JP2016033791A - Paper box having radio signal transmission element and manufacturing method thereof - Google Patents

Paper box having radio signal transmission element and manufacturing method thereof Download PDF

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JP2016033791A
JP2016033791A JP2014157079A JP2014157079A JP2016033791A JP 2016033791 A JP2016033791 A JP 2016033791A JP 2014157079 A JP2014157079 A JP 2014157079A JP 2014157079 A JP2014157079 A JP 2014157079A JP 2016033791 A JP2016033791 A JP 2016033791A
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signal transmission
transmission element
box
wireless signal
paper box
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劍寛 郭
Chien-Kuan Kuo
劍寛 郭
俊煌 黄
Chun-Huang Huang
俊煌 黄
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Golden Arrow Printing Co Ltd
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Golden Arrow Printing Co Ltd
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Abstract

PROBLEM TO BE SOLVED: To provide a paper box having a radio signal transmission element whose structure is stabilized without influencing its appearance by burying the radio signal transmission element into a box body, and a manufacturing method of the paper box.SOLUTION: A manufacturing method of a paper box having a radio signal transmission element comprises: providing a molding mold; charging pulp into the molding mold to form a base layer; installing a radio signal transmission element on the base layer; re-charging the pulp into the molding mold so as to cover the base layer and coupling with the base layer to thereby form a box body; coating the radio signal transmission element with the box body; and drying the box body with heat press after compression and dewatering. Consequently, molded is a paper box including an integrally molded box body and a radio signal transmission element buried in the box body.SELECTED DRAWING: Figure 1

Description

本発明は、箱体の製造方法に関し、特に、無線信号伝送素子を有する紙箱及びその製造方法に関する。   The present invention relates to a box manufacturing method, and more particularly to a paper box having a wireless signal transmission element and a manufacturing method thereof.

RFIDチップ(Radio Frequency IDentification Chip)は、包装内容物の識別として商品の包装に多く適用されている。既存のRFIDチップは、紙製包装に適用される場合に、ほとんどタグの形態で包装材に貼付される。このような形態によれば、商品包装の美観性を損なうほか、包装材から脱落しやすくなったり、外力によって破壊されたり、または偽物に置き換えられたりするリスクがある。   BACKGROUND ART RFID chips (Radio Frequency IDentification Chips) are often applied to product packaging as identification of package contents. Existing RFID chips are affixed to packaging materials almost in the form of tags when applied to paper packaging. According to such a form, in addition to impairing the aesthetics of the product packaging, there is a risk that it will be easily dropped from the packaging material, destroyed by an external force, or replaced with a fake.

これに鑑みて、上記の従来技術に対し、特に研究に専念し、学理の運用を合わせて、上記の問題点の解決に尽力するのが、本発明の発明者の改良の目標となっている。   In view of this, the improvement of the inventor of the present invention is to concentrate on the above-mentioned prior art, and to concentrate on research and to work together to solve the above-mentioned problems. .

本発明の一つの目的は、無線信号伝送素子が埋設された紙箱を製造することが可能な、無線信号伝送素子を有する紙箱の製造方法を提供することである。   One object of the present invention is to provide a method for manufacturing a paper box having a wireless signal transmission element, which can manufacture a paper box in which the wireless signal transmission element is embedded.

上記目的を達成するために、本発明に係る、無線信号伝送素子を有する紙箱の製造方法は、成型金型を提供する金型提供工程と、成型金型の内面を覆うように成型金型内にパルプを充填して基層を形成する基層形成工程と、基層上に無線信号伝送素子を設置する無線信号伝送素子設置工程と、基層を覆うように成型金型内にパルプを再充填して基層と結合させることで、内部に無線信号伝送素子が覆われている箱体を形成する箱体形成工程と、箱体を加圧して脱水させる脱水工程と、脱水した箱体を熱プレスして乾燥させる乾燥工程と、を含む。   In order to achieve the above object, a method for manufacturing a paper box having a wireless signal transmission element according to the present invention includes a mold providing step for providing a molding mold, and a molding mold so as to cover the inner surface of the molding mold. A base layer forming step of forming a base layer by filling pulp into a base layer, a wireless signal transmission element installing step of installing a radio signal transmission element on the base layer, and a base layer by refilling the pulp into a molding die so as to cover the base layer To form a box with a radio signal transmission element covered therein, a dehydration process for pressurizing and dehydrating the box, and hot-pressing and drying the dehydrated box Drying step.

好ましくは、上記の脱水工程には、成型金型に対応する脱水金型を提供し、脱水金型と成型金型との間に、厚さが2〜5mmの退避スペースを形成し、脱水金型を成型金型内に配置して、箱体が前記退避スペース内に収まれるように箱体を押圧して脱水させる工程が含まれる。なお、脱水工程は、必要に応じて繰り返して行われる。   Preferably, in the above dehydration step, a dehydration mold corresponding to the molding die is provided, and a retreat space having a thickness of 2 to 5 mm is formed between the dehydration mold and the molding die. A step is included in which the mold is placed in a molding die and the box is pressed and dehydrated so that the box fits in the retreat space. Note that the dehydration step is repeated as necessary.

好ましくは、上記の乾燥工程には、熱プレス金型を提供し、箱体を熱プレイ金型内に入れて所定の厚さまで押圧した、その後、120〜190℃まで箱体を加熱してから所定時間維持する工程が含まれる。   Preferably, in the above drying step, a hot press mold is provided, the box is placed in a heat play mold and pressed to a predetermined thickness, and then the box is heated to 120 to 190 ° C. A step of maintaining for a predetermined time is included.

好ましくは、成型金型の内面には、複数の網目が形成される。無線信号伝送素子は、能動素子または受動素子であってもよく、好ましくは、RFIDである。   Preferably, a plurality of meshes are formed on the inner surface of the molding die. The wireless signal transmission element may be an active element or a passive element, and is preferably an RFID.

本発明のもう一つの目的は、無線信号伝送素子を有する紙箱を提供することである。   Another object of the present invention is to provide a paper box having a wireless signal transmission element.

上記の目的を達成するために、本発明に係る、無線信号伝送素子を有する紙箱は、一体成形された箱体と、当該箱体内に埋設された無線信号伝送素子とを含む。
無線信号伝送素子は、能動素子または受動素子であってもよく、好ましくは、RFIDである。
In order to achieve the above object, a paper box having a radio signal transmission element according to the present invention includes an integrally molded box and a radio signal transmission element embedded in the box.
The wireless signal transmission element may be an active element or a passive element, and is preferably an RFID.

本発明に係る、無線信号伝送素子を有する紙箱の製造方法によれば、金型を使ってパルプによって箱体を形成することが可能である。さらに、箱体の成型過程において、無線信号伝送素子を箱体内に埋設することで、外観に影響することなく、構造の安定化を実現することができる。   According to the manufacturing method of the paper box which has a radio signal transmission element concerning the present invention, it is possible to form a box with pulp using a metallic mold. Furthermore, by embedding the radio signal transmission element in the box in the molding process of the box, the structure can be stabilized without affecting the appearance.

本発明の好適な実施形態に係る、無線信号伝送素子を有する紙箱の製造方法を示すフロー図である。It is a flowchart which shows the manufacturing method of the paper box which has a wireless signal transmission element based on suitable embodiment of this invention. 本発明の好適な実施形態の成型金型を示す図である。It is a figure which shows the shaping die of suitable embodiment of this invention. 本発明の好適な実施形態の基層の配置を示す図である。It is a figure which shows arrangement | positioning of the base layer of suitable embodiment of this invention. 本発明の好適な実施形態の無線信号伝送素子の配置を示す図である。It is a figure which shows arrangement | positioning of the radio | wireless signal transmission element of suitable embodiment of this invention. 本発明の好適な実施形態の箱体の成型を示す図である。It is a figure which shows shaping | molding of the box of preferable embodiment of this invention. 本発明の好適な実施形態の脱水金型を示す図である。It is a figure which shows the spin-drying | dehydration metal mold | die of preferable embodiment of this invention. 本発明の好適な実施形態の熱プレス金型を示す図である。It is a figure which shows the hot press metal mold | die of suitable embodiment of this invention. 本発明の好適な実施形態に係る、無線信号伝送素子を有する紙箱の完成品を示す図である。It is a figure which shows the completed product of the paper box which has a wireless signal transmission element based on suitable embodiment of this invention.

図1は、本発明の好適な実施形態に係る、無線信号伝送素子を有する紙箱の製造方法を示すフロー図である。以下、図面を参照しながら、本発明の好適な実施形態に係る、無線信号伝送素子を有する紙箱の製造方法について説明する。   FIG. 1 is a flowchart showing a method for manufacturing a paper box having a wireless signal transmission element according to a preferred embodiment of the present invention. Hereinafter, a method for manufacturing a paper box having a wireless signal transmission element according to a preferred embodiment of the present invention will be described with reference to the drawings.

まず、図1及び図2に示すように、成型金型100を提供する(ステップa、即ち、金型提供工程)。本実施形態において、成型金型100は成型網であることが好ましく、成型金型100の内面には、複数の網目110が形成されている。   First, as shown in FIG.1 and FIG.2, the molding die 100 is provided (step a, ie, metal mold | die provision process). In the present embodiment, the molding die 100 is preferably a molding net, and a plurality of meshes 110 are formed on the inner surface of the molding die 100.

ステップaの次に、図1及び図3に示すように、パルプが成型金型100の内面を覆うまで成型金型100内にパルプを充填し、同時に、成型金型100の外側において、これら網目110を介して成型金型100内に負圧を供給する(ステップb、即ち、基層形成工程)。これにより、パルプは成型金型100の内面に押し付けられるため、成型金型100の内面には基層210が形成される。   After step a, as shown in FIGS. 1 and 3, the pulp is filled into the molding die 100 until the pulp covers the inner surface of the molding die 100, and at the same time, these meshes are formed outside the molding die 100. A negative pressure is supplied into the molding die 100 through 110 (step b, ie, base layer forming step). Thereby, since the pulp is pressed against the inner surface of the molding die 100, the base layer 210 is formed on the inner surface of the molding die 100.

ステップbの次に、図1及び図4に示すように、基層210上に、無線信号伝送素子300を設置する(ステップc、即ち、無線信号伝送素子設置工程)。本実施形態において、無線信号伝送素子300はRFIDチップであることが好ましい。RFIDチップは、受動型のRFIDであってもよいし、能動型のRFIDであってもよい。また、能動型のRFIDの場合、基層210上に、RFIDに電気的に接続されてそれに給電する蓄電素子を設けることが好ましい。本発明は、無線信号伝送素子300の態様に限定されない。無線信号伝送素子300の配置態様としては、基層210に埋設される態様、基層210に半埋没される態様、または基層210の表面に設けられる態様があり得るが、これに限定されない。   After step b, as shown in FIGS. 1 and 4, the radio signal transmission element 300 is installed on the base layer 210 (step c, ie, radio signal transmission element installation process). In the present embodiment, the wireless signal transmission element 300 is preferably an RFID chip. The RFID chip may be a passive RFID or an active RFID. In the case of an active RFID, a power storage element that is electrically connected to the RFID and supplies power to the RFID is preferably provided over the base layer 210. The present invention is not limited to the aspect of the wireless signal transmission element 300. As an arrangement mode of the wireless signal transmission element 300, there may be a mode of being embedded in the base layer 210, a mode of being semi-buried in the base layer 210, or a mode of being provided on the surface of the base layer 210, but is not limited thereto.

ステップcの次に、図1及び図5に示すように、パルプが基層210を覆うまで成型金型100内にパルプを再充填し、無線信号伝送素子300が基層210に半埋設された場合または基層210の表面に設けられた場合には、パルプが無線信号伝送素子300を覆うまで成型金型100内にパルプを再充填する(ステップd、即ち、箱体形成工程)。成型金型100の外側において、これら網目110を介して成型金型100内に負圧を供給し、これにより、成型金型100に再充填されたパルプが、基層210の表面に吸着され、基層210と結合して箱体200が形成される。このように、無線信号伝送素子300は、箱体200内に埋設されることになる。   After step c, as shown in FIGS. 1 and 5, when the pulp is refilled into the mold 100 until the pulp covers the base layer 210, and the wireless signal transmission element 300 is semi-embedded in the base layer 210 or When provided on the surface of the base layer 210, the pulp is refilled into the molding die 100 until the pulp covers the wireless signal transmission element 300 (step d, that is, a box forming process). On the outside of the molding die 100, negative pressure is supplied into the molding die 100 through the mesh 110, whereby the pulp refilled in the molding die 100 is adsorbed on the surface of the base layer 210, and the base layer Combined with 210, a box 200 is formed. Thus, the radio signal transmission element 300 is embedded in the box body 200.

ステップdの次に、図1及び図6に示すように、上記の成型金型100に対応する脱水金型400を提供する。ここで、脱水金型400の外輪郭は、成型金型100の内輪郭に対応する。脱水金型400が成型金型100の中に配置された場合、脱水金型400と成型金型100との間には、退避スペースが形成されることが好ましい。退避スペースの厚さD1は、2〜5mmである。本実施形態において、退避スペースの厚さD1は3mmであることが好ましい。脱水金型400が成型金型100内に配置されて箱体200を押圧することで、箱体200を退避スペース内まで圧縮、即ち、箱体200の厚さD1を3mmまで圧縮し、これにより、箱体200に含まれた水分の一部を搾り出して、成型金型100における網目110から排出する(ステップe、即ち、脱水工程)。本実施形態において、ステップeは、選択的に繰り返して行われてもよい。脱水回数が多いほど箱体200の表面が滑らかになるため、箱体200の使用態様に応じて、ステップeの繰り返し回数を選択することができる。   After step d, as shown in FIGS. 1 and 6, a dehydrating mold 400 corresponding to the molding mold 100 is provided. Here, the outer contour of the dehydrating mold 400 corresponds to the inner contour of the molding mold 100. When the dewatering mold 400 is disposed in the molding mold 100, it is preferable that a retreat space is formed between the dehydrating mold 400 and the molding mold 100. The thickness D1 of the retreat space is 2 to 5 mm. In the present embodiment, it is preferable that the thickness D1 of the evacuation space is 3 mm. The dewatering mold 400 is arranged in the molding mold 100 and presses the box 200, thereby compressing the box 200 into the retreat space, that is, compressing the thickness D1 of the box 200 to 3 mm. Then, a part of the water contained in the box 200 is squeezed out and discharged from the mesh 110 in the molding die 100 (step e, ie, dehydration step). In the present embodiment, step e may be selectively repeated. Since the surface of the box 200 becomes smoother as the number of dehydrations increases, the number of repetitions of step e can be selected according to the usage mode of the box 200.

ステップeの次に、図1及び図7に示すように、熱プレス金型500を提供し、脱水した箱体200を上記の成型金型100から取り出して熱プレス金型500に入れ、熱プレス金型500によって厚さが所定の厚さD2になるまで箱体200を押圧し、その後、熱プレス金型500を所定の時間で継続的に加熱し、これにより、脱水した箱体200を加圧するとともに加熱し、所定の時間が経過した後に加熱押圧を停止する(ステップf、即ち、乾燥工程)。本実施形態において、上記の所定の厚さD2は、1.1〜1.5mmであってもよいが、1.3mmであることが好ましい。しかも、箱体200は120〜190℃まで加熱されることが好ましいが、これに限定されない。   After step e, as shown in FIG. 1 and FIG. 7, a hot press mold 500 is provided, and the dehydrated box 200 is taken out from the molding mold 100 and placed in the hot press mold 500. The box 200 is pressed by the mold 500 until the thickness reaches the predetermined thickness D2, and then the hot press mold 500 is continuously heated for a predetermined time, thereby adding the dehydrated box 200. Pressure is applied and heated, and the heating and pressing are stopped after a predetermined time has elapsed (step f, ie, drying step). In the present embodiment, the predetermined thickness D2 may be 1.1 to 1.5 mm, but is preferably 1.3 mm. And although it is preferable that the box 200 is heated to 120-190 degreeC, it is not limited to this.

上記の方法によれば、本発明に係る無線信号伝送素子300を有する箱体200を製造することができる。   According to said method, the box 200 which has the radio | wireless signal transmission element 300 which concerns on this invention can be manufactured.

本発明に係る無線信号伝送素子を有する紙箱の製造方法によれば、金型を使ってパルプによって、図8に示すような、一体成形した箱体200を形成することができる。さらに、箱体200が成型される過程において、無線信号伝送素子300を箱体200内に埋設することで、本発明に係る、無線信号伝送素子を有する紙箱を完成することができる。従って無線信号伝送素子300は、箱体200から脱落することなく、外力によって破壊されにくくなり、さらに箱体200の外観に影響しない。   According to the method for manufacturing a paper box having a wireless signal transmission element according to the present invention, an integrally formed box 200 as shown in FIG. 8 can be formed by pulp using a mold. Furthermore, by embedding the wireless signal transmission element 300 in the box body 200 in the process of molding the box body 200, the paper box having the wireless signal transmission element according to the present invention can be completed. Therefore, the wireless signal transmission element 300 does not fall off from the box body 200, and is not easily broken by an external force, and does not affect the appearance of the box body 200.

なお、本発明では好適な実施形態を上記の通りに開示したが、これらは決して本発明に限定するものではなく、請求項に示した範囲で種々の変更が可能であり、異なる形態例にそれぞれ開示された技術的手段を適宜組み合わせて得られる実施形態についても、本発明の技術的範囲に含まれる。   In the present invention, the preferred embodiments have been disclosed as described above. However, the present invention is not limited to the present invention, and various modifications can be made within the scope shown in the claims, and different embodiments are provided. Embodiments obtained by appropriately combining the disclosed technical means are also included in the technical scope of the present invention.

100 成型金型
110 網目
200 箱体
210 基層
300 無線信号伝送素子
400 脱水金型
500 熱プレス金型
D1 厚さ
D2 所定の厚さ
a〜f ステップ
100 Molding mold 110 Mesh 200 Box 210 Base layer 300 Wireless signal transmission element 400 Dehydration mold 500 Hot press mold D1 Thickness D2 Predetermined thickness af steps

Claims (16)

無線信号伝送素子を有する紙箱の製造方法であって、
成型金型を提供する金型提供工程と、
前記成型金型の内面を覆うように前記成型金型内にパルプを充填して基層を形成する基層形成工程と、
前記基層上に無線信号伝送素子を設置する無線信号伝送素子設置工程と、
前記基層を覆うように前記成型金型内にパルプを再充填して前記基層と結合させることで、前記無線信号伝送素子を被覆する箱体を形成する箱体形成工程と、
前記箱体を加圧して脱水させる脱水工程と、
脱水した前記箱体を熱プレスして乾燥させる乾燥工程と、を含むことを特徴とする、無線信号伝送素子を有する紙箱の製造方法。
A method of manufacturing a paper box having a wireless signal transmission element,
A mold providing process for providing a mold;
A base layer forming step of forming a base layer by filling pulp into the molding die so as to cover the inner surface of the molding die;
A radio signal transmission element installation step of installing a radio signal transmission element on the base layer;
A box forming step for forming a box covering the wireless signal transmission element by refilling the pulp into the molding die so as to cover the base layer and combining with the base layer;
A dehydration step of pressurizing and dehydrating the box;
And a drying step of drying the dehydrated box by hot pressing. A method for manufacturing a paper box having a wireless signal transmission element.
前記脱水工程においては、
前記成型金型に対応する脱水金型を提供し、前記脱水金型を前記成型金型の中に配置して、前記箱体を押圧して脱水させることを特徴とする請求項1に記載の、無線信号伝送素子を有する紙箱の製造方法。
In the dehydration step,
The dehydrating die corresponding to the molding die is provided, the dehydrating die is disposed in the molding die, and the box is pressed to dehydrate. A method for manufacturing a paper box having a wireless signal transmission element.
前記脱水金型と前記成型金型との間には、退避スペースが形成され、
前記脱水金型によって前記箱体が前記退避スペース内まで押圧されることを特徴とする請求項2に記載の、無線信号伝送素子を有する紙箱の製造方法。
A retreat space is formed between the dehydration mold and the molding mold,
3. The method for manufacturing a paper box having a wireless signal transmission element according to claim 2, wherein the box is pressed by the dewatering mold into the retreat space.
前記退避スペースの厚さは、2〜5mmである特徴とする請求項3に記載の、無線信号伝送素子を有する紙箱の製造方法。   The method of manufacturing a paper box having a wireless signal transmission element according to claim 3, wherein a thickness of the evacuation space is 2 to 5 mm. 前記成型金型の内面には、複数の網目が形成されることを特徴とする請求項1に記載の、無線信号伝送素子を有する紙箱の製造方法。   The method for manufacturing a paper box having a wireless signal transmission element according to claim 1, wherein a plurality of meshes are formed on the inner surface of the molding die. 前記脱水工程を選択的に繰り返して行うことが可能であることを特徴とする請求項1に記載の、無線信号伝送素子を有する紙箱の製造方法。   The method for manufacturing a paper box having a wireless signal transmission element according to claim 1, wherein the dehydration step can be selectively repeated. 前記乾燥工程において、
前記箱体を熱プレスして乾燥させる工程として、熱プレス金型を提供し、脱水した前記箱体を前記熱プレス金型に入れてから、前記熱プレス金型で前記箱体を押圧すると同時に、前記熱プレス金型を加熱することで前記箱体を加熱することを特徴とする請求項1に記載の、無線信号伝送素子を有する紙箱の製造方法。
In the drying step,
As the step of hot pressing the box body, a hot press mold is provided, and after the dehydrated box body is placed in the hot press mold, the box body is pressed with the hot press mold at the same time. The method for manufacturing a paper box having a wireless signal transmission element according to claim 1, wherein the box is heated by heating the hot press mold.
前記乾燥工程においては、前記熱プレス金型で前記箱体を所定の厚さに押圧した後、前記箱体を所定の時間継続的に加熱してから加熱、押圧を停止することを特徴とする請求項7に記載の、無線信号伝送素子を有する紙箱の製造方法。   In the drying step, after the box is pressed to a predetermined thickness with the hot press mold, the box is continuously heated for a predetermined time, and then heating and pressing are stopped. The manufacturing method of the paper box which has a wireless signal transmission element of Claim 7. 前記乾燥工程においては、前記箱体を120〜190℃まで加熱することを特徴とする請求項8に記載の、無線信号伝送素子を有する紙箱の製造方法。   In the said drying process, the said box is heated to 120-190 degreeC, The manufacturing method of the paper box which has a radio signal transmission element of Claim 8 characterized by the above-mentioned. 前記無線信号伝送素子は、RFIDチップであることを特徴とする請求項1に記載の、無線信号伝送素子を有する紙箱の製造方法。   The method of manufacturing a paper box having a wireless signal transmission element according to claim 1, wherein the wireless signal transmission element is an RFID chip. 前記無線信号伝送素子は、能動素子であることを特徴とする請求項1に記載の、無線信号伝送素子を有する紙箱の製造方法。   The method of manufacturing a paper box having a wireless signal transmission element according to claim 1, wherein the wireless signal transmission element is an active element. 前記無線信号伝送素子は、受動素子であることを特徴とする請求項1に記載の、無線信号伝送素子を有する紙箱の製造方法。   The method of manufacturing a paper box having a wireless signal transmission element according to claim 1, wherein the wireless signal transmission element is a passive element. 無線信号伝送素子を有する紙箱であって、
一体成形された箱体と、前記箱体内に埋設された無線信号伝送素子とを含むことを特徴とする、無線信号伝送素子を有する紙箱。
A paper box having a wireless signal transmission element,
A paper box having a radio signal transmission element, comprising a box body integrally formed and a radio signal transmission element embedded in the box body.
前記無線信号伝送素子は、RFIDチップであることを特徴とする請求項13に記載の、無線信号伝送素子を有する紙箱。   The paper box having a wireless signal transmission element according to claim 13, wherein the wireless signal transmission element is an RFID chip. 前記無線信号伝送素子は、能動素子であることを特徴とする請求項13に記載の、無線信号伝送素子を有する紙箱。   The paper box having a wireless signal transmission element according to claim 13, wherein the wireless signal transmission element is an active element. 前記無線信号伝送素子は、受動素子であることを特徴とする請求項13に記載の、無線信号伝送素子を有する紙箱。   The paper box having a wireless signal transmission element according to claim 13, wherein the wireless signal transmission element is a passive element.
JP2014157079A 2014-07-31 2014-07-31 Paper box having radio signal transmission element and manufacturing method thereof Pending JP2016033791A (en)

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Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09109113A (en) * 1995-10-18 1997-04-28 Taiho Kogyo Kk Molding method for fibrous molding and mold used therefor
JP2008106417A (en) * 2006-09-26 2008-05-08 Nippon Paper Industries Co Ltd Paper having enclosed ic tag
JP2008144284A (en) * 2006-12-06 2008-06-26 Kinousei Mokushitsu Shinsozai Gijutsu Kenkyu Kumiai Method for molding paper molded article and forming mold

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09109113A (en) * 1995-10-18 1997-04-28 Taiho Kogyo Kk Molding method for fibrous molding and mold used therefor
JP2008106417A (en) * 2006-09-26 2008-05-08 Nippon Paper Industries Co Ltd Paper having enclosed ic tag
JP2008144284A (en) * 2006-12-06 2008-06-26 Kinousei Mokushitsu Shinsozai Gijutsu Kenkyu Kumiai Method for molding paper molded article and forming mold

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