be seen that in the present invention, it is important to ensure a vapor escape path with a multilayer mesh. In Comparative Example 2, the IC tag inlet could not be read. From this, it can be seen that the mesh (mesh) plays a role of a cushion for protecting the IC chip under pressure.

2: IC tag inlet 2a: Film base 2b: Antenna 2c: IC chip 1: Press machine table 1a: Metal plate 3: 80 mesh wire mesh (5 sheets)
4: 500 mesh screen 5: IC tag inlet insertion wet paper sheet 6: Long wire 7: Inclined wire 8: Press part 9: Cylinder dryer 10: Calendar 11: IC tag inlet 12a, 12b: Paper layer 13: Yankee dryer Cylinder 14: Yankee dryer canvas 15: Wet paper 16, 16a: Metal belt 17, 17a: Wire belt 18, 18a: Steam box 19: Wet paper

Claims (2)

A method of manufacturing an IC tag inlet paper that contains an IC tag inlet having an IC chip and an antenna in the paper, and the IC tag inlet is formed between two wet papers obtained by papermaking using a papermaking net. After an IC tag inlet having a chip and an antenna is inserted to obtain a laminate, the laminate is sandwiched between surfaces heated via a mesh, and the moisture content of the laminate is 8% by mass or less. The manufacturing method of the said IC tag inlet papermaking characterized by including the process of heating and pressurizing until it becomes. 2. The method of manufacturing an IC tag paper-imprinted paper according to claim 1, wherein the mesh body is a metal sheet or a synthetic resin sheet.

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