JP2007119966A - Non-contact ic built-in paper and method for producing the same - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a non-contact IC built-in paper, in which non-contact type IC inlet equipped with IC chip and an antenna is built in printing/copying media and built-in parts of the IC inlet is smoothed, excellent in suitability for printing/copying including carrying property and having high security property; and to provide a method for producing the paper. <P>SOLUTION: In the non-contact IC built-in paper 2, a printing/copying medium 40 is composed of a three-layer structure of an intermediate layer 41 and surface and rear layers 42 and 43, and the intermediate layer 41 is a bulky non-coated paper and an opening 44 according to a planar shape of the outer periphery of an antenna coil 10 on a substrate sheet 30 is engraved and provided at the prescribed position of the non-coated paper and the non-contact type IC inlet 1 keeping an IC chip 20 and the antenna coil 10 in the upper surface from the opening 44 is placed and an adhesive layer 46 composed of an adhesive is applied to one surface of surface and rear layers 42 and 43 each composed of a thin paper and the surface and the rear of the intermediate layer 41 are covered with the surface and rear layers 42 and 43. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to a non-contact IC built-in paper containing a non-contact type IC inlet composed of an IC chip storing unique identification information and an antenna for transmitting and receiving the identification information, and a method for manufacturing the same. In particular, the present invention relates to a non-contact IC built-in paper suitable for printing / copying including a transportability and the like, and a method of manufacturing the same, in which the non-contact type IC inlet is smoothed.

  Conventionally, an information recording medium (RFID (RFID)) that is built in such as a non-contact IC card or a booklet with a non-contact IC (passport, etc.) and can transmit / receive the identification information in a non-contact state and record / erase the identification information. A non-contact type IC inlet used for RadioFrequency IDentification)) has a configuration in which an antenna made of a copper or aluminum conductive material and an RFID IC chip connected thereto are mounted on an insulating organic base material. is doing.

  In the case of the IC card with a built-in non-contact type IC inlet, for example, as shown in the side sectional view of FIG. 6, the non-contact type IC inlet (1) is used and it is made of a plastic sheet forming the front and back surfaces. A non-contact type IC inlet (1) is sandwiched between the front surface base material (14A) and the back surface base material (14B), and is adhered to the adhesive layer (16) to form a non-contact IC card (5). It is used for proofs and various membership cards, etc. In order to make such a thick card, even if IC inlet (1) is built in, there is no unevenness in that part, and even if many sheets are stacked, it collapses Therefore, there is no particular problem in manufacturing, storage or use.

  Further, in the case of the IC booklet with a built-in non-contact type IC inlet, for example, as shown in the side sectional view of FIG. 5 (a), on the upper surface side of the first base sheet (3a), a predetermined A second base sheet (3b) having a wide opening (4) is bonded to form a recess, and an IC chip (8) and an antenna (7) connected thereto are provided in the recess. The non-contact type data carrier (6) in which the adhesive layer (9) is provided on the lower surface side of the first base sheet (3a), and the non-contact type data carrier (6) is the back cover of the booklet. There is an IC booklet having a non-contact type data carrier attached to the inner surface of (13) (for example, see Patent Document 1).

  However, even in the case of the IC booklet, for example, as shown in the perspective view of FIG. 5B, the non-contact type data carrier (6) is attached to the inner surface of the back cover (13) such as upper bookbinding, By providing a cutout (15) in the text sheet (14) corresponding to the affixed part, this booklet has no irregularities and no problems with stacking, and therefore for manufacturing, storage or use The above is not particularly problematic.

  On the other hand, it is assumed that the non-contact type IC inlet is built in a printing medium such as printing paper or copying paper. For example, as shown in the side sectional view of FIG. As shown in the side sectional view of FIG. 7B, the contact type IC inlet (1) is embedded, or the IC tag (12) on the printing medium (17) (the IC tag is above and below the IC inlet). There are those with affixed an insulating base material for protection or the like (for example, see Patent Document 2).

However, in the case where the IC inlet (1) shown in FIG. 7A is embedded in the print medium (17), a convex portion is formed at a place where the IC inlet (1) is built, and the printing machine or the copying machine is used. When a plurality of print media (7) are stacked on the tray, problems such as bending of the print medium due to the convex portions occur, so it can be said that the stack (stacking) property is lacking. That is, the convex portions are stacked vertically, which causes the print medium to be curved. In a severe case, the IC inlet may be destroyed.

  In addition, printing media with convex parts lack in suitability for transporting into the printing press and transporting inside the equipment (including bending and catching between rollers), and a non-pressure printing method such as inkjet. Can be applied, but is unsuitable for printing machines that require pressure to transfer ink to other printing media.

  Furthermore, in the case where the IC tag (12) is pasted on the print medium (17) shown in FIG. 7B, in addition to the above-mentioned lack of printability, the inside of the IC tag (12) in a printing machine or other printing device. There was also a problem of breaking the IC inlet (1). Furthermore, the embedded part of the IC inlet (1), whether embedded in the print medium (17) or pasted on the print medium (17), is recognized by visual recognition or touch, so that the IC inlet (1) There was also a problem of lack of security including tampering and replacement.

The above prior art documents are shown below.
Japanese Patent Laid-Open No. 2002-4068 JP 2000-20664 A

  The present invention solves the problems of the prior art, and the problem is that a non-contact type comprising an IC chip storing unique identification information and an antenna for transmitting and receiving the identification information. In a non-contact IC built-in paper in which an IC inlet is built in a printing medium and its manufacturing method, the built-in portion of the non-contact type IC inlet is smooth and excellent in printability including stackability and transportability. An object of the present invention is to provide a non-contact IC built-in paper that can be printed at a location and has excellent security including replacement of a non-contact type IC inlet and prevention of tampering, and a method for manufacturing the same.

In order to achieve the above object in the present invention, according to the first aspect of the present invention, a non-contact IC built-in paper in which a non-contact type IC inlet having an IC chip and an antenna is built in a printing / copying medium. Because
The printing / copying medium has a three-layer structure of an intermediate layer and a front surface layer and a back surface layer provided on the front and back surfaces thereof,
The intermediate layer is a thick paper mainly composed of pulp fibers, and a predetermined large hole is engraved in a predetermined position according to the planar shape that maximizes the outer periphery of the antenna,
A non-contact type IC inlet is placed in the hole so that the IC chip faces the surface side of the intermediate layer and the antenna fits in the hole,
The front and back layers are mainly made of pulp fiber, and are thin paper preliminarily formed with an adhesive layer on one side, and are bonded to the front and back surfaces of cardboard with the holes engraved through the adhesive layer. This is a non-contact IC built-in paper.

  According to a second aspect of the present invention, there is provided the non-contact IC built-in paper according to the first aspect, wherein the thick paper constituting the intermediate layer is a bulky non-coated paper.

  Moreover, in invention of Claim 3, the adhesive bond layer apply | coated to the thin paper which comprises the said front and back surface layer is a pressure sensitive adhesive, Either of Claim 1 thru | or 2 characterized by the above-mentioned. Non-contact IC built-in paper.

According to a fourth aspect of the present invention, there is provided a non-contact IC built-in paper manufacturing method in which a non-contact type IC inlet having an IC chip and an antenna is built in a print / copy medium,
The print / copy medium is composed of a three-layer structure of an intermediate layer and a front layer and a back layer provided on the front and back surfaces thereof,
The intermediate layer is a cardboard mainly composed of pulp fiber, and a predetermined large hole according to a planar shape that maximizes the outer periphery of the antenna or a slightly larger through hole is engraved,
The front layer and the back layer are thin papers mainly composed of pulp fibers, and an adhesive layer is formed in advance on one side thereof, and the back layer is a cardboard on which the hole is formed on the surface on which the adhesive layer is formed. Adhere to the back of the
A non-contact type IC inlet is placed so that the IC chip and the antenna are on the upper surface,
The surface layer is bonded to the surface of the cardboard on which the hole is engraved with the surface on which the adhesive layer is formed.

  The invention according to claim 5 is the method for producing a non-contact IC built-in paper according to claim 4, wherein the thick paper constituting the intermediate layer is a bulky non-coated paper.

  Furthermore, in the invention of claim 5, any one of claims 4 to 5, wherein the adhesive layer applied to the thin paper constituting the front and back layers is a pressure sensitive adhesive. This is a method of manufacturing a non-contact IC built-in paper.

  Since this invention is the above structure, there exist the following effects.

  That is, according to the first aspect of the present invention, in the non-contact IC built-in paper in which the non-contact type IC inlet provided with the IC chip and the antenna is built in the print / copy medium, the print / copy medium is It consists of a three-layer structure consisting of an intermediate layer and front and back layers provided on the front and back surfaces. The intermediate layer is a cardboard mainly composed of pulp fibers, and has a planar shape that maximizes the outer periphery of the antenna at a predetermined position. A non-contact type IC inlet is placed in the hole so that the corresponding or slightly larger through hole is engraved, the IC chip faces the surface side of the intermediate layer, and the antenna fits in the hole. The back layer is mainly composed of pulp fiber, and is a thin paper with an adhesive layer formed on one side in advance, and is adhered to the front and back surfaces of the cardboard with the holes engraved through the adhesive layer. IC in The part (internal part) where the lid is built-in is also flat and smooth, so it has excellent stackability and transportability, and can be printed and copied on this part, and the built-in IC inlet is not visible from the outside. Since it cannot be recognized by touch, it can be a non-contact IC built-in paper with high security.

  Further, the hole engraved in the thick paper as the intermediate layer has a height corresponding to the thickness of the intermediate layer, so that a gap is generated between the surface layer and the antenna, and the thin paper in which the antenna is the surface layer. Therefore, it is possible to obtain a non-contact IC built-in paper having an effect of improving the high frequency characteristics.

  Further, according to the invention according to claim 2, the cardboard constituting the intermediate layer of the three-layer structure is made of a bulky non-coated paper, so that lightness and flexibility are increased, and is generated in a conveyance system between rollers. Distortion and wrinkles are prevented, and the burden on the transport system can be reduced.

According to the invention of claim 3, the adhesive applied to the thin paper constituting the front and back layers of the three-layer structure is a pressure-sensitive adhesive (also referred to as an adhesive), whereby the intermediate layer is It can be easily laminated with cardboard and can be made into non-contact IC inlet built-in paper without wrinkles or curls. When passed between rollers, natural glue such as starch paste or thermoplastic adhesive Compared with agents and the like, it does not become crisp and flexible, so it can be a non-contact IC built-in paper in which bending between rollers is smooth and does not wrinkle.

According to the fourth aspect of the present invention, in the method for producing a non-contact IC built-in paper in which a non-contact type IC inlet having an IC chip and an antenna is built in a printing / copying medium, The copy medium is composed of an intermediate layer and a three-layer structure of a front layer and a back layer provided on the front and back surfaces. The intermediate layer is a cardboard mainly composed of pulp fibers, and the outer periphery of the antenna is maximized at a predetermined position. According to the shape of the plane to be engraved or a slightly larger through hole,
The front layer and the back layer are thin papers mainly composed of pulp fibers, and an adhesive layer is formed in advance on one side thereof, and the back layer is a cardboard on which the hole is formed on the surface on which the adhesive layer is formed. The non-contact type IC inlet is placed so that the IC chip and the antenna are on the upper surface, and the surface layer is formed on the surface of the cardboard where the adhesive layer is formed and the hole is engraved. Adhesion to the IC makes the part containing the IC inlet (internal part) flat and smooth, so it has excellent stackability and transportability, and can be printed and copied in this part. Since the IC inlet is not visually recognized from the outside (cannot be recognized by touch), it can be a method for manufacturing a non-contact IC built-in paper with high security.

  Furthermore, according to the invention according to claim 4, a gap is formed between the surface layer and the antenna by the hole formed in the thick paper as the intermediate layer, and the thin paper in which the antenna is the surface layer. Therefore, it is possible to provide a method for manufacturing a non-contact IC built-in paper having an effect of improving the high frequency characteristics.

  Further, according to the invention according to claim 5, the thick paper constituting the intermediate layer of the three-layer structure is made of bulky non-coated paper, so that lightness and flexibility are increased, and a conveyance system between the rollers. Thus, a non-contact IC built-in paper manufacturing method that prevents distortions and wrinkles generated by the above-described method and reduces the burden on the conveyance system can be obtained.

  Furthermore, according to the invention according to claim 6, the adhesive layer formed in advance on the thin paper constituting the front and back layers of the three-layer structure is a pressure-sensitive adhesive (also referred to as an adhesive). It can be used as a method for producing non-contact IC inlet built-in paper that is easy to bond with the thick paper constituting the intermediate layer and does not have paper wrinkles or curls. Compared to an adhesive, a thermoplastic adhesive, or the like, the pliability is increased, so that it is possible to provide a method for manufacturing a non-contact IC built-in paper in which bending between rollers is not smooth and wrinkled.

  The best mode for carrying out the present invention will be described below in detail with reference to the drawings.

  FIG. 1 is a plan view showing an example of a non-contact type IC inlet constituting the non-contact IC built-in paper of the present invention, and FIG. 2 is a side sectional view showing an example of the non-contact IC built-in paper of the present invention. FIG. FIG. 3 shows an example of the front and back layers constituting the non-contact IC built-in paper of the present invention, and FIG. 4 shows an example of the manufacturing process of the non-contact IC built-in paper of the present invention. is there.

The present invention, for example, on an insulating organic substrate sheet (30) as shown in the plan view of FIG. 1 (a) and the cross-sectional view of FIG. A non-contact type IC inlet (1) including an RFID IC module (20) storing unique identification information and a coiled antenna (10) for transmitting and receiving the identification information is, for example, shown in FIG. As shown in the side sectional view, the present invention relates to a non-contact IC built-in paper (2) built in a sheet-like print / copy medium (40) and a method for manufacturing the same.

  In the invention according to claim 1, for example, as shown in FIG. 2, the printing / copying medium (40) includes an intermediate layer (41), a surface layer (42) provided on the surface thereof, and a back layer provided on the back surface ( 43).

  The intermediate layer (41) is made of thick paper mainly composed of pulp fibers, and has a through-opening corresponding to the size of the outer periphery in plan view of the antenna (10) on the base sheet (30). A portion (44) is engraved, and a non-contact type IC inlet (1) with an RFID IC chip (20) facing upward is fitted into the opening (44). .

  At that time, the IC chip (20) faces the upper surface, that is, the surface side so that the antenna (10) and the thin paper constituting the surface layer (42) are separated from each other at a distance, so that the antenna (10) can be received in the opening (44). Preferably, the antenna (10) is arranged to fit in the opening (44).

  Further, the surface layer (42) and the back surface layer (43) constituting the printing / copying medium (40) are thin paper mainly composed of pulp fibers, and an adhesive layer (46) is formed in advance on one side thereof, The adhesive layer (46) is bonded to the front and back surfaces of cardboard, which is the intermediate layer (41) in which the opening (44) is engraved, and is fitted into the opening (44). This is a non-contact IC built-in paper (2) that conceals and protects the IC inlet (1).

  Thus, the non-contact type IC inlet (1) is fitted into the opening (44) engraved in the intermediate layer (41) made of cardboard with the RFID IC chip (20) facing up, Since the front and back surfaces are covered with the front and back layers (42, 43) made of thin paper from the top through the adhesive layer (46) formed in advance, flat and smooth printing / copying Paper (2) with built-in non-contact IC can be obtained, and it is rich in paper stacking on the machine. Moreover, because it has transportability including paper separation by rollers, paper jamming does not occur. Therefore, it can be used as paper for general printing and copying machines, and can be printed and copied on both the front and back sides of the non-contact type IC inlet (1). Put a sticker etc. And a non-contact IC built sheet (2) which can be.

  Further, since the built-in non-contact type IC inlet (1) is covered with the front and back layers (42, 43) made of thin paper, the presence of the IC inlet (1) can be visually recognized from the outside. Since there is no unevenness, the location cannot be recognized even with the touch, so that the non-contact IC built-in paper (2) excellent in security (including tampering and replacement of the IC inlet) can be obtained.

  Furthermore, as shown in FIG. 2, an intermediate layer is formed between the thin paper as the surface layer (42) and the antenna (10) by the opening (44) engraved in the thick paper as the intermediate layer (41). Since the air gap (48) having a height due to the thickness of (41) is generated, the antenna (10) does not directly touch the thin paper as the surface layer (42), and therefore the non-contact IC built-in paper (2) having excellent high frequency characteristics. It can be.

In the invention according to claim 2, for example, as shown in FIG. 2, a thick paper as an intermediate layer (41) of a printing / copying medium (40) having a three-layer structure is used instead of, for example, general high-quality paper. The bulky non-coated paper is a relatively light non-coated paper having a thickness of 200 μm, a density of 0.72 g / m ³ , and a basis weight of about 143 g / m ^2. Specifically, T0K paper manufactured by Kishu Paper Co., Ltd. can be suitably used.

  Thus, by using a bulky non-coated paper for the intermediate layer (41), the entire paper is given lightness and flexibility, and it is applied to the paper transport system such as paper handling by a roller and soft bending between rollers. It is possible to obtain a non-contact IC built-in paper (2) that reduces the burden and eliminates a conveyance trouble.

The engraving of the opening (44) of the bulky uncoated paper (thick paper) constituting the intermediate layer (41) can be performed by, for example, a laser processing method. For the laser processing, CO in the infrared region is used. ₂ lasers (wavelength 9.3 to 10.6 μm), YAG laser (fundamental wavelength 1.06 μm), YAG, YLF, YAP lasers in the ultraviolet region (third harmonic wavelength 355 nm, fourth harmonic wavelength 266 nm) ) And excimer laser (XeCl wavelength: 308 nm, KrF wavelength: 248 nm, ArF wavelength: 193 nm) can be cited as the laser light of the processing machine. Yes, the latter laser processing using the wavelength in the ultraviolet region is photolytic processing using photochemical reaction, and any of the above processing methods can be used. Kill.

  As another method of engraving the opening (44), it can be obtained by a punching die having a punching blade corresponding to the periphery of the opening (44).

Further, as the thin paper constituting the front and back layers (42, 43) of the printing / copying medium (40) shown in FIG. 2, the printing / copying suitability on the surface opposite to the surface on which the adhesive layer (46) is formed in advance. If there is, there is no particular limitation, but, for example, high-quality paper having a basis weight of 52.3 g / m ² (thickness 80 μm) is preferably used because it is applied to a general printing / copier, In addition, it is also possible to use coated paper of the same thickness, or even paper coated with a functional agent on high-quality paper.

  Furthermore, in the invention according to claim 3, for example, as shown in FIG. 2, the adhesive layer (46) applied to the front surface layer (42) and the back surface layer (43) is replaced with a pressure-sensitive adhesive (adhesive). Agent).

  In this way, when the adhesive layer (46) is made of a pressure-sensitive adhesive, when the thin paper is bonded to the front and back surfaces of the thick paper as the intermediate layer (41), for example, as shown in the side sectional view of FIG. While peeling the release paper (50) coated with silicon from the adhesive layer (46) provided in advance on the front surface layer (42) or the back surface layer (not shown), the adhesive layer ( 46) The surface is bonded to the front and back surfaces of the cardboard, and it is simple and easy, and it is possible to prevent paper wrinkles and the like from being generated on the front surface layer and the back surface layer when the paper is bonded. That is, after applying adhesive to the intermediate layer just before bonding, or after applying adhesive to one side of the thin paper, if the thick paper that is the intermediate layer and the thin paper that is the front and back layers are bonded together, wrinkles will occur on the thin paper It was easy to do. However, in the present invention, wrinkling does not occur because the bonding is performed via an adhesive layer formed in advance on thin paper.

  In addition, by using non-contact IC built-in paper (2) bonded with an adhesive layer (46) made of an adhesive, ordinary starch paste and thermoplasticity when passed between rollers of printing and copying machines, etc. Compared to resin adhesives and the like, it has flexibility that does not burr, so it has excellent transportability between rollers and has the effect of preventing wrinkles and distortion.

The pressure-sensitive adhesives (adhesives) are classified into solvent type, water-based emulsion type, and hot melt type (solvent-free type). The solvent type is mainly composed of natural rubber and synthetic rubber including block copolymer system. And rosin and its esters, tackifier resins such as terpene resins, softeners such as phthalate esters and phosphate esters dissolved in solvents such as toluene and N-hexane,
Or an acrylic resin mainly composed of polyacrylate obtained by radical polymerization in a solvent mainly composed of ethyl acetate or toluene, rosin and its ester, tackifier resin such as terpene resin, phthalate ester, phosphate ester And the like, and those made of a curing agent such as a diisocyanate or aziridinyl group compound.

  In addition, as an aqueous emulsion type, an acrylic resin mainly composed of polyacrylic acid ester obtained by emulsion polymerization in water is an emulsion composed of an additive such as an antifoaming agent, a leveling agent, a thickener dispersion, etc. In addition, the hot melt type (solvent-free type) is mainly composed of an ethylene-vinyl acetate copolymer. The above solvent type, aqueous emulsion type, hot melt type (solvent-free type) Any of these can be used, and among them, an adhesive layer (46) using a water-based emulsion-type pressure-sensitive adhesive having an acrylic resin as a main resin is more preferable in terms of flexibility between rollers, and the environment. It is a more advantageous pressure-sensitive adhesive from the viewpoint of dealing with problems, safety, and economy.

  The above-mentioned pressure-sensitive adhesive, particularly the water-based emulsion type pressure-sensitive adhesive layer (42, 43), can be applied directly to the thin paper, but it can penetrate into the thin paper and wrinkle the paper. Therefore, for example, a reverse coater or a die coater is applied to release paper coated with silicon, and after drying, the coated film is reverse pressure-bonded to thin paper as the front and back layers (42, 43) ( The adhesive layer (46) having a uniform thickness can be obtained by a transfer method.

  The non-contact type IC inlet (1) built in the printing / copying medium (40) includes an insulating organic base sheet (30) as shown in FIGS. 1 (a) and 1 (b), for example. An RFID IC module (20) storing unique identification information on the front surface thereof and an antenna coil (10) for transmitting and receiving the identification information are disposed (however, the jumper wire (10a) for connecting the terminal of the antenna coil is on the back surface) As the organic base sheet (30), a tough film such as polyethylene terephthalate (PET), polyethylene naphthalate (PEN) or polyimide having a thickness (D) of about 50 μm is used. It is done.

  As the antenna coil (10) constituting the non-contact type IC inlet (1), a metal foil such as copper or aluminum laminated on an organic base sheet (30) made of PET or the like is etched. Alternatively, it can be obtained by screen printing with a conductive paste on a base material sheet (30) made of an organic material such as PET or paper. The planar shape of the antenna is not limited to a coil shape, and may be, for example, a loop type as shown in FIG. 1A or a dipole type (not shown).

  Furthermore, the thickness (H) of the RFID IC chip (20) constituting the non-contact type IC inlet (1) is preferably the same as or slightly smaller than the thickness of the intermediate layer (41) which is a cardboard, Specifically, a paper having a value of about 200 μm, which is the same as the thickness of the bulky uncoated paper forming the intermediate layer (41), or a value slightly smaller than that is preferably used. Recently, since a considerably thin IC chip has come to appear, a thin intermediate layer (41) is used depending on the thickness, so that the thickness of the intermediate layer (41) is particularly limited. Not what you want.

  Further, the invention according to claim 4 is, for example, a non-contact type IC having an IC chip (20) and an antenna (10) on an insulating base sheet (30) as shown in FIG. A method of manufacturing a non-contact IC built-in paper (2) built in a print / copy medium (40) by an inlet (1), wherein the print / copy medium (40) is an intermediate layer (41) and its front and back surfaces. The intermediate layer (41) is made of cardboard mainly composed of pulp fibers, and is formed on the base sheet (30) at a predetermined position. An opening (44) corresponding to a size that maximizes the outer periphery of the antenna (10) is engraved.

  On the other hand, the front and back layers (42, 43) are made of thin paper mainly composed of pulp fibers, and an adhesive layer (46) is applied to one side thereof, and the adhesive layer (46) of the back layer (43) is provided. ) Surface is adhered to the back surface of the intermediate layer (41), and then the IC chip (20) and the antenna (10) on the base sheet (30) from the upper opening (44) engraved in the intermediate layer (41). The non-contact type IC inlet (1) is inserted so that the upper surface is on the upper surface, and the opening (44) is a thin paper which is the surface layer (42) on which the adhesive layer (46) is applied. The non-contact IC built-in paper (1) is made to cover the built-in non-contact type IC inlet (1).

  Specific examples of the present invention will be described below.

As shown in the front view of FIG. 4, the intermediate layer (41) constituting the printing / copying medium has an A-4 size and a basis weight of 142.3 g / m ² (density 0.72 g / cm ³ , thickness 200 μm). Bulky uncoated paper: TOK paper (manufactured by Kishu Paper Co., Ltd.) is used. Specifically, the opening is 5 × 65 mm at a predetermined position, 115 mm in the X direction from the left end surface and 20 mm in the Y direction from the lower end surface. Part (44) was formed.

On the other hand, high-quality paper having a basis weight of 52.3 g / m ² (thickness of 80 μm) as shown in FIG. 3: CWF45S (manufactured by Oji Paper Co., Ltd.) is used as front and back layers (42, 43), and acrylic formed in advance on one side A tack paper (55) having an adhesive layer (46) made of an aqueous emulsion-type pressure-sensitive adhesive mainly composed of a resin and having the adhesive layer (46) surface protected with a release paper (50) was prepared.

  Subsequently, the release paper (50) is peeled from the tack paper (55) prepared above, and the adhesive layer (46) surface of the back surface layer (43) is obtained as shown in FIG. It was made to adhere to the back surface of the obtained intermediate | middle layer (41), pressing.

Subsequently, as shown in FIG. 2, a non-contact type IC inlet (1) is inserted into an RFID IC chip (20 mm) having a height of 0.198 mm from an opening (44) formed in the intermediate layer (41). ) With the top facing up, that is, with the top (front) side facing. At this time, the antenna (10) is accommodated in the opening (44), and the antenna (10) is removed from the IC chip (20) so that a gap (48) is formed between the antenna and the thin paper as the surface layer (42). It inserted so that it might become downward.

Subsequently, using the tack paper (55) obtained above, the surface layer (42) is formed on the surface of the cardboard as the intermediate layer (41) through the adhesive layer (46) while peeling the release paper (50). A-4 size non-contact IC built-in paper (2) was obtained by concealing the built-in IC inlet (1).

  When a plurality of non-contact IC built-in sheets (2) obtained in Example 1 above are stacked on a common copying machine (dry toner transfer system) tray and copied one by one using the copying machine, the stacked sheets The stackability was good, and there was no particular problem with the transportability in copying (no jamming occurred), and a good copy could be obtained.

  Therefore, as an example of utilizing the non-contact IC built-in paper according to the present invention, the recording / reproduction of unique identification information and the security (printing / reprinting impossible) of the printed / copied material of this paper are enhanced, and There are uses such as system construction for various management.

1 shows an example of an IC inlet used for a non-contact IC built-in paper of the present invention, in which (a) is a plan view thereof, and (b) is a cross-sectional view taken along a line B-B of a). FIG. It is explanatory drawing showing the example of the non-contact IC built-in paper of this invention with the side cross section. It is a sectional side view which shows an example of the tack paper used in the manufacturing process of the non-contact IC built-in paper of this invention. It is a top view explaining an example of the manufacturing process of the non-contact IC built-in paper of the present invention. An example of the conventional booklet with non-contact IC is shown, (a) is an enlarged view showing the side cross section, (b) is the perspective view. It is explanatory drawing which represented the example of the non-contact IC card in which the conventional non-contact type IC inlet was incorporated in the side cross section. An example of the conventional non-contact type paper with an IC inlet is shown. (A) is a side sectional view in which an IC inlet is incorporated, and (b) is a side sectional view in which an IC tag is attached. FIG.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 ... Non-contact type IC inlet 2 ... Non-contact IC built-in paper 3a ... 1st base material sheet 3b ... 2nd base material sheet 5 ... Non-contact IC card 6 ... Non-contact type data carrier 9 ... Adhesive layer 10 ... Antenna 10a ... Jump line 12 ... IC tag 13 ... Back cover 14 ... Text paper 14A ... Front base material 14B ... Back base material 16 ... Adhesive layer 17 ... ...... Printing medium 20 ...... RFID IC chip 30 ...... Substrate sheet 40 ...... Printing / copying medium 41 ...... Intermediate layer 42 ...... Surface layer 43 ...... Back layer 44 ...... Opening 46 ...... Adhesive layer 48 ... Air gap 50 ... Release paper 55 ... Tack paper H ... IC chip height D ... Base sheet thickness

Claims (6)

A non-contact type IC built-in paper in which a non-contact type IC inlet having an IC chip and an antenna is built in a print / copy medium, the print / copy medium being an intermediate layer and a surface layer provided on the front and back surfaces thereof And a three-layer structure of the back layer,
The intermediate layer is a thick paper mainly composed of pulp fibers, and a predetermined large hole is engraved in a predetermined position according to the planar shape that maximizes the outer periphery of the antenna,
A non-contact type IC inlet is placed in the hole so that the IC chip faces the surface side of the intermediate layer and the antenna fits in the hole,
The front and back layers are mainly made of pulp fiber, and are thin paper preliminarily formed with an adhesive layer on one side, and are bonded to the front and back surfaces of cardboard with the holes engraved through the adhesive layer. Non-contact IC built-in paper characterized by the above.   The non-contact IC built-in paper according to claim 1, wherein the thick paper constituting the intermediate layer is a bulky non-coated paper.   The non-contact IC built-in paper according to any one of claims 1 to 2, wherein the adhesive layer applied to the thin paper constituting the front and back layers is a pressure-sensitive adhesive. A non-contact IC built-in paper manufacturing method in which a non-contact type IC inlet having an IC chip and an antenna is built in a print / copy medium, wherein the print / copy medium is provided on an intermediate layer and its front and back surfaces Composed of a three-layer structure of a surface layer and a back layer,
The intermediate layer is a cardboard mainly composed of pulp fiber, and a predetermined large hole according to a planar shape that maximizes the outer periphery of the antenna or a slightly larger through hole is engraved,
The front layer and the back layer are thin papers mainly composed of pulp fibers, and an adhesive layer is formed in advance on one side thereof, and the back layer is a cardboard on which the hole is formed on the surface on which the adhesive layer is formed. Adhere to the back of the
A non-contact type IC inlet is placed so that the IC chip and the antenna are on the upper surface,
A method for producing a non-contact IC built-in paper, characterized in that the surface layer is adhered to the surface of a cardboard on which the hole is engraved.   5. The method for producing a non-contact IC built-in paper according to claim 4, wherein the thick paper constituting the intermediate layer is a bulky non-coated paper.   6. The method for producing a non-contact IC built-in paper according to claim 4, wherein the adhesive layer applied to the thin paper constituting the front and back layers is a pressure-sensitive adhesive.

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