GB2551770B - Chip scale LED packaging method - Google Patents

Chip scale LED packaging method

Info

Publication number
GB2551770B
GB2551770B GB1611349.0A GB201611349A GB2551770B GB 2551770 B GB2551770 B GB 2551770B GB 201611349 A GB201611349 A GB 201611349A GB 2551770 B GB2551770 B GB 2551770B
Authority
GB
United Kingdom
Prior art keywords
packaging method
chip scale
led packaging
scale led
chip
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
GB1611349.0A
Other versions
GB201611349D0 (en
GB2551770A (en
Inventor
Lin Shu-Hung
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shu Hung Lin
Original Assignee
Shu Hung Lin
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shu Hung Lin filed Critical Shu Hung Lin
Priority to GB1611349.0A priority Critical patent/GB2551770B/en
Publication of GB201611349D0 publication Critical patent/GB201611349D0/en
Publication of GB2551770A publication Critical patent/GB2551770A/en
Application granted granted Critical
Publication of GB2551770B publication Critical patent/GB2551770B/en
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/483—Containers
    • H01L33/486—Containers adapted for surface mounting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67121—Apparatus for making assemblies not otherwise provided for, e.g. package constructions
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B33/00—Electroluminescent light sources
    • H05B33/10—Apparatus or processes specially adapted to the manufacture of electroluminescent light sources
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
    • H01L2933/0008—Processes
    • H01L2933/0033—Processes relating to semiconductor body packages
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/005—Processes
    • H01L33/0095—Post-treatment of devices, e.g. annealing, recrystallisation or short-circuit elimination

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Led Device Packages (AREA)
GB1611349.0A 2016-06-30 2016-06-30 Chip scale LED packaging method Expired - Fee Related GB2551770B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
GB1611349.0A GB2551770B (en) 2016-06-30 2016-06-30 Chip scale LED packaging method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB1611349.0A GB2551770B (en) 2016-06-30 2016-06-30 Chip scale LED packaging method

Publications (3)

Publication Number Publication Date
GB201611349D0 GB201611349D0 (en) 2016-08-17
GB2551770A GB2551770A (en) 2018-01-03
GB2551770B true GB2551770B (en) 2018-09-26

Family

ID=56891166

Family Applications (1)

Application Number Title Priority Date Filing Date
GB1611349.0A Expired - Fee Related GB2551770B (en) 2016-06-30 2016-06-30 Chip scale LED packaging method

Country Status (1)

Country Link
GB (1) GB2551770B (en)

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005123238A (en) * 2003-10-14 2005-05-12 Matsushita Electric Ind Co Ltd Semiconductor light emitting device and method of manufacturing the same
CN101587923A (en) * 2008-05-19 2009-11-25 玉晶光电股份有限公司 Method for using screen plate for packaging and molding light emitting diode (LED)
SG183652A1 (en) * 2011-03-02 2012-09-27 Towa Corp Optoelectronic part producing method, optoelectronic part producing system, and optoelectronic part
KR101191869B1 (en) * 2011-06-08 2012-10-16 주식회사 프로텍 Method of manufacturing led device
EP2515333A2 (en) * 2011-04-21 2012-10-24 Samsung LED Co., Ltd. Light Emitting Device Module and Method of Manufacturing the Same
US20150111328A1 (en) * 2012-11-23 2015-04-23 Xiamen Sanan Optoelectronics Technology Co., Ltd. Light emitting diode fabrication method
US20160020367A1 (en) * 2014-07-15 2016-01-21 Achrolux Inc. Method for fabricating package structure

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005123238A (en) * 2003-10-14 2005-05-12 Matsushita Electric Ind Co Ltd Semiconductor light emitting device and method of manufacturing the same
CN101587923A (en) * 2008-05-19 2009-11-25 玉晶光电股份有限公司 Method for using screen plate for packaging and molding light emitting diode (LED)
SG183652A1 (en) * 2011-03-02 2012-09-27 Towa Corp Optoelectronic part producing method, optoelectronic part producing system, and optoelectronic part
EP2515333A2 (en) * 2011-04-21 2012-10-24 Samsung LED Co., Ltd. Light Emitting Device Module and Method of Manufacturing the Same
KR101191869B1 (en) * 2011-06-08 2012-10-16 주식회사 프로텍 Method of manufacturing led device
US20150111328A1 (en) * 2012-11-23 2015-04-23 Xiamen Sanan Optoelectronics Technology Co., Ltd. Light emitting diode fabrication method
US20160020367A1 (en) * 2014-07-15 2016-01-21 Achrolux Inc. Method for fabricating package structure

Also Published As

Publication number Publication date
GB201611349D0 (en) 2016-08-17
GB2551770A (en) 2018-01-03

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Legal Events

Date Code Title Description
PCNP Patent ceased through non-payment of renewal fee

Effective date: 20200630