CN211236933U - Chip assembly, fingerprint identification module and electronic device - Google Patents

Abstract

The application provides a chip module, fingerprint identification module and electron device, wherein, the chip module includes: base plate, circuit board, chip, recess and protection glue film. The circuit board is arranged on the substrate and is provided with a through hole penetrating through the circuit board. The chip is arranged on the substrate and is positioned in the through hole, an annular gap is formed between the chip and the wall of the through hole, and one end of the chip is electrically connected with the circuit board through a plurality of wires; the groove is arranged on the substrate and communicated with the annular gap, extends along a first direction and divides the annular gap into a first area and a second area; the protective adhesive layer is arranged on the substrate and covers the plurality of leads. The application provides a chip assembly, the glue of encapsulation wire can flow into in the recess, has avoided glue to flow into among the clearance of chip and circuit board to avoided glue shrink in the curing process to lead to the stress distribution between chip and the circuit board uneven, lead to the emergence of the warping condition of chip assembly, and then guaranteed the use reliability of chip assembly.

Description

Chip assembly, fingerprint identification module and electronic device

Technical Field

The application relates to the technical field of fingerprint identification, in particular to a chip assembly, a fingerprint identification module with the chip assembly and an electronic device with the fingerprint identification module.

Background

The statements in this application as background to the related art related to this application are merely provided to illustrate and facilitate an understanding of the contents of the present application and are not to be construed as an admission that the applicant expressly or putatively admitted the prior art of the filing date of the present application at the first filing date.

With the development of electronic technology, fingerprint identification technology is widely applied to various electronic devices due to its convenience in use and high security. Be equipped with the chip subassembly in the fingerprint identification module, chip subassembly among the prior art mainly includes circuit board, chip and a plurality of wire, and wherein, chip and circuit board are come electric sex connection through the wire, and when encapsulating fingerprint chip subassembly, the wire needs to be fixed through glue. In the curing process of the glue, the glue flows into the gap between the chip and the circuit board, and the contraction of the glue causes uneven stress distribution between the chip and the circuit board, so that the chip assembly is warped, and the normal use is influenced.

SUMMERY OF THE UTILITY MODEL

The application provides a sensitization subassembly, fingerprint identification module and electron device, can prevent that the glue of encapsulation wire from flowing into in the clearance of chip and circuit board, avoid the chip subassembly to take place the warpage.

Embodiments of a first aspect of the present application provide a chip assembly, comprising: a substrate; a circuit board disposed on the substrate and having a through hole penetrating the circuit board; the chip is arranged on the substrate and positioned in the through hole, an annular gap is formed between the chip and the wall of the through hole, and one end of the chip is electrically connected with the circuit board through a plurality of wires; the groove is arranged on the substrate and is communicated with the annular gap, the groove extends along a first direction and divides the annular gap into a first area and a second area, and the plurality of leads are positioned in the first area; and the protective adhesive layer is arranged on the substrate and covers the plurality of leads.

According to the chip assembly, in the packaging process, the glue for packaging the wires can flow into the groove, so that the glue is prevented from flowing into the gap between the chip and the circuit board, the phenomenon that the chip assembly is warped due to uneven stress distribution between the chip and the circuit board caused by shrinkage of the glue in the process of curing to form the protective glue layer is avoided, and the use reliability of the chip assembly is further ensured; in addition, the groove is simple in structure and easy to machine and manufacture, production and manufacturing cost of products is reduced, the problem of chip warping can be effectively solved, and economic benefits are good.

Optionally, the number of the grooves is two, and the two grooves are symmetrically arranged on two sides of the chip; one end of each groove extends to the hole wall of the through hole, the other end of each groove extends to the lower portion of the chip, and the chip covers the other end of each groove.

In the embodiment, the two grooves symmetrically arranged on the substrate can reduce the area of the grooves on the substrate, so that the substrate can be ensured to have higher strength; the other end of the groove extends to the lower part of the chip, so that the groove is guaranteed to have a larger size under the condition that the substrate has higher strength, and the probability that glue overflows the groove can be reduced.

Optionally, the number of the grooves is one, and two ends of each groove extend to the hole wall of the through hole along the first direction respectively.

In the embodiment, the groove is formed in the substrate, so that the difficulty of slotting on the substrate is reduced, and the substrate is easy to produce, process and manufacture, thereby improving the production efficiency of products, reducing the production and manufacturing cost of the products and achieving good economic benefit.

Optionally, the groove comprises a first groove, a second groove and a third groove which are connected in sequence; the first groove and the third groove are both communicated with the annular gap, the second groove is positioned below the chip, and the chip covers the second groove; the depth of the first groove is equal to that of the third groove, and the depth of the second groove is smaller than that of the first groove.

In this embodiment, when the glue in the first groove or the second groove is more, the glue can flow into the third groove, and under the condition that the substrate has higher strength, the groove is ensured to have a larger size, so that the probability that the glue overflows the groove can be reduced.

Optionally, the depth of the groove is 0.05mm to 0.15 mm.

In the embodiment, if the depth of the groove is less than 0.05mm and the depth of the groove is less than 0.05mm, the glue is easy to overflow out of the groove; if the depth of the groove is greater than 0.15mm, the depth of the groove is greater, and the overall strength of the substrate is affected; therefore, the depth of the groove is within 0.05-0.15 mm, the groove is ensured to have larger size under the condition of ensuring that the substrate has higher strength, and the probability of glue overflowing the groove can be reduced.

Optionally, the chip assembly further comprises: the blocking part is arranged on the substrate and located in the second area, the blocking part is close to the opening of the groove, one end of the blocking part is abutted to the chip, and the other end of the blocking part is abutted to the circuit board.

In this embodiment, when the amount of glue is relatively large, the blocking portion can play a role in blocking, further preventing the glue from flowing into the second region, the glue can only be left in the first region of the package lead, stress distribution between the chip and the circuit board cannot be caused to be uneven, and warping of the chip is avoided.

Optionally, a cross-sectional shape of the groove along a second direction perpendicular to the first direction is a triangle, and an opening of the groove is one side of the triangle.

In the embodiment, the cross section of the groove is triangular, so that the width of the groove is gradually reduced from the opening of the groove to the bottom of the groove, the occupied area of the groove on the substrate can be reduced, and the substrate can be ensured to have higher strength.

Optionally, the groove is disposed near an end of the chip connected to the wire.

In this embodiment, one end of the first region near the chip may be generally disposed flush with the end face of the chip. Therefore, the space of the annular gap can be fully utilized while the requirement of dispensing is met, and the arrangement of the groove and the second area is facilitated.

An embodiment of the second aspect of the present application provides a fingerprint identification module, including any one of the chip assemblies described above.

The application provides a fingerprint identification module, in the course of working, during glue of encapsulation wire can not flow into the clearance of optical chip and circuit board, avoided the warpage of chip subassembly.

An embodiment of the third aspect of the present application provides an electronic device, including the fingerprint identification module described above.

The application provides an electronic device, in the course of working, during the glue of encapsulation wire can not flow into the chip of fingerprint identification module and the clearance of circuit board, avoided the warpage of chip subassembly.

It is to be understood that both the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the application.

Additional aspects and advantages of the present application will be set forth in part in the description which follows, or may be learned by practice of the present application.

Drawings

The above and/or additional aspects and advantages of the present application will become apparent and readily appreciated from the following description of the embodiments, taken in conjunction with the accompanying drawings of which:

FIG. 1 is a schematic top view of a prior art chip assembly;

FIG. 2 is a schematic cross-sectional view of the chip assembly of FIG. 1;

FIG. 3 is a schematic perspective view of a first embodiment of a chip assembly according to the present application;

FIG. 4 is a schematic top view of a chip assembly according to the present application;

FIG. 5 is a schematic sectional view taken along line A-A in FIG. 4;

FIG. 6 is a schematic sectional view of the first embodiment taken along line B-B in FIG. 4;

FIG. 7 is a schematic sectional view of the second embodiment shown in FIG. 4 from B-B;

FIG. 8 is a schematic sectional view of the third embodiment from B-B in FIG. 4;

FIG. 9 is a schematic cross-sectional view of the fourth embodiment shown in FIG. 4 from B-B;

FIG. 10 is a schematic perspective view of a second embodiment of a chip assembly according to the present application;

fig. 11 is a schematic top view of a second embodiment of a chip assembly according to the present application.

Wherein, the correspondence between the reference numbers and the part names in fig. 1 to 11 is:

the chip package comprises a substrate 10, a circuit board 20, a through hole 21, a chip 30, a bonding pad 31, a groove 40, a first groove 41, a second groove 42, a third groove 43, a protective adhesive layer 50, a lead 60, a barrier portion 70, an annular gap 80, a first area 81 and a second area 82.

Detailed Description

In order that the above objects, features and advantages of the present application can be more clearly understood, the present application will be described in further detail with reference to the accompanying drawings and detailed description. It should be noted that the embodiments and features of the embodiments of the present application may be combined with each other without conflict.

In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present application, however, the present application may be practiced in other ways than those described herein, and therefore the scope of the present application is not limited by the specific embodiments disclosed below.

The following discussion provides a number of embodiments of the application. While each embodiment represents a single combination of applications, the various embodiments of the disclosure may be substituted or combined in any combination, and thus, the disclosure is intended to include all possible combinations of the same and/or different embodiments of what is described. Thus, if one embodiment comprises A, B, C and another embodiment comprises a combination of B and D, then this application should also be considered to comprise an embodiment that comprises A, B, C, D in all other possible combinations, although this embodiment may not be explicitly recited in the text below.

As shown in fig. 1 to 2, since the chip assembly mainly includes the circuit board 20, the chip 30 and a plurality of wires 60 in the prior art, the chip 30 and the circuit board 20 are electrically connected through the wires 60. The lead 60 needs to be fixed by glue when the chip assembly is packaged. During the curing process of the glue, the glue flows into the gap between the chip 30 and the circuit board 20, and the shrinkage of the glue causes uneven stress distribution between the chip 30 and the circuit board 20, resulting in warpage of the chip assembly and affecting normal use.

In order to solve the above technical problem, as shown in fig. 3 to 11, the embodiment of the present application proposes a chip assembly including a substrate 10, a circuit board 20, a chip 30, a groove 40, and a protective adhesive layer 50.

The substrate 10 is used for carrying the circuit board 20, the chip 30 and other components of the chip assembly, and the shape and size of the substrate 10 are determined according to the shape and size of the components carried on the substrate 10, and can be flexibly adjusted based on the requirement of being capable of completely carrying the required components. The substrate 10 may be a reinforced steel plate, and the reinforced steel plate can prevent the circuit board 20 from bending due to excessive flexibility of the circuit board 20 after bearing the circuit board 20, thereby improving the strength of the insertion connection between the circuit board 20 and other components. The substrate 10 includes a circuit board 20, and each component carried on the substrate 10 is disposed on the circuit board 20.

As shown in fig. 3 to 5, the circuit board 20 is provided on the substrate 10 and has a through hole 21 penetrating the circuit board 20. The type of the circuit board 20 may be a Flexible Printed Circuit (FPC), which is a printed circuit board made of a polymer material as a base material and has high reliability and excellent flexibility, and has the advantages of high wiring density, light weight, thin thickness, good bending property, and the like, and it is also convenient to form the through hole 21 on the circuit board 20. The shape of the through-hole 21 is not limited, and for example, the through-hole 21 may be a quadrangle or a circle. The circuit board 20 is fixed on the substrate 10 by an adhesive layer. Other ways, such as providing a connector on the circuit board 20 and providing a mounting hole corresponding to the connector on the substrate 10 to fix the circuit board 20, are also possible.

As shown in fig. 3 to 5, the through-hole 21 projects an orthographic projection area on the substrate 10. The orthographic projection area is the projection of the through hole 21 on the circuit board 20 along the direction perpendicular to the circuit board 20, so the size and the shape of the orthographic projection area are consistent with those of the through hole 21. In the present embodiment, in order to accommodate the shape of the chip 30 while saving space on the circuit board 20, the shape of the through-hole 21 is set to be rectangular. In the drawings, only a partial region of the substrate 10 and the circuit board 20 related to the present application is shown.

As shown in fig. 3 to 5, the chip 30 is disposed in an orthographic projection area on the substrate 10. The connection between the chip 30 and the substrate 10 may refer to the connection between the circuit board 20 and the substrate 10. The chip 30 may be provided with a photosensitive element, which is used for receiving light and converting the received light signal into an electrical signal through the chip 30.

As shown in fig. 3 to 5, there is an annular gap 80 between the chip 30 and the wall of the through hole 21. It can be understood that the annular gap 80 is an operation area defined by the substrate 10, the circuit board 20 and the chip 30, the bottom wall of the annular gap 80 is the surface of the substrate 10, one sidewall of the annular gap 80 is the wall of the through hole 21, and the other sidewall of the annular gap 80 is the outer sidewall of the chip 30. Since the chip 30 is disposed in the forward projection region, the annular gaps 80 are connected end to form a ring. The shape of the annular gap 80 is determined by the shape of the through-hole 21, the shape of the chip 30, and the position where the chip 30 is disposed on the substrate 10. In the present embodiment, since the shape of the through hole 21 and the shape of the chip 30 are both quadrilateral, the annular gap 80 may be a quadrilateral annular region.

As shown in fig. 3 to 5, the groove 40 is provided on the substrate 10 and communicates with the annular gap 80, and the groove 40 extends in the first direction L1 and divides the annular gap 80 into the first region 81 and the second region 82. The first region 81 is a region where a connection position between the chip 30 and the circuit board 20 is located, a pad 31 is disposed at an end of the chip 30 close to the first region 81, and the pad 31 is electrically connected to the circuit board 20 by a wire 60. After the chip 30 is electrically connected to the circuit board 20 by the wires 60, the electrical signals in the chip 30 can be transmitted to the circuits on the circuit board 20. Since the bonding pad 31 is disposed at one end of the chip 30, the wires 60 connecting the bonding pad 31 and the circuit board 20 extend from the position of the bonding pad 31 to the end away from the chip 30, and the glue fixing the wires 60 is located in this area to form the protective glue layer 50, and does not need to extend in the direction close to the chip 30. Thus, the groove 40 is disposed near the end of the chip 30 to which the wire 60 is connected; the end of the first region 81 near the chip 30 may be generally flush with the end face of the chip 30. This allows the space of the annular gap 80 to be fully utilized while satisfying the dispensing requirements, and also facilitates the positioning of the groove 40 and the second region 82.

As shown in fig. 3 to 5, the wires 60 need to be fixed by the protective adhesive layer 50 formed by glue, in order to have the function of fixing the wires 60 and not affect the normal use of the chip assembly, the glue for fixing the wires 60 needs to adopt epoxy glue, the epoxy glue needs to be mixed with a curing agent and then can be cured, and the cured product has the characteristics of water resistance, chemical corrosion resistance and the like. However, during the curing process of the epoxy adhesive, the epoxy adhesive may flow into the gap between the chip 30 and the circuit board 20, and the shrinkage of the epoxy adhesive may cause uneven stress distribution between the chip 30 and the circuit board 20, which may cause the chip 30 to warp and affect normal use. Therefore, the normal use of the chip assembly is prevented from being affected by the epoxy resin flowing into the region outside the first region 81. It is desirable to provide a structure outside the first region 81 that prevents the epoxy from flowing into the second region 82, i.e., the recess 40. The purpose of the grooves 40 is to block glue, so that the space occupied by the grooves 40 does not need to be too large, as long as glue is allowed to flow in. The size ratio of the first region 81 and the second region 82 can be adjusted according to actual requirements.

As shown in fig. 3 to 5, in order to block the epoxy glue from entering the second region 82, the groove 40 is disposed between the first region 81 and the second region 82. The groove 40 is the only channel separating the first region 81 and the second region 82, and the groove 40 can prevent the epoxy glue encapsulating the wires 60 in the first region 81 from flowing into the second region 82. And one end of the groove 40 extends to the edge of the chip 30 and the other end of the groove 40 extends to the edge of the circuit board 20, the groove 40 may completely separate the first region 81 and the second region 82. The groove 40 prevents glue of the package lead 60 from flowing into the gap between the chip 30 and the circuit board 20. Thus, during the curing process of the glue for encapsulating the wires 60, the stress distribution between the chip 30 and the circuit board 20 cannot be caused to be uneven, and the warpage of the chip 30 is avoided.

As shown in fig. 3 to 5, the size of the groove 40 may be determined according to the amount of epoxy glue to be blocked. When the amount of epoxy is small, the groove 40 is of a small size to completely prevent the epoxy in the first region 81 from flowing over the groove 40 into the second region 82. When the amount of epoxy glue is increased, the accumulated epoxy glue may flow into the second area 82 over the original groove 40, and therefore, the size of the groove 40 needs to be increased properly to meet the use requirement. But as a whole the amount of epoxy does not extend over the recess 40.

The following description is provided in connection with the specific embodiment of the groove:

example 1

In one embodiment of the present application, as shown in fig. 4, 5 and 6, the number of the grooves 40 is two, and the two grooves 40 are symmetrically disposed on both sides of the chip 30.

In this embodiment, two grooves 40 are provided on the substrate 10, so that the area of the grooves 40 on the substrate 10 can be reduced, thereby ensuring that the substrate 10 has high strength.

As shown in FIG. 6, in one embodiment of the present application, the depth H of the groove 40 is 0.05mm to 0.15 mm.

In this embodiment, if the depth of the groove 40 is less than 0.05mm, and the depth of the groove 40 is less than 0.05mm, the glue easily overflows the groove 40; if the depth of the groove 40 is greater than 0.15mm, the depth of the groove 40 is greater, which affects the overall strength of the substrate 10; therefore, the depth of the groove 40 is within 0.05 mm-0.15 mm, and under the condition that the substrate 10 has higher strength, the groove 40 is ensured to have larger size, and the probability that glue overflows the groove 40 can be reduced. Preferably, the depth of the groove 40 is 0.1 mm.

Example 2

As shown in fig. 7, in an embodiment of the present application, the number of the grooves 40 is two, two grooves 40 are symmetrically disposed on two sides of the chip 30, one end of each groove 40 extends to the hole wall of the through hole 21, the other end extends to the lower side of the chip 30, and the chip 30 covers the other end of the groove 40.

In this embodiment, the other ends of the grooves 40 extend to the lower side of the chip 30, and under the condition that the substrate 10 has higher strength, the size of the grooves 40 is larger than that of the embodiment 1, so that more glue can be accommodated, and the probability of the glue overflowing the grooves 40 can be reduced.

Example 3

As shown in fig. 8, in an embodiment of the present application, the number of the grooves 40 is one, and both ends of the groove 40 extend to the hole wall of the through hole 21 along the first direction L1, respectively.

In this embodiment, the substrate 10 is provided with the groove 40, and the groove 40 is processed, manufactured and accommodated, so that the difficulty of slotting on the substrate 10 is reduced, and the production, the processing and the manufacturing are easy, thereby improving the production efficiency of products; in addition, compared with the size of the groove 40 in the embodiment 2, the glue can be accommodated more, so that the probability of the glue overflowing the groove 40 can be reduced.

Example 4

As shown in fig. 9, in one embodiment of the present application, the groove 40 includes a first groove 41, a second groove 42, and a third groove 43 connected in sequence. The first groove 41 and the third groove 43 are both communicated with the annular gap 80, the second groove 42 is positioned below the chip 30, and the chip 30 covers the second groove 42; the depth of the first groove 41 is equal to the depth of the third groove 43, and the depth H2 of the second groove 42 is smaller than the depth H1 of the first groove 41.

In this embodiment, when the glue in the first groove 41 or the second groove 42 is more, the glue can flow into the third groove 43, and under the condition that the substrate 10 has higher strength, the size of the groove 40 is larger than that in embodiment 2, more glue can be accommodated, and the probability that the glue overflows the groove 40 can be reduced.

In the above embodiments, only a few forms of the grooves have been briefly described, and those skilled in the art can select the specific form of the grooves according to specific needs. In addition, in the above-described embodiment, as shown in fig. 5, the sectional shape of the groove 40 in the second direction L2 perpendicular to the first direction L1 is rectangular. The cross-sectional shape of the groove, such as the cross-sectional shape of the groove is triangular, and the opening of the groove is one side of the triangle, can be set by those skilled in the art according to specific needs. The cross section of the groove is triangular, so that the width of the groove is gradually reduced from the opening of the groove to the bottom of the groove, the occupied area of the groove on the substrate can be reduced, and the substrate can be ensured to have higher strength.

As shown in fig. 10 and 11, in one embodiment of the present application, the chip assembly further includes: a blocking portion 70.

The blocking portion 70 is disposed on the substrate 10 and located in the second region 82, the blocking portion 70 is disposed near the opening of the groove 40, one end of the blocking portion 70 abuts against the chip 30, and the other end of the blocking portion 70 abuts against the circuit board 20.

In this embodiment, when the amount of the glue is larger, the blocking portion 70 can play a role of blocking, so as to further prevent the glue from flowing into the second region 82, and the glue can only remain in the region of the package wires 60, which cannot cause uneven stress distribution between the chip 30 and the circuit board 20, and thus, the warpage of the chip 30 is avoided; in addition, one end of the blocking portion 70 abuts against the chip 30, and the other end of the blocking portion 70 abuts against the circuit board 20, so that the first region 81 and the second region 82 can be completely separated, and further, the glue can be prevented from flowing into the second region 82.

In one embodiment of the present application, as shown in fig. 10, the height of the barrier is the same as the height of the chip 30, which can ensure that the barrier can sufficiently perform the isolation function, and of course, the height of the barrier can also be half of the height of the chip 30; the height of the barrier portion may be not more than the height of the chip 30.

In one embodiment of the application, the barrier part and the substrate are of an integrated structure, on one hand, the connection strength between the barrier part and the substrate can be improved, so that the probability of fracture between the barrier part and the substrate is reduced, and the use reliability of a product is improved; on the other hand, the blocking part and the substrate can be manufactured by adopting an integral casting forming process, so that the production efficiency of the product is improved, and the production and manufacturing cost of the product is reduced.

This application still provides a fingerprint identification module. The fingerprint identification module comprises any one of the chip assembly and the touch layer. The fingerprint identification module may also include any components that need to be used when performing fingerprint identification operations. The touch layer is arranged on the surface of the chip, which is far away from the substrate. Light changes induced by the user or external environment through the touch layer can be collected by the chip assembly.

The application also provides an electronic device. The electronic device comprises the fingerprint identification module. The electronic device can be any one of wearable devices such as a mobile phone, a tablet computer, a notebook computer, a personal digital assistant, an intelligent bracelet, an intelligent watch and the like. The information input or the identity verification and other related operations of the electronic device can be realized through the fingerprint identification module.

It is to be understood that both the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the application. In this application, the terms "first," "second," and "third" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance; the term "plurality" means two or more unless expressly limited otherwise. The terms "mounted," "connected," and,

The terms "fixed" and the like are to be understood in a broad sense, for example, "connected" may be fixedly connected, detachably connected, or integrally connected; "coupled" may be direct or indirect through an intermediary. The specific meaning of the above terms in the present application can be understood by those of ordinary skill in the art as appropriate.

In the description herein, the description of the terms "one embodiment," "some embodiments," "specific embodiments," etc., means that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the invention. In this specification, the schematic representations of the terms used above do not necessarily refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.

The above description is only a preferred embodiment of the present application and is not intended to limit the present application, and various modifications and changes may be made by those skilled in the art. Any modification, equivalent replacement, improvement and the like made within the spirit and principle of the present application shall be included in the protection scope of the present application.

Claims (10)

1. A chip assembly, comprising:

a substrate;

a circuit board disposed on the substrate and having a through hole penetrating the circuit board;

the chip is arranged on the substrate and positioned in the through hole, an annular gap is formed between the chip and the wall of the through hole, and one end of the chip is electrically connected with the circuit board through a plurality of wires;

the groove is arranged on the substrate and is communicated with the annular gap, the groove extends along a first direction and divides the annular gap into a first area and a second area, and the plurality of leads are positioned in the first area; and

and the protective adhesive layer is arranged on the substrate and covers the plurality of leads.

2. The chip assembly according to claim 1,

the number of the grooves is two, and the two grooves are symmetrically arranged on two sides of the chip; one end of each groove extends to the hole wall of the through hole, the other end of each groove extends to the lower portion of the chip, and the chip covers the other end of each groove.

3. The chip assembly according to claim 1,

the number of the grooves is one, and two ends of each groove extend to the hole wall of the through hole along the first direction respectively.

4. The chip assembly according to claim 3,

the groove comprises a first groove, a second groove and a third groove which are connected in sequence;

the first groove and the third groove are both communicated with the annular gap, the second groove is positioned below the chip, and the chip covers the second groove;

the depth of the first groove is equal to that of the third groove, and the depth of the second groove is smaller than that of the first groove.

5. The chip assembly according to claim 1,

the depth of the groove is 0.05 mm-0.15 mm.

6. The chip assembly of claim 1, further comprising:

the blocking part is arranged on the substrate and located in the second area, the blocking part is close to the opening of the groove, one end of the blocking part is abutted to the chip, and the other end of the blocking part is abutted to the circuit board.

7. The chip assembly according to claim 1,

the cross section of the groove along a second direction perpendicular to the first direction is triangular, and the opening of the groove is one side of the triangle.

8. The chip assembly according to claim 1,

the groove is arranged close to one end of the chip connected with the lead.

9. A fingerprint identification module comprising a chip assembly according to any one of claims 1 to 8.

10. An electronic device comprising the fingerprint recognition module of claim 9.

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