JPH01208195A - Structure of ic card - Google Patents
Structure of ic cardInfo
- Publication number
- JPH01208195A JPH01208195A JP63033297A JP3329788A JPH01208195A JP H01208195 A JPH01208195 A JP H01208195A JP 63033297 A JP63033297 A JP 63033297A JP 3329788 A JP3329788 A JP 3329788A JP H01208195 A JPH01208195 A JP H01208195A
- Authority
- JP
- Japan
- Prior art keywords
- card
- chip
- metal
- metal substrate
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000002184 metal Substances 0.000 claims abstract description 25
- 229910052751 metal Inorganic materials 0.000 claims abstract description 25
- 239000000758 substrate Substances 0.000 claims abstract description 18
- 239000011347 resin Substances 0.000 claims abstract description 6
- 229920005989 resin Polymers 0.000 claims abstract description 6
- 239000000463 material Substances 0.000 claims description 10
- 230000005389 magnetism Effects 0.000 claims description 4
- 238000005452 bending Methods 0.000 abstract description 10
- 239000000853 adhesive Substances 0.000 abstract description 5
- 230000001070 adhesive effect Effects 0.000 abstract description 5
- 238000007789 sealing Methods 0.000 abstract description 3
- BZHJMEDXRYGGRV-UHFFFAOYSA-N Vinyl chloride Chemical compound ClC=C BZHJMEDXRYGGRV-UHFFFAOYSA-N 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000004049 embossing Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 230000000116 mitigating effect Effects 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 229920006267 polyester film Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
Landscapes
- Credit Cards Or The Like (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は、ＩＣチップを内蔵したカードの構造に関する
。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to the structure of a card incorporating an IC chip.
従来のＩＣチップを内蔵したカードの構造は、ガラスエ
ポキシフィルム基板又はポリイミドフィルム基板、ポリ
エステルフィルム基板等に外部接続端子となる電極パタ
ー７及びＩＣチップの電極と接続する回路パターンを形
成し、外部接続端子面と回路パター７面とはスルーホー
ル加工により４通せしめ、核基板に１個もしくは複数個
のＩＣチップをダイボンディング及びワイヤーボンディ
ング方式、またはフェイスボンディング方式等によりマ
ウントし樹脂により封止したＩＣモジュールを硬質塩化
ビニル、耐熱ポリエステルの積層体を使用したカード基
材の凹部内に埋没設置して、表裏を透明塩化ビニル等か
らなるオーバーシートでラミネートした構造が一般的で
ある。The structure of a conventional card with a built-in IC chip is such that an electrode pattern 7 serving as an external connection terminal and a circuit pattern connected to the electrode of the IC chip are formed on a glass epoxy film substrate, a polyimide film substrate, a polyester film substrate, etc. The terminal surface and the 7th surface of the circuit pattern are made to have 4 through holes, and one or more IC chips are mounted on the core substrate by die bonding, wire bonding, face bonding, etc. and sealed with resin. A common structure is that the module is embedded in a recess of a card base material using a laminate of hard vinyl chloride and heat-resistant polyester, and the front and back sides are laminated with an oversheet made of transparent vinyl chloride or the like.
又、カード基材が樹脂であり、カード厚みも薄いため特
に曲げに対する特性において故障が発生する危険が非常
に大きい、そのためＩＣチップのカード上での配置位置
（カードの角に配置し応力がかかりにくくする）やＩＣ
チップの向き（カードの長手方向に対してＩＣチップの
長手方向を直角にする）等の配慮をした構造となってい
た。In addition, since the card base material is resin and the card thickness is thin, there is a very high risk of failure, especially in terms of bending characteristics. ) and IC
The structure took into account the orientation of the chip (the longitudinal direction of the IC chip should be perpendicular to the longitudinal direction of the card).
しかし、前述の従来技術では、磁気記録体、外部接続端
子、エンボス加工等との併用、又、ＩＣチップの数も複
数個になる等の理由により、カード曲げに対する応力の
かん和のための配慮ができない場合が通常でありＩＣモ
ジュールにかかる応力による故障の発生を防止すること
ができないという問題点ををする。そこで本発明はこの
様な問題点を解決するもので、その目的とするところは
、カードの曲がりに対して強いＩＣカードを提供すると
ころにある。However, with the above-mentioned conventional technology, due to the combination of magnetic recording media, external connection terminals, embossing, etc., and the number of IC chips, consideration must be given to stress mitigation against card bending. This poses a problem in that it is not possible to prevent failures due to stress applied to the IC module. The present invention is intended to solve these problems, and its purpose is to provide an IC card that is resistant to bending of the card.
本発明のＩＣカードの構造は、帯磁性の弱い金属をコア
としたメタル基板の片方の面に外部接続端子を形成し、
もう一方の面の回路パターンにＩＣチップを配置接続し
たＩＣモジュールを使用し、ＩＣモジュールの外形サイ
ズをカードサイズと同一とし、これによりＩＣモジュー
ルそのものの剛性を高め又、カード全体の剛性を均一に
し、ある特定の部位に応力が集中するのを防止し、さら
に帯磁性の弱い金属を使用したカード基材とのラミネー
トによる積層体とすることによりさらにカード全体の剛
性を高め曲げに対して強いカードを得ることができる。The structure of the IC card of the present invention is that external connection terminals are formed on one side of a metal substrate with a core made of a weakly magnetic metal.
An IC module is used in which an IC chip is arranged and connected to the circuit pattern on the other side, and the external size of the IC module is the same as the card size, thereby increasing the rigidity of the IC module itself and making the rigidity of the entire card uniform. This prevents stress from concentrating on a specific area, and by laminating it with a card base material made of a metal with low magnetism, the overall rigidity of the card is increased and the card is resistant to bending. can be obtained.
又、ＩＣモジュール部もカード基材をかねるため金属板
の厚みも厚くすることができ、さらに剛性の高いカード
となることを特徴とする。Further, since the IC module portion also serves as the card base material, the thickness of the metal plate can be increased, and the card is characterized in that it has a higher rigidity.
第１図は本発明の実施例における主要断面図であって、
ＩＣモジュール１は磁気記録体への影響を与えない帯磁
性の弱い金属をコアとしたメタル基板５にＩＣチップ２
を接続し、封止樹脂３にて接続部及びＩＣチップ２の封
止及び保護を行ったものであり、このメタル基板５のＩ
Ｃチップ２を実装した反対側の面にはスルーホールによ
り導通せしめた外部入出力端子が形成されている。又こ
のメタル基板５はカード形状とほぼ同一の形状とし、や
はり帯磁性の弱い金属を使用したカード基材４と接着剤
１０によりラミネートされ剛性の高い積層体とし、ＩＣ
チップ２の配置部分への曲げ応力の集中を防ぎ、曲げに
対して曲がりにくい構造としている。尚、ここでの接着
剤には硬化タイプの接着剤を使用しさらに剛性を高めて
いる。FIG. 1 is a main sectional view in an embodiment of the present invention,
The IC module 1 includes an IC chip 2 on a metal substrate 5 whose core is made of a weakly magnetized metal that does not affect the magnetic recording medium.
are connected, and the connection portion and the IC chip 2 are sealed and protected with a sealing resin 3, and the I of this metal substrate 5 is
External input/output terminals are formed on the opposite surface on which the C chip 2 is mounted and are electrically connected by through holes. The metal substrate 5 has almost the same shape as the card, and is laminated with a card base material 4 made of metal with low magnetism and an adhesive 10 to form a highly rigid laminate.
The structure prevents concentration of bending stress on the portion where the chip 2 is arranged and is resistant to bending. Incidentally, a hardening type adhesive is used as the adhesive here to further increase the rigidity.
第４図は本発明の実施例２の主要断面図であり、第１図
のカード基材４をＩＣチップ２の封止樹脂３の厚さで分
割し、２体の金属板として、接着剤１０を２層に狭んだ
３枚の金属板の積層体として、さらに剛性を高めた構造
としている。FIG. 4 is a main sectional view of Embodiment 2 of the present invention, in which the card base material 4 of FIG. 10 is made into a laminate of three metal plates narrowed into two layers to create a structure with even higher rigidity.
以上述べたように本発明によれば、メタル基板を使用し
、基板サイズをカードサイズとすることにより、ＩＣチ
ップ配置部とその他の部分の剛性の差が少なく、曲げ応
力の集中しに（いカードが得られ、又、カード基材にも
金属板を用いてラミネートによる積層体とし、メタル基
板自体がカード基材をかねるため金属板の厚さを厚（す
ることができ、より剛性の高い、曲げに対して曲がりに
くいカードを得ることができ、金ｒＩ４仮には帯磁性の
弱い金属を使用しているため磁気記録体との併用も可能
であるという効果を育する。As described above, according to the present invention, by using a metal substrate and making the substrate size card-sized, the difference in rigidity between the IC chip placement area and other parts is small, and bending stress is prevented from concentrating. A card is obtained, and a metal plate is also used as the card base material to form a laminate, and since the metal board itself serves as the card base material, the thickness of the metal plate can be increased (thicker), making it more rigid. Therefore, it is possible to obtain a card that does not easily bend when bent, and since gold rI4 uses a metal with weak magnetism, it has the advantage that it can also be used in combination with a magnetic recording medium.
第１図は本発明のＩＣカード構造の一実施例を示す主要
断面図。
第２図は従来のＩＣカード構造を示す主要断面図。
第３図はＩＣカードの平面図。
第４図は本発明の実施例２の主要断面図。
１・・・Ｉｃモジュール
２・・・ＩＣチップ
３・・・封止樹脂
４・・・カード基材
５・・・メタル基板
６・・・磁気記録体
７ ・・・ 摩会 柄
８・・・オーバーコート
９・・・オーバーシート
１０・・・接着剤
以 上
出願人 セイコーエプソン株式会社
代理人 弁理士 最 上 務 他１名・、・２゛）
（；Ｊ＞
第１図FIG. 1 is a main sectional view showing an embodiment of the IC card structure of the present invention. FIG. 2 is a main sectional view showing a conventional IC card structure. Figure 3 is a plan view of the IC card. FIG. 4 is a main sectional view of Embodiment 2 of the present invention. 1... Ic module 2... IC chip 3... Sealing resin 4... Card base material 5... Metal substrate 6... Magnetic recording body 7... Rubber handle 8... Overcoat 9...Oversheet 10...Adhesive and above Applicant Seiko Epson Co., Ltd. Agent Patent attorney Tsutomu Mogami and 1 other person...2゛) (;J> Figure 1
Claims (1)
としたメタル基板の片方の面には外部接続端子として電
極パターンを形成し、他方の面にはＩＣチップをマウン
トしボンディングするための回路パターンを形成し、電
極面と回路面とはスルーホール加工により導通せしめ、
該基板に１個もしくは複数個のＩＣチップをダイボンデ
ィング及びワイヤーボンディング方式、又はフェイスボ
ンディング方式によりマウントし、樹脂による封止を行
ない、帯磁性の弱い金属を使用したカード基材とラミネ
ートしたことを特徴とするＩＣカードの構造。A metal substrate whose core is a weakly magnetized metal that does not affect the magnetic recording medium. An electrode pattern is formed as an external connection terminal on one side, and a circuit for mounting and bonding an IC chip on the other side. A pattern is formed, and the electrode surface and circuit surface are made conductive by through-hole processing.
One or more IC chips are mounted on the substrate by die bonding, wire bonding, or face bonding, sealed with resin, and laminated with a card base material using a metal with low magnetism. Characteristic IC card structure.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63033297A JP2661101B2 (en) | 1988-02-16 | 1988-02-16 | IC card |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63033297A JP2661101B2 (en) | 1988-02-16 | 1988-02-16 | IC card |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH01208195A true JPH01208195A (en) | 1989-08-22 |
| JP2661101B2 JP2661101B2 (en) | 1997-10-08 |
Family
ID=12382613
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP63033297A Expired - Lifetime JP2661101B2 (en) | 1988-02-16 | 1988-02-16 | IC card |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2661101B2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH1035164A (en) * | 1996-04-25 | 1998-02-10 | Samsung Aerospace Ind Ltd | Ic card and manufacture thereof |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61155976U (en) * | 1985-03-20 | 1986-09-27 |
-
1988
- 1988-02-16 JP JP63033297A patent/JP2661101B2/en not_active Expired - Lifetime
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61155976U (en) * | 1985-03-20 | 1986-09-27 |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH1035164A (en) * | 1996-04-25 | 1998-02-10 | Samsung Aerospace Ind Ltd | Ic card and manufacture thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2661101B2 (en) | 1997-10-08 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| EXPY | Cancellation because of completion of term | ||
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20080613 Year of fee payment: 11 |