JP4882622B2 - Anti-counterfeiting thread and anti-counterfeit paper - Google Patents

Description

The present invention relates to a thread provided with a very advanced anti-counterfeiting means, and an anti-counterfeit paper using the thread, and further relates to the anti-counterfeit paper. That is, the present invention relates to a technology (RFID Radio Frequency Identification) that reads and writes data using radio waves and recognizes an object without contact.

Bills, gift certificates, and the like are provided with anti-counterfeiting measures such as watermarking, coloring, fluorescent coloring fibers, paper pieces or particulates, and chemical reactions so that they cannot be tampered with or altered. One of the ideas of anti-counterfeiting measures is to manufacture paper using advanced manufacturing technology so that it cannot be easily manufactured. One example of this is anti-counterfeit paper called “threaded paper”, in which threads made by slitting plastic films, thin paper, etc., into a thin layer of about several millimeters using a micro slitter are drawn into the paper layer. Etc. are used a lot.

On the other hand, a technology (RFID Radio Frequency Identification) that reads and writes data using radio waves and recognizes an object without contact is put into practical use, and a fine semiconductor chip is inserted into a paper or film medium. Has been proposed. As such a semiconductor chip, for example, a semiconductor chip with a side of 0.5 mm or less having a built-in multi-bit memory and an antenna wiring can be used, and information can be written and read without contact. .

Recently, in various public facilities and other facilities such as libraries, transportation facilities, etc. to increase the amount of information and rewrite records in cards such as passports, insurance cards, membership registration cards for user identification and identification In order to cope with this, a non-contact type IC tag in which a resonance circuit such as an antenna coil or a capacitor and an IC chip are mounted is used. As such an IC card substrate, plastics such as polyester resin, ABS resin, or vinyl chloride resin are mainly used.

In order to promote the versatility of these IC cards, there is a demand for thinner and lower cost cards. From such a viewpoint, a paper IC card has been proposed in view of demands for easy processing such as printing and a significant reduction in cost.

For example, there has been proposed a product in which a semiconductor chip is sandwiched and bonded to card paper (for example, see Patent Document 1).

Further, for the purpose of preventing counterfeiting by re-attaching a non-contact type IC tag of the paper IC card, a paper IC card in which the IC tag is embedded between the layers of the paper when the paper is made (for example, patent document) 2 or 3), and anti-counterfeit papers (for example, see Patent Document 4, Patent Document 5, and Patent Document 6) incorporated in a paper layer have been proposed.
However, what is put into practical use in the anti-counterfeit paper in which the non-contact type IC tag is incorporated in the paper layer has a basis weight of 200 g / m ² or more, and is a so-called IC card made of paper. It has been desired to provide anti-counterfeit paper in which a small amount of a thin non-contact IC tag is incorporated in a paper layer.

In addition, the thread used in the conventional threaded paper technology is made of a film made of cellophane, polypropylene, polyester, nylon, etc., but when it is embedded in the paper layer, it has adhesion to the paper. There was a problem that it was remarkably bad, causing peeling between layers and causing damage to the semiconductor chip.
JP 2003-85518 A JP 2003-58856 A JP 2004-102353 A JP 2002-319006 A JP 2004-139405 A JP-A-2005-350823

The anti-counterfeit paper in which the semiconductor chip using the conventional thread is made in the paper layer is said to break the external antenna of the semiconductor chip with the external antenna and its joint due to the paper elongation in the flow direction of the paper machine. There was a problem.
A first object of the present invention is to provide a paper thread to which a semiconductor chip is bonded or buried. A second object of the present invention is to provide an anti-counterfeit paper that can be efficiently manufactured by using a paper thread to integrate layers including a semiconductor chip.

The inventors of the present invention have made extensive studies on the paper thread defects and the characteristics of the paper thread, and manufactured a paper thread including a semiconductor chip and completed anti-counterfeit paper using the paper thread. It came to do.
The present invention includes the following inventions.
(1) Adhering or burying a semiconductor chip having a multi-bit memory and antenna wiring on one side of a paper thread having a polyolefin-based resin layer on one side of a paper substrate slit in a narrow width Forgery prevention thread.
(2) The anti-counterfeiting thread according to (1), wherein the wet tear length of the paper base material measured in accordance with JIS P8135 is in the range of 0.05 km to 0.5 km.
(3) Anti-counterfeit paper in which the anti-counterfeit thread according to (1) or (2) is bonded to the surface of a sheet-like base material or inserted into the sheet-like base material.

The present invention relates to a thread provided with a very advanced anti-counterfeit means and an anti-counterfeit paper using the thread, and enables to provide a low-cost anti-counterfeit paper.

The present invention will be specifically described below, but the present invention is not construed as being limited to these descriptions. The semiconductor chip with an external antenna used in the present invention is one in which an external antenna is joined to a semiconductor chip having a side of 0.5 mm or less with a built-in memory of multiple bits, or one side with a built-in multi-bit memory and antenna wiring. An external antenna is joined to a semiconductor chip of 0.5 mm or less, and information stored in the semiconductor chip by the batteryless non-contact recognition method can be read through the antenna wiring.

Such a semiconductor chip is manufactured by the following method. First, a silicon single crystal wafer having a mirror surface and high purity is prepared. A resist pattern is formed on the wafer surface through a glass mask on which various element patterns having circuit designs are formed by a photoresist process through a process of insulating with various insulating films such as an oxide film and a nitride film. Through this resist pattern, the insulating film is etched or impurities are implanted to form an electrical device layer, and finally, a diffusion layer that becomes various transistors, diodes, resistors, and capacitors is formed. . Further, a wiring pattern layer is formed thereon, and the inter-element connection of the diffusion layer is terminated to achieve a circuit function. In the present invention, a resonance circuit including a coil element and a capacitor element is further formed to form an external antenna for obtaining microwave energy and signals. The typical method is described below.

The first method is a method disclosed in Republished Patent No. 2000-36555, that is, using a diamond blade after forming bumps for connecting an external antenna on the surface on which the semiconductor circuit is formed. In this method, one side is separated into semiconductor chips having a size of 0.5 mm or less, and the bump and the external antenna are connected using an anisotropic conductive adhesive.

In the second method, a semiconductor chip is manufactured by separating the wafer into semiconductor chips having a side of 0.5 mm or less using, for example, a diamond blade, and a wiring pattern layer is used for the semiconductor chip. Then, a resonance circuit including a coil element and a capacitor element is formed, and an internal antenna that obtains microwave energy and signals on-chip is formed. Since this internal antenna is a microwave, it has a small time constant. For example, by setting the inductance of the coil to 2 nanohenries and the capacitor to 2 picofarads, a resonant circuit can be realized with a small component circuit. is there. As a result, the internal antenna can be arranged on a semiconductor chip having a planar dimension of one side of 0.5 mm or less. The coil element and the capacitor element forming the internal antenna are connected in parallel or in series, and are connected to a high-frequency receiving circuit realized in a semiconductor chip.

Since the semiconductor chip with a built-in antenna has a radio wave reach distance of several millimeters, an external antenna is further joined to increase the radio wave reach distance. Specifically, a typical method is to form a bump for joining the external antenna to the tip of the internal antenna and connect the bump and the external antenna using an anisotropic conductive adhesive.

The semiconductor chip with an external antenna used in the present invention can be manufactured by the above-described method, and the maximum width of the external antenna is preferably equal to or less than the width of a thread described later. If the width of the external antenna is larger than the width of the sled, the external antenna is likely to be damaged when the sled is continuously fed out, and it is difficult to smoothly feed out the sled due to excessive load locally. Because. The length of the external antenna is preferably an integral multiple of a quarter wavelength of the radio wave to be used, and it is practically sufficient if it is easy to handle and the reach of the radio wave is several tens of centimeters. It is set to about several tens to 100 mm.

The dimension of the semiconductor chip is set to 0.5 mm or less on one side. If one side is larger than 0.5 mm, a replica of the chip can be manufactured relatively easily, and if the semiconductor chip is larger than the thread width, the thread provided with the semiconductor chip is bonded or inserted into the sheet-like material. In this case, the semiconductor chip easily falls off the thread, and when the sheet-like object is bent, the semiconductor chip easily breaks through the sheet-like object and is exposed to the outside. Furthermore, there is a problem in that the width of the thread becomes wide, and thus the vertical cracking of the paper occurs due to the fact that the dewatering property of the thread part is different from the part without the thread during paper making. The thickness of the semiconductor chip is preferably 0.1 to 120 μm. Manufacturing a semiconductor chip thinner than 0.1 μm is technically difficult and impractical. On the other hand, if the thickness is greater than 120 μm, the portion of the semiconductor chip becomes excessively thick when pasted or inserted into a sheet-like material, and the present invention for providing a thin anti-counterfeit paper cannot be achieved.

Next, a thread used in the present invention and a manufacturing method thereof will be described. In the present invention, it is important that the thread is a paper base and has a polyolefin resin layer on one side. Since the thread is a paper base, part of the paper is cut or dissolved by the moisture of the combined pulp layer when threading, and the resin layer follows the longitudinal extension of the paper machine. Thus, the stress on the semiconductor chip and the external antenna is not applied, and disconnection of the antenna can be prevented. In addition, by cutting or dissolving the paper base material when threading, the semiconductor chip with external antenna can be integrated with the finished anti-counterfeit paper pulp layer. There is an effect that internal peeling does not occur.

In the present invention, it is important to have a polyolefin resin layer on one side. In the present invention, with respect to the stress in the vertical direction of the paper machine, the portion that is not provided with the antenna wiring than the external antenna portion, that is, the portion that is formed only of paper and resin, extends sufficiently, thereby disconnecting the external antenna. Can be prevented. Therefore, as a general film physical property, the elongation is large and the elastic modulus is small. Further, as a method of adhering to paper, it is easy to adopt a laminating method, and therefore a polyolefin resin is optimal. Examples of the resin having a large elongation and a low elastic modulus include a silicone resin and a butadiene-based resin, but these resins have a defect that the adhesion to paper is inferior.
By having the polyolefin resin layer, it is possible to perform the paper-making without breaking the paper even if the paper-made thread gets wet with water in the general thread paper-making method. When a thread is manufactured using only a paper base material, it is necessary to increase the basis weight and to use a lot of paper strength enhancer, which increases the thickness of the anti-counterfeit paper to be manufactured, and the paper base material is difficult to dissolve. Problems arise.

Examples of the polyolefin resin include polyethylene (low density polyethylene, linear low density polyethylene, metallocene catalyzed polyethylene, medium density polyethylene, high density polyethylene, etc.), polypropylene, α-olefin copolymer (ethylene-propylene copolymer). Polyolefins such as ethylene-butene-1 copolymer, propylene-butene-1 copolymer, etc .; ethylene-based copolymers [for example, ethylene-acrylic acid copolymer (EAA), ethylene-methacrylic acid copolymer (EMAA) and other ethylene-unsaturated carboxylic acid copolymers; ionomers; ethylene-methyl acrylate copolymers, ethylene-ethyl acrylate copolymers (EEA), ethylene-methyl methacrylate copolymers and other ethylene- (Meth) acrylic acid ester copolymer; Styrene - vinyl acetate copolymer (EVA); ethylene - vinyl alcohol copolymer, etc.] and the like.

The thickness of the resin layer can be appropriately selected in consideration of the elongation during papermaking, but is generally about 5 to 50 μm. If the thickness of the resin layer is less than 5 μm, the strength is weak, and if it exceeds 50 μm, the increase in the total thickness of the tape and the elongation at the time of thread incorporation are not preferable. The resin layer can be formed by a conventional laminating method such as an extrusion laminating method, a co-extrusion method using a T-die tandem extrusion laminator, or a dry laminating method. Additives such as phosphorus and phenolic antioxidants, UV absorbers, rust inhibitors, softeners, surfactants, antistatic agents, fillers, coupling agents, and crosslinking agents are also added to the resin layer. May be blended.

Various pulps can be used as the paper base material pulp of the present invention. For example, chemical pulp such as kraft pulp (KP), sulfite pulp (SP), soda pulp (AP), semi-chemical pulp ( SCP), semi-chemical pulp such as Chemi-Grandwood pulp (CGP), ground pulp (GP), thermo-mechanical pulp (TMP, BCTMP), refiner Grandwood pulp (RGP), etc. Non-wood fiber pulp made from raw materials, etc., deinked pulp made from waste paper, etc. can be used, and these pulps may be used alone or in combination of two or more.

The pulp used for the paper substrate of the present invention can be beaten and used by a known method. There are no particular limitations on the beater, and various beaters such as a beater, Jordan, a deluxe refiner (DF), and a double disc refiner (DDR) are used. In the case of blending two raw pulps, beating may be beaten and blended alone, or may be beaten after mixing. The degree of beating can be arbitrarily set in consideration of a predetermined thickness and texture. Preferably, the Canadian Standard Freeness specified in JIS P8121 is beaten to 500 ml or less, preferably 400 ml or less as a mixed pulp. To do.

The paper machine for making the paper base material of the present invention is a conventionally used wet part paper machine such as a long net, circular net, inclined wire, etc., and the dryer part is a multi-cylinder, Yankee, through dryer. Any drying method can be adopted, but the wet part is preferably an inclined wire because it is easy to adjust the formation, and the dry part is preferably a Yankee dryer because it can form a smooth surface on which the semiconductor chip can be easily fixed.

In the paper base of the present invention, various internal chemicals can be used as necessary during papermaking. For example, rosin-based sizing agent, styrene / maleic acid, styrene / acrylic, styrene / olefin, alkyl ketene dimer, alkenyl succinic anhydride, and other various types such as internal sizing agent for natural and synthetic papermaking, starch, polyacrylamide resin, etc. Paper strength enhancers, wet paper strength enhancers such as polyamide polyamine epichlorohydrin resin, melamine resin, drainage yield improver, water resistance agent, antifoaming agent, dye, etc. can be used, but when thread embedding It is preferable not to use a sizing agent or a wet paper strength enhancer so that the paper substrate is dissolved by the moisture of the combined pulp layer.

In addition, inorganic or organic fillers can be used for papermaking. For example, kaolin, talc, clay, calcium carbonate, calcined clay, titanium oxide, diatomaceous fine particle anhydrous silica, activated clay, zinc oxide, aluminum oxide, aluminum hydroxide, zinc sulfate, barium sulfate, silicon dioxide, colloidal silica inorganic filler And organic fillers such as urea formalin filler, nylon powder, and polyethylene powder. However, when blending a large amount of these fillers, it is necessary to appropriately use a flocculant in consideration of water squeezing.

In the paper substrate of the present invention, various binders are used for the purpose of improving the surface strength, such as air knife coater, roll coater, reverse roll coater, blade coater, bar coater, gravure coater, kiss roll coater, cast coater, curtain coater, die. On-machine and off-machine coaters equipped with coating devices such as slot coaters, champlex coaters, brush coaters, gate roll coaters, Hamilton coaters, KCM coaters, size press coaters, madedo size presses, madedo film transfer roll coaters, etc. Can be applied and dried.

Various binders include starches such as oxidized starch, enzyme-modified starch, cation-modified starch, ester starch, and ether starch, methyl cellulose, ethyl cellulose, carboxymethyl cellulose, methoxy cellulose, hydroxy cellulose, fully (or partially) saponified polyvinyl alcohol, Polyvinyl alcohols such as carboxy-modified polyvinyl alcohol and silicon-modified polyvinyl alcohol, polyacrylamide, polyvinyl pyrrolidone, acrylic acid amide, acrylic acid ester copolymer, acrylic acid amide acrylic acid ester, methacrylic acid copolymer, styrene / anhydrous malein Alkali salt of acid copolymer, isobutylene / maleic anhydride copolymer alkali salt, water-soluble polymer such as casein, polyvinyl acetate, polyurethane, polyacrylic acid, polyacrylate Acrylic acid esters, polybutyl methacrylate, can be used a binder latexes such as styrene-butadiene copolymer, excess surface strength up undesirably deteriorate the solubility of the paper substrate.

The basis weight of the paper substrate is determined by the thickness of the semiconductor chip to be used and the strength of the required paper thread, and a basis weight range capable of papermaking is applicable, but in the present invention it is 10 to 70 g / m ² . . As the thickness, it is necessary to consider the thickness of the semiconductor chip with an external antenna and the thickness of the anti-counterfeit paper to be manufactured, but 20 to 100 μm is preferable.

In the present invention, it is important that the wet tear length of the paper base material measured in accordance with JIS P8135 is in the range of 0.05 km to 0.5 km. If the wet tear length is greater than 0.5 km, the paper base material will not break or melt when paper threads are incorporated, causing stress to be transmitted to the external antenna portion of the semiconductor chip with antenna, causing disconnection This is not preferable. As a method for adjusting the wet tear length to 0.5 km or less, it is important not to use a wet paper strength enhancer. However, if the basis weight is 20 g / m ² or less, the polyamide polyamine epichlorohydrin resin is used as a solid content with respect to pulp. If it is about 0.01%, it can be added.

The paper thread paper produced in this way is slit into a narrow width of several millimeters using a macro slitter, whereby the paper thread used in the present invention is obtained.

In the present invention, the semiconductor chip 3 provided with the external antenna 2 is bonded to the front or back surface of the paper thread 1 with an adhesive. Adhesives such as water-soluble adhesives such as PVA, starch, sodium alginate, polychloroprene adhesives, polyurethane adhesives, thermoplastic SBR adhesives, hot melt adhesives, epoxy adhesives, vinyl adhesives, Phenoxy resin adhesives, polyester adhesives, polysulfone adhesives and the like can be used alone or in combination. In particular, an adhesive excellent in water resistance and heat resistance is preferable. For example, a two-component curable epoxy adhesive is a typical example. In addition, when it is desired to cure the adhesive instantaneously, an ultraviolet curable adhesive can be used. In order to make it difficult to peel off the bonded semiconductor chip with the external antenna from the paper thread 1, the semiconductor chip 3 having the external antenna 2 having a width equal to or less than the width of the paper thread 1 as described above is used. It is desirable to adhere. (Figure 1)

Further, as a method of burying the semiconductor chip in the paper thread 1, a predetermined hole is formed in the paper thread 1 by a general punching process, and a semiconductor chip with an external antenna is attached and completed. The semiconductor chip 3 is fixed by the external antenna, and the semiconductor chip 3 is floating above the punch hole. In this case, the punch hole is made larger than the semiconductor chip 3 by 10 μm or more in both length and width. (Figure 2)

Furthermore, in this invention, after forming a semiconductor chip with an external antenna on a film, the method of cutting out a film and sticking on the paper thread | sled which has a resin layer is also employable. As the film at this time, various films such as cellophane, polypropylene film, polyester film, nylon film, polyvinyl alcohol film, polyvinyl chloride film and polycarbonate film can be used. For this base film, a material that does not melt or soften in the drying zone of the paper machine is used. However, it is desirable that the base film has a property that is not sticky at the temperature of the drying zone of 90 to 110 ° C. A heat-resistant film can be preferably used.

The semiconductor chip embedded in the paper thread may be of a type having an internal antenna, but a semiconductor chip having an external antenna is preferable because the detection distance with a reader is remarkably shortened.

In the method of embedding the semiconductor chip 3 in the paper thread 1 of the present invention, it is possible to prevent popping out by attaching a tape that serves as a cover after the semiconductor chip is inserted. As the cover tape, a Japanese paper tape 4 having a thickness of about 10 to 20 μm may be attached using a conventional adhesive. (Fig. 4)

The anti-counterfeit paper according to the present invention is completed by bonding or inserting a paper thread having a semiconductor chip bonded or buried on one side to the surface of a sheet-like substrate.
In the case where a paper thread is bonded, any paper such as commercially available high-quality paper, medium-quality paper, coated paper, newspaper, packaging paper, and paperboard can be used as the sheet-like substrate. As adhesives for bonding, water-soluble adhesives such as PVA, starch, sodium alginate, polychloroprene adhesives, polyurethane adhesives, thermoplastic SBR adhesives, hot melt adhesives, epoxy adhesives, Vinyl adhesives, phenoxy resin adhesives, polyester adhesives, polysulfone adhesives and the like can be used alone or in combination. As a surface to bond, various structures, such as putting in the surface of a sheet-like base material and the inner layer of a sheet-like base material, are employable.

When inserting a paper thread, a general film thread insertion method can be employed in the paper making process. As a paper machine, all wires such as long mesh, circular mesh, and inclined wire can be used in the wire part, and all dryers such as multi-cylinder, Yankee dryer, and through dryer can be used in the dryer part.
When inserting with a paper machine, multi-layer paper consisting of three or more layers is preferable. When inserting a paper thread into the middle layer, it is necessary to determine the basis weight of the middle layer in consideration of the thickness of the paper thread and the semiconductor chip. is there.

In the case of inserting a paper thread, various pulps can be used as the raw material pulp used in the anti-counterfeit paper of the present invention. For example, kraft pulp (KP), sulfite pulp (SP), soda pulp (AP) , Etc. Chemical pulp, Semi-chemical pulp (SCP), Semi-chemical pulp such as Chemi-Grandwood pulp (CGP), Groundwood pulp (GP), Thermomechanical pulp (TMP, BCTMP), Refiner Grandwood pulp (RGP), etc. Mechanical pulp can be used. Examples of other pulps include non-wood fiber pulp made from straw, sanjo, hemp, kenaf and the like, and deinked pulp made from waste paper. These pulps may be used alone or in combination of two or more. Pulp can be beaten and used by a known method. There are no particular limitations on the beater, and various beaters such as a beater, Jordan, a deluxe refiner (DF), and a double disc refiner (DDR) are used.

In the present invention, when making anti-counterfeit paper, various internal additives can be used as necessary. For example, rosin-based sizing agent, styrene / maleic acid, styrene / acrylic, styrene / olefin, alkyl ketene dimer, alkenyl succinic anhydride, and other various types such as internal sizing agent for natural and synthetic papermaking, starch, polyacrylamide resin, etc. Paper strength enhancers, wet paper strength enhancers such as polyamide polyamine epichlorohydrin resin, melamine resin, drainage yield improver, water resistance improver, antifoaming agent, dye and the like can be used.

In addition, inorganic or organic fillers can be used for papermaking. For example, kaolin, talc, clay, calcium carbonate, calcined clay, titanium oxide, diatomaceous fine particle anhydrous silica, activated clay, zinc oxide, aluminum oxide, aluminum hydroxide, zinc sulfate, barium sulfate, silicon dioxide, colloidal silica inorganic filler And organic fillers such as urea formalin filler, nylon powder, and polyethylene powder. However, when blending a large amount of these fillers, it is necessary to appropriately use a flocculant in consideration of water squeezing.

In the anti-counterfeit paper of the present invention, various binder resins can be used for the purpose of improving the surface strength. Oxidized starch, enzyme-modified starch, cation-modified starch, starch starch such as ester starch, ether starch, methylcellulose, ethylcellulose, carboxymethylcellulose, methoxycellulose, hydroxycellulose, fully (or partially) saponified polyvinyl alcohol, carboxy-modified polyvinyl alcohol, Polyvinyl alcohols such as silicon-modified polyvinyl alcohol, polyacrylamide, polyvinyl pyrrolidone, acrylic acid amide, acrylic acid ester copolymer, acrylic acid amide acrylic acid ester, methacrylic acid copolymer, styrene / maleic anhydride copolymer Alkali salt, isobutylene / maleic anhydride copolymer alkali salt, water-soluble polymer such as casein, polyvinyl acetate, polyurethane, polyacrylic acid, polyacrylate ester, polybutyl Methacrylate, latexes such as styrene-butadiene copolymer.

Furthermore, in the anti-counterfeit paper of the present invention, a coating layer corresponding to any printing or media such as a general coating layer, an ink jet receiving layer, a heat-sensitive layer, and sublimation heat transfer can be provided on the front and back surfaces of the anti-counterfeit paper.

The method for externally adding the surface strength agent and the method for forming the coating layer are not particularly limited, and include an air knife coater, roll coater, reverse roll coater, blade coater, bar coater, gravure coater, kiss roll coater, cast coater, On-machine equipped with coating equipment such as curtain coater, die slot coater, champlex coater, brush coater, gate roll coater, Hamilton coater, KCM coater, size press coater, metade size press, metade film transfer roll coater, etc. Apply and dry with an off-machine coater.

The basis weight of the anti-counterfeit paper with the paper thread of the present invention bonded or inserted is 70 g / m ² or more, and the upper limit can be up to the upper limit level of general paperboard, that is, 1000 g / m ² .

The present invention will be described in detail below with reference to examples, but the present invention is not limited thereto. Numerical values indicating the composition, concentration, etc. are numerical values based on the mass of the solid component or active ingredient. The presence / absence of disconnection of the semiconductor chip with an external antenna was determined by whether or not reading was possible using a system chip starter kit manufactured by Yagi Antenna using 100 semiconductor chips of the manufactured anti-counterfeit paper.

(Manufacturing method of paper thread paper)
Mixing 50% softwood bleached kraft pulp and 50% hardwood bleached kraft pulp, beat to 400ml Canadian Standard Freeness with a double disc refiner, and use PS-1250 (polyacrylamide resin, manufactured by Arakawa Chemical) as a dry paper strength agent 0.1% by weight was added, and a paper base A having a basis weight of 20 g / m ² , a thickness of 28 μm, and a wet tearing length of 0.4 km was manufactured using an inclined wire and a Yankee dryer. A resin layer having a thickness of 22 μm made of low-density polyethylene was formed on the base material A by extrusion lamination, and slitted to a width of 5 mm using a micro slitter to produce a paper thread paper B.

(Paper thread manufacturing method)
A semiconductor chip (0.4 × 0.4 × 0.075 mm) with an external antenna (length: 20 mm) was attached to the paper base A side of the paper thread paper B to produce a paper thread C. (Figure 1)
Also, punching was performed on the paper thread paper to form press forming holes of vertical 0.41 × horizontal 0.41, and the paper thread D was manufactured after inserting the semiconductor chip with external antenna. (Figure 2)
A polyester film in which a semiconductor chip with an antenna is bonded with an epoxy-based adhesive so that a chip portion of the semiconductor chip with an external antenna is placed in a hole in a 35 μm thick polyester film having a hole with a diameter of 2 mm. Was bonded to a paper thread paper B to produce a paper thread E. (Figure 3)
Punch holes are formed in paper thread paper B by punching, and a semiconductor chip with an external antenna is inserted into the punch hole, and a paper base material using starch (Oji Ace A, Oji Cornstarch) A paper thread F was created by covering the resin layer side bonded to the side with Japanese paper tape (FIG. 4).

Example 1
Containing 30% softwood bleached kraft pulp and 70% hardwood bleached kraft pulp as pulp raw materials, beat to 400ml Canadian Standard Freeness with a double disc refiner, and water based polymer (PS1250, polyacrylamide resin, Arakawa Chemical) as a paper strength agent. 0.1% of pulp solid content was added to obtain a papermaking raw material. Using this paper stock, adjusting 60 g / m 2 basis weight of the surface layer of the semiconductor chip is in contact with cylinder paper ^machine, the basis weight of the middle layer 30 g / m ^2, the basis weight of the backing layer to 30 g / m ² Then, a paper thread C was inserted into the middle layer to produce a forgery prevention paper having a thickness of 170 μm. In the evaluation of the presence or absence of disconnection, all 100 pieces could be read.

Example 2
An anti-counterfeit paper was manufactured in the same manner as in Example 1 except that the paper thread D was used. In the evaluation of the presence or absence of disconnection, all 100 pieces could be read.

Example 3
An anti-counterfeit paper was manufactured in the same manner as in Example 1 except that the paper thread E was used. In the evaluation of the presence or absence of disconnection, all 100 pieces could be read.

Example 4
An anti-counterfeit paper was produced in the same manner as in Example 1 except that the paper thread F was used. In the evaluation of the presence or absence of disconnection, all 100 pieces could be read.

Comparative Example 1
A film thread was manufactured in the same manner as the paper thread A except that a polyester film thread having a thickness of 20 μm and a width of 4 mm was used, and a 170 μm anti-counterfeit paper was manufactured in the same manner as in Example 1. In the evaluation of the presence / absence of disconnection, 13 of the 100 semiconductor chips can be read.

As is clear from the comparison between the example and the comparative example, the anti-counterfeit sheet-like base material that satisfies the requirements of the present invention uses the paper thread of the present invention, so that the disconnection of the external antenna due to thread embedding is eliminated. And anti-counterfeit paper including a semiconductor chip can be efficiently manufactured.

It is the schematic which adhere | attached the semiconductor chip with an external antenna on the paper thread paper. It is the schematic which formed the punch hole in the paper thread | yarn paper by punching, and embedded the semiconductor chip with an external antenna in it. It is the schematic which adhere | attached the polyester film which adhere | attached the semiconductor chip with an external antenna on paper thread paper. FIG. 3 is a schematic view in which punch holes are formed in a paper thread paper by punching, a semiconductor chip with an external antenna is disposed so that a chip portion is inserted therein, and a chip-side surface is covered with a Japanese paper tape.

Explanation of symbols

1, paper thread paper 2, external antenna 3, semiconductor chip 4, resin layer 5, Japanese paper tape 6, polyester film layer

Claims (2)

A semiconductor chip containing a multi-bit memory in which antenna wiring of 20 mm to 100 mm is joined by bumps is composed of a polyolefin resin layer and a paper layer having a wet tearing length in the range of 0.05 km to 0.5 km. in the paper layer surface of the slit and the substrate, by bonding the antenna wire, the anti-counterfeit thread characterized by comprising adhered to or embedded the semiconductor chip. An anti-counterfeit paper, wherein the anti-counterfeit thread according to claim 1 is inserted into a sheet-like base material by papermaking .

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