CN205303508U

CN205303508U - High -power LED lamp pearl of high light efficiency of low thermal resistance

Info

Publication number: CN205303508U
Application number: CN201521140699.8U
Authority: CN
Inventors: 蒋明杰; 黄星
Original assignee: Zhejiang Weiwei Optoelectronic Technology Co Ltd
Current assignee: Zhejiang Weiwei Optoelectronic Technology Co Ltd
Priority date: 2015-12-31
Filing date: 2015-12-31
Publication date: 2016-06-08
Anticipated expiration: 2025-12-31

Abstract

The utility model provides a high -power LED lamp pearl of high light efficiency of low thermal resistance, the heat is piled up fewly, heat conduction is smooth and easy, it includes 3V chip and support (2), the support is for take day font metal frame (2) as the skeleton and having the frame of PPA plastics (3) in the surperficial cladding of skeleton, metal frame (2) including first day word part (2.1) and second day word partially (2.2), metal frame (2) cross section is the shape of falling T, the first oral area of frame is equipped with first copper sheet (4), the second oral area of frame is equipped with second copper sheet (5), first copper sheet (4) surface bonding has four 3V chips, four 3V chips are the field font and distribute, first copper sheet (4), the 1st 3V chip (1.1), the 2nd 3V chip (1.2), the 3rd 3V chip (1.3), fourth 3V chip (1.4), establish ties according to the preface electrical property through bonding wire (6) second copper sheet (5).

Description

Low thermal resistance high-efficient large power LED lamp bead

Technical field

This utility model relates to LED technology field, is especially a kind of low thermal resistance high-efficient large power LED lamp bead.

Background technology

The structure of current LED lamp bead is varied, generally comprise chip, support, the conventional LED lamp bead of 3V is comparatively general, and become current major trend to the research of the LED lamp bead of the relatively high pressures such as 6V, 9V, 12V, but the LED lamp bead of multi-chip is due to the reason such as heat build-up, heat conduction is not smooth, life-span, light efficiency etc. all have problems, and especially chip is more many, problem is all the more serious, so simply efficiently solve one of not smooth direction falling over each other research for each producer of heat build-up, heat conduction always.

Utility model content

Technical problem to be solved in the utility model is, overcomes the defect of prior art, it is provided that a kind of heat build-up is few, heat conduction has the low thermal resistance high-efficient large power LED lamp bead of 12V of high reliability smoothly.

For solving above-mentioned technical problem, the utility model proposes a kind of low thermal resistance high-efficient large power LED lamp bead, it includes 3V chip and support, support be with day font metal frame for skeleton the framework being covered with PPA plastics at Skeleton Table bread, metal frame includes character segment on the firstth and second day character segment, the lower surface of character segment on the firstth and the upper surface of second day character segment connect, metal frame cross section is inverted T-shaped, the vertical portion of this inverted T-shaped is character segment on the firstth, the lateral part of this inverted T-shaped is second day character segment, first oral area of framework is provided with the first copper sheet, second oral area of framework is provided with the second copper sheet, first copper sheet, peripheral part that second copper sheet all includes inserting in PPA plastics and by peripheral part surround downwardly convex, two projections respectively with corresponding oral area close-fitting, first copper sheet inserts the peripheral part in PPA plastics, the peripheral part that second copper sheet inserts in PPA plastics is respectively positioned on above metal frame, first copper sheet surface is bonded with four 3V chips, four 3V chips are matrix pattern distribution, being positioned at the upper left corner is a 3V chip, being positioned at the lower left corner is the 2nd 3V chip, being positioned at the upper right corner is the 3rd 3V chip, being positioned at the lower right corner is the 4th 3V chip, first copper sheet, oneth 3V chip, 2nd 3V chip, 3rd 3V chip, 4th 3V chip, second copper sheet passes through bonding wire sequentially electrical series.

After adopting said structure, compared with prior art, this utility model has the advantage that said structure is a comprehensive design, comprise four 3V chips, general power is higher, therefore high-power feature is formed, the distributed architecture of four 3V chips can provide uniform illumination effect, between number of chips and uniformity of luminance, reach one balance preferably, number of chips controls in the reasonable scope, thus avoiding too much heat to produce, 12V is reached simultaneously four 3V chip-in series being made input voltage, the frame strength that cross section is inverted T-shaped is significantly high, framework stability in long-term persistently use is obviously enhanced, and adopt downwardly convex copper sheet, ensure that the segment thickness of copper sheet connection chip is thicker, and protruding face, outer circumferential will be provided and support by oral area circumference medial surface, this support is conducive to stablizing of copper sheet, these are all very beneficial for stablizing of chip and bonding wire, quickness and high efficiency heat can be conducted downwards simultaneously, form low thermal resistance feature, alleviate heat build-up, realize heat conduction smooth and easy, by the copper sheet that the heat conduction of chip is extremely installed, the PPA plastics that the conduction of a part of heat is connected by copper sheet to surrounding, inverted T-shaped metal frame strengthens heat conduction, heat transfer efficiency is high, and heat can be guided to walk toward PPA plastic lower portion, with away from chip, this time heat dissipation design, can retention frame stablize preferably, simultaneously to chip high efficiency and heat radiation, whole design has low thermal resistance high-efficient large power feature, therefore the low thermal resistance high-efficient large power LED lamp bead of the comprehensive 12V obtaining a kind of high reliability.

As improvement, each 3V chip is rectangular dies, and the negative pole of rectangular dies and positive pole are diagonal and arrange, wherein, negative pole is positioned at the upper left corner of rectangular dies, so, can make bonding wire as far as possible away from the luminous zone of 3V chip, it is to avoid what bonding wire was more blocks luminous zone, thus being more beneficial for luminescence.

As improvement, the length direction of rectangular dies is consistent with the length direction of framework, 2nd 3V chip is positioned at the underface of a 3V chip, oneth 3V chip and the 3rd symmetrical distribution of 3V chip, 2nd 3V chip and the 4th symmetrical distribution of 3V chip, so, on the one hand, total luminous zone comparatively uniform balance that four 3V chips build, illumination effect is good, second aspect, can make bonding wire as far as possible away from the luminous zone of 3V chip, avoid bonding wire more block luminous zone, thus being more beneficial for luminescence, the third aspect, bonding wire between electrical connection 3V chip can be made the camber line of tilt distribution, so that bonding wire has better stretches ability to bear, in vibration environment, expand with heat and contract with cold and environment is all not easy fracture.

As improvement, the first oral area is more than the second oral area, and so, the first copper sheet area is bigger, four 3V chips of more convenient layout and make bonding wire, and heat radiation is better simultaneously.

Accompanying drawing explanation

Fig. 1 is the top view of this utility model low thermal resistance high-efficient large power LED lamp bead.

Fig. 2 is that the A-A of this utility model low thermal resistance high-efficient large power LED lamp bead is to sectional view.

Fig. 3 is the side view of the first copper sheet of this utility model low thermal resistance high-efficient large power LED lamp bead.

Fig. 4 be this utility model low thermal resistance high-efficient large power LED lamp bead day font metal frame top view.

Fig. 5 be this utility model low thermal resistance high-efficient large power LED lamp bead day font metal frame B-B to cutaway view Amplified image.

Shown in figure, the 1.1, the oneth 3V chip, the 1.2, the 2nd 3V chip, 1.3, the 3rd 3V chip, the 1.4, the 4th 3V chip, 2, metal frame, 2.1, character segment on the firstth, 2.2, second day character segment, 3, PPA plastics, 4, the first copper sheet, 5, the second copper sheet, 6, bonding wire, 7, negative pole, 8, positive pole, 9, protruding.

Detailed description of the invention

Below this utility model is described in further detail:

This utility model low thermal resistance high-efficient large power LED lamp bead, it includes 3V chip and support 2, support be with day font metal frame 2 for skeleton the framework being covered with PPA plastics 3 at Skeleton Table bread, metal frame 2 includes character segment 2.1 on the firstth and second day character segment 2.2, the lower surface of character segment 2.1 on the firstth and the upper surface of second day character segment 2.2 connect, metal frame 2 cross section is inverted T-shaped, as shown in Figure 4, the vertical portion of this inverted T-shaped is character segment 2.1 on the firstth, the lateral part of this inverted T-shaped is second day character segment 2.2, first oral area of framework is provided with the first copper sheet 4, second oral area of framework is provided with the second copper sheet 5, first copper sheet 4, second copper sheet 5 all includes the peripheral part inserted in PPA plastics and surrounded downwardly convex 9 by peripheral part, two projections 9 respectively with corresponding oral area close-fitting, first copper sheet 4 inserts the peripheral part in PPA plastics, second copper sheet 5 inserts the peripheral part in PPA plastics and is respectively positioned on above metal frame, first copper sheet 4 surface is bonded with four 3V chips, four 3V chips are matrix pattern distribution, being positioned at the upper left corner is a 3V chip 1.1, being positioned at the lower left corner is the 2nd 3V chip 1.2, being positioned at the upper right corner is the 3rd 3V chip 1.3, being positioned at the lower right corner is the 4th 3V chip 1.4, first copper sheet 4, oneth 3V chip 1.1, 2nd 3V chip 1.2, 3rd 3V chip 1.3, 4th 3V chip 1.4, second copper sheet 5 is by bonding wire 6 sequentially electrical series.

PPA plastic frame manufacturing process can be, the first step, by character segment 2.1 on the firstth, second day character segment 2.2 heat-conducting glue bonding formation day font metal frame 2, second step, with PPA plastics, day font metal frame 2 is wrapped to form font PPA plastic frame on the firstth, 3rd step, before second step PPA plastics are uncured, at font PPA plastic frame the first oral area on the firstth, second oral area puts the first copper sheet 4 respectively, second copper sheet 5, the peripheral side of protruding 9 is all against the circumferential medial surface of corresponding oral area, then wrap up one layer of PPA plastics again and solidify to form and be provided with the first copper sheet 4, the second day font PPA plastic frame of the second copper sheet 5.

PPA plastic frame carries out chip installation and is connected by prior art.

PPA plastics 3 are PPTA.

Each bonding wire is aerial camber line, and the bonding wire being used for electrically connecting between 3V chip is the aerial camber line of tilt distribution, and tilt distribution refers to that aerial camber line is acute angle in the projection straight line of the first copper sheet 4 and the angle on the long limit of framework, and on-right angle.

Each 3V chip is rectangular dies, and the negative pole 7 of rectangular dies and positive pole 8 are diagonal and arrange, and wherein, negative pole 7 is positioned at the upper left corner of rectangular dies.

The length direction of rectangular dies is consistent with the length direction of framework, 2nd 3V chip 1.2 is positioned at the underface of a 3V chip 1.1, oneth 3V chip 1.1 and the 3rd symmetrical distribution of 3V chip 1.3, the 2nd 3V chip 1.2 and the 4th symmetrical distribution of 3V chip 1.4.

First oral area is more than the second oral area.

First oral area is coated with fluorescent glue; first copper sheet 4, four 3V chips, bonding wires 6 are all covered by this fluorescent glue, and this example adopts transparent fluorescent glue, therefore not shown in FIG.; fluorescent glue can play certain protective effect, and the light emission direction of luminous zone, light efficiency are all able to better simultaneously.

When this example is actually used, LED power negative pole end and the first copper sheet 4 electrically connect, and LED power positive terminal and the second copper sheet 5 electrically connect.

When improving or the later stage encapsulates this utility model low thermal resistance high-efficient large power LED lamp bead, all right: 1, by designing the flip-chip packaged substrate and thermoelectricity isolating construction being conducive to LED chip to dispel the heat, promote the LED chip heat dispersion to the outer pin of packaging body, significantly reduce the thermal resistance of encapsulating structure; 2, by the structural design of diffusion layer, make source light can carry out multiple reflections and refraction, luminescence is more uniform, light multiple reflections in transparency carrier is achieved by regularly arranged rough structure, reaching the lifting of substrate exterior light extraction efficiency, thus improve LED light effect, additionally diffusion layer too increases the contact area of substrate side surfaces and air, add the radiating effect of substrate, be effectively increased the making power of LED; 3, by designing multiple louvre in substrate along its length, add the contact area of substrate and air, and the heat within substrate can be derived either directly through louvre, further increase the radiating effect of substrate, improve the stability of high light efficiency LED.

The above is only better embodiment of the present utility model, therefore all equivalences done according to the structure described in present patent application scope, feature and principle change or modify, and are all included in this utility model patent claim.

Claims

1. a low thermal resistance high-efficient large power LED lamp bead, it includes 3V chip and support, it is characterized in that, support is for day font metal frame (2) for skeleton the framework being covered with PPA plastics (3) at Skeleton Table bread, metal frame (2) includes character segment (2.1) on the firstth and second day character segment (2.2), first day character segment (2.1) lower surface and second day character segment (2.2) upper surface connect, metal frame (2) cross section is inverted T-shaped, the vertical portion of this inverted T-shaped is character segment (2.1) on the firstth, the lateral part of this inverted T-shaped is second day character segment (2.2), first oral area of framework is provided with the first copper sheet (4), second oral area of framework is provided with the second copper sheet (5), first copper sheet (4), second copper sheet (5) all includes the peripheral part inserted in PPA plastics and downwardly convex (9) that surrounded by peripheral part, two projections (9) respectively with corresponding oral area close-fitting, first copper sheet (4) inserts the peripheral part in PPA plastics, the peripheral part that second copper sheet (5) inserts in PPA plastics is respectively positioned on above metal frame, first copper sheet (4) surface is bonded with four 3V chips, four 3V chips are matrix pattern distribution, being positioned at the upper left corner is a 3V chip (1.1), being positioned at the lower left corner is the 2nd 3V chip (1.2), being positioned at the upper right corner is the 3rd 3V chip (1.3), being positioned at the lower right corner is the 4th 3V chip (1.4), first copper sheet (4), oneth 3V chip (1.1), 2nd 3V chip (1.2), 3rd 3V chip (1.3), 4th 3V chip (1.4), second copper sheet (5) is by bonding wire (6) sequentially electrical series.

2. low thermal resistance high-efficient large power LED lamp bead according to claim 1, it is characterized in that, each 3V chip is rectangular dies, the negative pole (7) of rectangular dies and positive pole (8) are diagonal and arrange, wherein, negative pole (7) is positioned at the upper left corner of rectangular dies.

3. low thermal resistance high-efficient large power LED lamp bead according to claim 2, it is characterized in that, the length direction of rectangular dies is consistent with the length direction of framework, 2nd 3V chip (1.2) is positioned at the underface of a 3V chip (1.1), oneth 3V chip (1.1) and the 3rd 3V chip (1.3) symmetrical distribution, the 2nd 3V chip (1.2) and the 4th 3V chip (1.4) symmetrical distribution.

4. low thermal resistance high-efficient large power LED lamp bead according to claim 1, it is characterised in that the first oral area is more than the second oral area.