JP3925101B2 - Manufacturing method of anti-counterfeit sheet - Google Patents

Description

[0001]
[Industrial application fields]
The present invention relates to an extremely manufacture how advanced the paper equipped with a means of preventing forgery or such anti-counterfeit sheet of plastic sheet.
[0002]
[Prior art]
In order to facilitate understanding of the present invention, the following description will be given mainly with reference to anti-counterfeit paper, which is a typical example of the anti-counterfeit sheet material.
[0003]
Various measures for preventing counterfeiting are taken so that banknotes, gift certificates and the like cannot be illegally altered or forged. One of the ideas of anti-counterfeiting measures is to manufacture paper using advanced manufacturing technology so that it cannot be easily manufactured. One example of this is anti-counterfeit paper called “threaded paper”, in which threads made by slitting plastic films, thin paper, etc., into a thin layer of about several millimeters using a micro slitter are drawn into the paper layer. Etc. are used a lot.
[0004]
There are two main types of “threaded paper”. One is a type in which the thread 1 is buried in the paper layer as shown in FIG. 6 and is not exposed to the paper surface, and the other is a part of the thread 1 as shown in FIG. Is “paper with window opening thread” exposed on the paper surface. The latter is characterized in that a window opening portion 2 having a thickness reduced intermittently in the sheet flow direction is formed, and the thread 1 is exposed at the window opening portion 2.
[0005]
In order to further enhance the anti-counterfeit effect of such threaded paper, a gap 3 is provided in the window opening portion 2 of the paper with a window opening thread (Japanese Patent No. 2845197), or a metal is formed on the surface of the thread 1 Forming micro characters and micro images composed of vapor-deposited layers is also performed.
[0006]
On the other hand, the present inventors have proposed in Japanese Patent Application No. 10-358664 to insert a fine semiconductor chip into a paper or film medium for the purpose of preventing forgery of the paper or film medium. . As such a semiconductor chip, for example, a semiconductor chip with a side of 0.5 mm or less having a built-in memory of multiple bits and an antenna wiring can be used, and information can be written and read without contact. .
[0007]
In the above Japanese Patent Application No. 10-358684, as a method of inserting semiconductor chips into a film-like medium, a method of dispersing and arranging a plurality of semiconductor chips in a medium, a predetermined position between two film-like media For example, a method for inserting a semiconductor chip into the paper or a method for inserting a semiconductor chip into or on the surface of the Japanese paper along with the Japanese paper fiber when making Japanese paper has been proposed.
[0008]
[Problems to be solved by the invention]
The conventional "threaded paper" mentioned above is a technology for making a thread, a technology for intermittently exposing the thread to the window opening, a technology for making a window opening, and forming micro characters and micro images on the thread. Therefore, it is preferably adopted as a forgery prevention means.
[0009]
However, even though these forgery prevention means are not perfect, it has been proposed to insert a fine semiconductor chip as described above into paper or a film-like medium as a forgery prevention means that is more difficult to forge. However, it is actually difficult to insert such a fine semiconductor chip into a paper or film-like medium, and it is particularly difficult to insert the semiconductor chip at a predetermined position in the medium.
[0010]
Therefore, the present invention provides a technique for inserting a fine semiconductor chip into a sheet-like material such as paper or a plastic sheet in order to further enhance the anti-counterfeiting effect of the conventional anti-counterfeit paper in which threads are engraved, An object of the present invention is to provide a technique that allows even a fine semiconductor chip to be easily and efficiently inserted into a sheet-like material, and in particular to insert a semiconductor chip reliably at a predetermined position in the sheet-like material.
[0011]
[Means for Solving the Problems]
The inventors of the present invention previously bonded a fine semiconductor chip as described above to a thread that has been inserted into the paper as a means for preventing counterfeiting of anti-counterfeit paper such as “paper with threads”. It has been found that if it is inserted into a sheet-like material such as paper or plastic sheet, the semiconductor chip can be easily and efficiently inserted into the sheet-like material, and the anti-counterfeiting effect can be further improved, and the present invention has been completed. It is a thing.
[0015]
That is, the present invention has a semiconductor chip with a side of 0.5 mm or less having a multi-bit memory and antenna wiring adhered to one side of a thin slit film, and an indication of the bonding position of the semiconductor chip. The anti-counterfeit thread having a timing mark is bonded to the surface of a paper or plastic sheet to produce a forgery-preventing sheet, the timing mark and thread formed on the paper or plastic sheet The sheet for anti-counterfeiting is characterized in that the thread is bonded so that the semiconductor chip is positioned at a predetermined position by adjusting the tension of the thread at the time of bonding while detecting the position of the timing mark applied to the sheet. It is a manufacturing method of a thing.
[0016]
Furthermore, the present invention provides a measure of the bonding position of the semiconductor chip, in which a semiconductor chip having a multi-bit memory and an antenna wiring and having a side of 0.5 mm or less is bonded to one side of a thin slit film and the semiconductor chip is bonded. comprising the anti-counterfeit thread timing mark is applied, a plurality of paper or sheet of paper or multilayer anti-counterfeit sheet which comprises bonding a plastic sheet with insert between the plastic sheet The semiconductor chip is positioned at a predetermined position by adjusting the tension of the thread at the time of insertion while detecting the position of the timing mark formed on the paper or plastic sheet and the timing mark applied to the thread. A method of manufacturing a forgery-preventing sheet-like material, characterized by inserting a thread so as to
[0017]
As described above, the position of the timing mark applied to the thread and the position of the timing mark applied to the sheet-like material is used as a guide, and the semiconductor chip is bonded or inserted into the sheet-like material while detecting these timing marks. Can be bonded or inserted into a predetermined position of the sheet-like material accurately and efficiently.
[0018]
The anti-counterfeit sheet material of the present invention is applied to an external device such as a reader / writer, for example, so that the antenna of the semiconductor chip adhered to the thread and the external device can be subjected to radio waves, electrostatic coupling, electromagnetic waves, etc. The information can be exchanged wirelessly in a non-contact manner, and the information stored in the semiconductor chip is read out, and it is detected whether this is predetermined information, so that the sheet-like material is forged. It is possible to reliably recognize whether or not.
[0019]
DETAILED DESCRIPTION OF THE INVENTION
The semiconductor chip used in the present invention is a fine and thin IC semiconductor chip with a side of 0.5 mm or less, which has a multi-bit memory and antenna wiring, and is stored in the semiconductor chip by a batteryless non-contact recognition method. The read information can be read through the antenna wiring.
[0020]
Such a semiconductor chip is manufactured by the following method. First, a silicon single crystal wafer having a mirror surface and high purity is prepared. A resist pattern is formed on the wafer surface through a glass mask on which various element patterns having circuit designs are formed by a photoresist process through a process of insulating with various insulating films such as an oxide film and a nitride film. Through this resist pattern, the insulating film is etched or impurities are implanted to form an electrical device layer, and finally, a diffusion layer that becomes various transistors, diodes, resistors, and capacitors is formed. . Further, a wiring pattern layer is formed thereon, and the inter-element connection of the diffusion layer is terminated to achieve a circuit function. The wafer is separated into semiconductor chips each having a size of 0.5 mm or less using a diamond blade, for example, thereby completing a semiconductor chip.
[0021]
Further, a resonance circuit composed of a coil element and a capacitor element is formed on the semiconductor chip using a wiring pattern layer, and an antenna for obtaining microwave energy and signals is formed on-chip. Since this antenna is a microwave, its time constant is small. For example, by setting the inductance of the coil to 2 nanohenries and the capacitor to 2 picofarads, a resonant circuit can be realized with a small component circuit. is there. As a result, the antenna can be arranged on a semiconductor chip having a planar dimension with a side of 0.5 mm or less. A coil element and a capacitor element that form an antenna are connected in parallel or in series, and are connected to a high-frequency receiving circuit realized in a semiconductor chip. An example of the semiconductor chip 10 thus obtained is shown in FIG.
[0022]
Information is written to and read from the semiconductor chip as follows. A multi-bit memory is arranged at the location of “ID number” of the semiconductor chip as shown in FIG. In order to write information in this memory, a pattern is formed by a method of writing information by applying energy and signals from the outside through an antenna of a completed semiconductor chip, or by forming an electron beam direct drawing technique or laser technique in the wafer state described above. A method of writing information can be employed. Next, in order to read the information written in the memory, energy is applied to the antenna of the semiconductor chip by electromagnetic waves without contact, and a specific signal pattern is applied, and the memory data is read serially according to a predetermined procedure. The method can be adopted. These functions can be realized by analog and digital circuits in the semiconductor chip. The information read in this manner can be immediately determined to be authentic by collating it with authentic memory information in a database existing in the route server via the Internet, for example.
[0023]
The dimension of the semiconductor chip is set to 0.5 mm or less on one side. If one side is larger than 0.5 mm, a replica of the chip can be manufactured relatively easily, and if the semiconductor chip is larger than the thread width, the thread to which the semiconductor chip is bonded is bonded or inserted into the sheet-like material. In this case, the semiconductor chip easily falls off the thread, and when the sheet-like object is bent, the semiconductor chip easily breaks through the sheet-like object and is exposed to the outside. The thickness of the semiconductor chip is preferably 0.1 to 200 μm. Manufacturing a semiconductor chip thinner than 0.1 μm is technically difficult and impractical. Moreover, when it becomes thicker than 200 micrometers, when it pastes or inserts in a sheet-like thing, the location of a semiconductor chip will become excessively thick.
[0024]
The thread used in the present invention will be described. Various films such as cellophane, polypropylene film, polyester film, nylon film, polyvinyl alcohol film, polyvinyl chloride film, and polycarbonate film can be used as the base film. For this base film, a material that does not melt or soften in the drying zone of the paper machine is used. However, it is desirable that the base film has a property that is not sticky at the temperature of the drying zone of 90 to 110 ° C. A heat-resistant film can be preferably used.
[0025]
Further, when a water-soluble film such as polyvinyl alcohol is used as a thread, the thread can be dissolved during papermaking depending on the dissolution temperature of the water-soluble film. That is, when a thread made of a water-soluble film to which a semiconductor chip is bonded is inserted into the paper layer, the water-soluble film is dissolved during papermaking, and only the semiconductor chip is mounted in the paper layer. In addition, since the dissolved water-soluble film remains around the semiconductor chip, the semiconductor chip is more firmly fixed in the paper layer due to the adhesiveness of the dissolved water-soluble film. In addition, by using a water-soluble film as the base film of the thread, the problem of thread fragments mixed into the raw material when the anti-counterfeit paper using the thread is recovered and reused as waste paper or waste paper is also eliminated. The
[0026]
The thread base film may be subjected to various treatments as necessary. For example, corona discharge treatment for improving the wet index, primer treatment, and hologram embossing treatment by applying a transparent resin. The thread base film is usually 8 to 25 μm thick.
[0027]
A paster processing method can be preferably used when forming a micro character or a micro image comprising a metal vapor deposition layer on a base film. The paster processing method itself is a well-known method. For example, characters and images are printed with ink having alkali resistance on the vapor deposition surface of a polyester film obtained by vacuum vapor deposition of metal aluminum, and then the film is immersed in an aqueous sodium hydroxide solution. A typical example is a method in which the exposed aluminum vapor deposition layer other than the printed portion is dissolved, and then the film is washed with water to remove aluminum hydroxide and then dried (for details, see Japanese Patent Application Laid-Open No. 63-216795). (See the official gazette). By doing so, the printed portion and the lower metal deposition portion synchronized with the printed portion remain on the film, and the film is exposed in other portions.
[0028]
In this way, the base film of the thread that has been subjected to various processing on the front surface or back surface, or formed micro letters and / or micro images, is slit into a narrow width of usually 0.3 to several mm using a macro slitter. By doing so, a thread used in the present invention is obtained.
[0029]
When manufacturing a forgery-preventing paper by embedding a thread on which a micro character or micro image is formed in a paper layer, if the thread is exposed at the window opening of the paper (FIG. 7), the micro character on the surface of the thread And a micro image can be viewed under reflected light. Even when the thread is buried in the paper layer and is not exposed on the paper surface (FIG. 6), the micro characters and the micro image on the thread can be viewed under the transmitted light.
[0030]
When using a thread to make paper with a window opening thread, rubbing the exposed part of the thread in the window opening with a nail or the like may cause the thread to peel off or cause the thread to rise when printing on paper. Cheap. Therefore, paper with a window opening thread is made using a thread coated with heat-sensitive adhesive on both sides, and the heat-sensitive adhesive applied to the thread is melted when this paper is dried in the drying zone of the paper machine. Or by softening, the cellulose fiber and thread | sled which comprise paper can be adhere | attached reliably, and peeling strength can also be raised.
[0031]
In addition, when heat sensitive adhesive is applied to both front and back sides of the thread, the thread surface exposed at the window opening of the paper inevitably comes into contact with the cylinder dryer, canvas, touch roll, etc. in the middle of the drying zone on the paper machine. As a result, the heat-sensitive adhesive is melted or softened by heat, causing a problem of contaminating the surface of a cylinder roll or the like. Therefore, heat-sensitive adhesive is not applied to the thread surface (thread surface) exposed at the window opening of the paper, and heat-sensitive adhesive is applied only to the thread surface (thread back surface) that is not exposed at the window opening. desirable.
[0032]
According to the present invention, as shown in FIG. 2, the semiconductor chip 10 is bonded to the front or back surface of the thread 1 with an adhesive. Adhesives such as water-soluble adhesives such as PVA, starch, sodium alginate, polychloroprene adhesives, polyurethane adhesives, thermoplastic SBR adhesives, hot melt adhesives, epoxy adhesives, vinyl adhesives, Phenoxy resin adhesives, polyester adhesives, polysulfone adhesives and the like can be used alone or in combination. In particular, an adhesive excellent in water resistance and heat resistance is preferable. For example, a two-component curable epoxy adhesive is a typical example. In addition, when it is desired to cure the adhesive instantaneously, an ultraviolet curable adhesive can be used. In order to make it difficult to peel off the bonded semiconductor chip 10 from the thread 1, it is desirable to bond the semiconductor chip 10 smaller than the width of the thread 1, for example, a thread having a width of about 1.0 mm for a 0.3 mm square semiconductor chip. Is preferably used.
[0033]
The method of manufacturing the anti-counterfeit paper by embedding the thread to which the semiconductor chip is bonded into the paper layer can adopt the same method as the conventional “threaded paper” or “window-opened threaded paper”. .
[0034]
As a method for producing a threaded paper (FIG. 6) that is made so that the thread is buried in the paper layer, either a single-layer making method or a multi-layer making method can be adopted. For example, a single-layer paper making method is a method in which a thread is fed out together with a material supplied to the paper making net from a slice of a long paper machine, and the thread is embedded inside the paper layer formed on the paper making net. (Japanese Patent Laid-Open No. 51-13039) and a thread insertion device installed in the stock flowing out of the flow box of a long paper machine, and the thread is made while the thread and the stock are in a non-contact state by an air flow. For example, Japanese Patent Laid-Open No. 2-169790. As a method of multi-layer papermaking, for example, when producing a laminated paper composed of at least two layers of an outermost paper layer and an inner paper layer using a multi-tank type paper machine, immediately before superimposing each paper layer The method of inserting the thread between the paper layers can be adopted.
[0035]
When inserting and inserting the thread with the semiconductor chip bonded into the paper layer of the multi-layered paper, the paper layer where the thread is inserted is thinned, and the groove for inserting the thread. It is effective to form (see FIG. 4A described later). In this way, when pressure is applied to the paper, the thick part of the paper layer becomes a cushion, and the semiconductor chip on the thread inserted into the groove (thin part) can be protected from the pressure described above. . The difference in thickness between the thick and thin portions of the paper layer can be changed as appropriate depending on the thickness and material of the semiconductor chip and the thickness of the sheet, but is preferably about 0.5 to 2 times the thickness of the semiconductor chip.
[0036]
As a method of forming the groove in the paper layer, a known squeezing technique can be used. For example, soldering a wire, metal, resin, paper, etc. on the upper net of a circular net cylinder or attaching it with an adhesive, applying a paint or resin to the net, plugging the net, or making irregularities directly on the paper net A method of attaching a mold using a photosensitive resin to a net, a method of spraying compressed air on a portion where a groove is to be formed in a wet paper state, and a rubbing roll for a portion where a groove is to be formed in a wet paper state And the like.
[0037]
In addition, as a method of manufacturing paper with a window thread (Fig. 7), a belt mechanism having a groove through which a thread is passed at the tip of a convex portion of a guide having irregularities is embedded in a stock suspension on a papermaking wire. Then, a method for producing paper with a window opening thread (Japanese Patent Publication No. 5-085680), a compressed air nozzle is built in a rotating drum on a long paper machine wire, and the slurry on the thread previously inserted into the wet paper is compressed. A method of exposing the thread by intermittently blowing with air (Japanese Patent Laid-Open No. 06-272200), using a net processed into a concavo-convex shape for the upper net of a circular net paper machine, and inserting the thread while making contact with the concavo-convex part of the net surface And a method of drawing a thread into the window opening (US Pat. No. 4,462,866).
[0038]
Furthermore, when producing a laminated paper consisting of at least two layers, the outermost paper layer and the inner paper layer, using a multi-tank type paper machine, the outermost paper layer (or the inner paper layer) A window opening is intermittently formed on the top of the paper layer, and a thread is inserted between the paper layers just before it is overlapped with the inner paper layer (or the outermost paper layer) without the window opening, and the thread is exposed from the window opening. It is also possible to adopt a method to do so.
[0039]
FIG. 3 shows a two-tank circular net paper machine for producing a paper sheet with window opening thread composed of two paper layers, and a first paper layer for forming an inner paper layer without a window opening portion. And a second tank 12 for forming an outermost paper layer having a window opening. A circular mesh cylinder 11a of the tank 11 is provided with an upper net without any special work, and a plurality of molds 13 having dimensions corresponding to window opening portions are intermittently provided in the circumferential direction of the upper net of the circular cylinder 12a of the tank 12. By attaching them to each other, an outermost paper layer having a window opening can be formed. The paper layer made by the circular mesh cylinder 11a is transferred to the blanket 14, transported onto the circular mesh cylinder 12a, and superimposed on the outermost paper layer made by the circular mesh cylinder 12a. A sheet of paper is made of paper. The insertion of the thread is performed at the position indicated by the arrow V immediately before the two paper layers are overlapped. At this time, the thread 1 is exposed at the window opening portion 2 as shown in FIG. 7 by providing the window opening portion forming mold 13 with a missing portion for forming a character or image gap. At the same time, a paper with a window opening thread in which a gap 3 is formed in the window opening portion 2 can be manufactured (see Japanese Patent No. 2845197).
[0040]
If the insertion position of the semiconductor chip is adjusted so that the semiconductor chip is arranged in these window opening portions, the window opening portion is thinner than the paper layer of the other part, so that the effect of preventing the destruction of the semiconductor chip is obtained. can get. The insertion position of the semiconductor chip can be adjusted by detecting the position of the window opening with a detector and adjusting the tension of the sled so as to match this position.
[0041]
When the semiconductor chip is disposed in the window opening portion, if the semiconductor chip is disposed on the surface side of the thread exposed at the window opening portion, the semiconductor chip is exposed at the window opening portion and may be peeled off. For this reason, it is preferable that the semiconductor chip is bonded to the back surface side of the thread surface exposed at the window opening so that the semiconductor chip is not peeled off.
[0042]
When using anti-counterfeit paper in which a thread to which a semiconductor chip is bonded is used as a banknote, gift certificate, check, etc., as shown in FIG. 6 and FIG. It is used by cutting so that the thread is positioned along one side, but it is necessary to cut so that at least one semiconductor chip is placed on the thread in one sheet such as a banknote or a gift certificate. Also, in the paper with window opening thread, the semiconductor chip may be located on the thread exposed in the window opening part, or the semiconductor chip is located in the thread part buried between the window opening part and the window opening part. May be.
[0043]
When manufacturing such threaded paper, in order to increase productivity, it is usually performed to insert a plurality of threads in the width direction of the paper (that is, the direction perpendicular to the paper flow direction during paper making). Is called. At this time, in order to prevent meandering in the paper, the thread is usually engraved in the paper in a tensioned state. By such a method, the thread can be drawn in a fixed position with respect to the width direction of the paper. The positional accuracy in the width direction of the paper varies depending on the method and apparatus for detecting the thread, but is preferably within ± 5 mm, and preferably within ± 2 mm.
[0044]
As described above, the thread can be accurately placed in a fixed position with respect to the width direction of the paper by making it into the paper with tension applied to the thread. On the other hand, it can be engraved so that the semiconductor chip is positioned at a fixed position. However, with this method, the position of the semiconductor chip cannot be controlled with respect to the paper flow direction during papermaking. In order to make this possible, elastic deformation of the thread described later can be used.
[0045]
In general, a plastic film serving as a base film of a thread has a property of elastically deforming when the tension is low, that is, a property such as rubber that expands when tension is applied and contracts when tension is weakened. It is possible to adjust the position of the semiconductor chip in the paper flow direction during paper making by utilizing the property of elastic deformation of the thread. This principle is as follows. When the thread is made into the paper layer in the paper, the thread is elastically deformed and stretched when tension is applied to the thread. If it does so, the space | interval of the semiconductor chip adhere | attached on the thread | sled will become long, and it will become possible to shift the position of semiconductor chips. On the other hand, when the tension is weakened, the positions of the semiconductor chip and the semiconductor chip are narrowed from the same principle.
[0046]
A specific example will be explained. When a semiconductor chip is placed at a fixed position in the paper flow direction during papermaking, the semiconductor chip is shifted downstream from the target position in the paper flow direction. By increasing the tension of the thread, the semiconductor chip can be shifted upstream in the paper flow direction. When the sled is in the desired position, return the tension. When the semiconductor chip is shifted to the upstream side in the paper flow direction, the thread tension is reduced. It should be noted that if the tension applied to the thread is too strong, the thread will stretch too much and will not return to its original length even if the tension is reduced.
[0047]
In the process of bonding the semiconductor thread to the thread, it is necessary to bond the semiconductor chip on the thread at regular intervals, but even if the semiconductor chip is adhered at regular intervals, the semiconductor chip on the thread during papermaking There is a possibility that the interval is slightly shifted. Even if the deviation is small, the deviation accumulates during the paper making process for a long time, and finally, the deviation is greatly deviated. Therefore, in order to adjust the position of the semiconductor chip in the paper flow direction to be always constant, the position of the semiconductor chip on the thread, the insertion length of the thread into the paper layer per unit time, and the paper are drawn. It is necessary to accurately know the length per unit time (paper making speed).
[0048]
For this purpose, a timing mark is provided on the thread and the paper as a guide for alignment. When timing marks are given to the threads, the threads are colored at regular intervals, or, as shown in FIG. 2, in the case of polyester film threads on which aluminum is deposited, at regular intervals with respect to the length direction of the threads. A method of forming the aluminum vapor deposition elution portion 21 as a timing mark by using a paster processing method can be employed.
[0049]
When the thread is colored at regular intervals, the colored portion can be easily detected by the detector. For these colorings, dyes / pigments that reflect visible light with visible light can be used. However, these colorings are usually not preferred because the colored portions can be visually confirmed. For this reason, it is preferable to color using dyes / pigments that reflect light of wavelengths other than visible light. As these dyes / pigments, fluorescent coloring dyes / pigments and infrared coloring dyes / pigments can be used. By using such a dye / pigment, a timing mark that cannot be visually confirmed can be given to the thread.
[0050]
As shown in FIG. 2, when the aluminum vapor deposition part 20 is formed in the thread | sled 1, the aluminum vapor deposition elution part 21 can detect the position with a phototube using the passage of a light ray. Further, a method for detecting the semiconductor chip 10 itself bonded to the thread 1 can also be applied. Since the semiconductor chip used in the present invention can exchange data by radio waves, electrostatic coupling, electromagnetic waves, etc. in a non-contact manner, the position of the semiconductor chip can be easily detected using these principles. If the semiconductor chip 10 is adhered to the sled 1 accurately at regular intervals, the insertion length per unit time of the sled can be calculated by detecting the position of the semiconductor chip itself.
[0051]
When a timing mark is added to a sheet, for example, a sheet for making a timing mark is attached to the upper nets of the circular cylinders 11a and 12a as shown in FIG. This makes it possible to produce a paper sheet with a thin paper layer at the location according to the principle of “crease paper”. The position of the thinned portion can be detected by a phototube. In addition, a method of coloring the paper at regular intervals can be applied. The colored place can be easily detected by using an optical detector. In order to color the timing marks on the paper, the same dyes and pigments as those used when coloring the timing marks on the threads can be used.
[0052]
On the other hand, in addition to providing a timing mark on the paper itself, a bright plate is attached to the ends of the circular cylinders 11a and 12a as shown in FIG. The position can also be detected by reading with. This method is advantageous because it is not necessary to add timing marks to the paper. Even in the case of manufacturing with long net paper, a bright plate is attached to the paper making wire at regular intervals, and the position can be detected by the same principle. The glitter plate is an example. Instead of the glitter plate, a colored portion may be formed on the paper making wire, or a mark due to scratches or the like may be given to the paper making wire to the extent that there is no problem with paper making. In addition to the circular mesh cylinder and the wire, such a mark for detecting the position of the paper can provide the same effect even when applied to a rotating object such as a WET press or a dryer cylinder.
[0053]
In this way, it is possible to individually detect the insertion length per unit time of the thread to be paper-made and the length per unit time that the paper is made. The position of the semiconductor chip can be confirmed by the method described above. To insert the semiconductor chip at the target position of the paper, adjust the sled insertion device and first align the sled in the width direction of the paper, then adjust the tension applied to the sled in the paper flow direction to adjust the paper flow. Align the semiconductor on the thread in the direction. The alignment of the flow direction of the paper can be automatically performed by linking the timing mark of the paper and the sled and the position detecting device of the semiconductor chip on the sled with the tension adjusting device of the sled.
[0054]
The anti-counterfeit sheet and the method for producing the same according to the present invention have been described by taking the anti-counterfeit paper as an example, but the sheet according to the present invention is not only paper but also a plastic film, a plastic sheet, a ceramic sheet, a woven fabric, and a thermoplastic. A resin sheet, a thermosetting resin sheet, or the like can also be used.
[0055]
One form of the anti-counterfeit sheet material of the present invention is a semiconductor on the surface of a sheet material selected from paper, plastic film, plastic sheet, ceramic sheet, woven fabric, thermoplastic resin sheet, thermosetting resin sheet, etc. The thing which stuck the thread | chip which adhered the chip | tip is mentioned. In the bonding process, the thickness of the thread, the thickness of the semiconductor chip, and the thickness of the adhesive are raised, so as to eliminate this drawback, as shown in FIG. A groove 31 with a reduced thickness may be formed in 30. As a method of forming the groove 31 in the sheet-like material 30, for example, a method of reducing the thickness in the paper making process by the known pouring technique as described above, a method of reducing the thickness by embossing, etc., a chemical, etc. It is possible to employ a method of corroding with, a method of reducing the thickness by etching, or the like.
[0056]
In order to arrange the semiconductor chip at a predetermined position of the sheet-like object, when the thread is bonded to the surface of the sheet-like object, the position of the timing mark formed on the sheet-like object and the timing mark applied to the thread is detected, and the thread The thread may be bonded so that the semiconductor chip is arranged at a predetermined position by adjusting the tension of the thread.
[0057]
FIG. 4B shows a state in which the thread 1 is bonded to the groove 31 of FIG. In this case, it is desirable that the semiconductor chip 10 is disposed on the back side of the exposed surface of the thread 1 so that the semiconductor chip 10 is not exposed on the surface side of the sheet-like object 30.
[0058]
Another form of the anti-counterfeit sheet material of the present invention is paper, a plastic film, a plastic sheet, a ceramic sheet, a woven fabric, a thermoplastic resin sheet, a thermosetting resin sheet, etc. When a sheet is combined and bonded, a thread bonded with a semiconductor chip is inserted between the two, or a thread is bonded to one sheet in advance, and the thread is bonded. The thing which stuck the sheet-like thing which is not on this is mentioned. Since the part pasted by the thickness of the thread is raised at the time of pasting, in order to eliminate this defect, a groove with a thin thickness is formed in one sheet-like material in advance as shown in FIG. It is good to insert a thread into the groove.
[0059]
In order to arrange the semiconductor chip at a predetermined position, when bonding a plurality of sheet-like objects, the position of the timing mark formed on the sheet-like object and the timing mark applied to the thread is detected, and the tension of the thread is adjusted. The thread may be inserted so that the semiconductor chip is arranged at a predetermined position by adjustment.
[0060]
When a plurality of sheet-like materials are bonded together and a thread with a semiconductor chip bonded between them is inserted, the use of a cushion-like sheet-like material alleviates the increase in the thickness of the threads and semiconductor chips. Can do. For example, in the case of a laminated sheet with a structure in which a plastic film and a low-density nonwoven fabric are bonded together, or a structure in which a low-density nonwoven fabric is sandwiched between plastic sheets, a thread is inserted between these sheet-like materials. Accordingly, the low-density nonwoven fabric becomes a cushion, and the rise due to the thickness of the thread or the semiconductor chip can be alleviated.
[0061]
As a method of inserting a thread with a semiconductor chip bonded inside a plastic film or plastic sheet, two or more sheets of plastic film or plastic sheet are drawn out and a thread with a semiconductor chip bonded between them is inserted and melted by heat. When a plastic film is manufactured by the melt extrusion method using an extruder, the thread to which the semiconductor chip is bonded and the heat-melted resin that is the material of the plastic film are simultaneously discharged from the extruder discharge port. Method of cooling and solidifying, and providing two extruder outlets, and inserting a thread with a semiconductor chip bonded between the two outlets when discharging and bonding the heat-melted resin from each outlet Etc. can be adopted.
[0062]
【Example】
Hereinafter, the present invention will be described more specifically with reference to examples.
[Example 1]
<Production of thread>
Metal aluminum was deposited on the entire surface of a polyester film having a width of 1250 mm and a thickness of 16 μm so as to have a thickness of 400 Å. Alkali-resistant acrylic resin ink using a gravure roll so that an 82.6 mm wide alkali-resistant acrylic resin ink coating layer is repeatedly formed in parallel at intervals of 3 mm on the aluminum vapor deposition surface of this polyester film. Coated.
Next, this film was immersed in a 5% by weight aqueous sodium hydroxide solution to elute the exposed portion of the aluminum vapor deposition surface having a width of 3 mm which is not coated with the alkali-resistant acrylic resin ink. Thereby, the polyester film in which the aluminum vapor deposition part 20 with a width of 82.6 mm as illustrated in FIG. 5 was formed at intervals of 3 mm was obtained. Number 21 in the figure indicates an aluminum vapor deposition elution part.
Apply 5 g / m ² (dry conversion) of a paint containing a polyester-based heat-sensitive adhesive (trade name “Byron”, manufactured by Toyobo Co., Ltd.) to the back side of this film (the side not coated with aluminum). A heat-sensitive adhesive coating layer was formed. The polyester film thus obtained was slit into a width of 1.5 mm as shown in FIG. 5 using a micro slitter to produce a thread.
[0063]
<Adhesion of semiconductor chip to thread>
As the semiconductor chip, a semiconductor chip 10 having a side of 0.3 mm and a thickness of about 30 μm as shown in FIG. 1 was used. As shown in FIG. 2, the semiconductor chips 10 are successively placed one by one using an ultraviolet curable adhesive at the center of the aluminum deposition portion 20 on the surface of the thread (the surface not coated with the heat-sensitive adhesive). And glued. The aluminum vapor deposition elution part 21 in FIG. 2 functions as a timing mark that serves as a guide for the bonding position of the semiconductor chip.
[0064]
<Manufacture of anti-counterfeit paper (paper with window opening thread) that incorporates threads>
20 parts by weight of softwood bleached kraft pulp (NBKP) and 80 parts by weight of hardwood bleached kraft pulp (LBKP) were added to 350 ml freeness. S. F. This was beaten into 10 parts by weight of white clay, 0.3 parts by weight of paper strength enhancer (trade name “Polystron 191”, manufactured by Arakawa Chemical Co., Ltd.), sizing agent (trade name “Size Pine E”, Arakawa) A paper stock was prepared by adding 1.0 part by weight of Chemical Industries, Ltd. and an appropriate amount of a sulfuric acid band.
Using this paper stock, a two-layered laminated paper was produced at a paper making speed of 50 m / min using a two-tank circular net paper machine shown in FIG. At this time, the thread produced above was inserted between the first layer (basis weight 50 g / m ^{2 in} terms of dry weight) and the second layer (50 g / m ² ).
[0065]
<Writing and reading information to and from the semiconductor chip>
Information was written on the semiconductor chip by forming a pattern on the wafer by direct electron beam drawing at the stage of the wafer manufacturing process. When reading this information, a carrier carrier by microwave (2.45 GHz) was applied to the antenna of the semiconductor chip in a non-contact manner, and the circuit inside the semiconductor chip was activated to read the information. By comparing the information read in this way with authentic memory information to be written in advance, authenticity can be immediately determined.
[0066]
【The invention's effect】
As can be seen from the above description, according to the present invention, a fine semiconductor chip is formed as a single piece by attaching a thread to which a semiconductor chip is bonded to the surface of the sheet or inserting the thread into the sheet. Compared with pasting on the surface or inserting into the sheet-like material, the workability can be greatly improved, and the anti-counterfeit sheet-like material can be obtained extremely efficiently and simply.
[0067]
In addition, a timing mark that is an indication of the bonding position of the semiconductor chip is given to the thread, and the timing mark given to the thread and the timing given to the sheet-like object when the thread is bonded or inserted into the sheet-like object By using the position of the mark as a guide and detecting or timing these timing marks, the thread can be bonded or inserted into the sheet-like material, so that the semiconductor chip can be bonded or inserted accurately and efficiently at a predetermined position on the sheet-like material. It becomes possible.
[0068]
According to the anti-counterfeit sheet material of the present invention thus obtained, in addition to the anti-counterfeit means simply by engraving the thread, the information read from the semiconductor chip and the memory information are collated to verify the authenticity. It is possible to determine immediately, and it is possible to provide a more sophisticated and reliable forgery prevention means.
[Brief description of the drawings]
FIG. 1 is an explanatory diagram showing an example of a semiconductor chip used in the present invention.
FIG. 2 is a perspective view showing an embodiment of a thread to which a semiconductor chip is bonded.
FIG. 3 is an explanatory view showing an example of a two-tank type circular net paper machine for producing anti-counterfeit paper made of paper-making paper with a window thread.
4A and 4B show an example in which a groove for inserting a thread is formed in a sheet-like material, where FIG. 4A is a perspective view showing a state in which a groove is inserted, and FIG.
FIG. 5 is an explanatory diagram showing an example of a base film for creating a thread.
FIGS. 6A and 6B show an example of “threaded paper” in which a thread is buried in a paper layer, where FIG. 6A is a plan view and FIG. 6B is a cross-sectional view taken along line BB ′ in FIG. .
FIGS. 7A and 7B show an example of “paper with a window opening thread” in which a part of the thread is exposed on the paper surface, where FIG. 7A is a plan view and FIG. 7B is a cross-sectional view taken along line bb ′ of FIG. It is.
[Explanation of symbols]
1: Thread 2: Window opening part 10: Semiconductor chip 20: Aluminum vapor deposition part 21: Aluminum vapor deposition elution part 30: Sheet-like object 31: Groove

Claims (5)

The timing mark which is a measure of the adhesion position of the adhesive Tare Li Kui said semiconductor chip incorporates a plurality of bits of memory and one side 0.5mm below the semiconductor chip including an antenna wire on one side of the slit films in Hosohaba A method for producing a forgery-preventing sheet material by sticking a given anti-counterfeit thread to the surface of a paper or plastic sheet, the timing mark formed on the paper or plastic sheet and the timing given to the thread A method for producing a forgery-preventing sheet-like material, wherein the thread is bonded so that the semiconductor chip is positioned at a predetermined position by adjusting the tension of the thread at the time of bonding while detecting the position of the mark. . 2. The method for producing a forgery-preventing sheet material according to claim 1, wherein a groove for bonding a thread is formed on the surface of the paper or plastic sheet. A semiconductor chip with a multi-bit memory and antenna wiring with a side of 0.5 mm or less is bonded to one side of a thin slit film, and a timing mark is provided as an indication of the bonding position of the semiconductor chip. This is a method for producing a multilayer forgery-preventing sheet material comprising bonding a plurality of paper or plastic sheets while inserting a forgery-preventing thread between the plurality of papers or plastic sheets. The thread is inserted so that the semiconductor chip is positioned at a predetermined position by adjusting the tension of the thread at the time of insertion while detecting the position of the timing mark formed on the paper or plastic sheet and the timing mark applied to the thread. A method for producing a forgery-preventing sheet material characterized by comprising: 4. The method for producing a forgery-preventing sheet-like material according to claim 3, wherein a groove for inserting a thread is formed on at least one surface of the paper or plastic sheet. A semiconductor chip with a multi-bit memory and antenna wiring with a side of 0.5 mm or less is bonded to one side of a thin slit film, and a timing mark is provided as an indication of the bonding position of the semiconductor chip. The anti-counterfeit thread is inserted between paper layers when producing a laminated paper consisting of at least two layers of an outermost paper layer and an inner paper layer using a multi-tank type paper machine. A method for manufacturing anti-counterfeit paper comprising a step of adjusting a thread tension at the time of insertion while detecting a position of a timing mark formed on a paper layer and a timing mark applied to the thread. A method of manufacturing anti-counterfeit paper, wherein a thread is inserted and paper is drawn so that the semiconductor chip is located.

Images