WO2012141246A1

WO2012141246A1 - Ic module and ic card

Info

Publication number: WO2012141246A1
Application number: PCT/JP2012/060013
Authority: WO
Inventors: 和宏保坂; 辻井　雅人; 加藤　裕; 谷中　雅顕
Original assignee: 凸版印刷株式会社
Priority date: 2011-04-12
Filing date: 2012-04-12
Publication date: 2012-10-18
Also published as: TW201303742A; JP6079624B2; JPWO2012141246A1

Abstract

This IC module is provided with a substrate which has a first surface and a second surface upon the opposite side of the first surface, and upon which a connection terminal for connecting to a read and write device is formed upon the first surface thereof; an IC chip which is mounted upon the second surface and which is electrically connected to the connection terminal by wire bonding; and a resin mold which covers the IC chip. In the thickness direction of the substrate, the remaining thickness after subtracting the thickness of the IC chip from the thickness of the resin mold is greater than the thickness of the IC chip.

Description

IC module and IC card

The present invention relates to an IC module.
This application claims priority based on Japanese Patent Application No. 2011-088190 filed in Japan on April 12, 2011, the contents of which are incorporated herein by reference.

An IC card to which an IC module is attached is known. The IC card has a feature that it has a large storage capacity and is difficult to counterfeit compared to a conventional card to which a magnetic stripe is attached.
The shape of the IC card is standardized by ISO. For example, an IC module having a thickness of less than 0.76 mm is incorporated into an IC card having a thickness dimension of 0.76 mm. A general IC module includes a resin substrate having a contact terminal that can be connected to an external read / write device, an IC chip mounted on the resin substrate, and a resin mold that covers the IC chip.
When carrying an IC card to which an IC module is attached, an external force due to bending or a load may be applied to the IC module. When an external force is applied to the IC module and the IC module is damaged, the function of the IC module is impaired. For the purpose of preventing the IC module from being damaged, for example, Patent Documents 1 to 9 disclose a structure that can prevent the IC chip from breaking in the IC module.

Japanese Laid-Open Patent Publication No. Sho 63-145093 Japanese Unexamined Patent Publication No. 2-188298 International Publication No. 99/04367 Specification Japanese Unexamined Patent Publication No. 2002-123809 Japanese Unexamined Patent Publication No. 2004-264983 Japanese Unexamined Patent Publication No. 2006-268718 Japanese Unexamined Patent Publication No. 2006-18371 Japanese Unexamined Patent Publication No. 2006-331198 Japanese Unexamined Patent Publication No. 2007-1836

Each invention disclosed in Patent Literature 1 to Patent Literature 9 has means for reinforcing the IC chip for the purpose of preventing the IC chip from breaking in the IC module. However, when the cause of the IC card that actually failed was investigated in detail, it was found that most of the cause was not a breakage of the IC chip itself but a disconnection due to breakage of the resin mold.
Further, since the IC chip has been downsized due to recent technological innovation, the possibility of the IC chip being damaged when an external force is applied to the IC card is lower than before. On the other hand, since the shape and arrangement of the connection terminals of the IC module are standardized for the purpose of maintaining the compatibility of the IC card, it is difficult to reduce the size of the resin mold.
In each invention of patent documents 1 thru / or 9, since a disconnection by a resin mold being damaged cannot be prevented, it is insufficient as a measure for preventing failure of an IC module.

The present invention has been made in view of the above-described circumstances, and an object thereof is to provide an IC module and an IC card with a low occurrence frequency of failures.

In order to solve the above problems, the present invention employs the following means.
An IC module according to one embodiment of the present invention has a first surface and a second surface opposite to the first surface, and a connection terminal for connecting to a read / write device is formed on the first surface. An IC chip mounted on the second surface and conducted to the connection terminal by wire bonding; a resin mold that covers the IC chip, and in the thickness direction of the substrate, A residual thickness obtained by subtracting the thickness of the IC chip from the thickness of the resin mold is larger than the thickness of the IC chip.

The IC module may satisfy the following formula.

Here, h ₁ is the thickness of the IC chip, E ₁ is the elastic modulus of the IC chip, ha is the thickness of the resin mold, and E ₂ is the elastic modulus of the resin mold.

The IC module may satisfy the following formula.

Here, y ₁ is the thickness of the IC chip, E ₁ is the elastic modulus of the IC chip, t is the thickness of the resin mold, and E ₂ is the elastic modulus of the resin mold.

The resin mold is preferably made of a uniform kneaded material containing at least one of a thermoplastic resin, a thermosetting resin, and an ultraviolet curable resin.

The Young's modulus of the IC chip may be higher than the Young's modulus of the resin mold.

An IC card according to one embodiment of the present invention has a first surface and a second surface opposite to the first surface, and a connection terminal for connecting to a read / write device is formed on the first surface. An IC module including: an IC chip mounted on the second surface and electrically connected to the connection terminal by wire bonding; and a resin mold that covers the IC chip; And a resin base material on which a housing portion having a bottomed hole shape is formed, wherein the IC module is housed so that the resin mold faces a bottom surface of the housing portion. In the thickness direction of the IC card, the thickness of the IC chip is subtracted from the sum of the thickness of the resin mold and the thickness of the resin base material in the region where the housing portion is formed. Residual thickness is greater than the thickness of the IC chip.

The IC card may satisfy the following formula.

The IC card may satisfy the following formula.

According to the IC module and the IC card according to the above aspect of the present invention, the frequency of occurrence of failures in the IC module can be reduced.

It is a top view of the IC card with which the IC module which concerns on 1st Embodiment of this invention was attached. FIG. 2 is a cross-sectional view taken along line AA in FIG. It is a schematic diagram which shows the state in which the external force was applied to the IC card with which the conventional IC module was attached. It is a schematic diagram of an IC card showing a state where an external force is applied to the IC module of the embodiment. It is a figure which shows the IC card which concerns on 2nd Embodiment of this invention, and is sectional drawing along the line selected similarly to the AA line of FIG. It is a graph which shows the result of the linear pressure evaluation test in the Example and comparative example of this invention. It is a graph which shows the result of the linear pressure evaluation test in the Example and comparative example of this invention. It is explanatory drawing for demonstrating the curvature center and neutral surface in the beam to which the bending load was applied. 7 is a graph showing the results of linear pressure evaluation tests in Examples 3 to 7 of the present invention. 7 is a graph showing the results of linear pressure evaluation tests in Examples 3 to 7 of the present invention.

(First embodiment)
The IC module 5 and the IC card 1 according to the first embodiment of the present invention will be described.
FIG. 1 is a plan view showing the IC card 1. FIG. 2 is a cross-sectional view taken along line AA in FIG.
As shown in FIG. 1, the IC card 1 includes a resin base material 2 formed in a plate shape and an IC module 5 fixed to the resin base material 2.

The resin base material 2 is formed in a predetermined shape by, for example, a thermoplastic resin. The shape of the resin substrate 2 is determined according to the purpose of use of the IC card 1. The dimensions of the IC card are standardized by a standards organization such as ISO. Taking a cash card used in a financial institution as an example, the shape of the resin base material 2 conforms to ISO / IEC 7810 and JIS X 6301, and has a width of 85.60 mm, a height of 53.98 mm, and a thickness of 0.8. 76 mm (760 μm). Hereinafter, an example of the IC card 1 having a width of 85.60 mm, a height of 53.98 mm, and a thickness of 760 μm will be described.

As shown in FIG. 2, the resin base material 2 is formed with a housing portion 3 for housing the IC module 5. For example, in the case of the above-described cash card, the position of the accommodating portion 3 in the resin base material 2 is determined so that a connection terminal 7 to be described later can be arranged at a position defined in ISO 7816-2.
In the present embodiment, the accommodating portion 3 has, for example, a bottomed hole shape having a rectangular opening on the first surface 2a of the resin base material 2 (hereinafter, this surface is referred to as “surface”). Yes. The bottom portion 4 of the housing portion 3, that is, the region of the resin base material 2 where the housing portion 3 is formed is the second surface 2b of the resin base material 2 (hereinafter, this surface is referred to as "back surface"). Is formed to a thickness having sufficient rigidity to be flat. In this embodiment, the thickness dimension t4 of the bottom part 4 of the accommodating part 3 is 100 micrometers. In this embodiment, the depth dimension d3 of the accommodating portion 3 formed on the resin base material 2 is 660 μm obtained by subtracting 100 μm that is the thickness of the bottom portion 4 from 760 μm that is the thickness of the resin base material 2. The IC module 5 is accommodated in the accommodating portion 3 without protruding from the opening of the accommodating portion 3 having a depth of 660 μm.

The IC module 5 is mounted on a substrate 6 on which a connection terminal 7 for connecting to a read / write device is formed on the first surface 6 a and a second surface 6 b opposite to the first surface 6 a of the substrate 6. And an IC chip 8 conducted to the connection terminal 7 by wire bonding, and a resin mold 10 covering the IC chip 8.

The substrate 6 is a wiring substrate including a glass epoxy substrate, a polyimide substrate, or a lead frame. As the substrate 6, a known structure such as a single-sided substrate, a double-sided substrate, or a multilayer substrate can be appropriately selected and adopted. The thickness dimension t6 of the substrate 6 can be appropriately set according to the thickness dimension t2 of the resin base material 2 and the strength required for the substrate 6. In the present embodiment, the thickness dimension t6 of the substrate 6 is 160 μm. The position and area of each connection terminal 7 formed on the substrate 6 are set in accordance with the dimensions defined in ISO 7816-2. The surface of each connection terminal 7 is plated with nickel, gold, or silver, or palladium or the like is deposited on the surface of each connection terminal 7. One end of a metal wire 9 is joined to each connection terminal 7. The metal wire 9 is used for connecting each connection terminal 7 and the IC chip 8 by wire bonding.

The IC chip 8 is fixed to the substrate 6 with an adhesive or an adhesive. The IC chip 8 includes a silicon wafer having a circuit part and a terminal part (not shown). The circuit unit of the IC chip 8 includes input / output means for inputting / outputting information or signals to / from the read / write device and storage means for storing information output from the read / write device. The terminal portion of the IC chip 8 is a terminal for electrically connecting the circuit portion and each connection terminal 7. The other end of the metal wire 9 used for wire bonding is joined to the terminal portion of the IC chip 8.
As the material of the metal wire 9, for example, gold, silver, copper, aluminum or the like can be adopted.

The dimension of the IC chip 8 mounted on the substrate 6 (hereinafter, this dimension is referred to as “the thickness dimension t8 of the IC chip 8”) is 200 μm or less in the thickness direction of the substrate 6. When bending stress is generated in the IC chip 8, the IC chip 8 is more likely to bend as its thickness dimension t8 is smaller, so it is difficult to break. When the thickness dimension of the resin mold is 440 μm, the thickness dimension t8 of the IC chip 8 is desirably smaller than, for example, 220 μm. Further, the thickness t8 of the IC chip 8 is more preferably 139 μm or less, and further preferably 105 μm or less.

When an external force such as an impact is applied to the IC chip 8, the IC chip 8 is cracked as the mounting area of the IC chip 8 on the second surface 6 b of the substrate 6 is smaller and the volume of the IC chip 8 is smaller. Hateful. When the volume of the IC chip 8 is smaller, the number of IC chips 8 obtained from one wafer is larger and the yield of the IC chips 8 is higher. For example, the mounting area of the IC chip 8 is preferably about 10 mm ² or less on one side. Further, the volume of the IC chip 8 is preferably about 2 mm ³ or less. In the present embodiment, the IC chip 8 mounted on the substrate 6 has a square shape of 2.5 mm square when viewed from the thickness direction of the substrate 6.

The resin mold 10 is an insulator made of a kneaded material containing at least one of a thermoplastic resin, a thermosetting resin, and an ultraviolet curable resin.
The resin mold 10 is formed so that the IC chip 8 and the metal wire 9 are completely covered. The IC module 5 is accommodated in the accommodating portion 3 so that the resin mold 10 faces the bottom surface of the accommodating portion 3. In the present embodiment, the dimension of the resin mold 10 fixed to the substrate 6 in the thickness direction of the substrate 6 (hereinafter, this dimension is referred to as “thickness dimension t10 of the resin mold 10”) is 440 μm or less. Further, the remaining thickness t10a of the resin mold 10 obtained by subtracting the thickness dimension t8 of the IC chip 8 from the thickness dimension t10 of the resin mold 10 is larger than the thickness dimension t8 of the IC chip 8.

The resin mold 10 is provided on the substrate 6 by, for example, a transfer molding method, a potting method, and a printing method, and seals the IC chip 8 and the metal wire 9. It should be noted that other methods for sealing the IC chip 8 using the resin mold 10 may be employed as appropriate.

The dimension of the IC module 5 in the thickness direction of the substrate 6 (hereinafter, this dimension is referred to as “thickness dimension t5 of the IC module 5”) is the thickness dimension t10 of the resin mold 10 and the thickness dimension t6 of the substrate 6. And the sum. That is, in the present embodiment, the thickness dimension t5 of the IC module 5 is 600 μm. The connection terminal 7 of the IC module 5 accommodated in the accommodating portion 3 having a depth dimension d3 of 660 μm and the surface of the resin base material 2 are located on the same plane. In addition, there is a gap of 60 μm between the bottom 3 a of the housing part 3 and the resin mold 10. If the condition that the remaining thickness t10a of the resin mold 10 is larger than the thickness dimension t8 of the IC chip 8 is satisfied, the thickness dimension t5 of the IC module 5 may be less than 600 μm.

The relationship between the thickness dimension t8 of the IC chip 8 and the remaining thickness t10a of the resin mold 10 can be determined from the viewpoint of making the deflection amounts of the IC chip 8 and the resin mold 10 the same, as will be described in detail below. Hereinafter, the conditions under which the deflection amounts of the IC chip and the resin mold are the same will be described.
The amount of deflection of a simple beam varies depending on how the load is applied to the beam. For example, when one end of a beam having a length l, a thickness h, and a depth b is fixed (cantilevered) and a load P is applied to the other end (concentrated load), the deflection amount V is expressed as follows. The

Further, for example, when both ends of a beam having a length l, a thickness h, and a depth b are fixed (both ends) and a load P is uniformly applied over the entire length of the beam (equally distributed load), the deflection amount V is It is expressed as follows.

As described above, the amount of deflection differs depending on how the load is applied to the beam (cantilever / both-end support, concentrated load / equally distributed load). However, the conditions under which the amount of deflection of the IC chip and the resin mold in the laminated body La are the same do not depend on how the load is applied to the laminated body La. When a bending load is applied to the laminate La having a total thickness ha and a length la, which is composed of an IC chip having a thickness dimension h1 and an elastic modulus E1, and a resin mold having a thickness dimension h2 and an elastic modulus E2, the IC chip and The condition that the amount of deflection of the resin mold is the same is expressed by the following formula (3).

Solving the above equation (3) for h1, the following equation (4) is derived.

If the thickness h1 of the IC chip satisfies the above formula (4), it is possible to suppress the breakage at the IC chip / resin mold interface due to the difference in the amount of deflection between the IC chip and the resin mold.
As illustrated in FIG. 2, in the actual IC module 5, the IC chip 8 is covered with the resin mold 10, and the area of the IC chip 8 on the surface of the substrate 6 of the IC module 5 is that of the resin mold 10. Smaller than the area. Therefore, even when the deflection amount of the IC chip 8 is larger than the deflection amount of the resin mold 10, it is possible to obtain an effect of suppressing the breakage at the IC chip / resin mold interface.
In summary, if the following formula (5) is satisfied, it is possible to suppress the breakage at the IC chip / resin mold interface due to the difference in the deflection amount of the IC chip and the resin mold.

As an example of the IC module 5 satisfying the above formulas (4) and (5), in an IC module having a total thickness of 415 μm using an IC chip having an elastic modulus E1 of 170 GPa and a resin mold having an elastic modulus E2 of 16.6 GPa The IC chip has a thickness dimension h1 of about 131 μm so that the IC chip and the resin mold have the same amount of deflection. The thickness dimension h2 of the resin mold corresponding to the above-described remaining thickness t10a is 284 μm.

The relationship between the thickness dimension t8 of the IC chip 8 and the remaining thickness t10a of the resin mold 10 is described in detail below. The IC chip 8 and the resin mold are arranged on the neutral surface in the two-layer laminate of the IC chip 8 and the resin mold 10. It can be determined from the viewpoint of matching the boundary surfaces between the ten. A neutral surface in a material is a location where the material does not stretch or contract with respect to bending, i.e., where neither tensile nor compressive stress occurs. Hereinafter, the conditions under which the interface between the IC chip and the resin mold matches the neutral surface will be described.

As shown in FIG. 8, the upper surface of the beam is y = 0, the neutral surface is at y = y ₀ , the lower surface of the beam is at y = t, and the bending center of curvature O is y = Suppose that it is in the position of -ρ. Consider a minute deformation in a minute region defined by points a, b, c, and d.
The arc length ab between the two points a and b on the neutral plane shown in FIG. 8 is (ρ + y ₀ ) dθ. The arc length cd between the two points c and d on the plane parallel to the neutral plane is (ρ + y) dθ. The point c is on a straight line connecting the two points of the curvature center O and the point a, and the point d is on a straight line connecting the two points of the curvature center O and the point b. Y is an arbitrary position in the thickness direction of the beam.
The strain ε generated in the minute arc cd is expressed by the following equation.

Accordingly, when the elastic modulus of the beam is E, the stress σ generated in the minute arc cd is expressed by the following equation.

Since the value obtained by integrating the stress σ over the entire thickness direction of the beam is zero, the following equation is established.

Here, when the above formula (8) is applied to the laminate Lb having the total thickness t, which is composed of the IC chip having the thickness dimension y1, the elastic modulus E1, and the resin mold having the thickness dimension y2, the elastic modulus E2, The formula is obtained.

In the above equation (9), when y ₀ = y ₁ , that is, when the IC chip lower surface / resin mold interface coincides with the neutral surface, y ₁ is represented by the following equation.

Satisfies thickness y ₁ of the IC chip above formula (10), it is possible to suppress the breakage due to bending stress in the IC chip lower surface / resin mold surface.
When the thickness dimension of the IC chip is made smaller and the IC chip lower surface / resin mold interface is closer to the center of curvature than the neutral surface, the IC chip lower surface / resin mold interface has a compressive stress, not a tensile stress. Take it. In this case, the resin mold or the like is not broken by the tensile stress at the IC chip lower surface / resin mold interface. Therefore, even when the IC chip lower surface / resin mold interface is closer to the center of curvature than the neutral surface, an effect of suppressing breakage due to bending stress at the IC chip lower surface / resin mold interface can be obtained.
In summary, if the following formula (11) is satisfied, it is possible to suppress the breakage at the IC chip lower surface / resin mold interface due to the positional relationship between the IC chip lower surface / resin mold interface and the neutral surface.

As an example of the IC module 5 satisfying the above formulas (10) and (11), a laminate having a total thickness t = 415 μm using an IC chip having an elastic modulus E1 of 170 GPa and a resin mold having an elastic modulus E2 of 16.6 GPa. In Lb, the thickness y1 of the IC chip is about 100 μm. The thickness _{t-y 1} of the resin mold corresponding to the above-described residual thickness t10a is about 315 .mu.m.

Note that the thickness of the resin mold corresponding to the above-described remaining thickness t10a is 600 μm or less, and preferably about 400 μm or less. Since the thickness of the substrate of the IC module is about 100 to 200 μm and the thickness of the IC chip is about several tens of μm to 200 μm, if the thickness of the resin mold is larger than 600 μm, the thickness of the IC card is an IC according to JIS standards. The card will not fit in the thickness of 760 μm. Depending on the thickness of the substrate of the IC module and the thickness of the IC chip, if the thickness of the resin mold is larger than 400 μm, the thickness of the IC card does not fit in the thickness of 760 μm of the IC card according to the JIS standard.

The operation of the IC module 5 configured as described above will be described. FIG. 3 is a schematic diagram showing a state in which an external force is applied to an IC card to which a conventional IC module is attached. FIG. 4 is a schematic diagram of the IC card 1 showing a state in which an external force is applied to the IC module 5 according to the present embodiment.

Generally, IC cards are stored in wallets and card cases. In addition, a wallet or card case in which an IC card is stored may be stored in a trouser pocket, for example. When sitting on a chair or the like with a wallet or card case stored in a trouser pocket, an excessive load is applied to the IC card, and the IC card may be bent as shown in FIGS. When the carryer's weight and other external forces are transmitted to the resin mold of the IC module, bending stress is generated in the resin mold.

In the conventional IC module 105 shown in FIG. 3, a crack extending from the peripheral edge of the IC chip 108 in the thickness direction of the IC chip 108 occurs in the resin mold (indicated by reference numeral 110). This is because the hardness of the IC chip 108 and the resin mold 110 are different. For example, when the material of the IC chip 108 is silicon (Si), the Young's modulus of the IC chip 108 is about 170 GPa. When the material of the resin mold 110 is a commonly used thermosetting resin, the Young's modulus of the resin mold 110 is about 17 GPa.
That is, the IC chip 108 and the resin mold 110 are completely different in the amount of deflection with respect to bending stress. In other words, the resin mold 110 that is relatively softer than the relatively hard IC chip 108 causes a greater deflection.
It is considered that a crack is generated from the interface between the IC chip 108 and the resin mold 110 due to the difference in deflection amount between the IC chip 108 and the resin mold 110.

When a strong external force is applied to the conventional IC card 101 or a repeated external force is applied, a crack generated at the interface grows in the resin mold 110 and is bonded to the bonding wire 109 sealed in the resin mold 110. Reach up to. When the crack reaches the bonding wire 109, the bonding wire 109 may be cut off due to separation or displacement on the crack surface of the resin mold 110.

On the other hand, in the IC card 1 according to this embodiment shown in FIG. 4, the remaining thickness t10a of the resin mold 10 is larger than the thickness of the IC chip 8. The amount of deflection with respect to the bending stress described above is governed by hardness (Young's modulus) and thickness when considered simply. That is, according to the IC card 1 in which the thickness of the harder IC chip 8 is thinner and the softer resin mold 10 is thicker, the difference between the deflection amounts of both can be made smaller than that of the conventional IC card. Therefore, the resin mold 10 is less likely to crack due to external force than the conventional IC card. If the resin mold 10 is not cracked, the bonding wire will not be broken, so that the function of the IC module 5 is maintained.

In the IC card 1 according to the present embodiment, since the thickness t8 of the IC chip 8 is thin and the resin mold 10 is not easily cracked as described above, the possibility that the metal wire 9 is disconnected is kept low. . For this reason, the possibility that the function of the IC module 5 is impaired even though the IC chip 8 is not damaged is lower than that of the conventional IC module 105. In the IC card 1 according to the present embodiment, when an external force is applied to the resin mold 10 to cause the above cracks, the IC chip 8 itself may be broken.

As described above, according to the IC module 5 and the IC card 1 according to the present embodiment, the frequency of occurrence of failures in the IC module 5 can be reduced.
A reinforcing plate or the like may be attached to the resin mold for the purpose of reinforcing the resin mold. When the resin mold 10 is made of a uniform kneaded material containing at least one of a thermoplastic resin, a thermosetting resin, and an ultraviolet curable resin as in the present embodiment, the resin mold and the reinforcing plate are There is no need to consider the possibility of peeling. For this reason, it is possible to keep the occurrence rate of failure in the IC module 5 from varying depending on each IC card or depending on use conditions.

(Second Embodiment)
Next, an IC card 1A according to a second embodiment of the present invention will be described. In the present embodiment, the same components as those described in the first embodiment described above are denoted by the same reference numerals, and redundant description is omitted. FIG. 5 is a view showing the contact type IC card according to the present embodiment, and is a cross-sectional view along a selected line similar to the AA line of FIG.

As shown in FIG. 5, in the IC card 1 </ b> A of the present embodiment, the resin mold 10 is reinforced by the bottom portion 4 of the housing portion 3, that is, the region where the housing portion 3 of the resin base material 2 is formed. This is different from the IC card 1 of the first embodiment described above.
In the IC card 1A, the bottom portion 4 of the housing portion 3, the resin mold 10, the IC chip 8, and the substrate 6 are laminated in this order in the thickness direction of the resin base material 2 composed of a single layer or a plurality of layers. That is, the IC module 5 is accommodated in the accommodating portion 3 so that the resin mold 10 faces the bottom surface of the accommodating portion 3. In the present embodiment, the resin mold 10 is in close contact with the bottom 4 of the housing 3. For example, the resin mold 10 can be fixed to the housing portion 3 by applying an adhesive to one surface of the resin mold 10 and bonding the surface to the bottom surface of the housing portion 3.

The thickness t4 of the bottom 4 of the housing 3 is such that the IC module 5 can be housed in the housing 3 so that the IC module 5 does not protrude from the surface of the resin base material 2, and the back surface of the IC card 1A. It should be set to a value that does not impair the beauty of For example, the thickness dimension t4 of the bottom part 4 of the accommodating part 3 can be selected from a range of 100 μm or more and less than 160 μm. In the IC card 1A having a thickness of 760 μm, when the thickness dimension t5 of the IC module 5 is less than 600 μm, the thickness dimension t4 of the bottom portion 4 of the housing portion 3 is 160 μm or more. The thickness t4 of the bottom part 4 is determined in a range where the thickness of the IC card 1A does not exceed 760 μm.
In the thickness direction of the IC card 1A, the remaining thickness t10aA obtained by subtracting the thickness of the IC chip 8 from the sum of the thickness of the resin mold 10 and the thickness of the bottom 4 is larger than the thickness of the IC chip 8.

In the present embodiment, the resin mold 10 is reinforced by the bottom portion 4 of the housing portion 3 by fixing the bottom portion 4 of the housing portion 3 and the resin mold 10. For this reason, even when an external force such as bending or impact is applied to the IC card 1A, the resin mold 10 is not easily broken as in the first embodiment. Further, in the IC card 1A, since the resin mold 10 is reinforced by the bottom portion 4 of the housing portion 3, even if the thickness dimension t10 of the resin mold 10 is made smaller than that in the first embodiment, the remaining thickness t10aA is the IC. As long as the relationship that the thickness is larger than the thickness of the chip 8 is satisfied, the same effect as the IC card 1 of the first embodiment can be obtained.

The antenna module is formed on a resin base material used for the IC card, or a separate antenna sheet on which the antenna is formed is laminated on the IC card, and the IC module 5 according to the above embodiment attached to the antenna and the IC card By connecting the two, it is possible to obtain a so-called dual IC card capable of contact-type communication and non-contact-type communication.

Next, based on each example shown below, the IC module and the IC card according to the embodiment of the present invention will be described in more detail.
The relationship between the residual thickness of the resin mold and the thickness dimension of the IC chip in the following IC module is different between each example and comparative example. Using these IC modules, the relationship between the remaining thickness of the resin mold and the thickness dimension of the IC chip and the occurrence of cracks in the resin mold was examined. Specifically, an IC module satisfying the following dimensional conditions was manufactured, and an IC card was manufactured by fixing each IC module to a housing portion of a resin base material. A linear pressure evaluation test was performed on each manufactured IC card. 6 and 7 are graphs showing the results of the linear pressure evaluation test.

<Dimensional conditions>
Example 1
IC module thickness dimension: 540 μm
Substrate thickness dimension: 160 μm
IC chip thickness dimension: 150 μm
Resin mold thickness: 380 μm
Resin mold remaining thickness: 230 μm
(Example 2)
IC module thickness dimension: 540 μm
Substrate thickness dimension: 160 μm
IC chip thickness dimension: 180 μm
Resin mold thickness: 380 μm
Resin mold remaining thickness: 200 μm
(Example 3)
IC module thickness dimension: 575 μm
Substrate thickness dimension: 159 μm
IC chip thickness dimension: 80 μm
Resin mold thickness: 416 μm
Resin mold remaining thickness: 336 μm
Example 4
IC module thickness dimension: 575 μm
Substrate thickness dimension: 159 μm
IC chip thickness dimension: 100 μm
Resin mold thickness: 416 μm
Resin mold remaining thickness: 316 μm
(Example 5)
IC module thickness dimension: 575 μm
Substrate thickness dimension: 159 μm
IC chip thickness dimension: 130 μm
Resin mold thickness: 416 μm
Resin mold remaining thickness: 286 μm
(Example 6)
IC module thickness dimension: 575 μm
Substrate thickness dimension: 159 μm
IC chip thickness dimension: 185μm
Resin mold thickness: 416 μm
Resin mold remaining thickness: 231 μm
(Example 7)
IC module thickness dimension: 575 μm
Substrate thickness dimension: 159 μm
IC chip thickness dimension: 250 μm
Resin mold thickness: 416 μm
Resin mold remaining thickness: 166 μm
(Comparative Example 1)
IC module thickness dimension: 540 μm
Substrate thickness dimension: 160 μm
IC chip thickness dimension: 210 μm
Resin mold thickness: 380 μm
Resin mold remaining thickness: 170 μm

<Line pressure evaluation test>
A straight line parallel to one of the four sides of the IC chip when viewed from the thickness direction of the IC card and separated from the IC chip by about 1 mm (referred to as “first straight line X” in FIG. 1). ) The surface of the IC card was pressed above, and the load when a crack occurred in the resin mold was measured. In addition, for an IC card to which another IC module manufactured under the above dimensional conditions is attached, a straight line orthogonal to the first straight line X when viewed from the thickness direction of the IC card and separated from the IC chip by about 1 mm (reference numeral in FIG. 1). This is indicated by Y. Hereinafter, the surface of the IC card is pressed on the “second straight line Y”), and the load when a crack occurs in the resin mold is measured.

<Result>
As shown in FIGS. 6 and 7, the results of the linear pressure evaluation tests in Examples 1 and 2 and Comparative Example 1 show that the resin mold cracks when the remaining thickness of the resin mold becomes larger than the thickness dimension of the IC chip. It shows that the load required to make it increase.

From the above results, as shown in Example 1, it is possible to cause the resin mold to crack by making the remaining thickness of the resin mold larger than the thickness dimension of the IC chip and making the deflection amount of the resin mold and the IC chip closer. It was found that it can be kept low. That is, it was found that the frequency of occurrence of IC module failures can be reduced by making the remaining thickness of the resin mold larger than the thickness dimension of the IC chip.

9 and 10 show the results of the linear pressure evaluation test for each IC card using the IC modules of Examples 3 to 7. FIG. In the IC modules of Examples 3 to 7, the thickness dimension of the resin mold is constant, but the thickness dimension of the IC chip is different and is 80, 100, 130, 185, and 250 μm, respectively.
Table 1 shows the number of times the resin mold was cracked at the IC chip / resin mold interface, that is, the number of times the resin mold was broken at the IC chip / resin mold interface, for the IC modules of Examples 3 to 7.

From the results of FIGS. 9 and 10, it can be seen that the smaller the IC chip thickness dimension is, that is, the greater the residual thickness of the resin mold, the greater the load required to cause cracks in the resin mold. Further, from Table 1, the number of times of destruction at the IC chip / resin mold interface is drastically reduced from Example 5 (IC chip thickness dimension: 130 μm), and Example 4 (IC chip thickness dimension: 100 μm), it can be seen that the number of fractures at the interface is further reduced. That is, if the thickness dimension of the IC chip is 130 μm or less, the destruction at the IC chip / resin mold interface is difficult to occur, and if the thickness dimension of the IC chip is 100 μm or less, the destruction mode changes and the destruction at the interface occurs more. You can see that it is difficult.

More specifically, the IC module of Example 5 satisfies the above formula (4). That is, the IC module of Example 5 is configured so that the IC chip and the resin mold have the same amount of deflection. Therefore, in the IC module of Example 5, it is considered that the breakage at the IC chip / resin mold interface due to the difference in deflection amount between the IC chip and the resin mold is further suppressed.
As illustrated in FIG. 2, in the IC module 5, the IC chip 8 is covered with the resin mold 10, and the area of the IC chip 8 on the surface of the substrate 6 of the IC module 5 is larger than the area of the resin mold 10. Is also small. Therefore, even when the deflection amount of the IC chip 8 is larger than the deflection amount of the resin mold 10, the effect of suppressing the breakage at the IC chip / resin mold interface can be obtained.
As described above, among the IC modules of Examples 3 to 7, in the IC modules of Examples 3 to 5 in which the thickness dimension of the IC chip is 130 μm or less, the lower surface of the IC chip due to the difference in deflection amount between the IC chip and the resin mold / It is considered that the breakage at the resin mold interface is further suppressed.

The IC module of Example 4 satisfies the above formula (10). That is, the IC module of Example 4 is configured such that the interface between the IC chip and the resin mold matches the neutral surface. Therefore, in the IC module of Example 4, it is considered that the breakage due to bending stress at the IC chip lower surface / resin mold interface is further suppressed.
When the thickness dimension of the IC chip is made smaller and the IC chip lower surface / resin mold interface is closer to the center of curvature than the neutral surface, the IC chip lower surface / resin mold interface has a compressive stress, not a tensile stress. Take it. In this case, the resin mold or the like is not broken by the tensile stress at the IC chip lower surface / resin mold interface. Therefore, even when the IC chip lower surface / resin mold interface is closer to the center of curvature than the neutral surface, an effect of suppressing breakage due to bending stress at the IC chip lower surface / resin mold interface can be obtained.
As described above, among the IC modules of Examples 3 to 7, in the IC modules of Examples 3 and 4 in which the thickness dimension of the IC chip is 100 μm or less, the fracture due to the bending stress at the IC chip lower surface / resin mold interface occurs. It is thought that it is suppressed more.

As described above, the embodiments of the present invention have been described in detail with reference to the drawings. However, the specific configuration is not limited to the above-described embodiments, and includes design changes and the like without departing from the gist of the present invention.

It is possible to provide an IC module and an IC card with a low occurrence frequency of failures.

DESCRIPTION OF

SYMBOLS

1, 1A IC card 2 Resin base material 3 Accommodating part 4 Bottom part 5 IC module 6 Substrate 7 Connection terminal 8 IC chip 9 Metal wire 10 Resin mold

Claims

A substrate having a first surface and a second surface opposite to the first surface, wherein a connection terminal for connection to a read / write device is formed on the first surface;
An IC chip mounted on the second surface and conducted to the connection terminal by wire bonding;
A resin mold covering the IC chip;
With
An IC module in which a remaining thickness obtained by subtracting the thickness of the IC chip from the thickness of the resin mold in the thickness direction of the substrate is larger than the thickness of the IC chip.
The IC module according to claim 1 satisfying the following formula.

Here, h 1 is the thickness of the IC chip, E 1 is the elastic modulus of the IC chip, ha is the thickness of the resin mold, and E 2 is the elastic modulus of the resin mold.
The IC module according to claim 1 satisfying the following formula.

Here, y 1 is the thickness of the IC chip, E 1 is the elastic modulus of the IC chip, t is the thickness of the resin mold, and E 2 is the elastic modulus of the resin mold.
2. The IC module according to claim 1, wherein the resin mold is made of a uniform kneaded material containing at least one of a thermoplastic resin, a thermosetting resin, and an ultraviolet curable resin.
2. The IC module according to claim 1, wherein the Young's modulus of the IC chip is higher than the Young's modulus of the resin mold.
A substrate having a first surface and a second surface opposite to the first surface, wherein a connection terminal for connection to a read / write device is formed on the first surface; on the second surface; An IC chip mounted on the IC chip and connected to the connection terminal by wire bonding; and a resin mold that covers the IC chip;
A resin base material in which a housing portion having a bottomed hole shape in which the IC module is housed is formed;
An IC card with
The IC module is accommodated in the accommodating portion so that the resin mold faces the bottom surface of the accommodating portion,
In the thickness direction of the IC card, a residual thickness obtained by subtracting the thickness of the IC chip from the sum of the thickness of the resin mold and the thickness of the resin base material in the region where the housing portion is formed is An IC card larger than the thickness of the chip.
The IC card according to claim 6 satisfying the following formula.

Here, h 1 is the thickness of the IC chip, E 1 is the elastic modulus of the IC chip, ha is the thickness of the resin mold, and E 2 is the elastic modulus of the resin mold.
The IC card according to claim 6 satisfying the following formula.

Here, y 1 is the thickness of the IC chip, E 1 is the elastic modulus of the IC chip, t is the thickness of the resin mold, and E 2 is the elastic modulus of the resin mold.