JP2009205338A - Method of manufacturing dual interface ic card and dual interface ic card - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a method of manufacturing a dual interface IC card which is excellent in designability by stabilizing the joint between a card base material and an external connection terminal substrate. <P>SOLUTION: This method of manufacturing a dual interface IC card includes at least: a step (1) of mounting an IC chip on an antenna sheet having an antenna circuit as an inlet; a step (2) of embedding the inlet in a card substrate to form a laminate; a step (3) of forming a concave section having a convex section with the surface of the laminate as an upper face inside for embedding and fitting an external connection terminal substrate without IC having an opening in a region avoiding a terminal region determined by ISO/IEC7816-2 by trimming in the laminate; a step (4) of exposing the second connection pattern group of the antenna circuit on the bottom face of the concave section; and a step (5) of embedding and fixing and electrically connecting and fixing the external connection terminal substrate without IC having the opening into the concave section so as to be fitted to the convex section. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention relates to a method for manufacturing a dual interface IC card and a dual interface IC card that can exchange information with the outside in a contact and non-contact manner with a single IC chip.

  In recent years, there is an increasing demand for products having both functions of a contact IC card and a non-contact IC card, and an IC chip having both functions for this card is being developed and commercialized. Here, as one form of commercialization in an IC card using this IC chip, an IC chip is mounted on an antenna sheet, and an antenna circuit (coil) is arranged on the antenna sheet for a non-contact card function, For the contact card function, an IC non-mounting external connection terminal board that can guarantee the position of the external connection terminal defined in ISO / IEC7816-2 is provided, and a connection land is provided on the IC non-mounting external connection terminal board to electrically connect to the antenna sheet. A technology has been developed to connect to a dual interface IC card.

  Patent Document 1 discloses a dual interface IC card (contact-type non-contact type shared IC card) and a manufacturing method thereof. Here, the antenna coil and the antenna coil connection terminal are cut so that the antenna coil connection terminal is exposed on the card base in which the antenna coil is embedded, and a two-step recess is provided at a depth where the IC module can be embedded. A board to be an external device connection terminal mounted is fitted and mounted in the recess, and the IC module side antenna coil connection terminal and the card base antenna coil connection terminal are electrically connected and integrated. .

  However, even in a method other than the manufacturing method disclosed in Patent Document 1, in the conventional dual interface IC card, an IC chip is directly mounted on a substrate serving as an external device connection terminal, or disclosed in Patent Document 2. As shown, the IC chip is often mounted at the position of the card base corresponding to the substantially central portion on the back side of the tab substrate that is the external device connection terminal on which no IC is mounted. Since the chips are mounted adjacent to each other, it is difficult to consider providing an opening in the substrate itself. In addition, when the IC module is installed in another position, the reliability of the planar connection between the tab substrate that is the external device connection terminal and the card body is improved, and problems such as peeling and warping deformation of the card surface are suppressed. The actual situation is that it is difficult to select the bonding method and the bonding material for this purpose.

On the other hand, the position and size of the external connection terminal are standardized by the ISO / IEC7816-2 in both the contact type IC card and the dual interface IC card, and it is difficult to differentiate except by changing the design of the external connection terminal. Further, the shape of the IC module is almost rectangular or elliptical, and there are many simple designs, and there are few degrees of freedom in design.
JP 2000-182017 A Japanese Patent Laid-Open No. 2004-13855

The present invention solves the problems of the prior art, and an object of the present invention is to provide a dual interface IC card having a stable bonding between the card base and the external connection terminal board and having an excellent design. The manufacturing method of this is provided.

The invention according to claim 1 of the present invention includes an external connection terminal board on which no IC is mounted, and a dual IC card manufacturing method having a contact and non-contact interface function in one chip, including at least the following steps: And it is a manufacturing method of the dual interface IC card characterized by manufacturing in order of this process.
(1) An antenna sheet having an antenna circuit by electrically connecting an IC chip having both a contact type and a non-contact type function to a first connection pattern group corresponding to a connection land of the IC chip of the antenna circuit. The process of mounting on top to make an inlet.
(2) A step of sandwiching the inlet into an insulating card base material and hot pressing to embed the inlet in the card base material to form a laminate.
(3) An inner side for embedding and fitting an IC non-mounting external connection terminal board having an opening in an area avoiding a terminal area defined in ISO / IEC7816-2 by milling (counterbore) processing on the laminate. Forming a concave portion having a convex portion (non-milled portion) having the laminate surface as an upper surface.
(4) A step of exposing the second connection pattern group of the antenna circuit for connecting to the connection land of the IC non-mounting external connection terminal board on the bottom surface of the recess.
(5) An IC non-mounting external connection terminal board having the opening is embedded and fixed in the concave portion by a bonding means such as an adhesive in such a manner that the opening is fitted with the convex portion. Electrically connecting and fixing the second connection pattern group of the antenna circuit corresponding to the connection land.

  Next, in the invention according to claim 2 of the present invention, plating is performed on a convex portion (non-milling processed portion) having the laminate surface as an upper surface, which is fitted into the opening portion of the IC non-mounting external connection terminal substrate having the opening. The dual interface IC card manufactured by the manufacturing method according to claim 1, wherein the design is displayed by printing or the like.

  According to the method for manufacturing a dual interface IC card of the present invention, an IC non-mounting external connection terminal board having an opening is formed into a recess that is milled by a bonding means such as an adhesive in such a manner that the opening is fitted with the protrusion. Because it is embedded and fixed, the connection between the card base and the external connection terminal board is three-dimensional with respect to the conventional planar adhesion, so the external connection terminal board is stable due to card warpage and expansion / contraction due to temperature changes. Thus, a dual interface IC card that is less likely to cause defects such as peeling and has a stable joint can be obtained.

  In addition, according to the dual interface IC card of the present invention, printing or the like is performed on the convex portion (non-milling processed portion) having the upper surface of the laminated body fitted into the opening portion of the IC non-mounting external connection terminal substrate having an opening. It is possible to display an IC card with a degree of freedom in design. The non-IC external connection terminal board can be cut out except for the area defined by ISO / IEC7816-2. For this reason, the shape of the external connection terminal board itself is a design. In other words, the design of the shape of the opening can be given, and the superiority of the design can be imparted even with a plain appearance such as normal gold plating.

Furthermore, the design of the opening at the center of the external connection terminal board using the dual interface IC card of the present invention cannot be realized with a contact type IC card. In the contact type IC card, since the IC chip is always mounted on the back surface of the center of the terminal board, the center of the board cannot be cut out. Therefore, the card having the design of the present invention is differentiated from a general contact type IC card, and can appeal that it is a dual interface IC card, that is, a high function IC card.

  A method for manufacturing a dual interface IC card of the present invention will be described below based on an embodiment.

  FIG. 1 is a schematic diagram illustrating the configuration of an inlet used in the process of an embodiment of a method for manufacturing a dual interface IC card of the present invention. First, an IC chip 6 having both a contact type and a non-contact type function in one chip corresponds to the IC chip connection land of the antenna circuit 2 provided on the antenna sheet 1 as shown in FIG. 1 is connected to the connection pattern group 3 and mounted on the antenna sheet 1 to form an inlet 5.

  After bonding a 15-50 μm thick copper foil or aluminum foil to an insulating film made of PEN (polyethylene naphthalate), PET (polyethylene terephthalate) or PI (polyimide) with a thickness of 15-50 μm via an adhesive layer Then, an antenna sheet having an antenna circuit pattern arranged and formed by an etching method is prepared. The antenna circuit 2 on the antenna sheet 1 has a first connection pattern group 3 for connection to a connection land (pad) of the IC chip 6 and a connection land of an IC non-mounted external connection terminal board. A second connection pattern group 4 is provided. As shown in the schematic cross-sectional view of FIG. 1B, the IC chip 6 has an anisotropy between the first connection pattern group of the antenna circuit and the bumps provided on the connection lands (pads) of the IC chip. An antenna 5 is mounted face-down on the antenna sheet 1 with an electrically conductive adhesive sheet (ACF) 7 interposed therebetween to form an inlet 5.

  Next, the inlet 5 is sandwiched between the insulating card base material 8 and hot-pressed to embed the inlet in the card base material to obtain a laminate 9 having a thickness of about 0.8 mm. FIG. 2 (a) is a schematic diagram showing a cross-sectional view of components before hot pressing in an embodiment of the method for manufacturing a dual interface IC card of the present invention, and FIG. 2 (b) is a laminate after hot pressing / laminating. FIG.

  An example of an insulating card base material constituting the dual interface IC card of the present invention includes an insulating card base material and an inlet composed of a first surface sheet and a first core sheet in order from the upper side (not shown). The insulating card base material composed of the second core sheet and the second surface sheet is sandwiched. Usually, the first and second core sheets sandwiched between the inlets are sandwiched between front and back first and second surface sheets that have been subjected to offset printing or screen printing with multiple impositions, respectively, and hot pressed to form a laminate. Card base.

  The first surface sheet is preferably made of PET (biaxially stretched polyethylene terephthalate) as the material, and may have a rewrite layer as the outermost layer. The material of the second surface sheet is preferably PET having the same thickness as that of the first surface sheet in order to avoid curling of the card. As the first core sheet, an electrically insulating thermoplastic resin sheet can be used. Generally, a hard vinyl chloride (PVC) sheet is used. However, as an alternative to PVC that generates toxic gas during incineration, non-crystalline polyester (for example, Eastsr PET-G manufactured by Eastman Chemical Company: terephthalic acid, glycol) 1,4 cyclohexanedimethanol copolymer) and the like can be preferably used. The material of the second core sheet is the same as that of the first core sheet because of heat-fusibility. With the configuration described above, the sheets are laminated so that the total thickness of the card after hot pressing is 0.68 to 0.84 mm. Here, the first and second core sheets are not limited to a single layer in relation to the height of the IC chip portion or other constituent materials, and may be a plurality of layers. Although not shown, there is no particular limitation on the interposition of the adhesive resin layer or the treatment of the interface for assisting the heat-fusability and adhesion between the top sheet and the core sheet.

  Next, the laminate 9 is cut into a card size. Thereafter, an IC non-mounting external connection terminal board 13 having an opening (A) 14 is embedded and fitted to each card by milling (counterbore) processing to avoid the terminal area defined in ISO / IEC7816-2. For this purpose, a concave portion 12 having a convex portion (non-milled portion) 11 having the laminate surface as an upper surface is formed on the inner side, and further, as shown in FIG. The second connection pattern group of the antenna circuit for connecting to the connection land of the substrate is exposed.

  In one embodiment of the manufacturing method of the present invention, a single-sided board is used as the external connection terminal board 13 on which no IC is mounted. FIG. 4 shows a schematic view of the IC non-mounted external connection terminal board 13. (A) is a schematic cross-sectional view, and (b) is a schematic surface view. The single-sided substrate is a conductor in which one side of the glass epoxy base 16 is based on a copper foil, and the surface thereof has Ni (nickel) plating of 1-2 μm and Au (gold) plating of 0.2-0.3 μm. A plurality of external connection terminals 17 are formed. An opening (B) 15 for enabling electrical connection with the second connection pattern group of the antenna sheet is provided at a position corresponding to the external connection terminal of the glass epoxy substrate corresponding to each external terminal. The connection land 21 on the bottom surface of the opening (B) 15 is also plated with Ni and Au. As a point of the present invention, as shown in FIG. 4 (b), the substrate is avoided by avoiding the terminal area 20 defined in ISO / IEC7816-2, and an opening ( A) 14 is provided. The opening (A) may be a rectangle, an ellipse, or a special design shape such as a star or an arrow.

  Next, a hot-melt adhesive 19 such as a hot-melt sheet is temporarily fixed at predetermined positions on the outer periphery and the lower surface of the IC non-mounted external connection terminal board 13 so that the second connection pattern group 4 of the antenna sheet and the IC non-connecting The connection element of the mounting external connection terminal board 13 with the connection land 21 is a solder paste or a conductive adhesive 18 such as a silver-based conductive resin, and the non-IC mounting external connection terminal board is a card base laminate. It arrange | positions in a predetermined | prescribed recessed part. Pressurize and heat from the external connection terminal surface of the IC non-mounted external connection terminal board, melt the cream solder as the conductive adhesive 18 or cure the silver conductive resin, and provide the IC non-mount external connection terminal board The connection land 21 and the second connection pattern group of the antenna sheet are electrically joined together, and the hot-melt adhesive 19 is melt-bonded, and as shown in a schematic cross-sectional view of FIG. The mounting external connection terminal board is embedded and fixed in the recess so that the opening fits with the projection. As described above, the dual interface IC card having the IC non-mounted external connection terminal board of the present invention is manufactured through the steps described above.

  Each card is subjected to various optional processes such as holograms, diffraction gratings, etc., or a rewrite function, as in the conventional case. Also, 0th-order issuance and primary issuance such as IC initialization and security information setting and generation of necessary data files are performed. In addition, inspection based on the function of exchanging information with the outside and various standard physical properties is performed, and the apparatus becomes ready for use. Further, the small card produced as described above is packed, transported, and shipped to the customer side. Finally, as a secondary issue (personalization) using an issuing machine according to the card specifications, individual information is put on the surface of the card together with the IC encoding. Examples of processing contents in the card issuing machine include monochrome printing (UG), color printing (photo CP), and overcoat. FIG. 6A is an explanatory diagram of an external appearance of an example of the dual interface IC card of the present invention, and FIG. 6B is an explanatory diagram of an example of the opening shape of the external connection terminal portion, that is, the convex shape of the card base. The card of the present invention, which can be designed and displayed on the external connection terminal portion, is given fashionability simultaneously with the stability of the adhesion function of the external connection terminal.

Schematic explaining the structure of the inlet used at the process of one Embodiment of the manufacturing method of the dual interface IC card of this invention. BRIEF DESCRIPTION OF THE DRAWINGS Schematic which shows in cross section the structural member before hot press in 1 embodiment of the manufacturing method of this invention, and the laminated body after hot press lamination. Schematic explaining the milling process state in one Embodiment of the manufacturing method of this invention with a plane and a cross section. The schematic diagram of the IC non-mounting external connection terminal board in one embodiment of the manufacturing method of the present invention. The cross-sectional schematic explaining the state by which IC non-mounting external connection terminal board was embed | buried and fixed to the recessed part in one Embodiment of the manufacturing method of this invention. Explanatory drawing of the external appearance of an example of the dual interface IC card of this invention, and the example of a shape of an external connection terminal part.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 ... Antenna sheet 2 ... Antenna circuit 3 ... 1st connection pattern group 4 ... 2nd connection pattern group 5 ... Inlet 6 ... IC chip 7 ... ACF
DESCRIPTION OF SYMBOLS 8 ... Card base material 9 ... Laminated body 10 ... (Small) Card base 11 ... Convex part 12 ... Concave part 13 ... IC non-mounting external connection terminal board 14 ... Opening Part (A) 15 ... Opening (B)
DESCRIPTION OF SYMBOLS 16 ... Glass epoxy base material 17 ... External connection terminal 18 ... Conductive adhesive 19 ... Hot-melt adhesive 20 ... ISO / IEC7816-2 regulation terminal area | region 21 ... Connection land

Claims (2)

A method of manufacturing a dual IC card having an external connection terminal board on which no IC is mounted and having a contact and non-contact interface function on a single chip, including at least the following steps and manufacturing in the order of these steps: To manufacture a dual interface IC card.
(1) An antenna sheet having an antenna circuit by electrically connecting an IC chip having both a contact type and a non-contact type function to a first connection pattern group corresponding to a connection land of the IC chip of the antenna circuit. The process of mounting on top to make an inlet.
(2) A step of sandwiching the inlet in an insulating card base material and hot pressing it to embed it in the card base material to form a laminate.
(3) An inner side for embedding and fitting an IC non-mounting external connection terminal board having an opening in an area avoiding a terminal area defined in ISO / IEC7816-2 by milling (counterbore) processing on the laminate. Forming a concave portion having a convex portion (non-milled portion) having the laminate surface as an upper surface.
(4) A step of exposing the second connection pattern group of the antenna circuit for connecting to the connection land of the IC non-mounting external connection terminal board on the bottom surface of the recess.
(5) An IC non-mounting external connection terminal board having the opening is embedded and fixed in the concave portion by bonding means such as an adhesive so that the opening is fitted with the convex portion. Electrically connecting and fixing the second connection pattern group of the antenna circuit corresponding to the connection land.   A design indication by plating, printing, or the like is provided on a convex portion (non-milled portion) having the upper surface of the laminated body fitted into the opening portion of the IC non-mounting external connection terminal board having the opening. A dual interface IC card manufactured by the manufacturing method according to claim 1.