CN108538943A - The encapsulating method of solar cell module - Google Patents
The encapsulating method of solar cell module Download PDFInfo
- Publication number
- CN108538943A CN108538943A CN201810621699.1A CN201810621699A CN108538943A CN 108538943 A CN108538943 A CN 108538943A CN 201810621699 A CN201810621699 A CN 201810621699A CN 108538943 A CN108538943 A CN 108538943A
- Authority
- CN
- China
- Prior art keywords
- glue
- solar cell
- cell module
- potato block
- region
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000000034 method Methods 0.000 title claims abstract description 59
- 239000003292 glue Substances 0.000 claims abstract description 162
- 235000002595 Solanum tuberosum Nutrition 0.000 claims abstract description 61
- 244000061456 Solanum tuberosum Species 0.000 claims abstract description 61
- 238000007711 solidification Methods 0.000 claims description 7
- 230000008023 solidification Effects 0.000 claims description 7
- 230000008014 freezing Effects 0.000 claims description 5
- 238000007710 freezing Methods 0.000 claims description 5
- 239000004033 plastic Substances 0.000 claims description 5
- 229920003023 plastic Polymers 0.000 claims description 5
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 5
- 229920005549 butyl rubber Polymers 0.000 claims description 4
- 238000009434 installation Methods 0.000 claims description 4
- 238000005498 polishing Methods 0.000 claims description 4
- 235000013606 potato chips Nutrition 0.000 claims description 4
- 239000013464 silicone adhesive Substances 0.000 claims description 4
- 238000002360 preparation method Methods 0.000 claims 1
- 239000000463 material Substances 0.000 abstract description 7
- 239000011248 coating agent Substances 0.000 description 4
- 238000000576 coating method Methods 0.000 description 4
- 238000005520 cutting process Methods 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 238000007789 sealing Methods 0.000 description 3
- 239000002699 waste material Substances 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 239000002390 adhesive tape Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000012530 fluid Substances 0.000 description 2
- 239000000565 sealant Substances 0.000 description 2
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000013084 building-integrated photovoltaic technology Methods 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 230000009545 invasion Effects 0.000 description 1
- 238000005304 joining Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 210000003097 mucus Anatomy 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 230000005622 photoelectricity Effects 0.000 description 1
- 229920002635 polyurethane Polymers 0.000 description 1
- 239000004814 polyurethane Substances 0.000 description 1
- 239000000741 silica gel Substances 0.000 description 1
- 229910002027 silica gel Inorganic materials 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
- H01L31/042—PV modules or arrays of single PV cells
- H01L31/048—Encapsulation of modules
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02S—GENERATION OF ELECTRIC POWER BY CONVERSION OF INFRARED RADIATION, VISIBLE LIGHT OR ULTRAVIOLET LIGHT, e.g. USING PHOTOVOLTAIC [PV] MODULES
- H02S40/00—Components or accessories in combination with PV modules, not provided for in groups H02S10/00 - H02S30/00
- H02S40/30—Electrical components
- H02S40/34—Electrical components comprising specially adapted electrical connection means to be structurally associated with the PV module, e.g. junction boxes
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
Abstract
This disclosure relates to the encapsulating method of solar cell module, more particularly to a kind of glue method of solar cell module comprising:A) prepare fresh potato block according to the shape and size in glue region;B) it surrounds glue region and places the potato block;C) glue is injected in glue region;D) potato block is removed after glue dry tack free.Glue method through the invention can improve glue efficiency and reduce material loss.
Description
Technical field
This disclosure relates to the encapsulating method of solar cell module, more particularly to a kind of glue of solar cell module
Method.
Background technology
In the manufacturing process of solar cell module, need to be sealed solar cell module, conventional at present
Sealing means are the surrounding coating fluid sealants in solar cell module.In the prior art, four peripheries of solar cell module
Adhesive tape be connected in an overlapping manner in intersection, if it find that joining place has the gap, then need to wipe original sealing off
It glue and coats again.Since existing glue method needs to wipe original adhesive tape and again coating glue off, increase
Activity duration, the loss for reducing work efficiency, also adding material.
In addition, in the manufacturing process of part photoelectricity architecture-integral (BIPV) solar cell module, need in component
Edge is installed by pen type terminal box.The mode of installation pen type terminal box is that sticky bonded adhesives is coated in its bottom, and by pen
Formula terminal box is installed to module edge, it is still necessary in terminal box periphery glue, to prevent from leading because of module edge out-of-flatness
Cause the invasion of the external substances such as steam.
Therefore, this field also needs to a kind of glue method for improving glue efficiency and reducing material loss.
Invention content
This is completed at least partly solve the technical problem that glue work efficiency is low in the prior art and material loss is high
Open, present disclose provides a kind of glue methods of solar cell module comprising:
A) prepare fresh potato block according to the shape and size in glue region;
B) it surrounds glue region and places the potato block;
C) glue is injected in glue region;
D) potato block is removed after glue dry tack free.
In the glue method of solar cell module described in the disclosure, the step a) is according to the shape in glue region
Further include that the fresh potato block is placed in clear water to store after preparing fresh potato block with size..
In the glue method of solar cell module described in the disclosure, the step c) injects glue in glue region
Further include being smoothed out glue surface using fresh potato chips after water.
In the glue method of solar cell module described in the disclosure, after step d), can also include:E) exist
The corner angle of polishing freezing plastic after glue solidification completely.
The glue method of solar cell module described in the disclosure, the glue are silicone adhesive or butyl rubber.
In the glue method of solar cell module described in the disclosure, solar battery group is closed in the glue region
When the edge of part, the solar cell module is inserted into the potato block of corresponding position.
According to the glue method of the solar cell module of the disclosure, the potato block being conveniently easy to get is used for solar cell
During the glue of component, not only can easily to potato block carry out it is arbitrary cutting to meet the needs of forming glue region,
And using potato block to the anti-stick ability of the glue so that can easily remove potato after glue surface solidification
Block, and regular shape, the smooth surface of gained glue part, the contact with component are more compacted.Pass through the sun of the disclosure
The glue method of energy battery component, can efficiently reduce the time of glue process needs, provide working efficiency.Meanwhile this public affairs
The glue method for the solar cell module opened also reduces the waste of glue material to a certain extent, reduce technique at
This.
Description of the drawings
Structure, feature in order to illustrate more clearly of the disclosure with reference to the following drawings carry out the embodiment of the disclosure
Description, but these attached drawings are only for the purpose of explanation, are not intended to limit the disclosure.
Fig. 1 is the flow chart according to the glue method of disclosure embodiment.
Fig. 2 is to be mended by the intermediate of potato block enclosing solar cell module according to the glue method of disclosure embodiment
Sectional view when glue region.
Fig. 3 is that fresh potato block is surrounded solar cell module surface need according to the glue method of disclosure embodiment
The vertical view when region of glue being wanted to place.
Fig. 4 is the glue method according to disclosure embodiment in the end benefit by potato block enclosing solar cell module
Sectional view when glue region, wherein there is part solar cell module to enter in potato block.
Fig. 5 is the glue method according to disclosure embodiment in the solar-electricity with terminal box by potato block enclosing
The sectional view after glue is injected in the glue region of pond component.
Fig. 6 be according to the glue method of the disclosure embodiment remove after glue dry tack free after potato obtained by the sun
The partial enlarged view in the glue region of energy battery component.
Fig. 7 is to be polished after glue solidifies completely obtained by the corner angle of freezing plastic according to the glue method of disclosure embodiment
The partial enlarged view in the glue region of solar cell module.
Drawing reference numeral:
1- potato block 2- glues region 3- solar cell modules
Redundances of the 4- glue 5- terminal boxes 6- after the glue solidifies
Specific implementation mode
To make those skilled in the art more fully understand the technical solution of the disclosure, come to according to this below in conjunction with attached drawing
The embodiment of the glue method of open solar cell module is described in detail.
A kind of glue method of solar cell module is provided according to the certain embodiments of the disclosure comprising:
A) prepare fresh potato block 1 according to the shape and size in glue region;
B) potato block 1 is placed around glue region 2;
C) glue 4 is injected in glue region;
D) potato block 1 is removed after glue dry tack free.
The flow chart of the glue method according to the solar cell module of the disclosure is shown in Fig. 1.
Inventor is had found by many experiments, after potato is cut into potato block, will produce on the surface of potato block viscous
Liquid, the mucus does not generate chemical reaction with the glue used in solar cell module manufacturing process (does not influence silica gel
Performance), and it is very high to the pick resistance of the glue.Based on this, potato block is used for the glue mistake of solar cell module
Cheng Zhong not only can carry out arbitrary cutting according to the shape and size in glue region to potato block, be allowed to meet enclosing formation benefit
The demand in glue region;Simultaneously using potato block to the anti-stick ability of the glue so that can be square after glue surface solidification
Just potato block, and regular shape, the smooth surface of gained glue part are removed, the contact with component is more compacted.Pass through
The glue method of the solar cell module of the disclosure can efficiently reduce the time of glue process needs, prior art side
Original fluid sealant is struck off in case and coating glue needs 80S again, and the glue surrounded in potato block in method of disclosure
Coating glue only needs 10S in region.Meanwhile the glue method of the solar cell module of the disclosure also subtracts to a certain extent
The waste for having lacked glue material, reduces process costs.
Further, fresh potato block aoxidizes and is dried and loses anti-stick ability in air in order to prevent, glue method
In step a) after preparing fresh potato block, fresh potato can be placed in clear water and be preserved in short-term, to keep its surface to glue
The pick resistance of water.
It further,, can be with profit in order to ensure to hand in the smooth of interface retroactively after injecting glue in glue region in step c)
Glue surface is smoothed out with fresh potato chips.
Specifically, in the glue method of the solar cell module described in the disclosure, the glue can be this field
Conventional use of various glue, including polyurethane adhesive, acrylate glue, silicone adhesive, butyl rubber etc..Optionally, the glue
Taste silicone adhesive or butyl rubber
In the glue method of solar cell module described in the disclosure, the time that glue dry tack free needs is 5-10
Minute, gained glue region shape rule, smooth surface, with the contact of peripheral sealing zone and component closely.Wait for glue
It is completely dried the glue operation that solar cell module is completed after forming.
The glue method of solar cell module described in the disclosure can also include after step d):E) in glue
The corner angle of polishing freezing plastic completely after solidification.
In the glue method of solar cell module described in the disclosure, the time that glue solidifies needs completely is 25-
35 minutes.
Embodiment
Embodiment 1
Refering to what is shown in Fig. 2, the region if necessary to glue is located at the intermediate region outside solar cell module, according to this
The glue method of disclosed solar cell module specifically includes following steps:
A) prepare fresh potato block 1 according to the shape and size in glue region;
B) potato block 1 (as shown in the vertical view of Fig. 3), potato block 1 and solar cell are placed around glue region 2
Component 3 constitutes glue region;
C) glue 4 is injected in glue region;
D) 5 minutes are stood and removes the potato block 1 after glue dry tack free.
Embodiment 2
Refering to what is shown in Fig. 4, the region if necessary to glue is located at the end regions outside solar cell module, according to this
The glue method of disclosed solar cell module specifically includes following steps:
A) prepare fresh potato block 1 according to the shape and size in glue region;
B) potato block 1 is placed around glue region 2, corresponding position is inserted into the end of solar cell module 3
In potato block 1, thus, it is possible to prevent glue from leaking outside;
C) glue 4 is injected in glue region, is then smoothed out glue surface using fresh potato chips;
D) 5 minutes are stood and removes the potato block 1 after glue dry tack free;
E) corner angle for standing freezing plastic of polishing after glue completely solidification for 30 minutes, to remove extra part 6, such as Fig. 5
Shown in Fig. 6.
Embodiment 3
Refering to what is shown in Fig. 5, the solar cell module for needing installation terminal box, it can be according to the method for embodiment 1
Implement the glue method of the solar cell module according to the disclosure.The difference is that by 1 enclosing of potato block in terminal box 5
Installation site periphery, therebetween have a certain distance to form glue region.Specific steps include:
A) prepare fresh potato block 1;
B) terminal box 5 is placed on to position to be installed, and the potato block is placed around terminal box interval 5mm;
C) glue 4 is injected in the region between terminal box and potato block;
D) potato block 1 is removed after glue dry tack free, is continued standing to glue and is completely dried.
According to the glue method of the solar cell module of the disclosure, the potato block being conveniently easy to get is used for solar cell
During the glue of component, not only can easily to potato block carry out it is arbitrary cutting to meet the needs of forming glue region,
And using potato block to the anti-stick ability of the glue so that can easily remove potato after glue surface solidification
Block, and regular shape, the smooth surface of gained glue part, the contact with component are more compacted.Pass through the sun of the disclosure
The glue method of energy battery component, can efficiently reduce the time of glue process needs, provide working efficiency.Meanwhile this public affairs
The glue method for the solar cell module opened also reduces the waste of glue material to a certain extent, reduce technique at
This.
Although specific embodiment is described above, even if only describing single implementation relative to specific feature
Example, also it is not intended to limit the scope of the present disclosure for these embodiments.Unless otherwise stated, feature provided in the disclosure
Example it is intended that it is illustrative and not restrictive.What above description was intended to cover to will be apparent to those skilled in the science
Those of advantageous effect with disclosure alternative form, modification and equivalents.
The scope of the present disclosure includes any feature or feature combination (express or imply) disclosed herein or its is any general
It includes.Specifically, with reference to the appended claims, the feature from dependent claims can be with those of independent claims feature
It is combined, the feature from corresponding independent claims can combine in any appropriate manner, and not be only with appended power
The particular form combination that profit is enumerated in requiring.
Claims (8)
1. a kind of glue method of solar cell module, including:
A) prepare fresh potato block according to the shape and size in glue region;
B) it surrounds glue region and places the potato block;
C) glue is injected in glue region;
D) potato block is removed after glue dry tack free.
2. glue method according to claim 1, which is characterized in that the step a) is according to the shape and ruler in glue region
Further include that the fresh potato block is placed in clear water to store after the fresh potato block of very little preparation.
3. glue method according to claim 1, which is characterized in that the step c) injects glue in glue region
Afterwards, further include being smoothed out glue surface using fresh potato chips.
4. glue method according to claim 1, which is characterized in that after step d), can also include:E) in glue
The corner angle of polishing freezing plastic completely after solidification.
5. glue method according to claim 1, which is characterized in that the glue is silicone adhesive or butyl rubber.
6. glue method according to claim 1, which is characterized in that solar cell module is closed in the glue region
When edge, the solar cell module is inserted into the potato block of corresponding position.
7. glue method according to claim 1, which is characterized in that the glue method is used in solar cell module
Upper installation terminal box.
8. glue method according to claim 7, which is characterized in that the glue method specifically includes following steps:
A) prepare fresh potato block;
B) terminal box is placed on to position to be installed, and around the terminal box placement potato spaced apart
Block;
C) glue is injected in the region between the terminal box and the potato block;
D) potato block is removed after glue dry tack free.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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CN201810621699.1A CN108538943A (en) | 2018-06-15 | 2018-06-15 | The encapsulating method of solar cell module |
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CN201810621699.1A CN108538943A (en) | 2018-06-15 | 2018-06-15 | The encapsulating method of solar cell module |
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Publication Number | Publication Date |
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CN108538943A true CN108538943A (en) | 2018-09-14 |
Family
ID=63470969
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CN201810621699.1A Pending CN108538943A (en) | 2018-06-15 | 2018-06-15 | The encapsulating method of solar cell module |
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CN101789483A (en) * | 2010-02-05 | 2010-07-28 | 江苏伯乐达光电科技有限公司 | Coating method of light-emitting diode fluorescent powder |
CN201956391U (en) * | 2010-12-21 | 2011-08-31 | 华宏光电子(深圳)有限公司 | LED (Light-Emitting Diode) packaging module |
CN103078049A (en) * | 2013-02-07 | 2013-05-01 | 张刚维 | COB (Chip On Board) packaged LED (Light Emitting Diode) light source and manufacturing method |
CN104851961A (en) * | 2015-03-24 | 2015-08-19 | 湘能华磊光电股份有限公司 | Chip scale packaging method and structure for light-emitting device |
CN105429590A (en) * | 2015-12-25 | 2016-03-23 | 江苏云之尚节能科技有限公司 | Fully glue-poured photovoltaic special junction box with diode integration module as movement |
CN107731996A (en) * | 2017-09-28 | 2018-02-23 | 惠州市华瑞光源科技有限公司 | Led lamp bead and preparation method thereof |
-
2018
- 2018-06-15 CN CN201810621699.1A patent/CN108538943A/en active Pending
Patent Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
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CN101609872A (en) * | 2009-06-19 | 2009-12-23 | 云南北方奥雷德光电科技股份有限公司 | Quantity production packaging technique of minitype OLED display |
CN101789483A (en) * | 2010-02-05 | 2010-07-28 | 江苏伯乐达光电科技有限公司 | Coating method of light-emitting diode fluorescent powder |
CN201956391U (en) * | 2010-12-21 | 2011-08-31 | 华宏光电子(深圳)有限公司 | LED (Light-Emitting Diode) packaging module |
CN103078049A (en) * | 2013-02-07 | 2013-05-01 | 张刚维 | COB (Chip On Board) packaged LED (Light Emitting Diode) light source and manufacturing method |
CN104851961A (en) * | 2015-03-24 | 2015-08-19 | 湘能华磊光电股份有限公司 | Chip scale packaging method and structure for light-emitting device |
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Application publication date: 20180914 |