JPS6290213A - Molding method of integrated circuit element casing based on injection molding - Google Patents

Molding method of integrated circuit element casing based on injection molding

Info

Publication number
JPS6290213A
JPS6290213A JP23172885A JP23172885A JPS6290213A JP S6290213 A JPS6290213 A JP S6290213A JP 23172885 A JP23172885 A JP 23172885A JP 23172885 A JP23172885 A JP 23172885A JP S6290213 A JPS6290213 A JP S6290213A
Authority
JP
Japan
Prior art keywords
mold
cavity
movable
stationary
lead frame
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP23172885A
Other languages
Japanese (ja)
Other versions
JPH0349729B2 (en
Inventor
Mitsuhiro Obara
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Metal Corp
Original Assignee
Mitsubishi Metal Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Metal Corp filed Critical Mitsubishi Metal Corp
Priority to JP60231728A priority Critical patent/JPH0349729B2/ja
Publication of JPS6290213A publication Critical patent/JPS6290213A/en
Publication of JPH0349729B2 publication Critical patent/JPH0349729B2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14639Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components
    • B29C45/14655Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components connected to or mounted on a carrier, e.g. lead frame
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/16Making multilayered or multicoloured articles
    • B29C45/1671Making multilayered or multicoloured articles with an insert

Abstract

PURPOSE:To constitute the titled method so that cutting-off of a bonding wire is prevented to stabilize manufacture of a casing of an integrated circuit element, by a method wherein a casing of one side of a lead frame is molded by a primary mold on only one side of a movable mold or stationary mold of which a cavity has been formed and the other side casing is molded by a secondary mold on both of a movable and stationary molds of which a cavity has been formed. CONSTITUTION:A lead frame L is fitted to a recessed part 1 of a primary mold 3a by turning the surface of the lead frame L whereon an IC element I is mounted into a stationary mold 2 side. Theremoplastic resin is injected through a nozzle 13 after closure of a movable mold 1 and simultaneously with mold break an ejector pin 18 is ejected into a cavity 2a after cure through cooling. A semiproduct S' is peeled off from the stationary mold 2, and is carried up to an ejection position and removed from the movable mold 1 by an ejector up to an ejection position and removed from the movable mold 1 by an ejector pin 9. Neither the cut-off of bonding wire B nor the spoilage of the IC element I occurs as the surface is covered already. A product is obtained by inserting the semiproduct S' into a cavity 1b of the movable mold 1, fitting the same to a secondary mold 3b and performing injection and the mold break of the same again.
JP60231728A 1985-10-17 1985-10-17 Expired - Lifetime JPH0349729B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP60231728A JPH0349729B2 (en) 1985-10-17 1985-10-17

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP60231728A JPH0349729B2 (en) 1985-10-17 1985-10-17

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP18835890A Division JPH0525655B2 (en) 1990-07-17 1990-07-17

Publications (2)

Publication Number Publication Date
JPS6290213A true JPS6290213A (en) 1987-04-24
JPH0349729B2 JPH0349729B2 (en) 1991-07-30

Family

ID=16928095

Family Applications (1)

Application Number Title Priority Date Filing Date
JP60231728A Expired - Lifetime JPH0349729B2 (en) 1985-10-17 1985-10-17

Country Status (1)

Country Link
JP (1) JPH0349729B2 (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0361194A2 (en) * 1988-09-30 1990-04-04 Siemens Aktiengesellschaft Method of enveloping electrical or electronic components or component assemblies, and envelope for electrical or electronic components or component assemblies
JPH0324000A (en) * 1989-05-26 1991-01-31 Gerard Lemaire Credit card having microprocessor chip therein
US5876765A (en) * 1995-11-09 1999-03-02 Micron Technology, Inc. Injection molding equipment for encapsulating semiconductor die and the like
US6033933A (en) * 1997-02-14 2000-03-07 Lg Semicon Co., Ltd Method for attaching a removable tape to encapsulate a semiconductor package
WO2005025832A3 (en) * 2003-09-05 2005-08-25 Bosch Gmbh Robert Method for producing plastic parts with strip conductors integrated therein

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS53121055A (en) * 1977-03-31 1978-10-23 Mitsubishi Rayon Co Ltd Manufacture of synthetic resin decorative article
JPS58147331A (en) * 1982-02-26 1983-09-02 Matsushita Electric Works Ltd Insert molding method

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS53121055A (en) * 1977-03-31 1978-10-23 Mitsubishi Rayon Co Ltd Manufacture of synthetic resin decorative article
JPS58147331A (en) * 1982-02-26 1983-09-02 Matsushita Electric Works Ltd Insert molding method

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0361194A2 (en) * 1988-09-30 1990-04-04 Siemens Aktiengesellschaft Method of enveloping electrical or electronic components or component assemblies, and envelope for electrical or electronic components or component assemblies
JPH0324000A (en) * 1989-05-26 1991-01-31 Gerard Lemaire Credit card having microprocessor chip therein
FR2659157A2 (en) * 1989-05-26 1991-09-06 Lemaire Gerard METHOD FOR MANUFACTURING A CARD, SAID CARD, AND CARD OBTAINED BY THIS PROCESS.
US5134773A (en) * 1989-05-26 1992-08-04 Gerard Lemaire Method for making a credit card containing a microprocessor chip
US5876765A (en) * 1995-11-09 1999-03-02 Micron Technology, Inc. Injection molding equipment for encapsulating semiconductor die and the like
US6033933A (en) * 1997-02-14 2000-03-07 Lg Semicon Co., Ltd Method for attaching a removable tape to encapsulate a semiconductor package
WO2005025832A3 (en) * 2003-09-05 2005-08-25 Bosch Gmbh Robert Method for producing plastic parts with strip conductors integrated therein

Also Published As

Publication number Publication date
JPH0349729B2 (en) 1991-07-30

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