JPH09248986A - Structure of card-type electric circuit device - Google Patents
Structure of card-type electric circuit deviceInfo
- Publication number
- JPH09248986A JPH09248986A JP5957796A JP5957796A JPH09248986A JP H09248986 A JPH09248986 A JP H09248986A JP 5957796 A JP5957796 A JP 5957796A JP 5957796 A JP5957796 A JP 5957796A JP H09248986 A JPH09248986 A JP H09248986A
- Authority
- JP
- Japan
- Prior art keywords
- chip
- electronic circuit
- card
- main body
- wiring pattern
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
- H01L2224/321—Disposition
- H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/32225—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73201—Location after the connecting process on the same surface
- H01L2224/73203—Bump and layer connectors
- H01L2224/73204—Bump and layer connectors the bump connector being embedded into the layer connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
- H01L2924/191—Disposition
- H01L2924/19101—Disposition of discrete passive components
- H01L2924/19105—Disposition of discrete passive components in a side-by-side arrangement on a common die mounting substrate
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、所謂ＩＣカードや
ＩＤカードのようにカード型の本体にＩＣチップを含む
電子回路部品が配設されて成るカード型電子回路装置の
構造に関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a structure of a card type electronic circuit device such as a so-called IC card or ID card in which an electronic circuit component including an IC chip is arranged in a card type main body.
【０００２】[0002]
【従来の技術】近年、所謂ＩＣカードやＩＤカードのよ
うにカード型の本体にＩＣチップを含む電子回路部品が
配設されて成るカード型電子回路装置が普及しつつあ
る。このようなカード型電子回路装置は、本来の機能と
して薄型であることが要求されている。2. Description of the Related Art In recent years, card-type electronic circuit devices, such as so-called IC cards and ID cards, in which electronic circuit parts including an IC chip are arranged in a card-type main body are becoming widespread. Such a card-type electronic circuit device is required to be thin as its original function.
【０００３】図３は従来のカード型電子回路装置のう
ち、ＩＤカードの構造の一例を示す側面断面図であり、
コンデンサやチップ抵抗などの電子回路部品２とＩＣチ
ップ１が実装されたプリント基板１０と、所謂ラミネー
トシートなどから成る一対の外装板１１1 ，１１2 が枠
体１２を介して対向配置されることでカード型に形成さ
れた本体Ｂとを具備し、本体Ｂ内にプリント基板１０を
納装して構成されている。なお、ＩＣチップ１はバンプ
５によってプリント基板１０にフリップチップ実装され
るとともに合成樹脂製の封止材７によって封止されてい
る。各部の厚みは、例えば、プリント基板１０が０．２
ｍｍ、ＩＣチップ１が０．３ｍｍ、バンプ５が５０μ
ｍ、外装板１１1 ，１１2 が各々０．１ｍｍであって、
本体Ｂの厚みは０．７６ｍｍ程度になるようにしてい
る。FIG. 3 is a side sectional view showing an example of the structure of an ID card in a conventional card type electronic circuit device.
A printed circuit board 10 on which an electronic circuit component 2 such as a capacitor and a chip resistor and an IC chip 1 are mounted, and a pair of exterior plates 11 1 and 11 2 made of a so-called laminate sheet are arranged to face each other with a frame 12 interposed therebetween. And a main body B formed in a card shape, and the printed circuit board 10 is installed in the main body B. The IC chip 1 is flip-chip mounted on the printed board 10 by the bumps 5 and sealed by a synthetic resin sealing material 7. The thickness of each part is, for example, 0.2 for the printed circuit board 10.
mm, IC chip 1 0.3 mm, bump 5 50 μ
m, the outer plates 11 1 and 11 2 are each 0.1 mm,
The body B has a thickness of about 0.76 mm.
【０００４】また、図４は他の例を示す側面断面図であ
り、プリント基板１３に開けた孔の内部にＩＣチップ１
並びに他の電子回路部品２を埋め込むとともに、ＩＣチ
ップ１などの電極からプリント基板１３の配線パターン
まで配線を行うことで本体Ｃの薄型化を図っている。FIG. 4 is a side sectional view showing another example, in which the IC chip 1 is placed inside the hole formed in the printed circuit board 13.
Besides, other electronic circuit components 2 are embedded, and wiring is performed from the electrodes such as the IC chip 1 to the wiring pattern of the printed circuit board 13 to reduce the thickness of the main body C.
【０００５】[0005]
【発明が解決しようとする課題】しかしながら、上記前
者の従来構造では、外装板１１1 ，１１2 を枠体１２に
接着する接着材の厚みや外装板１１1 ，１１2 の表面に
施される印刷などによって実際の本体Ｂの厚みがねらい
とする厚み（０．７６ｍｍ）を越えてしまう場合があっ
た。However, in the former conventional structure described above, the thickness of the adhesive material for adhering the exterior plates 11 1 and 11 2 to the frame 12 and the surface of the exterior plates 11 1 and 11 2 are applied. In some cases, the actual thickness of the main body B exceeds the intended thickness (0.76 mm) due to printing or the like.
【０００６】また、上記後者の従来構造では、薄型化が
可能であるが、プリント基板１３の加工や配線などの作
業に手間がかかり、製造コストがアップするという問題
があった。本発明は上記問題に鑑みて為されたものであ
り、その目的とするところは、コストアップを招くこと
なく薄型化が可能なカード型電子回路装置の構造を提供
するにある。Further, although the latter conventional structure can be made thin, there is a problem that the work such as the processing of the printed circuit board 13 and wiring is troublesome and the manufacturing cost is increased. The present invention has been made in view of the above problems, and an object of the present invention is to provide a structure of a card-type electronic circuit device that can be thinned without increasing cost.
【０００７】[0007]
【課題を解決するための手段】請求項１の発明は、上記
目的を達成するために、カード型の本体にＩＣチップを
含む電子回路部品が配設されて成るカード型電子回路装
置の構造において、内側面に配線パターンが形成された
外装板によって本体を構成し、表面に電子回路部品が実
装され且つ裏面にて外装板の内側面と密着し外装板の配
線パターンと電気的に接続されるプリント基板を本体内
に納装するとともに、プリント基板の厚み方向に貫通し
た収納孔にＩＣチップを収納して、プリント基板と接続
されている外装板の内側面の配線パターンとＩＣチップ
とをバンプにより接続し、プリント基板の表裏両面に形
成された配線パターンをプリント基板の厚み方向に貫通
して形成されるスルーホールにより接続して成るもので
あり、ＩＣチップをプリント基板に設けた収納孔の内部
に収納することにより、ＩＣチップの部分における本体
の厚みがプリント基板の厚み分だけ薄くでき、しかも、
プリント基板の加工も容易に行うことができるからコス
トアップを招くこともない。In order to achieve the above object, the present invention provides a structure of a card type electronic circuit device in which an electronic circuit component including an IC chip is arranged in a card type main body. , The main body is constituted by an exterior plate having a wiring pattern formed on the inner side surface, electronic circuit components are mounted on the front surface, and the rear surface is in close contact with the inner side surface of the exterior plate and electrically connected to the wiring pattern of the exterior plate. The printed circuit board is installed in the main body, the IC chip is stored in a storage hole penetrating in the thickness direction of the printed circuit board, and the wiring pattern on the inner surface of the exterior plate connected to the printed circuit board and the IC chip are bumped. And the wiring patterns formed on both front and back surfaces of the printed circuit board are connected by through holes formed by penetrating in the thickness direction of the printed circuit board. By accommodated in the accommodating hole formed in the printed circuit board, it can be thinned the thickness of the body by the thickness of the printed circuit board at a portion of the IC chip, moreover,
Since the printed circuit board can be easily processed, the cost does not increase.
【０００８】請求項２の発明は、上記目的を達成するた
めに、カード型の本体にＩＣチップを含む電子回路部品
が配設されて成るカード型電子回路装置の構造におい
て、内側面に配線パターンが形成された外装板によって
本体を構成し、この外装板の内側面にＩＣチップを含む
電子回路部品を実装して成るものであり、コストアップ
を招くことなく、従来例に比べてプリント基板の厚み分
だけ本体の厚みを薄くできる。In order to achieve the above-mentioned object, a second aspect of the present invention is a structure of a card type electronic circuit device in which an electronic circuit component including an IC chip is arranged in a card type main body, and a wiring pattern is formed on an inner side surface. The main body is composed of an exterior plate on which is formed, and an electronic circuit component including an IC chip is mounted on the inner surface of the exterior plate. The thickness of the body can be reduced by the thickness.
【０００９】[0009]
（実施形態１）図１は請求項１に係る発明の実施形態を
示す側面断面図である。本実施形態におけるカード型電
子回路装置は従来例と同じく所謂ＩＤカードと呼ばれる
ものであるが、これに限定する主旨ではなく、ＩＣカー
ドなどを含めたカード型電子回路装置全般の構造に本発
明の技術的思想が適用可能であることはいうまでもな
い。(Embodiment 1) FIG. 1 is a side sectional view showing an embodiment of the invention according to claim 1. The card type electronic circuit device according to the present embodiment is a so-called ID card as in the conventional example, but the present invention is not limited to this, and the general structure of the card type electronic circuit device including an IC card and the like of the present invention is not limited to this. It goes without saying that technical ideas can be applied.
【００１０】図１に示すように、枠体６と、ポリ塩化ビ
ニル（ＰＶＣ）などの合成樹脂を材料とするラミネート
シートから成る一対の外装板４1 ，４2 とでカード型の
本体Ａが構成され、この本体Ａ内にプリント基板３が配
設される。このプリント基板３は表裏両面に配線パター
ン（図示せず）が形成されており、表面側にコンデンサ
やチップ抵抗などの電子回路部品２が実装されている。
また、プリント基板３の裏面側の配線パターンは、一方
の外装板４1 の内側面に形成された配線パターンと電気
的に接続される。すなわち、プリント基板３の裏面が外
装板４1 の内側面に密着され、両者の配線パターンが半
田により接続されるのである。As shown in FIG. 1, a frame 6 and a pair of exterior plates 4 1 and 4 2 made of a laminated sheet made of a synthetic resin such as polyvinyl chloride (PVC) form a card-type main body A. The printed circuit board 3 is arranged in the main body A. Wiring patterns (not shown) are formed on both front and back surfaces of the printed circuit board 3, and electronic circuit components 2 such as capacitors and chip resistors are mounted on the front surface side.
Further, the wiring pattern on the back surface side of the printed board 3 is electrically connected to the wiring pattern formed on the inner side surface of the one exterior plate 4 1 . That is, the back surface of the printed circuit board 3 is in close contact with the inner surface of the outer plate 4 1 is the both wiring patterns are connected by solder.
【００１１】さらに、プリント基板３には厚み方向に貫
通する収納孔３ａが形成されており、この収納孔３ａの
内部にＩＣチップ１が収納される。そして、ＩＣチップ
１の電極（図示せず）と、外装板４1 の内側面に形成さ
れた配線パターンとがバンプ５によって接続されるとと
もに、合成樹脂製の封止材７によりＩＣチップ１が封止
される。Further, the printed board 3 is formed with a storage hole 3a penetrating in the thickness direction, and the IC chip 1 is stored in the storage hole 3a. Then, the electrodes (not shown) of the IC chip 1 and the wiring pattern formed on the inner surface of the exterior plate 4 1 are connected by the bumps 5, and the IC chip 1 is sealed by the synthetic resin sealing material 7. It is sealed.
【００１２】また、プリント基板３の裏面側の配線パタ
ーン並びに外装板４1 の内側面の配線パターンと、プリ
ント基板３の表面側の配線パターンとを電気的に接続す
るため、プリント基板３には厚み方向に貫通するスルー
ホール３ｂが形成されており、このスルーホール３ｂを
介してＩＣチップ１とプリント基板３の表面に実装され
た電子回路部品２とが接続され、所定の電子回路が形成
されるものである。Further, since the wiring pattern on the back side of the printed board 3 and the wiring pattern on the inner side surface of the exterior plate 4 1 are electrically connected to the wiring pattern on the front side of the printed board 3, the printed board 3 is not connected. A through hole 3b penetrating in the thickness direction is formed, and the IC chip 1 and the electronic circuit component 2 mounted on the surface of the printed circuit board 3 are connected through the through hole 3b to form a predetermined electronic circuit. It is something.
【００１３】ここで、各部の厚みが従来例のものと同じ
であるとすると、本実施形態の本体Ａの厚みは、外装板
４1 ，４2 の厚み（０．１ｍｍ×２）と電子回路部品２
の厚み（０．３ｍｍ以下）とプリント基板３の厚み
（０．２ｍｍ）の和（約０．７ｍｍ）よりも薄くなり、
外装板４1 ，４2 への印刷や接着材の厚みなどを考慮し
ても従来よりも薄型化を図ることができる。しかも、プ
リント基板３に収納孔３ａやスルーホール３ｂを形成す
る作業、外装板４1 の内側面に配線パターンを形成する
作業並びに外装板４1 の配線パターンにＩＣチップ１を
接続する作業などは従来例におけるプリント基板１３の
加工作業や配線作業に比較して容易に行うことができ、
コストアップを招くこともない。Here, assuming that the thickness of each part is the same as that of the conventional example, the thickness of the main body A of this embodiment is the same as the thickness of the outer plates 4 1 and 4 2 (0.1 mm × 2) and the electronic circuit. Part 2
Thickness (0.3 mm or less) and the thickness (0.2 mm) of the printed circuit board 3 (about 0.7 mm),
Also in consideration of the thickness of the outer plate 4 1, 4 to 2 printing or adhesive than the conventional can be made thin. Moreover, the work for forming a housing hole 3a and the through hole 3b on the printed board 3, the working and the outer plate 4 1 of the wiring pattern to form a wiring pattern on the inner surface of the outer plate 4 1 like the work of connecting the IC chip 1 It can be performed more easily than the conventional work of processing the printed circuit board 13 and wiring
There is no cost increase.
【００１４】（実施形態２）図２は請求項２に係る発明
の実施形態を示す側面断面図であり、実施形態１と同様
にＩＤカードを例とするものである。但し、これに限定
する主旨でないことはいうまでもない。図２に示すよう
に、本実施形態では、枠体８と、一対の外装板９1 ，９
2 とでカード型の本体Ａ’が構成され、一方の外装板９
1 の内側面に形成された配線パターン（図示せず）にＩ
Ｃチップ１や電子回路部品２が実装されている。ＩＣチ
ップ１はバンプ５によって配線パターンに接続されてお
り、合成樹脂製の封止材７で封止されている。(Embodiment 2) FIG. 2 is a side sectional view showing an embodiment of the invention according to claim 2, and an ID card is taken as an example like Embodiment 1. However, it goes without saying that the purpose is not limited to this. As shown in FIG. 2, in the present embodiment, the frame 8 and the pair of exterior plates 9 1 , 9 are used.
The card-shaped main body A ′ is composed of 2 and one of the exterior plates 9
I on the wiring pattern (not shown) formed on the inner surface of 1
A C chip 1 and an electronic circuit component 2 are mounted. The IC chip 1 is connected to the wiring pattern by bumps 5 and is sealed with a synthetic resin sealing material 7.
【００１５】ここで、各部の厚みが従来例のものと同じ
であるとすると、本実施形態の本体Ａ’の厚みは、外装
板９1 ，９2 の厚み（０．１ｍｍ×２）とＩＣチップ１
の厚み（０．３ｍｍ）とバンプ５の厚み（０．０５ｍ
ｍ）の和（約０．５５ｍｍ）よりも薄くなり、外装板９
1 ，９2 への印刷や接着材の厚みなどを考慮しても実施
形態１よりもさらに薄型化を図ることができる。しか
も、外装板９1 の内側面に配線パターンを形成する作業
や外装板９1 の配線パターンにＩＣチップ１並びに電子
回路部品２を実装する作業などは従来例におけるプリン
ト基板の加工作業や配線作業に比較して容易に行うこと
ができ、コストアップを招くこともない。Here, assuming that the thickness of each part is the same as that of the conventional example, the thickness of the main body A'in this embodiment is equal to the thickness (0.1 mm × 2) of the exterior plates 9 1 and 9 2 and the IC. Chip 1
Thickness (0.3 mm) and bump 5 thickness (0.05 m
m) is thinner than the sum (about 0.55 mm), and the exterior plate 9
Even in consideration of printing on 1 , 9 2 and the thickness of the adhesive, it is possible to make the device thinner than in the first embodiment. Moreover, machining work and wiring work of the printed circuit board in the prior art such as the work of mounting the IC chip 1 and the electronic circuit component 2 on the wiring pattern of the work and the outer plate 9 1 for forming a wiring pattern on the inner surface of the outer casing 9 1 Compared with the above, it can be performed more easily and does not increase the cost.
【００１６】[0016]
【発明の効果】請求項１の発明は、カード型の本体にＩ
Ｃチップを含む電子回路部品が配設されて成るカード型
電子回路装置の構造において、内側面に配線パターンが
形成された外装板によって本体を構成し、表面に電子回
路部品が実装され且つ裏面にて外装板の内側面と密着し
外装板の配線パターンと電気的に接続されるプリント基
板を本体内に納装するとともに、プリント基板の厚み方
向に貫通した収納孔にＩＣチップを収納して、プリント
基板と接続されている外装板の内側面の配線パターンと
ＩＣチップとをバンプにより接続し、プリント基板の表
裏両面に形成された配線パターンをプリント基板の厚み
方向に貫通して形成されるスルーホールにより接続して
成るので、ＩＣチップをプリント基板に設けた収納孔の
内部に収納することにより、ＩＣチップの部分における
本体の厚みがプリント基板の厚み分だけ薄くでき、しか
も、プリント基板の加工も容易に行うことができるから
コストアップを招くこともなく、薄型のカード型電子回
路装置を安価に製造できるという効果がある。According to the invention of claim 1, the card-type main body has an I
In a structure of a card type electronic circuit device in which electronic circuit components including a C chip are arranged, a main body is constituted by an exterior plate having a wiring pattern formed on an inner side surface, electronic circuit components are mounted on a front surface and a rear surface is mounted on a rear surface. The printed circuit board that is in close contact with the inner surface of the exterior plate and is electrically connected to the wiring pattern of the exterior plate is installed in the main body, and the IC chip is stored in the storage hole that penetrates in the thickness direction of the printed circuit board. A through formed by connecting the wiring pattern on the inner surface of the exterior plate connected to the printed board and the IC chip by bumps, and penetrating the wiring patterns formed on both front and back surfaces of the printed board in the thickness direction of the printed board. Since the IC chips are connected by holes, the thickness of the main body at the IC chip portion is reduced by accommodating the IC chips inside the accommodating holes provided in the printed circuit board. Can be thinned by the thickness of the preparative substrate component, moreover, without incurring the cost because it is possible to perform also easily processed in the printed circuit board, there is an effect that can be manufactured inexpensively a thin card-type electronic circuit device.
【００１７】請求項２の発明は、カード型の本体にＩＣ
チップを含む電子回路部品が配設されて成るカード型電
子回路装置の構造において、内側面に配線パターンが形
成された外装板によって本体を構成し、この外装板の内
側面にＩＣチップを含む電子回路部品を実装して成るの
で、コストアップを招くことなく、従来例に比べてプリ
ント基板の厚み分だけ本体の厚みを薄くでき、薄型のカ
ード型電子回路装置を安価に製造できるという効果があ
る。According to a second aspect of the present invention, an IC is mounted on a card type main body.
In a structure of a card type electronic circuit device in which an electronic circuit component including a chip is arranged, an outer plate having a wiring pattern formed on an inner surface constitutes a main body, and an electronic chip including an IC chip is formed on an inner surface of the outer plate. Since the circuit components are mounted, there is an effect that the thickness of the main body can be reduced by the thickness of the printed circuit board as compared with the conventional example without increasing the cost, and a thin card-type electronic circuit device can be manufactured at low cost. .
【図１】実施形態１を示す側面断面図である。FIG. 1 is a side sectional view showing a first embodiment.
【図２】実施形態２を示す側面断面図である。FIG. 2 is a side sectional view showing a second embodiment.
【図３】従来例を示す側面断面図である。FIG. 3 is a side sectional view showing a conventional example.
【図４】他の従来例を示す側面断面図である。FIG. 4 is a side sectional view showing another conventional example.
Ａ 本体 １ ＩＣチップ ２ 電子回路部品 ３ プリント基板 ３ａ 収納孔 ３ｂ スルーホール ４1 ，４2 外装板 ５ バンプ ６ 枠体 ７ 封止板A Main body 1 IC chip 2 Electronic circuit component 3 Printed circuit board 3a Storage hole 3b Through hole 4 1 , 4 2 Exterior plate 5 Bump 6 Frame body 7 Sealing plate
Claims (2)
回路部品が配設されて成るカード型電子回路装置の構造
において、内側面に配線パターンが形成された外装板に
よって本体を構成し、表面に電子回路部品が実装され且
つ裏面にて外装板の内側面と密着し外装板の配線パター
ンと電気的に接続されるプリント基板を本体内に納装す
るとともに、プリント基板の厚み方向に貫通した収納孔
にＩＣチップを収納して、プリント基板と接続されてい
る外装板の内側面の配線パターンとＩＣチップとをバン
プにより接続し、プリント基板の表裏両面に形成された
配線パターンをプリント基板の厚み方向に貫通して形成
されるスルーホールにより接続して成ることを特徴とす
るカード型電子回路装置の構造。1. A structure of a card-type electronic circuit device in which an electronic circuit component including an IC chip is arranged in a card-type main body, the main body is constituted by an exterior plate having a wiring pattern formed on an inner side surface, and a surface is formed. A printed circuit board on which electronic circuit parts are mounted and which is in close contact with the inner surface of the outer plate on the back side and electrically connected to the wiring pattern of the outer plate is installed in the main body and penetrated in the thickness direction of the printed circuit board. The IC chip is housed in the housing hole, the wiring pattern on the inner surface of the exterior plate connected to the printed board and the IC chip are connected by bumps, and the wiring patterns formed on both front and back surfaces of the printed board are connected to the printed board. A structure of a card type electronic circuit device, characterized in that they are connected by through holes formed so as to penetrate in the thickness direction.
回路部品が配設されて成るカード型電子回路装置の構造
において、内側面に配線パターンが形成された外装板に
よって本体を構成し、この外装板の内側面にＩＣチップ
を含む電子回路部品を実装して成ることを特徴とするカ
ード型電子回路装置の構造。2. In a structure of a card type electronic circuit device in which an electronic circuit component including an IC chip is arranged in a card type main body, the main body is constituted by an exterior plate having a wiring pattern formed on an inner side surface thereof. A structure of a card-type electronic circuit device, characterized in that an electronic circuit component including an IC chip is mounted on an inner surface of an exterior plate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5957796A JPH09248986A (en) | 1996-03-15 | 1996-03-15 | Structure of card-type electric circuit device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5957796A JPH09248986A (en) | 1996-03-15 | 1996-03-15 | Structure of card-type electric circuit device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH09248986A true JPH09248986A (en) | 1997-09-22 |
Family
ID=13117234
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5957796A Pending JPH09248986A (en) | 1996-03-15 | 1996-03-15 | Structure of card-type electric circuit device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH09248986A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6313521B1 (en) | 1998-11-04 | 2001-11-06 | Nec Corporation | Semiconductor device and method of manufacturing the same |
-
1996
- 1996-03-15 JP JP5957796A patent/JPH09248986A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6313521B1 (en) | 1998-11-04 | 2001-11-06 | Nec Corporation | Semiconductor device and method of manufacturing the same |
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