CN206568505U - A kind of integrated circuit plastic packaging mould injecting systems - Google Patents
A kind of integrated circuit plastic packaging mould injecting systems Download PDFInfo
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- CN206568505U CN206568505U CN201720220831.9U CN201720220831U CN206568505U CN 206568505 U CN206568505 U CN 206568505U CN 201720220831 U CN201720220831 U CN 201720220831U CN 206568505 U CN206568505 U CN 206568505U
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- injection
- seat
- pressing plate
- integrated circuit
- plastic packaging
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- Injection Moulding Of Plastics Or The Like (AREA)
Abstract
The utility model and semiconductor plastic package apparatus field, and in particular to a kind of integrated circuit plastic packaging mould injecting systems, including jam plate, pressing plate, injection seat, floating seat, cap handle, injection rod and injection head；Described injection seating is in the bottom of the system；Described pressing plate is located at the injection seat upper end and forms cavity with injection seat；Described jam plate is located between described pressing plate and cap handle；It is spring to be located in the cavity；One end of described injection rod is connected in spring, and the other end is connected with described injection head.The utility model is linked together injection rod, pressing plate and cap handle three using jam plate, during later maintenance, it is only necessary to unclamp jam plate and quick change can be achieved, relatively safeguard.Total system uses floating structure, to ensure that each injection head pressure in injection is balanced, it is ensured that die cavity is full of in injection molding.
Description
Technical field
The present invention and semiconductor plastic package apparatus field, and in particular to a kind of integrated circuit plastic packaging mould injecting systems.
Background technology
Injection head refers to during Semi-conductor plastic capsulation mould injection and barrel coordinates pressurization pressure injection plastic packaging material to pass through runner cast gate by it
Into a device of die cavity formation product.Existing injection head majority is overall fixed, when injection head length increase, side
Face is big with material tube inner wall mating surface, and increase resistance or interference, influence are normally used and reduced the life-span；When injection head length is shortened
When, it is small with material tube inner wall mating surface sideways, it is impossible to ensure to coordinate the precision being oriented to, influence is normally used, and can also reduce injection head
Service life, more than in addition to, overall fixed injection device dismounting trouble must integral replacing during replacing, it is impossible to individually
Part exchanging.
The content of the invention
The purpose of the present invention is exactly a kind of floating type integrated electricity for being easy to repair for overcoming the deficiencies in the prior art and providing
Road plastic sealed mould injecting systems.
In order to solve the above technical problems, the present invention is adopted the following technical scheme that：
A kind of integrated circuit plastic packaging mould injecting systems, including jam plate, pressing plate, injection seat, floating seat, cap handle, injection rod and
Injection head；Described injection seating is in the bottom of the system；Described pressing plate is located at the injection seat upper end and with being molded seat
Form cavity；Described jam plate is located between described pressing plate and cap handle；It is spring to be located in the cavity；Described injection
One end of bar is connected in spring, and the other end is connected with described injection head.
Preferably, described injection rod is multiple.
Compared with prior art, beneficial effects of the present invention are：
The present invention is linked together injection rod, pressing plate and cap handle three using jam plate, during later maintenance, it is only necessary to unclamp
Jam plate is that quick change can be achieved, and is relatively safeguarded.Total system uses floating structure, to ensure that each injection head pressure in injection is equal
Weighing apparatus, it is ensured that die cavity is full of in injection molding.
Brief description of the drawings
Fig. 1 is schematic structural view of the invention.
Embodiment
Referring to shown in accompanying drawing 1, a kind of integrated circuit plastic packaging mould injecting systems, including jam plate 1, pressing plate 2, injection seat 8, float
Seat 4, cap handle 5, injection rod 6 and injection head 7；Described injection seat 8 is placed in the bottom of the system；Described pressing plate 2 is located at institute
State the injection upper end of seat 8 and form cavity 3 with injection seat 8；Described jam plate 1 is located between described pressing plate 2 and cap handle 5；It is located at
In the cavity 3 is spring 9；One end of described injection rod 6 is connected in spring 9, the other end and the described phase of injection head 7
Even.
Preferably, described injection rod 6 is multiple.
During use, injection seat 8 is connected with plastic packaging injection device, and injection head 7 is connected with injection molding, and material is from cavity
3 enter in injection rods 6, and are expelled to from injection head 7 in injection molding, when multiple injection heads 7 are in injection process, injection head 7
When being under pressure, pressure is transmitted to the spring 9 of other end connection, and spring 9 is played regulatory role to the pressure suffered by injection head, to protect
Pressure is balanced during card injection, consistent to mould filling and be full of.In terms of maintenance, the present invention uses jam plate 1 by injection rod 6, pressure
Plate 2 and the three of cap handle 5 link together, during later maintenance, it is only necessary to unclamp jam plate 1 and quick change can be achieved, relatively safeguard.It is overall
Mechanism is reasonable in design, meets the production needs of integrated circuit plastic packaging.
Claims (2)
1. a kind of integrated circuit plastic packaging mould injecting systems, it is characterised in that：Including jam plate（1）, pressing plate（2）, injection seat（8）, it is floating
Dynamic seat（4）, cap handle（5）, injection rod（6）And injection head（7）；Described injection seat（8）It is placed in the bottom of the system；Described
Pressing plate（2）It is located at the injection seat（8）Upper end and with injection seat（8）Form cavity（3）；Described jam plate（1）Described in being located at
Pressing plate（2）And cap handle（5）Between；It is located at the cavity（3）Interior is spring（9）；Described injection rod（6）One end be connected to
Spring（9）It is interior, the other end and described injection head（7）It is connected.
2. a kind of integrated circuit plastic packaging mould injecting systems according to claim 1, it is characterised in that：Described injection rod
（6）To be multiple.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720220831.9U CN206568505U (en) | 2017-03-08 | 2017-03-08 | A kind of integrated circuit plastic packaging mould injecting systems |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720220831.9U CN206568505U (en) | 2017-03-08 | 2017-03-08 | A kind of integrated circuit plastic packaging mould injecting systems |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN206568505U true CN206568505U (en) | 2017-10-20 |
Family
ID=60057902
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201720220831.9U Active CN206568505U (en) | 2017-03-08 | 2017-03-08 | A kind of integrated circuit plastic packaging mould injecting systems |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN206568505U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107053618A (en) * | 2017-03-08 | 2017-08-18 | 安徽国晶微电子有限公司 | A kind of integrated circuit plastic packaging mould injecting systems |
-
2017
- 2017-03-08 CN CN201720220831.9U patent/CN206568505U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107053618A (en) * | 2017-03-08 | 2017-08-18 | 安徽国晶微电子有限公司 | A kind of integrated circuit plastic packaging mould injecting systems |
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