JP5181724B2 - IC card and manufacturing method thereof - Google Patents

Description

  The present invention relates to an IC card incorporating an IC chip having functions such as a memory and a CPU, and more particularly to a non-contact type IC card incorporating an IC module (inlet) having an IC chip mounted on an antenna sheet.

  In an IC card typified by a non-contact IC card with a built-in IC chip and an antenna, conventionally, for example, in Patent Document 1, the IC chip 2 is mounted on the antenna sheet 1 on which the antenna wiring pattern 1a is formed as shown in FIG. Further, a roof-like reinforcing plate 3 having a larger area than that of the IC chip 2 is bonded to the IC chip 2 via a sealing resin. For example, the IC chip 2 is further covered with the sealing resin 6 and the antenna sheet 1 is covered. An IC module (inlet) in which the second reinforcing plate 4 is further bonded with an adhesive is formed on the surface opposite to the surface on which the IC chip 2 is mounted. The IC chip 2 is protected by the sealing resin 6 and prevents cracks on the IC card surface due to stress. This inlet is used as the center layer of the IC card, the inlet is sandwiched between the first core sheet 7 and the second core sheet 7d from both sides, and a laminate in which the exterior sheet 8 is laminated on both outer sides is made of a metal plate. An IC card was manufactured by heat-sealing by applying pressure while sandwiching and heating. Here, a hole 7e into which the IC chip 2 is fitted is formed in the first core sheet 7 in contact with the surface of the antenna sheet 1 on the mounting surface side of the IC chip 2, and the opposite side of the antenna sheet 1 is formed. Holes 7f into which the second reinforcing plate 4 is fitted are formed in the second core sheet 7d in contact with the surface, and the IC chip 2 is embedded in the holes 7e of the first core sheet 7.

The above prior art documents are shown below.
JP 2005-4429 A

  However, this conventional technique has a problem that the outer sheet 8 of the IC card is recessed at the hole 7e portion into which the IC chip 2 is fitted. In addition, when a sealing resin is provided, height variations including the sealing resin and the reinforcing plate are likely to occur. Therefore, in order to satisfy the standard of the thickness of the IC card as in ISO etc. There was a disadvantage and it was a problem. Therefore, as in the comparative example shown in FIG. 7, without covering the IC chip 2 mounted on the antenna sheet 1 with the sealing resin 6, the antenna sheet 1 and the IC chip 2 are placed in the holes 7 e of the first core sheet 7. The second core sheet 7C is brought into contact with the surface of the other antenna sheet 1, and the resin of the first core sheet 7 is melted by heating and pressurizing laminating with the metal plate 9 to provide holes. A method of eliminating the dent of the IC card by filling 7e was considered.

  However, in the case of this comparative example, as shown in FIG. 8, the air holes 7 e between the reinforcing plate 3 installed on the IC chip 2 and the first core sheet 7 are the ICs of the first core sheet 7. Before the resin on the surface on the chip 2 side flows and fills, the resin on the second core sheet 7C flows from the surface of the antenna sheet 1 on the side opposite to the mounting surface of the IC chip 2, and the holes It was found that the antenna sheet 1 was deformed so as to fill 7e. And since the deformation | transformation part of the antenna sheet | seat 1 interrupted the flow of the resin of the 1st core sheet | seat 7, the space | gap 2a remained, without fully filling the hole 7e with resin. Then, since the gap 2a remains, there is a problem that the strength of the IC card around the IC chip 2 is weakened. Further, the antenna wiring pattern 1a on the surface of the antenna sheet 1 is deformed together with the antenna sheet 1 and comes into contact with the metal reinforcing plate 3, so that the antenna characteristics are deteriorated.

  The present invention has been made in view of the above-described problems of the prior art, in which no sealing resin is provided on the IC chip, and a reinforcing plate larger than the IC chip is bonded and fixed on the IC chip. When using an inlet, there is no dent around the IC chip of the IC card, the antenna does not touch the reinforcing plate, and the antenna characteristics do not deteriorate, or there is no gap around the IC chip part below the reinforcing plate. An object is to obtain a good IC card.

The present invention provided to solve the above-described problems is an IC card in which the following (A), (B), and (C) are laminated.
(B) An IC chip is mounted on the antenna wiring pattern of the antenna sheet having the antenna wiring pattern, and the reinforcement is made of SUS, aluminum, or copper having a larger area than the IC chip on the IC chip. Inlet with the board bonded to the roof ,
(B) A core made of a copolymer obtained by copolymerizing terephthalic acid and glycol with 1,4 cyclohexanedimethanol at least on the side close to the inlet where the IC chip is mounted. A hole having a sheet layer (B) and a core sheet layer (A) made of heat-resistant PET-G having a softening temperature higher than that of the core sheet layer (B) on the side far from the inlet, into which the IC chip fits A first core sheet having
(C) A second core sheet of a thermoplastic resin having a softening temperature equivalent to that of the core sheet layer (A) on the opposite side of the inlet from the first core sheet.

  Further, the present invention provides the above IC card, wherein an exterior sheet made of a crystalline resin that does not flow at the softening temperature of the first core sheet is laminated on the outside of the first core sheet. is there.

In the present invention, an IC chip is mounted on an antenna sheet having an antenna wiring pattern, and a reinforcing plate made of SUS, aluminum, or copper having a larger area than the IC chip is formed in a roof shape on the IC chip. A core sheet layer (B) made of a copolymer obtained by copolymerizing terephthalic acid and glycol with 1,4 cyclohexanedimethanol is provided on the surface of the bonded inlet on the IC chip side and on the inlet side (inner side). The outer side has a core sheet layer (A) made of heat-resistant PET-G having a softening temperature higher than that of the core sheet layer (B), and has a hole in which the IC chip is fitted. A second core of thermoplastic resin having a softening temperature equivalent to that of the core sheet layer (A) on the surface of the inlet opposite to the IC chip. A sheet is installed, an exterior sheet is installed outside the first core sheet and the second core sheet, and laminating by heating and pressing, the core sheet layer (B) is first melted to An IC card manufacturing method comprising a step of filling holes and then melting the core sheet layer (A) and the second core sheet to bond the inlet and the exterior sheet. .

  In the antenna sheet, the mounting surface of the IC chip of the antenna sheet is in contact with a core sheet in which holes for avoiding the IC chip are formed by a core sheet of a plurality of thermoplastic resin layers having different softening temperatures. A second core sheet made of a thermoplastic resin having a softening temperature equivalent to that of the layer having a higher softening temperature is in contact with the other surface, and the IC chip is embedded without deforming the antenna sheet by laminating by heating and pressing. There is an effect that an IC card can be manufactured. Then, the resin between the antenna sheet and the IC chip is sufficiently filled with the resin so that an IC card having no gap and high mechanical strength can be obtained. Furthermore, since the opening of the core sheet can be filled stably, there is an effect that an IC card excellent in appearance quality can be obtained without generating a dent in the embedded portion of the IC chip.

The best mode for carrying out the present invention will be described below in detail with reference to the drawings. The IC card of the present invention is generally a bank card or a credit card size IC card having a thickness of 0.76 mm ± 0.08 mm.
<First Embodiment>
In the IC card of the first embodiment, as shown in the sectional view of FIG. 1A, an IC chip 2 is mounted face-down on an antenna sheet 1, and then on the IC chip 2 (the circuit surface of the IC chip 2). An inlet in which a metal reinforcing plate 3 having a larger area than the IC chip 2 is bonded and fixed is formed on the back surface side opposite to the IC chip 2. The reinforcing plate 3 is a plate that protects the IC chip 2 from being damaged by an external load such as a point pressure, and is preferably a metal plate. Here, even if the reinforcing plate 3 having the same size and shape as the IC chip 2 is accurately stacked on the IC chip 2, the role of reinforcement can be fulfilled. However, as a practical problem, it requires advanced alignment technology and expensive equipment. In general, it is considered undesirable because it leads to high costs. As a solution, a reinforcing plate 3 having a larger area than the IC chip 2 is used and mounted on the IC chip 2 even if the positioning accuracy is not so high, and a practically sufficient reinforcing effect is obtained. As a result, the eaves-like reinforcing plate 3 is installed on the upper surface of the IC chip.

  The inlet is sandwiched between a first core sheet 7 and a second core sheet 7C of thermoplastic resin having a thickness of about 0.3 mm from both sides. Then, an exterior sheet 8 having a thickness of about 0.1 mm made of a resin that does not flow at the temperature of the heat and pressure laminate is laminated on both outer surfaces. The first core sheet 7 on the IC chip 2 mounting surface side has a low heat-resistant core sheet layer 7B having a low softening temperature on the IC chip 2 mounting surface side of the inlet, and on the upper side of the core sheet layer 7B. And a high heat resistant core sheet layer 7A having a high softening temperature. That is, the first core sheet 7 has a plurality of layers 7A and 7B. The first core sheet 7 is provided with a hole for fitting the IC chip 2 therein. The second core sheet 7C is made of a thermoplastic resin having the same softening temperature as that of the core sheet layer 7A, and the surface of the inlet opposite to the first core sheet 7 (the surface on which the IC chip 2 is not mounted). Install in. The exterior sheet 8 may be a sheet made of a crystalline resin having high heat resistance and suitable for processing, which does not flow at the temperature of the heat and pressure laminating for heat-sealing the first core sheet 7 and the second core sheet 7C. The biaxially stretched PET film may be used as a crystalline resin that does not flow at the softening temperature of the first core sheet 7 and the second core sheet 7C.

(Production method)
Hereinafter, a method for manufacturing the IC card of this embodiment will be described. (Typical example)
(Inlet manufacturing process)
First, as shown in the plan view of FIG. 1B, the antenna sheet 1 having the antenna wiring pattern 1a is manufactured. Next, as shown in the middle part of the cross-sectional views of FIG. 1A and FIG. 2, the antenna sheet 1 is mounted face down so that the circuit surface of the IC chip 2 faces, and then on the IC chip 2 (IC A metal reinforcing plate 3 having a larger area than that of the IC chip 2 such as SUS, aluminum, or copper is attached to the surface of the chip opposite to the circuit surface of the chip with an adhesive 5a. Thus, an inlet is manufactured in which the IC chip 2 is mounted on the antenna sheet 1 and the reinforcing plate 3 having a larger area than the IC chip 2 is installed on the IC chip 2. In addition, an inlet is manufactured in which the second reinforcing plate 4 is further bonded to the surface of the antenna sheet 1 opposite to the surface on which the IC chip 2 is mounted with an adhesive 5b.

(Heat and pressure lamination process)
Next, as shown in FIGS. 1A and 2, the first core sheet 7 made of thermoplastic resin is brought into contact with the surface of the inlet antenna sheet 1 on which the IC chip 2 is mounted, and the IC of the antenna sheet 1 is contacted. The second core sheet 7C is brought into contact with the surface opposite to the surface on which the chip 2 is mounted, and an outer sheet 8 of a biaxially stretched PET film having a thickness of 0.1 mm is laminated on the outside of the second core sheet 7C. They are sandwiched between metal plates 9 and integrated by heat fusion using a heat and pressure laminate that applies pressure while heating. Here, the first core sheet 7 is composed of at least two layers of thermoplastic resins having different softening temperatures, and is provided with holes 7e into which the IC chip 2 is fitted. That is, the first core sheet 7 is provided with a low heat resistant core sheet layer 7B having a softening temperature lower than that of the outer layer on the antenna sheet 1 side (inner side), and the outer layer has a high heat resistant core. The sheet layer 7A is installed. Further, on the opposite surface of the antenna sheet 1, a second core sheet 7C made of a high heat resistant resin having a high softening temperature and a softening temperature equivalent to that of the high heat resistant core sheet layer 7A is installed.

(Hole filling process by heat and pressure laminating process)
In FIG. 3, the graph of the experimental data of the heating-pressing lamination time, lamination temperature, and the flow state of a core sheet is shown. When the laminating time is about 5 minutes after the laminating time is relatively low, as shown in FIG. 4, the inner low heat resistant core sheet layer 7B having a low softening temperature is softened first, and the resin flows. start. At that time, the second core sheet 7C contacting the surface of the antenna sheet 1 opposite to the mounting surface of the IC chip 2 does not flow, so the second core sheet 7C supports the antenna sheet 1 and the antenna sheet 1 There is an effect to prevent deformation. Then, the resin of the low heat resistant core sheet layer 7B having a low softening temperature at the lower part of the reinforcing plate 3 flows into the hole 7e including the gap formed under the reinforcement plate around the IC chip 2 and fills the hole 7e. Here, since the high heat resistant core sheet layer 7A is installed outside the low heat resistant core sheet layer 7B, when the resin of the low heat resistant core sheet layer 7B moves to flow into the holes 7e, The high heat resistant core sheet layer 7A has an effect of holding the surface of the IC card flat and preventing the surface of the IC card from being uneven.

  Next, when the laminating time is about 11 minutes, the laminating temperature rises, and the outer high heat resistant core sheet layer 7A and the second core sheet 7C of the high heat resistant resin on the opposite side of the antenna sheet 1 are melted. Start flowing. At this time, since the hole 7e is already filled, the antenna sheet 1 is not deformed. Further, since the holes 7e are already filled, the second core sheet 7C does not have irregularities on the surface of the IC card even if the holes 7f are not provided as in the prior art. The hole 7f is not formed in the core sheet 7C, and the manufacturing cost is reduced. Thus, since the IC chip 2 is completely filled with the surrounding holes 7e and embedded in the first core sheet 7, the physical strength of the IC chip 2 portion is stabilized.

(Punching process)
Next, it is punched into a desired IC card shape.
(Printing process)
Next, as shown in FIG. 5, a printed layer 10 is formed by printing a pattern on the front and back surfaces of the outermost outer sheet of the IC card. Through the above steps, a non-contact type IC card in which the IC chip 2 is built in the IC card can be manufactured. Further, this IC card may be a combined magnetic card having a magnetic recording layer on the card surface.

<Second Embodiment>
As a second embodiment, an IC component is used in which an IC chip 2 is mounted on the lower surface of a substrate having external connection electrodes exposed on the surface of the IC card formed on the upper surface. The substrate of this IC component also has a function of reinforcing the IC chip 2 like the reinforcing plate 3 of the first embodiment, and has a wiring pattern, and the electrodes of the IC chip 2 are connected to the wiring pattern. It is a substrate. The wiring pattern of the substrate has an antenna electrode to be connected to the antenna wiring pattern 1a. An antenna electrode connected to the antenna wiring pattern 1a of the antenna sheet 1 is provided on the lower surface of the substrate. This IC component is a composite IC module. A composite IC card can be manufactured by embedding this IC component in the IC card. In this embodiment, in order to manufacture a composite IC card, first, the IC component of the composite IC module is directed to the antenna sheet 1 and the IC chip 3 side is directed, and the wiring pattern of the substrate of the IC component is connected. The antenna electrode is connected to the antenna wiring pattern 1a for mounting. An inlet integrated with the antenna sheet 1 is manufactured with the external connection electrodes of the IC components of the composite IC module facing outward.

  Second, a first core sheet 7 having a hole 7e into which the IC chip 2 is fitted is installed on the surface of the inlet on the IC chip 2 side, and the second core sheet 7 is installed on the surface opposite to the IC chip 2 mounting surface. The core sheet 7C is installed, and the antenna sheet 1 is sandwiched between the core sheet 7C and heated and pressed to laminate the IC component 2 of the composite IC module by the same manufacturing method as the non-contact IC card manufacturing method. Manufactures composite IC cards embedded inside. Here, the external connection electrodes of the IC components of the composite IC module are exposed from the composite IC card. In this way, an inlet in which the IC component (IC chip 2) of the composite IC module is mounted face down on the antenna sheet 1 is formed, and then the first core sheet 7 having a hole 7e into which the IC chip 2 fits is formed as the inlet. A composite IC card can be manufactured by a manufacturing method in which the IC chip 2 is embedded in a stacked manner.

<Example 1>
This IC card is manufactured as follows.
(Process 1)
First, an IC chip 2 having a thickness of about 0.2 mm is mounted on an antenna sheet 1 on which a plurality of antenna wiring patterns 1 a as shown in FIG. 1 are formed, and then the area of the IC chip 2 is larger than that of the IC chip 2. By bonding the wide reinforcing plate 3, an IC module (inlet) in which the IC chip 2 and the reinforcing plate 3 are mounted on the antenna sheet 1 is manufactured. This inlet has the following configuration. Antenna wiring of antenna coil by etching by bonding a 15-50 μm thick copper foil or aluminum foil to a 15-200 μm thick insulating film made of PEN (polyethylene naphthalate), PET (polyethylene terephthalate), or PI (polyimide) The antenna sheet 1 on which the pattern 1a and the connection pattern are formed is manufactured. A connection land (pad) of the IC chip 2 is connected to the connection pattern of the antenna sheet 1. The IC chip 2 faces down to the antenna sheet 1 (the circuit surface side is directed), and bumps provided on the connection lands (pads) of the antenna sheet 1 are interposed by an anisotropic conductive adhesive sheet (ACF). Connect to the connection pattern. Next, a reinforcing plate 3 such as a SUS (stainless steel) metal plate having a thickness of 30 to 100 μm is bonded to the upper surface (surface opposite to the circuit surface) of the mounted IC chip 2 with an insulating adhesive. Further, an inlet is manufactured in which the second reinforcing plate 4 is further bonded to the surface of the antenna sheet 1 opposite to the mounting surface of the IC chip 2 with the adhesive 5b.

(Process 2)
Next, the inlet antenna sheet 1 is used as the center layer of the IC card, and a hole 7e into which the IC chip 2 is fitted is formed in advance on the mounting surface of the IC chip 2 of the antenna sheet 1. 1 core sheet 7 is installed, a second core sheet 7C having a thickness of about 0.3 mm is installed on the other surface of the antenna sheet 1, and the antenna sheet 1 is sandwiched between both core sheets. A biaxially stretched PET film exterior sheet 8 with a thickness of about 0.1 mm aligned on both sides on the outside is installed, and an IC card is manufactured by heat and pressure lamination that is heat-sealed with a heat press. To do.

  Here, as shown in FIGS. 1 and 2, the first core sheet 7 has a high heat-resistant core sheet layer 7A having a thickness of about 0.15 mm and a high softening temperature, and a low heat resistance having a thickness of about 0.15 mm. A two-layer first core sheet 7 made of two kinds of resins having different softening temperatures is used with the core sheet layer 7B. The second core sheet 7C uses the same material as the high heat resistant core sheet layer 7A. The high heat-resistant core sheet layer 7A is a layer having a high heat resistance (softening temperature) having a softening temperature of 90 to 95 ° C., and is disposed on the side (outside) far from the antenna sheet 1. The low heat-resistant core sheet layer 7B is a layer having a low heat resistance (softening temperature) having a softening temperature of 70 to 75 ° C., and is installed on the antenna sheet 1 side (inside).

  That is, it is important that the low heat-resistant core sheet layer 7B has a thickness of about 0.15 mm and has the lowest softening temperature compared to the other layers of the first core sheet 7. For example, the low heat resistant core sheet layer 7B has a white amorphous PET copolymer as an amorphous resin sheet having a softening temperature of 70 to 75 ° C. and softening and flowing at 100 to 120 ° C. In this case, a copolymer sheet obtained by copolymerizing terephthalic acid and glycol with 1,4 cyclohexanedimethanol (1,4CMH) (trademark of a product of Eastman Chemical Co., Ltd., hereinafter referred to as PET-G) is used. Alternatively, white polyvinyl chloride can be used.

  Heat resistant PET-G (PET-G / PC) is used for the high heat resistant core sheet layer 7A and the second core sheet 7C of the high heat resistant resin. Also, the degree of difference in heat resistance between the high heat resistant core sheet layer 7A and the low heat resistant core sheet layer 7B varies depending on the lamination conditions, but is desirably 30 ° C. or higher.

Then, as shown in FIG. 2, an outer sheet 8 of PET film is placed outside the first core sheet 7 on both sides of the antenna sheet 1, and is sandwiched between metal plates 9, and heated and pressed by a hot press machine. To do. The heating and pressurizing laminating temperature is 150 ° C., and the laminating pressure is 120 N / cm ² while heating and pressurizing and laminating for 50 minutes. FIG. 3 shows the relationship between the lamination time and the lamination temperature in this case. About 5 minutes after starting the lamination, the lamination temperature rises to about 75 ° C., and the low heat resistant core sheet layer 7B having a low softening temperature starts to soften and flow. As shown in FIG. 4, the low heat-resistant core sheet layer 7B that has flowed out flows toward the air holes 7e that are easy to flow. At this time, the high heat-resistant core sheet layer 7A and the second core sheet 7C made of high heat-resistant resin are not sufficiently softened so that they do not flow. In particular, the second core sheet 7C supports the antenna sheet 1 and the antenna sheet. 1 deformation is prevented.

  If heating and pressurization are further continued, as shown in FIG. 3, about 11 minutes after the start of lamination, the lamination temperature rises to about 90 ° C., and the high heat-resistant core sheet layer 7A and the second core sheet 7C soften. And begin to flow. However, since the holes 7e are already filled with the low heat resistant core sheet layer 7B at this time, the high heat resistant core sheet layer 7A and the second core sheet 7C flow to the left and right without deforming the antenna sheet 1. .

(Process 3)
Next, a substrate formed by laminating the first core sheet 7 and the second core sheet 7C on the inlet is punched into a desired IC card shape for each antenna wiring pattern 1a. This IC card is generally formed in a bank card or credit card size with a thickness of 0.76 mm ± 0.08 mm.
(Process 4)
Next, as shown in FIG. 5, the printed layer 10 is formed by printing a pattern on the front and back surfaces of the outer and outermost outer packaging sheets.

  In the present embodiment, as described above, the low heat resistant core sheet layer 7B and the high heat resistant core sheet layer 7A are formed from the inside from the mounting surface side of the IC chip 2 of the antenna sheet 1 as shown in FIGS. The second core sheet 7C made of high heat resistance resin is placed on the opposite surface side of the antenna sheet 1, and the high heat resistance exterior sheet 8 is placed on both outer surfaces of the antenna sheet 1 for heat and pressure lamination. Thereby, at the initial stage of the heat and pressure laminating, the low heat resistant core sheet layer 7B is melted while the second core sheet 7C of the high heat resistant resin is not melted and the antenna sheet 1 is supported so as not to be deformed. The hole 7e near the chip 2 is filled. Next, at a later stage of the heat and pressure lamination, the high heat resistant core sheet layer 7A and the second core sheet 7C of high heat resistant resin are melted, and the antenna sheet 1 and the exterior sheet 8 are bonded to complete the IC card.

  Thus, in this embodiment, since the first core sheet 7 having a plurality of layers having different softening temperatures is laminated, when the IC card is manufactured by integrating with the heat and pressure laminate, the heat and pressure laminate is used. In the initial stage, there is an effect of supporting the antenna sheet 1 so as not to be deformed without melting the second core sheet 7C of the high heat resistant resin, and the high heat resistant core sheet layer 7A does not cause unevenness on the surface of the IC card. As a supportive effect. In the meantime, since the low heat resistant core sheet layer 7B melts and fills the air holes 7e near the IC component 2, there is an effect that the antenna sheet 1 is not deformed during the heat and pressure lamination. In addition, since the hole 7e is not blocked by the deformed antenna sheet 1, the resin can be sufficiently poured and completely filled, and the effect of obtaining an IC card having a stable strength with no gap 2a remaining. There is. And since the deformation | transformation of the antenna sheet | seat 1 of an inlet can be suppressed, the short circuit by the contact of the antenna wiring pattern 1a and the metal reinforcement board 3 by a deformation | transformation of the antenna sheet | seat 1 can be prevented. Further, since the holes 7e can be sufficiently filled with the low heat-resistant core sheet layer 7B, there is an effect that an IC card excellent in appearance quality free from dents can be obtained.

(A) It is side sectional drawing of the IC card of embodiment of this invention. (B) It is the top view seen from the upper surface of the IC card of embodiment of this invention. It is a sectional side view which shows the manufacturing method of the IC card of the 1st Embodiment of this invention. It is a graph which shows the experimental data of the lamination time in the manufacturing method of the IC card of the Example of this invention, lamination temperature, and the flow state of a core sheet. It is a sectional side view which shows the manufacturing method of the IC card of the 1st Embodiment of this invention. It is a sectional side view which shows the manufacturing method of the IC card of the 1st Embodiment of this invention. It is side sectional drawing of embodiment of the conventional IC card. It is a sectional side view which shows the manufacturing method of the IC card of a comparative example. It is a sectional side view which shows the manufacturing method of the IC card of a comparative example.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 ... Antenna sheet 1a ... Antenna wiring pattern 2 ... IC chip 2a ... Space | gap 3 ... Reinforcement plate 4 ... Second reinforcement plate 5a, 5b ... Adhesive 6 ... Sealing resin 7 ... first core sheet 7A ... high heat resistant core sheet layer 7B ... low heat resistant core sheet layers 7C, 7d ... second core sheets 7e, 7f ... Hole 8 ... exterior sheet 9 ... metal plate 10 ... printed layer

Claims (3)

An IC card characterized in that the following (a), (b), and (c) are laminated.
(B) An IC chip is mounted on the antenna wiring pattern of the antenna sheet having the antenna wiring pattern, and the reinforcement is made of SUS, aluminum, or copper having a larger area than the IC chip on the IC chip. Inlet with the board bonded to the roof ,
(B) A core made of a copolymer obtained by copolymerizing terephthalic acid and glycol with 1,4 cyclohexanedimethanol at least on the side close to the inlet where the IC chip is mounted. A hole having a sheet layer (B) and a core sheet layer (A) made of heat-resistant PET-G having a softening temperature higher than that of the core sheet layer (B) on the side far from the inlet, into which the IC chip fits A first core sheet having
(C) A second core sheet of a thermoplastic resin having a softening temperature equivalent to that of the core sheet layer (A) on the opposite side of the inlet from the first core sheet.   2. The IC card according to claim 1, wherein an exterior sheet made of a crystalline resin that does not flow at the softening temperature of the first core sheet is laminated on the outside of the first core sheet. An IC chip is mounted on an antenna sheet having an antenna wiring pattern, and a reinforcing plate made of SUS, aluminum, or copper having a larger area than the IC chip is bonded to the IC chip in a roof shape . The IC chip side surface has a core sheet layer (B) made of a copolymer obtained by copolymerizing terephthalic acid and glycol with 1,4 cyclohexanedimethanol on the inlet side (inside), and the core on the outside. A first core sheet having a core sheet layer (A) made of heat-resistant PET-G having a softening temperature higher than that of the sheet layer (B) and having a hole into which the IC chip is fitted is installed. A second core sheet of a thermoplastic resin having a softening temperature equivalent to that of the core sheet layer (A) is installed on the surface of the inlet opposite to the IC chip; By installing an exterior sheet on the outside of the first core sheet and the second core sheet and laminating by heating and pressing, the core sheet layer (B) is first melted to fill the holes, Next, the method for producing an IC card comprising the step of melting the core sheet layer (A) and the second core sheet and bonding the inlet and the exterior sheet.

Images