CN202352654U - Electronic element - Google Patents
Electronic element Download PDFInfo
- Publication number
- CN202352654U CN202352654U CN2011204896138U CN201120489613U CN202352654U CN 202352654 U CN202352654 U CN 202352654U CN 2011204896138 U CN2011204896138 U CN 2011204896138U CN 201120489613 U CN201120489613 U CN 201120489613U CN 202352654 U CN202352654 U CN 202352654U
- Authority
- CN
- China
- Prior art keywords
- circuit board
- pin
- pad
- electronic component
- fixed arm
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
- H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
- H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
- H01L2224/48139—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate with an intermediate bond, e.g. continuous wire daisy chain
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/4912—Layout
- H01L2224/49171—Fan-out arrangements
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Abstract
The utility model relates to an electronic element, which comprises a package body, a circuit board and a plurality of pins, wherein the circuit board is positioned inside the package body, and one end of each pin is positioned inside the package body and electrically connected with the circuit board. The electronic element is characterized by further comprising fixed arms positioned inside the package body, and a pin bonding pad corresponding to the pins and a location bonding pad corresponding to the fixed arms are arranged on the circuit board; and the fixed arms are welded on the location bonding pad, and the pins are welded on the pin bonding pad. When the electronic element executes a package operation process, the fixed arms and the pins on a frame are fixedly connected with the circuit board in a welding manner, the circuit board is subjected to dual fixation, so that the circuit board is not easy to incline in the package process, and the finished product rate of the electronic element is improved.
Description
[technical field]
The utility model relates to electronic technology field, particularly relates to the encapsulation type electronic component that a kind of inside comprises circuit board and has a plurality of pins.
[background technology]
Electronic component has a variety of, and wherein having a kind of is the electronic component that has a plurality of pins and have a packaging body, like power model.
As shown in Figure 1, it is the internal structure sketch map of conventional power module 10, and it comprises circuit board 102 and a plurality of pin 104 of packaging body 100, packaging body 100 inside.Generally include chip for driving and passive device on the circuit board 102, because this part circuit devcie is many, caloric value is little, so usually this part circuit devcie is installed on circuit board 102 plates.Circuit board 102 is electrically connected through bonding line 106 and pin 104.Bonding line 106 can be aluminum steel, gold thread, copper cash etc.One end and some other device of said circuit board 102, bonding line 106, pin 104 are packaged together through moulding resin.
The injection molding way encapsulation is normally adopted in the moulding resin encapsulation of power model 10, and in the process of moulding resin injection moulding, flowing of moulding resin makes circuit board 102 produce through regular meeting.As shown in Figure 2, the inclination of circuit board 102 will cause bonding line 106 to come off with the solder joint that circuit board 102 is connected, even might cause circuit board 102 to expose to packaging body 100, finally causes the inefficacy of power model 10.
See also Fig. 3, in order to solve the tilt problem of circuit board 102 in encapsulation process, traditional approach is the mode that adopts thimble, promptly in encapsulation process, circuit board 102 is withstood through a thimble 110, and encapsulation is removed thimble 110 after finishing.But the shortcoming of doing like this is; Because flowing of moulding resin constantly has friction to thimble 110, especially at the moulding resin that uses square particle during as encapsulating material; Thimble 110 there is very big damage; So thimble 110 will often be changed or maintaining, cause the overall cost of power model 10 to increase, and operation is complicated.
[utility model content]
Based on this, be necessary to provide a kind of through preventing the electronic component of the electron element packaging method acquisition that internal circuit board tilts.
A kind of electronic component; It comprises packaging body, circuit board and a plurality of pin; Said circuit board is positioned at said package interior; One end of said pin is positioned at said package interior and is electrically connected with said circuit board, and said electronic component also comprises the fixed arm that is positioned at said package interior, and said circuit board is provided with pin pad corresponding with said pin and the capture pad corresponding with said fixed arm; Said fixed arm is welded on the said capture pad, and said pin is welded on the said pin pad.
In the utility model one preferred embodiment, said circuit board is square, and said pin pad is positioned on the plate face of said circuit board one side, and said capture pad is positioned on the plate face of side adjacent with said pin pad place side on the said circuit board.
In the utility model one preferred embodiment, said fixed arm has two, and two corresponding said capture pad are separately positioned on the plate face of two adjacent with said pin pad place side on said circuit board sides
In the utility model one preferred embodiment, said two capture pad are separately positioned on the said circuit board on two angles away from said pin pad.
In the utility model one preferred embodiment, said capture pad is arranged on the angle of said circuit board.
Above-mentioned electronic component is in carrying out the encapsulation operation process; Fixed arm on the framework and pin all are fixed together through the mode and the circuit board of welding; Thereby circuit board has been carried out double fixed, made circuit board in encapsulation process, be difficult for tilting, and then improved the rate of finished products of electronic component.
[description of drawings]
Fig. 1 is the internal structure sketch map of conventional power module;
Fig. 2 is the internal structure sketch map of circuit board heeling condition in the power model shown in Figure 1;
Fig. 3 is the scheme sketch map that tradition solves circuit board tilt problem in the power model encapsulation process;
Fig. 4 is the electron element packaging method flow chart of an embodiment;
Fig. 5 is the electronic component internal structure sketch map of an embodiment;
Fig. 6 is the internal structure sketch map at another visual angle of electronic component shown in Figure 5.
[embodiment]
In order to solve the problem that circuit board tilts in the encapsulation process, proposed a kind of through preventing the electronic component of the electron element packaging method acquisition that internal circuit board tilts.
See also Fig. 4, it is the electron element packaging method flow chart of an embodiment, comprises the steps:
Step S201 provides circuit board, framework that is fixed together and pin, and the inwall of said framework is provided with fixed arm, and said circuit board is provided with and fixed arm and pin corresponding bonding pad.
Among the utility model embodiment, said framework and pin are copper material, and framework is square, and said pin is a plurality of.Be respectively equipped with fixed arm on the framework two opposite inner walls, said fixed arm also is a metal material, and the one of which end is fixedly connected with frame inner wall.
Be arranged on position with the fixed arm corresponding bonding pad on the circuit board away from the corresponding pad of pin; Among the utility model embodiment; Circuit board is square; Be arranged on the plate face of circuit board one side with the pin corresponding bonding pad, be provided with on the plate face with the adjacent side of pin corresponding bonding pad place side with the fixed arm corresponding bonding pad.Among the utility model embodiment, said fixed arm is two, and two corresponding pads are separately positioned on the circuit board on two angles away from said pin corresponding bonding pad.
Step S202 is with corresponding bonding pad welding on fixed arm and the circuit board.
Step S203 is with corresponding bonding pad welding on pin and the circuit board.
Step S204 utilizes encapsulating material that one end of circuit board, framework and pin is packaged together.
Step S205 cuts off the connection between framework and the pin.
Step S206 cuts off the connection between framework and the fixed arm.
In the above-mentioned electron element packaging method; In carrying out the encapsulation operation process; Fixed arm on the framework and pin all are fixed together through the mode and the circuit board of welding; Thereby circuit board has been carried out double fixed, made that circuit board can run-off the straight in encapsulation process, and then improved the rate of finished products of electronic component.
Please consult Fig. 5 and Fig. 6 simultaneously, it is the structural representation through two visual angles of the electronic component 30 of above-mentioned electron element packaging method acquisition.Electronic component 30 comprises packaging body 300, fixed arm 350, circuit board 302 and a plurality of pin 304.Circuit board 302 all is positioned at packaging body 300 inside with fixed arm 350, and fixed arm 350 is welded to connect with circuit board 302.One end of pin 304 is positioned at packaging body 300 inside and is welded to connect with circuit board 302.
The above embodiment has only expressed several kinds of execution modes of the utility model, and it describes comparatively concrete and detailed, but can not therefore be interpreted as the restriction to the utility model claim.Should be pointed out that for the person of ordinary skill of the art under the prerequisite that does not break away from the utility model design, can also make some distortion and improvement, these all belong to the protection range of the utility model.Therefore, the protection range of the utility model patent should be as the criterion with accompanying claims.
Claims (5)
1. electronic component; It comprises packaging body, circuit board and a plurality of pin; Said circuit board is positioned at said package interior, and an end of said pin is positioned at said package interior and is electrically connected with said circuit board, it is characterized in that; Said electronic component also comprises the fixed arm that is positioned at said package interior, and said circuit board is provided with pin pad corresponding with said pin and the capture pad corresponding with said fixed arm; Said fixed arm is welded on the said capture pad, and said pin is welded on the said pin pad.
2. electronic component according to claim 1; It is characterized in that; Said circuit board is square, and said pin pad is positioned on the plate face of said circuit board one side, and said capture pad is positioned on the plate face of side adjacent with said pin pad place side on the said circuit board.
3. electronic component according to claim 2 is characterized in that, said fixed arm has two, and two corresponding said capture pad are separately positioned on the plate face of two adjacent with said pin pad place side on said circuit board sides
4. electronic component according to claim 3 is characterized in that, said two capture pad are separately positioned on the said circuit board on two angles away from said pin pad.
5. electronic component according to claim 1 is characterized in that said capture pad is arranged on the angle of said circuit board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011204896138U CN202352654U (en) | 2011-11-30 | 2011-11-30 | Electronic element |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011204896138U CN202352654U (en) | 2011-11-30 | 2011-11-30 | Electronic element |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202352654U true CN202352654U (en) | 2012-07-25 |
Family
ID=46541634
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2011204896138U Expired - Fee Related CN202352654U (en) | 2011-11-30 | 2011-11-30 | Electronic element |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202352654U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102437061A (en) * | 2011-11-30 | 2012-05-02 | 深圳市威怡电气有限公司 | Electronic component and packaging method thereof |
-
2011
- 2011-11-30 CN CN2011204896138U patent/CN202352654U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102437061A (en) * | 2011-11-30 | 2012-05-02 | 深圳市威怡电气有限公司 | Electronic component and packaging method thereof |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C17 | Cessation of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20120725 Termination date: 20131130 |