JP2015051557A - Molding die, resin molding device and resin molding method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a molding die, a resin molding apparatus and a resin molding method which save maintenance by preventing leakage of a resin and keep high quality of the molding, independently of accuracy of end surfaces of work and the viscosity of a resin.SOLUTION: Workpieces W are aligned without gaps between a runner gate-side end surface of the workpiece W and a die by moving, with pushing, an end surface of the workpiece W through movement of an alignment block 9 and pressing the opposite-side end surface of the workpiece W toward the end surface of a pot insert 7 rising from a lower die insert block 6, in mounting the workpiece W on the lower insert block 6 and clamping the molding die 3.

Description

  The present invention relates to a mold, a resin molding apparatus, and a resin molding method for positioning and clamping a substrate placed on an insert block by a center block disposed opposite to the substrate.

  In the resin sealing device, the work is loaded into a mold mold opened and positioned, and then clamped and resin-sealed. As the workpiece, a resin substrate (organic substrate), a ceramic substrate, a lead frame or the like (hereinafter simply referred to as a substrate) is used, and is held together with the sealing resin in a carry-in device and carried into a mold. The substrate is clamped by a mold, and the molten mold resin is sent across the substrate (transversely) to the cavity and resin-molded.

When the workpiece is resin-molded, if the mold resin passes across the end surface of the substrate, the resin adheres to the end surface (side surface) of the substrate and hinders handling, and it is necessary to remove unnecessary resin in a subsequent process. In particular, as shown in FIG. 13, in the case of a mold resin having a low viscosity (transparent resin for LED, etc.), a large amount of resin leakage 55 occurs from the end face of the substrate 51, so that automatic production by an auto molding apparatus becomes impossible and leakage occurred. Maintenance work to remove the resin requires time and effort.
Further, as shown in FIG. 13, in order to improve the peelability of the molded product runner 53 supplied to the cavity 52 (package part) on the substrate 51, it is necessary to form a gold plating area 54 including the runner area on the substrate 51. However, the manufacturing cost of the substrate 51 is increased.

The following techniques have been proposed as a resin molding apparatus that performs resin molding without polluting the edges and end surfaces (side surfaces) of the workpiece. By attaching a holder member that covers the periphery of the lower mold pot, clamping the work with the holder member, and filling the cavity with the mold resin through the runner formed on the holder member, the mold resin adheres to the edge and side of the substrate There has been proposed a resin molding apparatus that does not (see Patent Document 1).
Similarly, the work piece placed on one mold is pressed by the presser plate, the other mold with the runner gate formed on the surface facing the presser plate is closed, and the mold resin is filled into the cavity. A resin mold apparatus has been proposed (see Patent Document 2).
Alternatively, a gate plate having a gate groove is arranged on the substrate, and a side gate communicating with the side of the cavity is provided between the gate plate and the upper mold and the upper mold and the lower mold, and the mold resin is made into the cavity through the side gate. A resin molding method for filling has also been proposed (see Patent Document 3).

Special table 2003-508911 gazette Japanese Patent Laid-Open No. 11-284002 Japanese Patent Publication No. 6-33020

However, in the above-described resin molding apparatuses and methods disclosed in Patent Documents 1 to 3, when a resin having a low viscosity (such as LED transparent resin) is used as the mold resin, a holder member (Patent Document 1), a presser Even if the plate (Patent Document 2) and the gate plate (Patent Document 3) are overlapped, the substrate is not positioned with respect to the mold, that is, there is a gap between the mold and the end of the substrate. The possibility of leakage of highly fluid resin from the edge of the substrate has not been resolved. In particular, the organic substrate has low substrate end face accuracy and external shape accuracy, and when it is carried into a mold and preheated, the substrate is likely to stretch and warp, and the positioning pin position accuracy and hole accuracy are low, A gap is generated between the positioning pins and blocks and the substrate is likely to be displaced. Due to the displacement of the substrate, resin leakage occurs on the end surface of the substrate, and production is stopped for maintenance, so that the apparatus operating rate is lowered. Further, defective products are generated due to the misalignment of the molded product, and the molding quality deteriorates.
In addition, after placing the work (substrate) on the mold, a holder member (Patent Document 1), a holding plate (Patent Document 2), and a gate plate (Patent Document 3) are overlapped so as to partially overlap, Since it takes time for setting the workpiece in the mold and it is necessary to align the substrate with the holder member, the workability may be reduced.

  The present invention solves the above-mentioned problems of the prior art, a mold mold, a resin molding apparatus, and a resin molding method capable of maintaining a high molding quality by preventing resin leakage, saving maintenance, and maintaining high molding quality regardless of workpiece end face accuracy and resin viscosity. Is to provide.

In order to achieve the above object, the present invention comprises the following arrangement.
That is, a mold that clamps the workpiece with one mold for placing the workpiece and the other mold with a cavity concave portion formed on the mold clamping surface, the one mold includes An insert block on which the workpiece is placed and fixed in alignment with the cavity recess, and a pot that is provided adjacent to the insert block and is filled with a mold resin to be supplied to the cavity recess are provided. The pot insert provided so that it can be moved up and down, and the insert block and the pot insert are assembled adjacent to each other, and the work placed on the insert block is pushed toward the pot insert on the work end surface. Match the chase block with the alignment block and the mold closing operation of the one mold and the other mold. Te, characterized by comprising a moving mechanism for pressing the opposite end surfaces of moving the alignment block pushes the workpiece end face the workpiece to the end surface of the pot insert spaced from the chase block.

  When the above mold mold is used, when placing the workpiece on the insert block and closing the mold die, the alignment block is moved to push the workpiece end surface and the opposite end surface of the workpiece is separated from the chase block. By pressing against the end face of the pot insert at the above position, the work can be aligned without causing a gap between the runner gate side end face of the work and the pot insert.

Further, the pot insert has a flange portion that presses the upper surface of the pot insert toward the insert block while the work end surface is abutted against the pot insert, and the flange portion is molded from the pot toward the cavity recess. It is desirable that a resin path for supplying the resin is formed.
Thus, the mold resin can be supplied toward the cavity concave portion through the resin passage formed in the flange portion in a state where the workpiece is sandwiched between the flange portion and the insert block of the pot insert in an aligned state. Thereby, it is possible to prevent the resin from leaking from the gap between the workpiece and the mold regardless of the workpiece end surface accuracy and the resin viscosity.

  When the flange portion is formed with a reverse taper portion that intersects the inclination of the taper portion forming the resin path and forms the side wall surface of the cavity recess, the pot insert is separated from the insert block together with the mold opening after the resin molding. When moving in the direction, stress concentration occurs at a portion of the molded product where the tapered portion and the reverse tapered portion intersect, and the unnecessary resin can be reliably gate-breaked from the molded product.

The raising / lowering operation of the pot insert and the moving operation of the alignment block are interlocked with the ejecting operation of the ejector pin plate, and the aligning block is separated from the end surface of the workpiece by the projecting operation of the ejector pin by the mold opening operation. The pot insert moves in a direction away from the workpiece, the aligning block pushes the workpiece end surface along with the retracting operation of the ejector pin by a mold closing operation, and the workpiece end surface is pressed against the pot insert. It is preferable that the upper surface is pressed down by the pot insert.
As a result, the pot insert can be moved up and down with respect to the workpiece using the lifting and lowering operation of the ejector pin that releases the molded product from the mold, and the workpiece can be positioned and the molded product can be gate-breaked. The workpiece can be positioned and the molded product can be released simply by changing the ejector mechanism of the mold.

The other mold has a center insert disposed opposite to the pot insert and a cavity insert formed opposite to the insert block, and the cavity insert formed with a predetermined gap with respect to the center insert. The other die is supported by being suspended from the chase block, and is provided with a pushing means that abuts against the cavity insert and pushes toward the center insert when the die is closed to eliminate the gap. It is preferable.
As a result, when the mold is closed, the pot side surface of the cavity insert can be pressed against the opposite side surface of the center insert without any gap, thereby preventing resin leakage of a resin having a small filler diameter or a resin having a low viscosity. be able to.

  When the release film covering the resin path provided in the center insert and the cavity insert is adsorbed and held on the other mold, the resin surface of the mold surface is not stained, and the gap between the molds Can prevent resin leakage.

The other mold may be provided with a relief recess at a position facing the alignment block, and an overflow cavity may be formed in the relief recess with mold resin filled in the cavity recess.
In this case, the cavity is surely filled with the mold resin, and the occurrence of voids in the molded product is reduced.

The resin mold apparatus includes the mold described above, a mold opening / closing mechanism for opening / closing the mold, and a transfer mechanism for operating a plunger inserted in the pot.
As a result, the molding quality can be stabilized and the mold maintenance can be reduced regardless of the workpiece end face accuracy and the resin viscosity. Further, since the gold plating area can be omitted in the runner portion of the workpiece, the product cost can be reduced.

In the resin molding method, a workpiece is supplied to the insert block of one mold among the mold dies that have been opened, and the workpiece end surface is pushed by the alignment block in conjunction with the mold closing operation of the mold. And pressing the workpiece opposite side end surface against the pot insert for alignment, and moving the pot insert closer to the workpiece so that the flange portion is superimposed on the gate side runner area of the aligned workpiece. The mold was closed while the work was clamped and held on the insert block, and the mold resin melted from the pot was formed on the other mold through the runner gate formed on the flange. A step of filling the cavity recess and heat-curing, and the molding after heat-curing Starting the mold opening of the mold, releasing the adsorption holding of the workpiece, and with the progress of the mold opening operation, the pot insert is moved in a direction away from the workpiece to cause a gate break, and The method includes a step of retracting the alignment block that has been pushing the workpiece from an end portion of the workpiece, and a step of taking out the molded workpiece from the mold mold opened.
Thereby, it is possible to stabilize the molding quality irrespective of the workpiece end face accuracy and the resin viscosity, to reliably perform the mold release operation and the gate break of the molded product, and to reduce the mold maintenance.
Further, when the mold is closed, the mold may have a step of contacting the cavity insert and pushing toward the adjacent center insert to eliminate the gap between the inserts.

  If the mold is used, it is possible to prevent the resin from leaking from the gap between the workpiece and the mold regardless of the accuracy of the workpiece end surface and the resin viscosity. Therefore, it is possible to prevent resin leakage, save labor for mold mold maintenance, and maintain high molding quality. Further, in the resin molding apparatus and the resin molding method, the molding quality can be stabilized regardless of the workpiece end surface accuracy and the resin viscosity, and the mold release operation and the gate break of the molded product can be performed reliably.

It is sectional explanatory drawing of the mold open state of the resin mold apparatus. It is sectional explanatory drawing which shows the process of resin mold operation | movement. FIG. 3 is an explanatory cross-sectional view showing a resin molding operation process following FIG. 2. FIG. 4 is an explanatory cross-sectional view illustrating a resin molding operation process subsequent to FIG. 3. FIG. 5 is an explanatory cross-sectional view illustrating a resin molding operation process subsequent to FIG. 4. FIG. 6 is an explanatory cross-sectional view illustrating a resin molding operation process subsequent to FIG. 5. FIG. 7 is an explanatory cross-sectional view illustrating a resin molding operation process subsequent to FIG. 6. FIG. 8 is an explanatory cross-sectional view illustrating a resin molding operation process subsequent to FIG. 7. FIG. 9 is an explanatory cross-sectional view illustrating a resin mold operation process subsequent to FIG. 8. It is sectional explanatory drawing of the mold closing state of the resin mold apparatus which concerns on another example. It is a section explanatory view of the mold opening state of the resin mold device concerning other examples. It is the front view and top view of a lower mold | type, and sectional explanatory drawing of a mold metal mold | die. It is explanatory drawing of the workpiece | work and mold metal which show the conventional subject.

  Hereinafter, preferred embodiments of a mold and a resin molding apparatus according to the present invention will be described in detail with reference to the accompanying drawings. In the following embodiments, a transfer mold and a resin mold apparatus will be described in which an organic substrate is used as a substrate, a cavity recess is formed on the upper mold side, and a pot is formed on the lower mold side.

  In FIG. 1, a resin mold apparatus includes a mold mold 3 having a lower mold 1 (one mold) that is a movable mold and an upper mold 2 (the other mold) that is a fixed mold, and a mold mold 3. A mold opening / closing mechanism (an electric motor, a toggle link mechanism, etc .; not shown) that opens and closes and a transfer mechanism that operates a plunger 5 inserted in a pot 4 provided in the lower mold 2 are provided. Hereinafter, the configuration of the mold 3 will be specifically described.

  The lower mold 1 has a lower mold insert block 6 on which a workpiece is placed and fixed in alignment with the cavity recess, and a pot provided with a mold resin provided adjacent to the lower mold insert block 6 and supplied to the cavity recess. 4, a pot insert 7 provided so as to be movable up and down with respect to the lower mold insert block 6, and a lower mold chase block 8 to which these are assembled.

  The lower die chase block 8 is aligned with the alignment block 9 that pushes the workpiece end surface toward the pot insert 7 with the workpiece W placed on the lower die insert block 6 in accordance with the mold closing operation of the mold 1. A moving mechanism 10 is provided that moves the block 9 to push the end surface of the workpiece and presses the opposite end surface of the workpiece against the end surface of the pot insert 7 raised from the lower mold insert block 6.

  The pot insert 7 is formed with a flange portion 7 a that presses the upper surface of the pot insert 7 toward the lower insert block 6 while the work end surface is abutted against the pot insert 7. On the upper surface of the flange portion 7a, a resin passage (taper portion 7b; runner gate) for supplying mold resin from the pot 4 toward the cavity recess is engraved so as to incline downward toward the peripheral portion. In addition, a reverse taper portion 7c that intersects the inclination of the taper portion 7b that forms the resin path and that forms the side wall surface of the cavity recess is carved on the lower surface of the flange portion 7a so as to incline upward.

  The pot insert 7 has a cylindrical pot 4 integrally assembled at a central portion at a plurality of locations in the longitudinal direction (5 locations in FIG. 12B), and plungers 5 are inserted into the pots 4 so as to be movable up and down. Yes. The pot insert 7 is supported by a support pin 7d, and the support pin 7d is supported by a pot urging pin 7e. A coil spring 7f biased in a direction to push down the support pin 7d is fitted on the outer periphery of the support pin 7d. The pot urging pin 7 e is erected on an ejector pin plate (not shown) provided below the lower chase block 8. Therefore, when the ejector pin protrudes from the lower mold clamping surface when the mold is opened, the support pin 7d is pushed upward by the pot urging pin 7e.

  The lower mold insert block 6 is provided with a suction hole 6a for sucking and holding the workpiece W. The suction hole 6a is connected to a suction device (not shown). The alignment block 9 is slidably provided outside the work mounting area 6b of the lower mold insert block 6. The alignment block 9 is formed with a claw portion 9a for pressing the work upper surface when pressed against the outer end face of the work W.

  The alignment block 9 is slid along the upper surface of the lower mold insert block 6 by the moving mechanism 10. The alignment block 9 is provided with a fitting hole 9b, and the tip of the swing pin 10a is fitted into the fitting hole 9b. The swing pin 10a is supported on the lower chase block 8 so as to be swingable about a fulcrum 10b. Specifically, the coil spring 10d is in contact with one end of the contact portion 10c provided with the fulcrum 10b of the swing pin 10a. The coil spring 10d constantly urges the swing pin 10a counterclockwise around the fulcrum 10b. Further, the swing support pin 10e is in contact with the other end of the contact portion 10c. The swing support pin 10 e is erected on an ejector pin plate (not shown) provided below the lower mold chase block 8. As shown in FIG. 12B, the alignment blocks 9 are provided at four locations in the longitudinal direction along the outer end surface of the workpiece W.

  Further, a pushing block 11 (pushing means) is provided so as to protrude from the upper surface of the lower mold insert block 6 in the vicinity of the outside of the alignment block 9 provided on the lower mold insert block 6. The push block 11 is integrally supported by a support block 12, and the support block 12 is urged upward by a coil spring 12 a provided between the push block 11 and the lower chase block 8. The push block 11 has an inclined surface (tapered surface) 11a. The inclined surface 11 a comes into contact with an inclined surface provided on an upper mold cavity insert described later via a release film 16. As shown in FIG. 12 (B), the push block 11 is provided at a total of four places, two places in the vicinity of the corner portion of the outer side surface in the width direction of the lower mold insert block 6.

The raising / lowering operation of the pot insert 7 and the sliding operation of the alignment block 9 are performed in conjunction with the ejecting operation by the ejector pin plate. That is, an ejector pin (not shown) protrudes from the lower mold clamping surface by the mold opening operation of the mold 3, the alignment block 9 is separated from the end surface of the workpiece W, and the pot insert block 7 is separated from the lower mold chase block 8. Pushed up.
Further, by the mold closing operation of the mold 3, the ejector pin (not shown) is retracted from the lower mold clamping surface, the alignment block 9 pushes the outer end surface of the work W, and approaches the lower mold chase block 8. While the end surface of W is pressed against the lower mold chase block 8, the upper surface is pressed toward the lower mold insert block 6 by the flange portion 7a.
Instead of providing the ejector pin plate with the pot urging pin 7e, the swinging support pin 10e, etc., separate drive means (cylinder, solenoid, etc.) may be provided.

  The upper mold 2 is disposed so as to face the upper mold center insert 13 opposed to the pot insert 7 and the lower mold insert block 6, and includes a first cavity concave portion 14a (package portion molding) and a deeper second cavity concave portion 14b ( The upper mold cavity insert 14 in which the lens part molding) is formed is supported by being suspended from the upper mold chase block 15 with a predetermined gap G (for example, about 2 to 3 mm) provided to the upper mold center insert 13.

An upper mold cull 13a and an upper mold runner gate 13b, which are resin paths, are engraved on the surface of the upper mold center insert 13 facing the pot. The upper mold center insert 13 is suspended and supported by the upper mold chase block 15 via a coil spring 13c.
The upper mold cavity insert 14 includes a cavity insert 14A and a cavity piece 14B constituting the cavity bottom. The cavity insert 14A and the cavity piece 14B may be suspended and supported by the upper chase block 15 via a coil spring. The cavity insert 14A is formed with a runner gate 14c, a first cavity recess 14a, an escape recess 14d of the alignment block 9, and an inclined surface (taper surface) 14e that contacts the inclined surface 11a of the push block 11.
Further, the bottom of the first cavity recess 14a and the second cavity recess 14b are formed in the cavity piece 14B. The cavity insert 14 </ b> A is urged toward the upper mold center insert 13 by the abutment pin 14 f and a coil spring 14 g provided around the abutment pin 14 f with respect to the upper mold chase block 15.

  Further, the release film 16 is sucked and held on the upper mold clamping surface including the upper mold center insert 13 and the upper mold cavity insert 14. The release film 16 has a thickness of about 0.5 mm and has heat resistance, and is easily peeled off from the mold surface and has flexibility and extensibility, such as PTFE, ETFE, PET, FEP. A single layer or a multi-layer film mainly composed of a film, a fluorine-impregnated glass cloth, a polypropylene film, polyvinyl chloride or the like is preferably used. Note that the release film 16 can be omitted when the workpiece end face accuracy is high or when a mold resin having a large filler diameter is used.

When the mold 3 is closed, the inclined surface 11a of the push block 11 provided in the lower mold 1 comes into contact with the inclined surface 14e of the upper mold cavity insert 14 via the release film 16, and the upper mold center insert. The gap G is eliminated by pushing toward 13 (see FIG. 5). Thereby, the clearance gap between the upper runner gate 13b of the upper mold | type center insert 13 and the runner gate 14c of the upper mold | type cavity insert 14 (cavity insert 14A) can be eliminated, and resin leak can be prevented.
Further, the pushing block 11 is pushed against the upper mold cavity insert 14 via the release film 16, so that a stretching effect in the width direction in which the tension of the release film 16 hardly acts can be obtained.

  FIG. 12A shows a front view of the lower mold 1. The pot insert 7 and the lower mold insert block 6 are assembled to the lower mold chase block 8 and positioned by end blocks 18A and 18B on both sides in the longitudinal direction. Further, lower mold lock blocks 8 a and 8 b are provided opposite to each other at the peripheral edge of the lower mold chase block 8. These are adapted to mesh with the upper die 2 and engage with an upper die lock block (not shown) provided on the upper die chase block 15.

  In FIG. 12C, when the mold 3 is opened, the ejector pin plate (not shown) is in the ejecting operation, that is, the ejector pin protrudes from the lower mold clamping surface. The support pin 7d protrudes from the lower die chase block 8 and is pushed up against the bias of the coil spring 7f, and the pot insert 7 is supported in a state separated from the lower die chase block 8. At this time, the flange portion 7a is in a state of being separated from the workpiece W placed on the lower mold insert 6 (see FIG. 12A).

  Further, the swing support pin 10e protrudes from the lower die chase block 8, and the swing pin 10a is rotated clockwise or counterclockwise about the fulcrum 10b, so that the alignment blocks 9 arranged opposite to each side of the workpiece W are arranged. Is slid on the lower insert block 6 to the outside away from the end face of the workpiece W. Thereby, the workpiece | work W can be mounted by open | releasing the upper direction of the workpiece | work mounting area 6b of the lower mold | type insert block 6. FIG.

Here, an example of a resin molding method will be described with reference to FIGS. One of the workpieces W supplied to both sides of the pot insert 7 will be described as an example.
In FIG. 2, the workpiece W is supplied to the workpiece mounting area 6 b of the lower mold insert block 6 in the mold mold 3 that has been opened. Further, in the pot 4, mold resin (liquid resin, granular resin, granular resin (powder resin), sheet resin, tablet resin, etc.) is supplied.
At this time, since the ejector pin plate (not shown) is in the ejecting operation as described above, the pot insert 7 is in the raised position, and the flange portion 7a and the lower mold insert 6 are in a separated state. The alignment block 9 is located at a position away from the work mounting area 6b.

Next, in FIG. 3, the mold closing operation of the mold 3 is started. That is, a lower mold 1 that is a movable mold is brought close to the upper mold 2 by operating a mold opening / closing mechanism (not shown). At this time, since the ejector pin plate (not shown) ends the ejecting operation, the pot urging pin 7e is retracted into the lower chase block 8 and the support pin 7d is pushed back by the urging of the coil spring 7f. Begins to approach the lower chase block 8.
Further, the swing support pin 10e is retracted into the lower chase block 8, and the swing pin 10a is rotated counterclockwise around the fulcrum 10b by the bias of the coil spring 10d. The end surface of the workpiece W is pressed against the pot insert 7 while being in contact with the end surface of the pot insert 7.

  In FIG. 4, as the mold closing of the mold 3 progresses, the pot insert 7 is lowered so as to approach the lower mold chase block 8 and overlapped with the gate side runner area of the work W in which the flange portion 7a is aligned. Clamp. At this time, the alignment block 9 is in a state where the end face of the work W is being pushed. In this state, a suction device (not shown) is operated to suck the work W from the suction hole 6a of the lower mold insert block 6 and hold it in the work suction area 6b.

Further, as shown in FIG. 5, the release film 16 is adsorbed and held on the clamp surface of the upper mold 2 including the first cavity recess 14a and the second cavity recess 14b. Further, when the mold 3 is closed, the inclined surface 11a of the push block 11 is closed while contacting the inclined surface 14e of the upper mold cavity insert 14 (cavity insert 14A) via the release film 16. Thus, the upper mold cavity insert 14 is pushed toward the upper mold center insert 13 to eliminate the gap G between the inserts.
In addition, when the inclined surface 11 a of the push block 11 slides on the inclined surface 14 a via the release film 16, the effect of stretching the release film 16 can be obtained. Since the alignment block 9 is accommodated in the relief recess 14d of the cavity insert 14A, there is no problem in the mold clamping operation.

  Then, the transfer mechanism is operated in the mold clamped state, and the mold resin melted from the pot 4 is runner gate formed on the flange portion 7a, specifically, the upper die cull 13a, the upper die runner gate 13b, and the runner gate. The first cavity recess 14a and further the second cavity recess 14b are filled through 14c, and are cured by heating.

Next, in FIG. 6, opening of the mold 3 after heat curing is started. The suction operation of the suction hole 6a of the lower mold insert block 6 is stopped, and the suction holding of the workpiece W to the workpiece suction area 6b is released. The release film 16 is adsorbed and held on the upper mold clamping surface, the work W is adsorbed on the lower mold insert block 6, and the claw portion 9a of the alignment block 9 holds the work W. Therefore, when the lower mold 1 is lowered, The release film 16 is released (peeled) from the molded product 17.
When the push block 11 (inclined surface 11 a) comes out of contact with the inclined surface 14 e of the upper mold cavity insert 14 (cavity insert 14 A) via the release film 16, the upper mold cavity insert 14 becomes the upper mold center insert 13. A gap G is formed away from Further, the release film 16 is peeled off from the upper mold clamping surface by stopping the suction of the release film 16 and ejecting air, increasing the tension, or using these together.

  Next, in FIG. 7, when the mold opening operation of the mold 3 proceeds, an ejecting operation of an unillustrated ejector pin plate proceeds, the pot urging pin 7e protrudes from the lower mold chase block 8, and the support pin 7d is coiled. The pot insert 7 is pushed up against the urging force of the spring 7 f and moved in a direction away from the lower chase block 8. At this time, when the flange portion 7a in which the resin path is formed is separated from the workpiece W, stress concentration occurs in the boundary portion of the molded product 17 between the unnecessary resin 17b and the product 17a. Since the tapered portion 7b and the reverse tapered portion 7c formed in the flange portion 7a are formed so as to intersect in a tapered manner, stress concentration is likely to occur at the boundary portion between the unnecessary resin 17b and the product 17a.

  Also, as shown in FIG. 8, the swing support pin 10e protrudes from the lower chase block 8 and rotates the swing pin 10a clockwise around the fulcrum 10b to abut against the end face of the workpiece W and push it. The moving alignment block 9 slides on the lower mold insert block 6 to a position retracted from the end face to the work W.

  When the mold opening of the mold 3 further proceeds, as shown in FIG. 9, the unnecessary resin 17b and the product 17a formed on the pot insert 7 are gate-breaked from the boundary portion. Then, the product 17a is taken out from the mold 3 by taking out the work W from the work mounting area 6b. Further, the unnecessary resin 17b is discarded by being separated from the flange portion 7a of the pot insert 7.

  According to the above resin mold apparatus and method, it is possible to stabilize the molding quality regardless of the workpiece end surface accuracy and resin viscosity, to reliably perform the mold release operation and gate break of the molded product, and to reduce the mold maintenance. it can.

  Next, another example of the mold 3 will be described with reference to FIGS. In addition, the same number is attached | subjected to the same member as the Example mentioned above, and detailed description shall be used. As shown in FIG. 11, an overflow cavity 14h is formed in the relief recess 14d facing the alignment block 9 formed in the upper mold cavity insert 14, although the depth is deeper than that.

As shown in FIG. 10, when the transfer mechanism is operated in a state where the mold 3 is closed and the workpiece W is clamped, the mold resin is transferred from the pot 4 to the upper mold cull 13a, the upper mold runner gate 13b, and the runner gate. The first cavity concave portion 14a and the second cavity concave portion 14b are filled through 14c and pass through the upper surface of the claw portion 9a of the alignment block 9 from the gate cavity side (outer end side) opposite to the first cavity concave portion 14a. 14d and then cured by heating in the overflowed state into the overflow cavity 14h.
Thereby, the void mixed in the 1st cavity recessed part 14a and the 2nd cavity recessed part 14b can be extruded, the filling property of mold resin can be improved, and molding quality can be improved. Since the overflowing unnecessary resin 17c is molded on the upper surface of the alignment block 9, it is separated from the product 17a by the operation of sliding the alignment block 9 away from the workpiece W by opening the mold.

  If the above-mentioned mold die 3 is used, it is possible to prevent the resin from leaking from the gap between the workpiece W and the die regardless of the workpiece end face accuracy and the resin viscosity. Therefore, it is possible to prevent resin leakage, save labor of the mold 3 and maintain high molding quality. Further, in the resin molding apparatus and the resin molding method, the molding quality can be stabilized regardless of the workpiece end surface accuracy and the resin viscosity, and the mold release operation and the gate break of the molded product 17 can be performed reliably.

In the mold described above, the upper mold 2 is a fixed mold and the lower mold 1 is a movable mold. However, the upper mold 2 may be a movable mold and the lower mold 1 may be a fixed mold, or both may be movable molds. Good. Alternatively, the pot 4 may be formed in the upper mold 2 and the cavity recess may be formed in the lower mold 1.
The workpiece W is not limited to a substrate using an LED resin, but can be used for other molded products such as a semiconductor chip flip-chip connected or wire bonded to the substrate.

  1 Lower mold 2 Upper mold 3 Mold mold 4 Pot 5 Plunger 6 Lower mold insert block 6a Suction hole 6b Workpiece mounting area 7 Pot insert 7a Flange 7b Taper 7c Reverse taper 7d Support pin 7e Pot biasing pin 7f Coil spring 8 Lower mold chase block 9 Alignment block 9a Claw part 9b Fitting hole 10 Moving mechanism 10a Oscillating pin 10b Support point 10c Abutting part 10d Coil spring 10e Oscillating support pin 11 Pushing block 11a Inclined surface 12 Support block 12a Coil spring 13 Upper mold center insert 13a Upper mold cull 13b Upper mold runner gate 13c Coil spring 14 Upper mold cavity insert 14A Cavity insert 14B Cavity piece 14a First cavity I recess 14b second cavities 14c runner gate 14d relief recess 14e inclined surface 14f abutting pin 14g coil spring 14h overflow cavity 15 upper chase block 16 release film 17 moldings 17a products 17b, 17c unnecessary resin 18A, 18B endblock

Claims (9)

A mold that clamps the workpiece with one mold for placing the workpiece and the other mold with a cavity recess formed on the mold clamping surface,
In the one mold, an insert block on which the work is placed and fixed in alignment with the cavity recess,
A pot insert provided adjacent to the insert block and loaded with a mold resin to be supplied to the cavity recess is provided so as to be movable toward and away from the insert block; and
A chase block including an alignment block in which the insert block and the pot insert are assembled adjacently, and the workpiece placed on the insert block pushes the workpiece end surface toward the pot insert;
In accordance with the mold closing operation of the one mold and the other mold, the alignment block is moved to push the work end face, and the opposite end face of the work is moved to the end face of the pot insert separated from the chase block. A mold having a moving mechanism for pressing.   The pot insert has a flange portion that presses the upper surface of the pot insert against the insert block while the workpiece end surface is abutted against the pot insert. Mold resin is applied to the flange portion from the pot toward the cavity recess. The mold according to claim 1, wherein a resin path to be supplied is formed.   The raising / lowering operation of the pot insert and the moving operation of the alignment block are interlocked with the ejecting operation of the ejector pin plate, and the alignment block is separated from the end surface of the workpiece by the projecting operation of the ejector pin by the mold opening operation. The pot insert moves in a direction away from the workpiece, the alignment block pushes the workpiece end surface in accordance with the retraction operation of the ejector pin by a mold closing operation, and the workpiece end surface remains pressed against the pot insert. The mold according to claim 1 or 2, wherein the upper surface is pressed by the pot insert.   The other mold has a center insert disposed opposite to the pot insert and a cavity insert formed opposite to the insert block, and the cavity insert formed with a predetermined gap with respect to the center insert. The other die is supported by being suspended from the chase block, and is provided with a pushing means that abuts against the cavity insert and pushes toward the center insert when the die is closed to eliminate the gap. The mold according to any one of claims 1 to 3, wherein:   The mold according to any one of claims 1 to 4, wherein a release film that covers a resin path provided in the center insert and the cavity insert is adsorbed and held in the other mold.   The other mold has a relief recess formed at a position facing the alignment block, and an overflow cavity is formed in the relief recess with a mold resin filled in the cavity recess. The mold according to claim 5. A mold according to any one of claims 1 to 6,
A mold opening and closing mechanism for opening and closing the mold,
And a transfer mechanism for actuating a plunger inserted into the pot. A step of supplying a workpiece to an insert block of one of the molds that have been opened;
Pressing the workpiece end surface against the pot insert by pushing the workpiece end surface with the alignment block in conjunction with the mold closing operation of the mold mold, and aligning,
Moving the pot insert so as to approach the workpiece and superimposing and clamping the flange portion on the gate side runner area of the aligned workpiece;
The mold is closed with the work held by the insert block, and the mold resin melted from the pot is filled into a cavity recess formed in the other mold through a runner gate formed in the flange. Heating and curing,
Starting the mold opening of the mold after heat curing, and releasing the adsorption holding of the workpiece;
Moving the pot insert in a direction in which the flange part moves away from the work as the mold opening operation proceeds, and retreating the alignment block that has pushed the work from the work end part; and
And a step of taking out the work after molding from the mold mold opened.   The resin molding method according to claim 8, further comprising a step of eliminating the gap between the inserts by closing the mold mold and pressing toward the adjacent center insert in contact with the cavity insert.

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