JP2005284333A - Method for manufacturing sheet with ic chip and ic chip loading device - Google Patents

Method for manufacturing sheet with ic chip and ic chip loading device Download PDF

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Publication number
JP2005284333A
JP2005284333A JP2004092832A JP2004092832A JP2005284333A JP 2005284333 A JP2005284333 A JP 2005284333A JP 2004092832 A JP2004092832 A JP 2004092832A JP 2004092832 A JP2004092832 A JP 2004092832A JP 2005284333 A JP2005284333 A JP 2005284333A
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Japan
Prior art keywords
ic chip
adhesive
sheet
chip
head
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Granted
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JP2004092832A
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Japanese (ja)
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JP4377273B2 (en
Inventor
Yasuhiro Endo
Yoriko Ota
Hironari Takahashi
従子 太田
康博 遠藤
裕也 高橋
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Toppan Forms Co Ltd
トッパン・フォームズ株式会社
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Priority to JP2004092832A priority Critical patent/JP4377273B2/en
Publication of JP2005284333A publication Critical patent/JP2005284333A/en
Application granted granted Critical
Publication of JP4377273B2 publication Critical patent/JP4377273B2/en
Application status is Expired - Fee Related legal-status Critical
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Abstract

<P>PROBLEM TO BE SOLVED: To attain the high speed operation of an operation to load an IC chip on a sheet base. <P>SOLUTION: An IC chip 10 is ejected from a chip ejection head 11 to a resin sheet 20, and adhesive 30 is ejected from an adhesive ejection head 31 to a resin sheet 20, and the adhesive 30 is adhered to the IC chip 10 before the IC chip 10 and the adhesive 30 reach the resin sheet 20, and the IC chip 10 is fixed to the resin sheet 20 through the adhesive 30 adhered to the IC chip 10. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to an IC chip-containing sheet manufacturing method in which an IC chip is mounted on a sheet substrate.

  In the past, counterfeit crimes have frequently occurred in securities such as prepaid cards, various admission tickets, gift certificates and stock certificates because they are widely distributed and can be exchanged relatively easily. In particular, in recent years, with the improvement and popularization of copying machines such as color copiers, counterfeit products that cannot be easily distinguished from genuine products can be manufactured relatively easily, and countermeasures against counterfeiting are required. Yes. Moreover, measures against counterfeiting are required not only for the above-mentioned securities but also for banknotes.

  As one of countermeasures against such counterfeiting, a technique for preventing forgery of securities or banknotes by attaching or inserting a member called a thread on the securities or banknotes is considered. In this technology, a thread formed by cutting a plastic film, thin paper, etc. to a width of about several millimeters is not exposed from the surface of securities or banknotes, or securities such that a part is exposed from the surface. It is inserted into the paper layer of the banknote, and the authenticity of the securities and banknotes is determined by the presence or absence of this thread.

Furthermore, in recent years, a technique for determining the authenticity of securities or bills using a thread on which an IC chip is mounted has been considered. In this technology, a thread made by bonding an IC chip with an adhesive on one side of a film cut to a width of several millimeters is inserted into a paper layer of securities or banknotes, and the use of securities or banknotes is performed. Sometimes, authenticity of securities and banknotes is determined by reading information written on the IC chip (see, for example, Patent Document 1).
JP 2002-319006 A

  However, in an IC chip-containing sheet in which an IC chip is mounted on a sheet base material like the thread described above, a fine IC chip is adhered to a sheet base material such as a film by an adhesive, The IC chips are stored in a container such as a tray, and when the IC chips are bonded onto the sheet base material, the IC chips are taken out one by one from the container, and the taken out IC chips are mounted on the sheet base material one by one. It will be glued. Therefore, when mounting and bonding an IC chip on a sheet substrate, it is necessary to stop the conveyance of the sheet substrate conveyed in a continuous state, and it is difficult to speed up the work. There is a point.

  Further, when the IC chip is bonded on the sheet base material, there is a problem that the adhesive adheres to the chip mounting head for mounting the IC chip on the sheet base material.

  The present invention has been made in view of the problems of the conventional techniques as described above, and can speed up the work of mounting an IC chip on a sheet base material. To provide a method for producing a sheet containing an IC chip, in which the fixing liquid does not adhere to the chip mounting head on which the IC chip is mounted when the IC chip is fixed on the sheet substrate with the fixing liquid. Objective.

In order to achieve the above object, the present invention provides:
An IC chip-containing sheet in which an IC chip capable of reading at least information in a non-contact state is mounted on a sheet substrate, and the IC chip is fixed on the sheet substrate with a fixing liquid. ,
The IC chip and the fixing liquid are separately injected onto the sheet base material, and the fixing liquid is attached to the IC chip before the IC chip and the fixing liquid reach the sheet base material. Then, the IC chip is fixed on the sheet base material by the fixing liquid attached to the IC chip.

  The IC chip and the fixing liquid are ejected from a direction substantially perpendicular to the sheet base material.

  Further, the fixing liquid is ejected after ejecting the IC chip.

In addition, the first head for injecting or dropping the IC chip onto the sheet base material and the second head for injecting or dropping the fixing liquid onto the sheet base material are arranged so that their normal lines intersect with each other. An IC chip mounting apparatus,
A control unit configured to control the timing of injection or drop in the first head and the second head so that the IC chip and the fixing liquid intersect with each other before reaching the sheet base material;

  In the present invention configured as described above, an IC chip mounted on a sheet base material is injected onto the sheet base material, and a fixing liquid for fixing the IC chip on the sheet base material is used as a sheet. When injected onto the substrate, the injected fixing liquid adheres to the IC chip before the IC chip and the fixing liquid reach the sheet substrate, and in this state, the IC chip and the fixing liquid are attached to the sheet substrate. To reach. Thereby, the IC chip is fixed on the sheet base material by the fixing liquid.

  As described above, the fixing liquid injected separately from the IC chip adheres to the IC chip before the IC chip and the fixing liquid reach the sheet base material, and reaches the sheet base material together with the IC chip. Since the IC chip is fixed on the sheet base material by the liquid for use, when the IC chip is mounted on the sheet base material and bonded, the transport of the sheet base material transported in a continuous state is stopped. There is no need, and the fixing liquid does not adhere to the chip mounting head for mounting the IC chip on the sheet substrate.

  Further, if the IC chip and the fixing liquid are ejected from a direction substantially perpendicular to the sheet substrate, the IC chip is ejected in such a direction that the mounting surface of the IC chip with respect to the sheet substrate is on the lower side. The chip is not mounted in such a state that the chip stands on the sheet base material.

  In addition, if the fixing liquid is injected after the IC chip is injected, the IC chip is mounted on the sheet base so as to be pressed by the fixing liquid, whereby the IC chip is placed on the sheet base. It will not be mounted in a standing state.

  As described above, in the present invention, when an IC chip is mounted on a sheet base material and the IC chip is fixed on the sheet base material with a fixing liquid, the IC chip and the fixing liquid are attached to the sheet base material. Injecting separately, the fixing liquid is attached to the IC chip before the IC chip and the fixing liquid reach the sheet base, and the IC chip is fixed on the sheet base by the fixing liquid attached to the IC chip. Therefore, when the IC chip is mounted on and bonded to the sheet base material, there is no need to stop the transport of the sheet base material that is transported in a continuous state. It is possible to speed up the work to be mounted on. Further, when the IC chip is fixed on the sheet base material with a fixing liquid such as an adhesive, the fixing liquid does not adhere to the chip mounting head on which the IC chip is mounted.

  In the case where the IC chip and the fixing liquid are injected from a direction substantially perpendicular to the sheet substrate, the IC chip is injected in such a direction that the mounting surface of the IC chip with respect to the sheet substrate is on the lower side. The IC chip is not mounted in a state where it stands on the sheet base material.

  Further, in the case of injecting the fixing liquid after injecting the IC chip, the IC chip is mounted on the sheet base so as to be pressed by the fixing liquid, whereby the IC chip is mounted on the sheet base. It will not be mounted in a state of standing on top.

  Embodiments of the present invention will be described below with reference to the drawings.

  FIG. 1 is a view showing an embodiment of an IC chip-containing sheet manufactured by the method for manufacturing an IC chip-containing sheet according to the present invention, wherein (a) is a top view and (b) is shown in (a). It is AA 'sectional drawing.

  As shown in FIG. 1, the IC chip-containing sheet manufactured by the method for manufacturing an IC chip-containing sheet according to the present invention can read information in a non-contact state on a resin sheet 20 as a sheet base material. 10 is mounted, and the IC chip 10 is covered with an adhesive 30 that is a fixing liquid, whereby the IC chip 10 is fixed on the resin sheet 20. In addition, as a material of the resin sheet 20, PET, PET-G, PVC, etc. can be considered. Further, in the IC chip 10, information written in the IC chip 10 is read by being brought close to an information writing / reading device provided outside, but is brought close to the information writing / reading device. Accordingly, the information may be written in a non-contact state.

  Below, the manufacturing method of the sheet | seat containing an IC chip mentioned above is demonstrated.

  FIG. 2 is a diagram for explaining an embodiment of the method for manufacturing the IC chip-containing sheet shown in FIG.

  First, the chip injection head 11 which is a first head for injecting the IC chip 10 from the substantially vertical direction to the continuously conveyed resin sheet 20 and the adhesive 30 from the substantially vertical direction to the resin sheet 20. And a pressure-sensitive adhesive injection head 31 which is a second head for injecting the liquid (FIG. 2A). The chip injection head 11 and the adhesive injection head 31 are connected to a control unit (not shown) that controls the injection timing and the injection speed of each. The control unit is also connected to a conveyance status detection unit (not shown) that detects the conveyance status of the resin sheet 20. Thereby, the timing of injection in each of the chip injection head 11 and the adhesive injection head 31 can be controlled according to the conveyance speed of the resin sheet 20. It is also conceivable to control the injection speed in each of the chip injection head 11 and the adhesive injection head 31 as necessary.

  In such an apparatus, the IC chip 10 is injected from the chip injection head 11 to the resin sheet 20 being conveyed, and the adhesive 30 is injected from the adhesive injection head 31 to the resin sheet 20 (FIG. 2). (B)). Note that the timing of ejection of the IC chip 10 from the chip ejection head 11 and the timing of ejection of the adhesive 30 from the adhesive ejection head 31 are equal to each other, and the ejection speed of the IC chip 10 from the chip ejection head 11 And the injection speed of the adhesive 30 from the adhesive injection head 31 are equal to each other. Further, in the chip injection head 11, the IC chip 10 is injected such that the IC chip 10 is oriented so that the mounting surface with respect to the resin sheet 20 is on the lower side.

  Then, the adhesive 30 ejected from the adhesive ejection head 31 adheres to the IC chip 10 before the adhesive 30 and the IC chip 10 ejected from the chip ejection head 11 reach the resin sheet 30. Then, the IC chip 10 is covered with the cover 30 (FIG. 2C).

  The IC chip 10 ejected from the chip ejection head 11 and the adhesive 30 ejected from the adhesive ejection head 31 reach the resin sheet 20 with the adhesive 30 attached to the IC chip 10, and the adhesive 30 causes the IC to The chip 10 is bonded and fixed on the resin sheet 20 (FIG. 2D). At this time, the IC chip 10 is injected from the chip injection head 11 in such a direction that the mounting surface with respect to the resin sheet 20 is on the lower side, and the IC chip 10 and the adhesive are substantially perpendicular to the resin sheet 20. Since the agent 30 is injected, the IC chip 10 is not mounted in a state where it stands on the resin sheet 20.

  Hereinafter, the injection angle of the IC chip 10 from the chip injection head 11 and the injection angle of the adhesive 30 from the adhesive injection head 31 and the distance between the chip injection head 11 and the adhesive injection head 31 and the resin sheet 20 are described. Will be described in detail.

  3 shows an injection angle of the IC chip 10 from the chip injection head 11, an injection angle of the adhesive 30 from the adhesive injection head 31, and the chip injection head 11 in the manufacturing method of the IC chip-containing sheet shown in FIG. 4 is a diagram for explaining the relationship between the distance between the adhesive injection head 31 and the resin sheet 20. FIG.

  Like the manufacturing method of the IC chip-containing sheet described above, the IC chip 10 is ejected from the chip ejection head 11, the adhesive 30 is ejected from the adhesive ejection head 31, and the adhesive 30 ejected from the adhesive ejection head 31 is In order to adhere to the IC chip 10 ejected from the chip ejection head 11, as shown in FIG. 3, the normal line of the ejection direction of the IC chip 10 from the chip ejection head 11 and the adhesive from the adhesive ejection head 31 are used. There must be a point X where the normal of the injection direction of the agent 30 intersects. In order to attach the adhesive 30 ejected from the adhesive ejection head 31 to the IC chip 10 before the IC chip 10 ejected from the adhesive 30 and the chip ejection head 11 reaches the resin sheet 20, this point is used. X needs to exist between the chip injection head 11 and the adhesive injection head 31 and the resin sheet 20.

  Therefore, as shown in FIG. 3, when the interval between the chip injection head 11 and the adhesive injection head 31 is w and the angle of the chip injection head 11 and the adhesive injection head 31 with respect to the resin sheet 20 is α, the chip injection head 11 and the distance L between the adhesive injection head 31 and the resin sheet 20 must be longer than (w · tan α) / 2.

  Here, the distance L between the chip injection head 11 and the adhesive injection head 31 and the resin sheet 20 is that the IC chip 10 injected from the chip injection head 11 is fine, the chip mounting head 11 and the adhesive injection. It is preferable that the length is as short as possible in view of the accuracy of the head 31.

  Therefore, the distance L between the chip injection head 11 and the adhesive injection head 31 and the resin sheet 20 is made as short as possible, and the IC chip 10 and the adhesive 30 are injected from the substantially perpendicular direction to the resin sheet 20. In order to attach the adhesive 30 ejected from the adhesive ejection head 31 to the IC chip 10 before the IC chip 10 ejected from the adhesive 30 and the chip ejection head 11 reaches the resin sheet 20, the chip It is preferable to make the interval w between the injection head 11 and the adhesive injection head 31 as narrow as possible.

  In this embodiment, the injection speed of the IC chip 10 from the chip injection head 11 and the injection speed of the adhesive 30 from the adhesive injection head 31 are equal to each other, but each injection speed is zero. There may be. That is, the IC chip 10 is freely dropped from the chip injection head 11, and the adhesive 30 is injected from the adhesive injection head 31 to cross them, or the adhesive 30 is dropped from the adhesive injection head 31. Then, it is also conceivable to control the timing by setting the angle so that the IC chip 10 is ejected from the chip ejection head 11 and intersected with the free-falling adhesive 30. It is also conceivable to control the injection speed as necessary.

(Other embodiments)
FIG. 4 is a view for explaining another embodiment of the method for manufacturing the IC chip-containing sheet shown in FIG.

  First, a chip injection head 111 that is a first head for injecting the IC chip 10 from a direction perpendicular to the continuously conveyed resin sheet 20 and a direction different from the chip injection head 111 with respect to the resin sheet 20. A pressure-sensitive adhesive injection head 131 which is a second head for injecting the pressure-sensitive adhesive 30 is respectively installed (FIG. 4A). The chip injection head 111 and the adhesive injection head 131 are connected to a control unit (not shown) that controls the injection timing and the injection speed of each. The control unit is also connected to a conveyance status detection unit (not shown) that detects the conveyance status of the resin sheet 20. Thereby, the timing of injection in each of the chip injection head 111 and the adhesive injection head 131 can be controlled according to the conveyance speed of the resin sheet 20. Note that it is conceivable to control the injection speed in each of the chip injection head 111 and the adhesive injection head 131 as necessary.

  In such an apparatus, the IC chip 10 is injected from the chip injection head 111 onto the conveyed resin sheet 20 (FIG. 4B). In the chip injection head 111, it is preferable to inject the IC chip 10 such that the IC chip 10 is oriented so that the mounting surface with respect to the resin sheet 20 is on the lower side.

  Next, the adhesive 30 is injected from the adhesive injection head 131 onto the resin sheet 20 (FIG. 4C). The injection speed of the adhesive 30 from the adhesive injection head 131 is faster than the injection speed of the IC chip 10 from the chip injection head 111, and details thereof will be described later.

  Then, the adhesive 30 ejected from the adhesive ejection head 131 adheres to the IC chip 10 before the IC chip 10 ejected from the adhesive 30 and the chip ejection head 111 reaches the resin sheet 30, and the adhesive Thus, the IC chip 10 is covered by 30 (FIG. 4D).

  Thereafter, the IC chip 10 ejected from the chip ejection head 111 and the adhesive 30 ejected from the adhesive ejection head 131 reach the resin sheet 20 with the adhesive 30 attached to the IC chip 10, and the adhesive 30 Thus, the IC chip 10 is bonded and fixed on the resin sheet 20 (FIG. 4E). After the IC chip 10 is ejected from the chip ejection head 111, the adhesive 30 is ejected from the adhesive ejection head 131 at an ejection speed faster than the ejection speed of the IC chip 10 from the chip ejection head 111. 30 is attached to the IC chip 10 and the IC chip 10 and the adhesive 30 reach the resin sheet 20, so that the IC chip 10 is mounted to be pressed onto the resin sheet 20 by the adhesive 30, As a result, the IC chip 10 is not mounted in a state of standing on the resin sheet 20.

  The relationship between the injection angle of the adhesive 30 from the adhesive injection head 131 and the distance between the adhesive injection head 131 and the resin sheet 20, and the injection speed of the IC chip 10 from the chip injection head 111 are as follows: The relationship between the injection speed of the adhesive 30 from the adhesive injection head 131 and the timing of the adhesive 30 from the adhesive injection head 131 will be described in detail.

  5 shows the relationship between the injection angle of the pressure-sensitive adhesive 30 from the pressure-sensitive adhesive injection head 131 and the distance between the pressure-sensitive adhesive injection head 131 and the resin sheet 20 in the manufacturing method of the IC chip-containing sheet shown in FIG. Also, a diagram for explaining the relationship between the injection speed of the IC chip 10 from the chip injection head 111, the injection speed of the adhesive 30 from the adhesive injection head 131, and the timing of the adhesive 30 from the adhesive injection head 131. It is.

  As in the above-described method for manufacturing an IC chip-containing sheet, the IC chip 10 is ejected from the chip ejection head 111, the adhesive 30 is ejected from the adhesive ejection head 131, and the adhesive is ejected from the adhesive ejection head 131. 30 is attached to the IC chip 10 ejected from the chip ejection head 111, as shown in FIG. 5, the normal line in the ejection direction of the IC chip 10 from the chip ejection head 111 and the adhesive ejection head 131. There must be a point X where the normal of the injection direction of the adhesive 30 intersects. In order to attach the adhesive 30 ejected from the adhesive ejection head 131 to the IC chip 10 before the IC chip 10 ejected from the adhesive 30 and the chip ejection head 111 reaches the resin sheet 20, this point is used. X needs to exist between the chip injection head 111 and the adhesive injection head 131 and the resin sheet 20.

  Therefore, as shown in FIG. 5, when the distance between the chip injection head 111 and the adhesive injection head 131 is w and the angle of the adhesive injection head 131 with respect to the resin sheet 20 is α, the adhesive injection head 131 and the resin sheet It is necessary to make the distance L to 20 longer than w · tan α.

  Here, the distance L between the adhesive injection head 131 and the resin sheet 20 is preferably as short as possible from the viewpoint of the accuracy of the adhesive injection head 131 and the like.

  Therefore, the distance L between the adhesive injection head 131 and the resin sheet 20 is made as short as possible, and the adhesive 30 injected from the adhesive injection head 131 is injected from the adhesive 30 and the chip injection head 111. In order for the chip 10 to adhere to the IC chip 10 before reaching the resin sheet 20, it is preferable to make the interval w between the chip injection head 111 and the adhesive injection head 131 as narrow as possible.

In order for the adhesive 30 ejected from the adhesive ejection head 131 to adhere to the IC chip 10 ejected from the chip ejection head 111 at the point X, the point X from the chip ejection head 111 and the adhesive ejection head 131 1 and l 2 , the injection speed of the IC chip 10 from the chip injection head 111 is v 1 , the injection speed of the adhesive 30 from the adhesive injection head 131 is v 2 , and the IC from the chip injection head 111 is IC. If the time from when the chip 10 is ejected to when the adhesive 30 is ejected from the adhesive ejection head 131 is t, it is necessary to satisfy the relationship of l 1 / v 1 = l 2 / v 2 + t.

  Note that the injection speed of the IC chip 10 from the chip injection head 111 may be zero. That is, the IC chip 10 can be freely dropped from the chip injection head 111, and the angle can be set to control the timing by injecting the adhesive 30 from the adhesive injection head 131 and intersecting them. It is done. It is also conceivable to control the injection speed as necessary.

  It is also conceivable to manufacture an IC chip-containing sheet by combining the manufacturing methods described as the two embodiments described above. That is, the injection direction of the IC chip 10 and the adhesive 30 onto the resin sheet 20 is substantially perpendicular to the resin sheet 20 as shown in FIG. 2, and first, as shown in FIG. It is also conceivable to inject the adhesive 30 after injecting the chip 10.

  In the IC chip-containing sheet shown in FIG. 1, the entire IC chip 10 mounted on the resin sheet 20 is covered with the adhesive 30, but the IC chip 10 is placed on the resin sheet 20 by the adhesive 30. If it is fixed to, at least a part of the IC chip 10 may be covered with the adhesive 30.

  In the above-described embodiment, the adhesive 30 is described as an example of the fixing liquid for fixing the IC chip 10 on the resin sheet 20, but the present invention is not limited to this, and UV ink or the like is not limited thereto. As long as the IC chip 10 can be fixed on the resin sheet 20 such as a sealant made of a liquid that cures under the predetermined conditions, it can be applied.

  Further, although the resin sheet 20 has been described as an example of the sheet substrate on which the IC chip 10 is mounted, the present invention is not limited to this, and paper, nonwoven fabric, or the like may be used as the sheet substrate.

  In addition, the IC chip-containing sheet in which the IC chip 10 is mounted and fixed on the resin sheet 20 is not limited to the shape shown in FIG. A thread or the like on which an IC chip is mounted is also applicable.

It is a figure which shows one Embodiment of the sheet | seat containing an IC chip manufactured by the manufacturing method of the sheet | seat containing an IC chip of this invention, (a) is a top view, (b) is AA 'shown to (a). It is sectional drawing. It is a figure for demonstrating one Embodiment of the manufacturing method of the sheet | seat containing an IC chip shown in FIG. In the manufacturing method of the IC chip-containing sheet shown in FIG. 2, the injection angle of the IC chip from the chip injection head, the injection angle of the adhesive from the adhesive injection head, the chip injection head, the adhesive injection head, and the resin sheet It is a figure for demonstrating the relationship with the distance between. It is a figure for demonstrating other embodiment of the manufacturing method of the sheet | seat containing an IC chip shown in FIG. In the manufacturing method of the IC chip-containing sheet shown in FIG. 4, the relationship between the injection angle of the adhesive from the adhesive injection head and the distance between the adhesive injection head and the resin sheet, and the IC from the chip injection head It is a figure for demonstrating the relationship between the injection speed of a chip | tip, the injection speed of the adhesive from an adhesive injection head, and the timing of the adhesive from an adhesive injection head.

Explanation of symbols

10 IC chip 11, 111 Chip injection head 20 Resin sheet 30 Adhesive 31, 131 Adhesive injection head

Claims (4)

  1. An IC chip-containing sheet in which an IC chip capable of reading at least information in a non-contact state is mounted on a sheet substrate, and the IC chip is fixed on the sheet substrate with a fixing liquid. ,
    The IC chip and the fixing liquid are separately injected onto the sheet base material, and the fixing liquid is attached to the IC chip before the IC chip and the fixing liquid reach the sheet base material. A method of manufacturing a sheet containing an IC chip, wherein the IC chip is fixed on the sheet base material by the fixing liquid attached to the IC chip.
  2. In the manufacturing method of the sheet | seat containing an IC chip of Claim 1,
    A method for producing a sheet containing an IC chip, wherein the IC chip and the fixing liquid are ejected from a direction substantially perpendicular to the sheet base material.
  3. In the manufacturing method of the sheet | seat containing an IC chip of Claim 1 or Claim 2,
    A method for producing a sheet containing an IC chip, wherein the fixing liquid is injected after the IC chip is injected.
  4. The first head for injecting or dropping the IC chip onto the sheet base material and the second head for injecting or dropping the fixing liquid onto the sheet base material are arranged so that their normal lines intersect with each other. An IC chip mounting device,
    An IC chip having a control unit that controls the timing of injection or dropping in the first head and the second head so that the IC chip and the fixing liquid intersect with each other before reaching the sheet base material. On-board equipment.
JP2004092832A 2004-03-26 2004-03-26 IC chip-containing sheet manufacturing method and IC chip mounting apparatus Expired - Fee Related JP4377273B2 (en)

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Application Number Priority Date Filing Date Title
JP2004092832A JP4377273B2 (en) 2004-03-26 2004-03-26 IC chip-containing sheet manufacturing method and IC chip mounting apparatus

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Application Number Priority Date Filing Date Title
JP2004092832A JP4377273B2 (en) 2004-03-26 2004-03-26 IC chip-containing sheet manufacturing method and IC chip mounting apparatus

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JP4377273B2 JP4377273B2 (en) 2009-12-02

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Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8178415B2 (en) 2006-11-27 2012-05-15 Philtech, Inc. Method for manufacturing RF powder
US8237622B2 (en) 2006-12-28 2012-08-07 Philtech Inc. Base sheet
US8318047B2 (en) 2006-11-28 2012-11-27 Philtech, Inc. Method for providing RF powder and RF powder-containing liquid
US8704202B2 (en) 2006-11-28 2014-04-22 Philtech Inc. RF powder particles including an inductance element, a capacitance element, and a photovoltaic cell and method for exciting RF powder
US8766853B2 (en) 2006-11-27 2014-07-01 Philtech Inc. Method for adding RF powder and RF powder-added base sheet
US8766802B2 (en) 2006-11-27 2014-07-01 Philtech Inc. Base data management system
US8933784B2 (en) 2006-11-28 2015-01-13 Philtech Inc. RF powder particle, RF powder, and RF powder-containing base

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8178415B2 (en) 2006-11-27 2012-05-15 Philtech, Inc. Method for manufacturing RF powder
US8766853B2 (en) 2006-11-27 2014-07-01 Philtech Inc. Method for adding RF powder and RF powder-added base sheet
US8766802B2 (en) 2006-11-27 2014-07-01 Philtech Inc. Base data management system
US8318047B2 (en) 2006-11-28 2012-11-27 Philtech, Inc. Method for providing RF powder and RF powder-containing liquid
US8704202B2 (en) 2006-11-28 2014-04-22 Philtech Inc. RF powder particles including an inductance element, a capacitance element, and a photovoltaic cell and method for exciting RF powder
US8933784B2 (en) 2006-11-28 2015-01-13 Philtech Inc. RF powder particle, RF powder, and RF powder-containing base
US8237622B2 (en) 2006-12-28 2012-08-07 Philtech Inc. Base sheet

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