JP2009243032A - Method for producing multilayer combination paper sheets and apparatus for combining multiple layer of paper sheets - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a thin multilayer combination paper sheet having a thickness of not more than 150 μm, including IC chips therein and thereby having a large amount of concealed information and excellent in anti-counterfeit effect, where the IC chips are accurately arranged at predetermined fixed positions of the paper sheet. <P>SOLUTION: Provided is the method for producing the multilayer combination paper sheet comprising following structure, a nonwoven fabric 2 combined between a lower paper layer 3 and an upper paper layer 4, a watermark 6 provided at the paper, IC chips 5 included in the nonwoven fabric 2 are inserted into positions q apart from a positions p of the watermark 6 in a papermaking direction at predetermined intervals s, the lower paper layer 3, the nonwoven fabric 2 and the upper paper layer 4 are combined to each other while fibers are entangled with one another, and provided is the apparatus for combining multiple layers of paper sheets. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  TECHNICAL FIELD The present invention relates to a method for producing a multi-layered paper and a multi-layer paper-making apparatus, and in particular, an IC chip is inserted (embedded) by embedding a non-woven fabric containing an IC chip between paper layers by multi-layer paper. The present invention relates to a method for producing a multi-layered paper made of multi-layered paper and a multi-layered paper-making apparatus.

  A technique for producing a multilayer paper by arranging a plurality of raw material tanks on a single net and discharging a stock material from the respective raw material tanks onto the net is conventionally known (for example, see Patent Document 1). Further, a technique for producing a multilayer paper by preparing a sheet of upper and lower sheets in advance and pasting it with a polymer base material as an intermediate layer using an adhesive in a separate process is known (for example, see Patent Document 2). ).

  By the way, the present inventors have already imparted machine-readable functional substances such as colored pigments, magnetic materials, infrared absorbing materials, infrared reflecting materials, fluorescent light emitting materials, metal fibers, and thermochromics to the paper layer. The technique which laminates the laminated nonwoven fabric which was made is proposed (for example, refer patent document 3).

  Furthermore, for the paper on which the IC chip is engraved, the two-layer wet paper is made by applying the IC chip to the wet paper made by the first paper making machine using two layers of the circular paper machine. Is known (see, for example, Patent Document 4).

  Furthermore, a technique is known in which a paper layer is formed by applying an IC chip to a thread or the like in order to apply the IC chip to the inside or front and back surfaces of the paper (for example, see Patent Document 5).

  Furthermore, a technique using a nonwoven fabric for the purpose of holding an IC chip when an IC card or a flexible IC module is manufactured is already known (see, for example, Patent Documents 6 and 7).

Japanese Patent Application Laid-Open No. 11-323964 JP-T-8-501838 JP 2003-13395 A JP 2002-298118 A Special Table 2002-512406 gazette Japanese Patent Laid-Open No. 10-171954 Japanese Patent Laid-Open No. 2003-6604

  The technique which the present inventors have already proposed in Patent Document 3 is a duplicate product in which a non-woven fabric provided with a machine-readable functional material such as a colored pigment or an infrared absorbing material is combined in a paper layer. It is excellent in that it is difficult to make, but because it is a functional substance that is added to the paper layer, the amount of confidential information is small and multilayer laminated paper that requires highly functional information Therefore, further improvement is desired.

  Patent Document 4 has already proposed a paper on which an IC chip has been engraved, but this is simply the case where an IC chip is applied to a wet paper made by a first-layer circular paper machine. Even if the IC chip is inserted into the wet paper in a fluidized state, the position and orientation of the IC chip is considered to be extremely unstable. In addition, there is a risk of disturbing the texture of the paper during paper making and reducing the smoothness. In addition, it is composed of two layers of a circular mesh, and the wet paper is brought into contact with each other after the wet paper is formed in each of the circular meshes. Therefore, there is a risk that peeling occurs between the two layers.

  Patent Document 5 discloses a technique for forming a paper layer by applying an IC chip to a thread or the like in order to apply the IC chip to the inside or front and back surfaces of the paper. Therefore, the thickness is increased by the thickness of the paper and the thickness of the IC chip, which is not suitable for embedding in a thin paper.

  Furthermore, since the piece that carries the IC chip in advance is a thin piece such as a thread, it tends to be twisted or twisted when fed into the paper layer. Further, when the thread is applied at a fixed position, there is a risk that the part may have a step in winding during paper making and the thickness becomes thick. For this reason, conventionally, paper making is generally performed by shifting the insertion position of the thread in the width direction, and therefore it cannot be applied to a fixed position in the paper layer.

  In Patent Documents 6 and 7, a nonwoven fabric is used for the purpose of holding an IC chip. However, in addition to the thickness of a card or the like, the thickness of the IC chip is increased and embedded in a thin paper as in Patent Document 5. Is not suitable.

  The present invention solves the above-mentioned various conventional problems, includes an IC chip, has a large amount of confidential information, has an excellent anti-counterfeit effect, the IC chip is accurately placed at a predetermined position on the paper, and has a paper thickness. It is an object of the present invention to realize a thin multi-layered paper having a smoothness of 150 μm or less, a smoothness of 10 seconds or more, and a delamination strength of 10 g / 15 mm or more, a method for producing the same, and a multi-layer bonding device.

  In order to solve the above problems, the present invention is a multilayer laminated paper in which a nonwoven fabric is formed between a lower paper layer and an upper paper layer, and the nonwoven fabric contains an IC chip, The lower paper layer, the non-woven fabric, and the upper paper layer provide a multilayered laminated paper characterized in that fibers are intertwined and bonded to each other.

  The multilayer laminated paper is characterized by being provided with either or both of papermaking and marks.

  The multilayer laminated paper has a thickness of 150 μm or less.

  The multilayer laminated paper has a Beck smoothness of 10 seconds or more.

  The multilayer laminated paper has a delamination strength of 10 g / 15 mm or more.

  The IC chip is characterized in that each IC chip is placed at a predetermined position.

  An antenna is attached to the IC chip, and the antenna is included in the nonwoven fabric around the IC chip and within the same plane.

  The IC chip is provided with an antenna, and the antenna is incorporated in the IC chip.

In order to solve the above-mentioned problem, the present invention includes a position shift detection device and a nonwoven fabric position correction device, and in an apparatus for inserting a nonwoven fabric containing an IC chip into a paper layer,
The positional deviation detecting device measures the interval between the IC chips, detects a deviation of the measured interval from a preset predetermined interval, and the specific position serving as a reference and the nonwoven fabric position correcting device are The distance between the IC chip and the specific position serving as a reference is set in advance by controlling the non-woven fabric supply speed and / or the non-woven fabric width supply position based on the misalignment detected by the misalignment detection device. Provided is a multi-layer stitching apparatus characterized by being controlled at a predetermined interval.

In order to solve the above-mentioned problems, the present invention includes a misalignment detecting device and a non-woven fabric position correcting device, and manufactures laminated paper using a device for inserting a non-woven fabric containing an IC chip into a paper layer. In the way to
The position deviation detection device measures a distance between the reference specific position and the IC chip, detects a deviation of the measured distance from a predetermined interval, and based on the detected deviation, The non-woven fabric position correcting device controls the non-woven fabric supply speed and / or the non-woven fabric width supply position, so that the interval between the specific position serving as a reference and the IC chip is set to the preset predetermined interval. Provided is a method for producing a multi-layered laminated paper characterized by controlling.

According to the present invention, the following effects are produced.
(1) A separate process is unnecessary.
Since the IC chip is inserted together with the non-woven fabric into the multi-layered laminated paper, no post-process such as pasting is required.
(2) The paper thickness can be reduced to 150 μm or less.
By using a nonwoven fabric, it is possible to make the thickness of the multilayer laminated paper 150 μm or less.
(3) A paper surface having a Beck smoothness of 10 seconds or more can be obtained.
Since the paper layer is formed (the texture is adjusted) after laminating the lower layer stock + the nonwoven fabric containing the IC chip + the upper layer stock, it is possible to make paper without disturbing the paper layer of the multilayer laminated paper.
(4) A paper having a delamination strength of 10 g / 15 mm or more is obtained.
When a non-woven fabric is used, the upper layer stock enters between the non-woven fabric fibers and has an entanglement with the lower layer stock, thereby improving the interlayer bonding force. As a result, a sheet having an interlayer peel strength of 10 g / 15 mm or more is obtained.
(5) An IC chip can be attached to a fixed position.
By controlling the insertion position of the IC chip using the “position shift detection device” and the “position correction device”, it is possible to attach the IC chip to a predetermined position.
(6) There are few restrictions on printing conditions and design configuration.
Since it is possible to attach an IC chip to the inner surface of the paper layer, it is possible to reduce the restrictions on the printing conditions and the design configuration when printing on the front and back surfaces.

It is a figure explaining the structure of Example 1 of the multilayer paper-bonding paper based on a present Example. (A), (b) is a schematic cross-sectional view of a multi-layered paper, (c) is a detailed cross-sectional view of the multi-layered paper, (d) is a multi-layered paper from the surface of the paper It is the figure seen with the transmitted light. (A) It is a figure explaining the whole structure and the manufacturing method of the Example of the manufacturing apparatus which manufactures the multilayer laminated paper of Example 1. FIG. (B) It is the schematic of another manufacturing apparatus which manufactures multilayer laminated paper. It is a figure explaining the structure of Example 2 of the multilayer laminated paper which concerns on a present Example. (A), (b) is a schematic cross-sectional view of a multi-layered paper, (c) is a detailed cross-sectional view of the multi-layered paper, (d) is a multi-layered paper from the surface of the paper It is the figure seen with the transmitted light.

  The best mode for carrying out the invention of a multi-layered paper, a manufacturing method thereof and a multi-layered paper manufacturing apparatus according to the present invention will be described below with reference to FIGS.

(Multi-layered laminated paper)
FIG. 1 is a view for explaining Example 1 of a multilayered laminated paper according to this example. FIG. 1 (a) is a schematic cross-section cut in the longitudinal direction of a strip-shaped multi-layered paper 1 that is finally manufactured by a multi-layered papermaking apparatus according to the present embodiment, which will be described later, and wound on a winding drum. FIG.
This strip-shaped multilayer paper 1 shows a configuration in which a nonwoven fabric 2 containing an IC chip is formed between a lower paper layer 3 and an upper paper layer 4 so as to be integrally formed in multiple layers. .

  A plurality of IC chips 5 are encapsulated in advance in the longitudinal direction in the nonwoven fabric 2 at regular intervals, and when the nonwoven fabric 2 is interwoven between the lower paper layer 3 and the upper paper layer 4, the nonwoven fabric is 2 and inserted into the longitudinal direction of the multilayer laminated paper 1 as shown in FIG. 1A.

  FIG. 1B is a schematic cross-sectional view for enlarging a part of FIG. 1A and explaining the structure more easily. As shown in FIG. 1B, the multilayer laminated paper 1 is basically composed of a lower paper layer 3, a non-woven fabric 2 containing an IC chip 5, and an upper paper layer 4 which are laminated together. It is of a structure formed integrally.

  In the multilayer laminated paper 1 of the present embodiment, a papermaking 6 is provided, and the position of the papermaking 6 (hereinafter referred to as “papermaking position”) p (on the basis of). The position q of the IC chip (in the first embodiment, the position of one corner of the IC chip 5 may be determined, but the center position or the like may be determined in advance) in the longitudinal direction of the multilayer laminated paper 1 (papermaking). The direction in which the sheet moves on the wire at the time of this, and in this specification is also referred to as the “paper making direction”), and the IC chip 5 in the non-woven fabric 2 is inserted. It is stationary.

  The position q of the IC chip is not the longitudinal direction of the multi-layered paper 1 relative to the position p of the papermaking 6, but the width direction of the multi-layered paper 1 (hereinafter also simply referred to as “width direction”). .) May be placed at a predetermined interval.

  1 (a) and 1 (b), for convenience of explanation showing the layers constituting the multilayer structure in an easy-to-understand manner, the layers constituting the multilayer paper 1 are shown as if they are separated at the boundary between each other. Has been. However, as shown in FIG. 1 (c), the actual structure is a multilayer paper in which the fibers constituting the lower paper layer 3, the nonwoven fabric 2 and the upper paper layer 4 are entangled with each other and difficult to peel off. It is formed as.

  That is, during papermaking, the lower layer material forming the lower paper layer 3 enters between the fibers of the nonwoven fabric, the fibers of the lower sheet material and the fibers of the nonwoven fabric 2 are entangled with each other, and the lower paper layer 3 and the nonwoven fabric 2 are extremely strong layers. They are bonded to each other with an adhesive force.

  Further, during paper making, the upper layer paper material forming the upper paper layer 4 enters between the fibers of the nonwoven fabric 2, and the fibers of the upper paper material intertwine with the fibers of the nonwoven fabric 2 and enter between the fibers of the nonwoven fabric 2. Intertwined with the fibers of the underlying paper stock.

  As a result, in the thickness direction of the multilayer laminated paper 1, the lower layer paper layer is not only in the fibers of the nonwoven fabric 2 but also at the boundary 7 between the nonwoven fabric 2 and the lower paper layer 3, or at the boundary layer 8 between the nonwoven fabric 2 and the upper paper layer 4. 3, a bonding layer 9 having a strong interlayer adhesive force is formed in which the fibers of the nonwoven fabric 2 and the upper paper layer 4 are entangled with each other.

  Therefore, the multi-layered paper 1 is formed as an integrated multi-layer paper in which the lower paper layer 3, the nonwoven fabric 2, and the upper paper layer 4 are firmly bonded to each other with a strong interlayer adhesive force and are difficult to peel off. Yes. Thus, since the lower paper layer 3, the nonwoven fabric 2 and the upper paper layer 4 are firmly bonded to each other, the IC chip 5 included in the nonwoven fabric 2 is interposed between the lower paper layer 3 and the upper paper layer 4. It is inserted and firmly placed in the bonding layer 9.

  FIG. 1D is a view of the multilayer laminated paper 1 as seen from the paper surface with transmitted light. As shown in FIGS. 1C and 1D, an antenna 10 is attached to the IC chip 5 so as to surround the IC chip 5 in the same horizontal plane.

  As shown in FIG. 1 (c), the IC chip 5 and the antenna 10 are both disposed so as to be included substantially in the center of the nonwoven fabric 2 in the thickness direction. As described above, when the paper is made, the lower paper layer 3 and the upper paper layer 4 are disposed. And firmly placed in the bonding layer 9. Note that this embodiment can also be applied to a configuration in which the antenna 10 is incorporated in the IC chip 5 (an IC chip with a built-in antenna).

  As described above, the multilayer laminated paper of Example 1 has been described with respect to the three-layer structure including the lower paper layer 3, the nonwoven fabric 2, and the upper paper layer 4. However, the lower paper layer 3 and the upper paper layer 4 sandwiching the nonwoven fabric 2 are As long as it is included, a multi-layer structure such as four layers or five layers may be used. In addition, as for the non-woven fabric containing the IC chip, the form to be inserted into the multi-layered paper is not limited to the full width, but may be a strip-shaped one. This insertion is possible.

  While the multilayer laminated paper of Example 1 has been described above, a modification of Example 1 will be described below. Regarding the positioning of the position q of the IC chip, in the first embodiment, the position q of the IC chip is determined on the basis of the position of the engraving 6. Will be explained.

(Modification 1)
That is, normally, in the multi-layered paper 1, as shown by a cross mark in FIG. 1 (d), a register mark made of white paper or a mark 6 ′ by IJP is formed at a plurality of positions at regular intervals in the paper making direction. Has been granted. In the first modification, focusing on the register mark or the IJP mark 6 ′, the IC chip 5 is spaced from the register mark or the IJP mark 6 ′ (on the basis) by a predetermined interval in the paper making direction and the width direction. It is configured to be placed at a distant position.

  Specifically, as shown in FIG. 1 (d), the position q of the IC chip 5 is spaced in the paper making direction with respect to the position r of the register mark or IJP mark 6 '(intersection center point of the cross mark). m, and the IC chip 5 in the nonwoven fabric 2 is inserted and placed so as to be at a position separated by an interval n in the width direction. This modified example 1 may be applied to the multi-layered paper 1 provided with paper making as in the first embodiment, but the multi-layered paper not provided with paper making as in Example 2 described later. It is suitable for the laminated paper.

(Modification 2)
In the first embodiment and the first modification thereof, the IC chip 5 is placed at a predetermined position with reference to the marking position, the register mark, or the IJP mark. When the multi-layered paper 1 wound up by the take-up device is cut, the multi-layered paper 1 is cut so that a predetermined interval is provided from the side position of the cut multi-layered paper 1 to the position q of the IC chip 5. . As a result, a structure is formed in which a paper sheet containing an IC chip manufactured from the multilayer paper 1 is arranged at a predetermined position.

(Manufacturing equipment)
An embodiment of a manufacturing apparatus for manufacturing the multilayered laminated paper 1 according to the embodiment described above will be described with reference to FIG. FIG. 2 (a) is a diagram showing the overall configuration of the manufacturing apparatus for the multi-layered laminated paper 1. As shown in the figure, the apparatus will be described using a long paper machine, but is not limited thereto. In FIG. 2 (a), this multi-layer paper making apparatus 11 is made of a net and has an endless paper making wire 12 that circulates. The wire 12 is bridged between the driven pulley 13 and the driving pulley 14, and is supported by a plurality of supporting and guiding rollers arranged inside the wire 12, though not shown. Has been circulating.

  In the upstream portion (movement start end portion on the upper surface of the wire 12) 15 of the wire 12, from the upstream side to the downstream side, the lower layer material supply tank 16, the nonwoven fabric supply device 17, and the upper layer material supply tank 18 are spaced apart. Are sequentially arranged.

  The lower layer stock supply tank 16 and the upper layer stock supply tank 18 are filled with a lower layer stock 19 and an upper layer stock 20, respectively, and are appropriately supplied from a supply source (not shown) so as to maintain a predetermined liquid level. It is controlled. The lower layer stock 19 and the upper layer stock 20 are materials that are materials of the lower paper layer 3 and the upper paper layer 4, and mainly include pulp fibers, water, and additives.

  In each of the downstream portions of the lower layer material supply tank 16 and the upper layer material supply tank 18, a lower sheet material sealing plate 21 and an upper layer material sealing plate 22 are arranged. Paper making is possible by supplying the lower layer material and the upper layer material on the wire 12 through the gaps between the lower material material sealing plate 21 and the upper layer material sealing plate 22 and the wire 12, respectively.

  The nonwoven fabric supply part by the nonwoven fabric supply device 17 is provided on the downstream side of the lower layer stock supply tank 16 and the upstream side of the upper layer stock supply tank 18, and the lower layer stock on which the nonwoven fabric 2 is formed on the wire 12 is provided. Supply toward the layer (wet paper) 23. The nonwoven fabric supply device 17 includes a nonwoven fabric supply drum 24, a tension roller 25, and a position correction roller 29 in the position correction device 26 for correcting the insertion position of the IC chip 5 included in the nonwoven fabric 2 in the paper making direction. Yes.

  A belt-shaped nonwoven fabric 2 is wound around the nonwoven fabric supply drum 24, and the nonwoven fabric 2 is supplied while being fed toward the wire 12. As described above, the IC chip 5 is included in the strip-shaped nonwoven fabric 2 at a predetermined interval in the longitudinal direction. As shown in FIG. 1C, the IC chip 5 is in an intermediate position in the thickness direction in the nonwoven fabric 2, and is encapsulated in a state where the upper and lower sides of the IC chip 5 are covered with the nonwoven fabric 2.

  The width w of the strip-shaped nonwoven fabric 2 supplied from the nonwoven fabric supply device 17 is the lower layer paper layer (lower wet paper) formed by being supplied from the lower material sealing plate 21 to the upper surface (conveying surface) of the wire 12. 23 is substantially the same as the width of the upper layer stock layer (upper wet paper) 27 formed by being supplied from the upper layer stock plug 22 to the upper surface of the lower layer stock layer 23. .

  The nonwoven fabric position correction device 26 has a position controller 28 for controlling the position correction roller 29. The position correction roller 29 shifts the positions of the non-woven fabric 2 and the IC chip 5 when the distance between the paper making position p of the multilayer laminated paper 1 and the IC chip position q deviates from a predetermined distance s. It is a roller that corrects.

  The position correction roller 29 is driven by a motor whose speed can be controlled by a control signal from the position controller 28 and is configured as a roller capable of feed control capable of positively increasing or decreasing the feed speed of the nonwoven fabric 2.

  The nonwoven fabric supply drum 24 moves in the longitudinal direction of the axis (the direction perpendicular to the paper surface in FIG. 2A), that is, in the width direction of the nonwoven fabric 2, and moves together with the nonwoven fabric wound to adjust the position in the width direction. The non-woven fabric supply drum width direction position adjusting device (not shown) is adjusted so as to be able to. Thereby, as will be described later, in the multi-layered paper 1, the IC chip position q is set at a predetermined interval n preset in the width direction of the multi-layered paper 1 from the paper-making position p or the register mark position r. Or when it shifts | deviates from u, the nonwoven fabric 2 can be moved to the width direction with respect to the multilayer laminated paper 1, and a shift | offset | difference can be corrected.

  A squeezing box 30 is arranged below the downstream portion of the wire 12 (moving terminal portion on the upper surface of the wire). The water squeezing box 30 squeezes the water contained in the lower paper layer 3, the nonwoven fabric 2, and the upper paper layer 4 in the downstream portion of the wire 12 in the paper making process.

  The multilayer paper 1 formed with the wire 12 is guided by a guide roll (not shown) and wound up as a final product by a take-up roll. A press roll 31 is provided between the wire 12 and the take-up roll from the upstream side. A drying device 32 (shown by an imaginary line in FIG. 2A) and a positional deviation detection device 33 are provided.

  The press roll 31 sandwiches the multi-layered paper 1 and sends it to the further downstream roll side. For the paper making 6, a known press roll 31 or dandy roll 35 is used. The drying device 32 uses a known drying device, but the description thereof is omitted.

  The position deviation detection device 33 includes a position detector 34 and a position deviation discriminator 36. The position detector 34 is an optical detection means having a CCD, and a paper making position using transmitted light from a light table 37 disposed on the opposite side across the multilayer paper 1 to be detected. By detecting p and the insertion position q of the IC chip 5, the distance between them is measured, and this is sent as an electrical signal to the position discriminator 36.

  The position deviation discriminator 36 is the amount of deviation between the interval between the paper making position p sent from the position detector 34 and the insertion position q of the IC chip 5 and a predetermined interval s, and its size. The direction of deviation is discriminated and sent to the position controller 28 as position deviation information. It should be noted that there is a difference between the vertical direction (papermaking direction) and the horizontal direction (horizontal width direction) when measuring the gap in the width direction between the paper making position p and the insertion position q of the IC chip 5 and detecting the deviation. However, the detection of the deviation is basically the same.

  In the first modification, even when the IC chip 5 is configured to be placed at a predetermined distance in the paper making direction and the width direction with reference to the register mark or the IJP mark 6 ′, the positional deviation is detected. Is detected by the positional deviation detection device 33 in the same manner as described above.

  That is, the position detector 34 uses the transmitted light from the light table 37 to detect the register mark or IJP mark 6 'position r and the IC chip 5 insertion position q, so that the distance m between the paper making directions, The interval n is measured in the width direction, and this is sent as an electrical signal to the position shift discriminator 36. The position shift discriminator 36 is connected to the position r of the register mark or IJP mark 6 'sent from the position detector 34. Discrimination of the gap between the insertion direction q of the IC chip 5 and the gap in the paper making direction and the gap in the width direction and the predetermined paper making direction gap m and the gap in the width direction n, and the direction of the deviation. Then, it is sent to the position controller 28 as position deviation information.

  In the second modification, the IC chip 5 is detected by detecting the transmitted light from the light table in the vicinity of a cutting device (not shown) for cutting the multilayer paper 1 wound up by the winding device. A position detector for detecting the position of is provided. Based on the position information of the IC chip 5 detected by the position detector, the interval from the position of the side of the multilayer paper 1 to be cut to the position where the IC chip 5 is made is a predetermined distance. In addition, the cutting device is controlled.

  As described above in detail in the embodiment using the long net paper machine, the present invention is not limited to the long net paper machine. For example, when a circular net paper machine is used, although not described in detail, it is shown in FIG. By adopting such a configuration, a multilayer laminated paper similar to the multilayer laminated paper made of the multilayer laminated paper into which the IC chip produced by the above-described long net paper machine is inserted can be obtained.

(Production method)
Examples of the manufacturing method by the manufacturing apparatus for the multilayer laminated paper 1 of the embodiment shown in FIG. 2A described above will be sequentially described below.
(1) The lower layer material 19 is supplied from the lower layer material supply tank 16 to the upper surface of the wire 12 being circulated through the gap between the lower material sealing plate 21 and the wire 12. The lower layer stock 23 supplied onto the wire 12 is sent in the paper making direction as a lower layer stock layer (lower wet paper) 23.

(2) On the upper surface of the lower layer stock layer 23, the strip-shaped nonwoven fabric 2 enclosing the IC chip 5 is continuously supplied from the nonwoven fabric supply device 17. Then, the belt-like nonwoven fabric 2 and the lower layer stock layer 23 overlap while being sent in the paper making direction on the wire 12, the lower layer stock 19 enters between the fibers of the nonwoven fabric 2, and the pulp fibers of the lower layer stock 19 and the nonwoven fabric 2 The fibers are entangled and a strong bond between the two is generated.

(3) The upper layer stock 20 is supplied from the upper layer stock supply tank 18 to the upper surface of the strip-shaped nonwoven fabric 2 overlapped with the pulp fibers of the lower layer stock 19 through the gap between the upper layer stock plug 22 and the wire 12. To do. Then, the upper layer stock 20 overlaps with the nonwoven fabric 2 while being sent in the paper making direction as the upper layer stock layer 27 on the wire 12, and the upper layer stock 20 enters between the fibers of the nonwoven fabric 2. As a result, the pulp fibers of the upper layer stock 20 are intertwined with the fibers of the nonwoven fabric 2 and are also intertwined with the pulp fibers of the lower layer stock 19 already in the nonwoven fabric 2 so that a strong bond is generated.

(4) In this way, the lower layer stock 19, the non-woven fabric 2 containing the IC chip 5 and the upper layer stock 20 are sequentially supplied onto the wire 12, and the lower layer stock 19 is made by superposing multiple layers. The fibers of the non-woven fabric 2 and the upper layer stock 20 are entangled with each other to form a strong bonding layer 9, and the paper making of the multilayer multilayer paper 1 in which the IC chip 5 is inserted into the bonding layer 9. Is done.

(5) The multi-layered paper 1 that has been multi-layered passes through a squeezing box 30 and is subjected to papermaking 6 by a press roll 31. The paper making 6 is applied to a position separated from the position q where the IC chip 5 is inserted in the longitudinal direction (paper making direction) of the multilayer paper 1 by a predetermined interval s. To do.

  That is, in consideration of the wire feed speed and the IC chip inclusion position in the nonwoven fabric, the rotation speed of the press roll is controlled to set the timing of paper making. However, in actuality, when the nonwoven fabric is inserted, the insertion position q of the IC chip 5 is deviated from a position separated by a predetermined interval s from the planned paper making position p. It is necessary to correct the misalignment position.

(6) The multilayer laminated paper 1 formed in this way is further dried by passing through a drying device to be completed as a final product. Then, the multi-layered paper 1 is sent to a winding device that winds it up as a product, and the positional deviation detecting device 33 determines in advance the actual interval between the paper making position p and the IC chip 5 insertion position q. The amount of deviation from the set predetermined interval s is detected to generate position deviation information, which is sent to the position controller 28 of the position correction device 26.

  Similarly, the positional deviation detection device 33 detects the amount of deviation from a predetermined interval u set in advance in the width direction between the paper making position p and the IC chip 5 insertion position q. Position shift information is generated and sent to the position controller 28 of the position correction device 26.

(7) The position controller 28 receives the position shift information and controls the position correction roller 29 to control the feeding of the nonwoven fabric 2. That is, the lower layer of the IC chip 5 enclosed in the nonwoven fabric 2 by adjusting the feed speed of the position correction roller 29 via the motor by the position controller 28 to increase or decrease the feed speed of the belt-shaped nonwoven fabric 2. The relative position of the paper making direction with respect to the paper material layer 23 can be adjusted, and the interval between the paper making position p and the insertion position q of the IC chip 5 can be corrected to a predetermined interval s set in advance. .

  In addition, regarding the positional deviation information in the width direction between the paper making position p sent to the position controller 28 and the input position q of the IC chip 5, the width of the nonwoven fabric supply drum in the width direction of the nonwoven fabric supply drum 24 (not shown). The sheet is fed to the directional position adjusting device, whereby the nonwoven fabric 2 can be moved in the width direction with respect to the multi-layered laminated paper 1 to correct the deviation.

  Similarly, when the IC chip position q deviates from a predetermined position u or n preset in the width direction of the multi-layered paper 1 from the paper making position p or the register mark position r, Based on the deviation information of the IC chip position q with respect to the paper making position p or the register mark position r sent to the position controller 28, the non-woven fabric supply drum width direction position adjusting device adjusts each of the paper making direction and the width direction. Correction is made.

  In the second modification, when the multilayer laminated paper 1 taken up by the winding device is cut, the transmitted light from the light table is detected by the position detector provided near the cutting device, and the IC chip 5 is detected. The cutting position is detected based on the detected value so that the distance from the position of the side of the multi-layered paper 1 to be cut to the position where the IC chip 5 is made is a predetermined distance. Is calculated and cutting is performed. Thereby, what is arranged at a predetermined position of a paper sheet containing an IC chip manufactured from the multi-layered paper 1 can be formed.

(Characteristics of multi-layered laminated paper of this example)
The features of the multilayer laminated paper, the manufacturing apparatus, and the manufacturing method described above, and the features related to the operational effects will be further described below.

  Since the IC chip 5 is usually packaged in a case such as resin or ceramic, unlike the case where a colored pigment or infrared material having an identification function is applied in a fixed position in the paper layer, the case in the paper layer. It is difficult to position and place accurately because of misalignment or change of direction. Especially during paper making, the lower paper layer (wet paper) and the upper paper layer (wet paper) are in a fluid state, which may cause a slight misalignment even if they are inserted accurately with respect to the paper making position. It is.

  However, the multilayer laminated paper 1 of this example is not made by dropping the IC chip on the lower layer material layer (wet paper) alone, but is inserted and made in a state of being encapsulated in a fixed position in the nonwoven fabric in advance. Therefore, positioning is easy and it is easy to prevent displacement.

  In this case, when the IC chip 5 is supported on the thin strip and supplied onto the lower paper layer 3, the thin strip is kinked or shaken in the width direction, and the width direction of the multilayer laminated paper 1 is increased. The insertion position of the IC chip 5 is not stable.

  However, in the multilayer laminated paper 1 of the present embodiment, the width of the nonwoven fabric enclosing the IC chip 5 is the width of the lower layer material layer 23 supplied from the lower sheet material sealing plate 21, and the upper layer sheet material. Since the width of the upper layer stock layer 27 supplied from the stop plate 22 is the same as that of the upper layer stock layer 27, the nonwoven fabric 2 is not kinked or shaken in the width direction when the nonwoven fabric 2 is made. The bonding paper 1 is arranged at a fixed position without shaking in the width direction.

  Even after the IC chip 5 is inserted between the lower layer material layer 23 and the upper layer material layer 27, the lower layer material layer (wet paper) and the upper layer material layer (wet paper) are in a fluid state, and thus a deviation occurs. Although there is a possibility, in the manufacturing apparatus and the manufacturing method according to the present embodiment, the positional shift detection device 33 detects the positional shift and sends the positional shift information to the position correction device 26, and the lower layer stock is still in the paper making process. In a state where the layer (wet paper) and the upper layer stock layer (wet paper) are not hardened, the positional deviation is constantly corrected, so that the IC chip 5 is separated from the making position p by a predetermined interval s. It can be placed at a precise position.

  In the multilayer laminated paper 1 of the present embodiment, the IC chip 5 has a fiber structure in a strong bonding layer 9 formed by intertwining the fibers of the lower paper layer 3, the nonwoven fabric 2, and the upper paper layer 4. Because of the restrained and fixed structure, even if the paper itself is slightly deformed under severe conditions such as changes in temperature and humidity in the distribution state after manufacture, the IC chip 5 is not displaced. Absent.

  Since the IC chip 5 has a structure that is fixed and fixed by a fiber structure in the strong bonding layer 9 in the multilayer paper 1, the IC chip 5 is removed from the multilayer paper 1 for the purpose of unauthorized use. Even if only 5 is taken out, the paper layer such as the bonding layer 9 around the IC chip 5 breaks, and an illegal act such as taking out the IC chip and applying an operation or embedding and modifying another IC chip is substantially It is impossible to counterfeit and is very good at preventing counterfeiting.

  In particular, in the multilayer laminated paper 1 of the present embodiment, when the antenna 10 line is also confined in the coupling layer 9, the antenna 10 line of the IC chip 5 is formed by extremely fine lines. If a force that causes breakage is applied in the vicinity thereof, the breakage is caused, so that it is very difficult to perform an illegal act such as alteration work on the IC chip 5.

  Since the IC chip 5 is usually packaged in the case as described above, the thickness is inevitably increased, and if the paper layer is to be protected from above and below, the thickness of the multilayer laminated paper 1 as a whole is further increased. Becomes larger. However, the multi-layered paper 1 of the present embodiment is different from one in which the lower layer stock 19 and the upper layer stock 20 penetrate into the fiber structure of the nonwoven fabric 2 so that the three layers are simply bonded to each other. The thickness can be made very thin, 150 μm or less.

  In the case where the authenticity of the multi-layered laminated paper 1 of the present embodiment is determined, for example, in the authenticity determination device, the input information is read by the input identification device and the input identification device. Authenticity is discriminated by reading the information concealed in the IC chip 5 with an IC chip reader arranged at a predetermined interval s. Therefore, as described above, it is very important that the paper making position p and the insertion position q of the IC chip 5 are adjusted and positioned so as to be exactly the predetermined interval s.

  FIGS. 3A to 3D show Example 2 of the multi-layered paper according to this example, and the multi-layered paper 1 ′ is provided with a register mark 6 ′. However, it is characterized by a structure in which no papermaking is given. Since other configurations are the same as those of the first embodiment, the same reference numerals are used in the specification and the drawings, and descriptions of the same configurations are omitted.

  In the multilayer laminated paper 1 ′ according to the second embodiment, as described in the first modification of the first embodiment, the IC chip 5 may be formed at a predetermined position with reference to the register mark 6 ′. Similarly, as explained in the second modification, when cutting the multi-layered paper 1 ′, the position from the side of the cut multi-layered paper 1 ′ to the position where the IC chip 5 is made is made. It is good also as a structure formed by cut | disconnecting so that it may become a predetermined space | interval, and the thing arrange | positioned in the predetermined position of the paper sheet containing IC chip manufactured from multilayer laminated paper 1 '.

  In addition, the manufacturing apparatus and manufacturing method of multilayer laminated paper 1 'of Example 2 are made on the press roll 31 (dandy roll 35 in the case of making paper with a dandy roll) by the same manufacturing apparatus as in Example 1. What is necessary is just to make it not give paper making without mounting a type.

  The best mode for carrying out the invention of the multi-layered laminated paper according to the present invention has been described based on the embodiments. However, the present invention is not limited to such embodiments, and It goes without saying that there are various embodiments within the scope of the technical matters described in the scope.

  The multi-layered paper, the manufacturing method thereof, and the multi-layered paper device according to the present invention contain an IC chip, have a large amount of confidential information, have an excellent anti-counterfeit effect, and are accurately placed at a predetermined fixed position on the paper. Moreover, since it is possible to realize a thin multi-layered laminated paper having a paper thickness of 150 μm or less, a smoothness of 10 seconds or more, and a delamination strength of 10 g / mm or more, securities, passports, various kinds of cash vouchers, banknotes, It can be used in fields that require various anti-counterfeit functions such as books and top secret materials (eg, design documents, contracts, know-how materials).

1, 1 'multilayer laminated paper 2 nonwoven fabric 3 lower paper layer 4 upper paper layer 5 IC chip 6 paper making 6' register mark 7 boundary between nonwoven fabric and lower paper layer 8 boundary layer between nonwoven fabric and upper paper layer 9 bonding layer DESCRIPTION OF SYMBOLS 10 Antenna 11 Multi-layering apparatus 12 Paper making wire 13 Driven pulley 14 Drive pulley 15 Upstream part of wire 16 Lower layer material supply tank 17 Non-woven fabric supply device 18 Upper layer material supply tank 19 Lower layer material 20 Upper layer material 21 Sealing plate for lower layer material 22 Sealing plate for upper layer material 23 Lower layer material layer (lower wet paper)
24 Nonwoven fabric supply drum 25 Tension roller 26 Position correction device 27 Upper layer paper layer (upper wet paper)
28 Position Controller 29 Position Correcting Roller 30 Water Squeezing Box 31 Press Roll 32 Drying Device 33 Position Misalignment Detection Device 34 Position Detector 35 Tundy Roll 36 Position Misalignment Discriminator 37 Light Table p Making Position q IC Chip Insertion Position r Register mark position s, m, n, u Predetermined spacing t Width spacing gap w Width of the lower stock layer

Claims (2)

In a method of manufacturing a laminated paper using a device that includes a positional deviation detection device and a nonwoven fabric position correction device, and inserts a nonwoven fabric containing an IC chip into a paper layer.
The position deviation detection device measures a distance between the reference specific position and the IC chip, detects a deviation of the measured distance from a predetermined interval, and based on the detected deviation, The non-woven fabric position correcting device controls the non-woven fabric supply speed and / or the non-woven fabric width supply position, so that the interval between the reference specific position and the IC chip is set to the predetermined interval set in advance. A multilayer laminated paper manufacturing method characterized by controlling. In a device that includes a misalignment detection device and a nonwoven fabric position correction device, and inserts a nonwoven fabric containing an IC chip into a paper layer,
The positional deviation detection device measures a distance between a specific position serving as a reference and the IC chip, detects a deviation of the measured distance from a predetermined interval, and the nonwoven fabric position correction device The distance between the IC chip and the specific position serving as a reference is set in advance by controlling the non-woven fabric supply speed and / or the non-woven fabric width supply position based on the misalignment detected by the misalignment detection device. And a multi-layer stitching apparatus characterized by being controlled to a predetermined interval.

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