CN201204210Y - Encapsulation structure for light emitting diode and forming die for manufacturing the same - Google Patents
Encapsulation structure for light emitting diode and forming die for manufacturing the same Download PDFInfo
- Publication number
- CN201204210Y CN201204210Y CNU2008200933403U CN200820093340U CN201204210Y CN 201204210 Y CN201204210 Y CN 201204210Y CN U2008200933403 U CNU2008200933403 U CN U2008200933403U CN 200820093340 U CN200820093340 U CN 200820093340U CN 201204210 Y CN201204210 Y CN 201204210Y
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- emitting diode
- light
- encapsulation
- encapsulating structure
- packaging
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Abstract
A light-emitting diode packaging structure includes a light-emitting diode wafer, a cathode bracket, an anode bracket corresponding to the cathode bracket, and wires for connecting the light-emitting diode wafer with the cathode bracket and the anode bracket. The packaging structure of the light-emitting diode wafer also includes a first packaging portion for packaging the light emitting diode wafer, and a second packaging portion convex on the top of the first packaging portion, wherein, the cross sectional area of the first portion is larger than that of the second packaging portion. The light-emitting diode packaging structure of the utility model, enlarges the irradiance angle of the light emitting diode by the packaging geometrical shapes of the first packaging portion and second packaging portion, has a simple structure, and can make the light emitting diode to send out uniform light. In addition, the utility model also provides a mold for manufacturing the light-emitting diode packaging structure.
Description
Technical field
The utility model relates to the light-emitting diode field, relates in particular to that a kind of lighting angle is big, the encapsulating structure of luminous uniform light-emitting diode and make its mould.
Background technology
(Light Emitting Diode LED) is a kind of gallium phosphide semi-conducting material light-emitting display devices that make, that can directly electric energy be converted into luminous energy such as (GAP) to light-emitting diode.When its inside had certain electric current to pass through, it will be luminous.Because characteristics such as Toxic matter are grown, are quick on the draw, are not contained to led light source little power consumption, life-span, make its application more and more widely, for example: be applied in backlight, display screen, auto lamp and various Landscape Lightings place etc.
Publication number in the Chinese invention patent ublic specification of application " CN101093868 " name is called " a kind of LED encapsulating structure " and discloses a kind of LED encapsulating structure; the gold thread that it comprises the electrode suppor of wafer, bearing wafer and is electrically connected wafer and electrode suppor; be provided with the protective clear layer at complete coating wafer, gold thread and electrode suppor top on the electrode suppor top of LED, what this protective layer coated outward is the encapsulated layer that injection moulding forms.Yet, the light-emitting diode of this structure, because the cross sectional shape of the encapsulated layer that this injection moulding forms is to fall " U " shape, lighting angle is less, and its application is restricted.
The utility model content
The technical problem that the utility model solves provide a kind of simple in structure, lighting angle is big, the encapsulating structure of luminous uniform light-emitting diode.
In addition, the mould that also provides a kind of encapsulating structure simple in structure, that make light-emitting diode to use.
Goal of the invention of the present utility model is achieved through the following technical solutions:
A kind of encapsulating structure of light-emitting diode, comprise LED wafer, cathode anchor, the anode carrier corresponding with described cathode anchor, the lead-in wire that connects described LED wafer and described cathode anchor, anode carrier, wherein, the encapsulating structure of described light-emitting diode also comprises first encapsulation that encapsulates described LED wafer, and the top of described first encapsulation also convexes with second encapsulation, and the cross-sectional area of described first encapsulation is greater than the cross-sectional area of described second encapsulation.
The encapsulating structure of above-mentioned light-emitting diode, wherein: the vertical sectional shape of described first encapsulation is trapezoidal, rectangle or square.
The encapsulating structure of above-mentioned light-emitting diode, wherein: the vertical sectional shape of described second encapsulation is for falling " U " shape.
The encapsulating structure of above-mentioned light-emitting diode, wherein: described first encapsulation and second encapsulation are epoxide-resin glue.
The encapsulating structure of above-mentioned light-emitting diode, wherein: described first encapsulation and second encapsulation are one-body molded.
The encapsulating structure of above-mentioned light-emitting diode, wherein: the quantity of described cathode anchor and anode carrier is respectively 1.
The mould that a kind of encapsulating structure of making above-mentioned light-emitting diode is used, it comprises die holder, has at least one to be used for the shaping mould grain that embedding forms described first encapsulation and second encapsulation on the described die holder.
Above-mentioned mould, wherein: a side of described die holder is provided with the guide pillar that imports for LED support, and described guide pillar is provided with the guide groove that the guiding LED support enters.
Above-mentioned mould, wherein: be provided with the stuck point for LED support location between the described shaping mould grain, described stuck point is provided with the groove of the cross rib that is used to hold LED support; The structure of employing groove can strengthen fixedly preventing the swing of LED support.
Above-mentioned mould, wherein: described stuck point is dismountable being arranged on the die holder.
The encapsulating structure of light-emitting diode of the present utility model by the package geometry of first encapsulation and second encapsulation, increases the lighting angle of light-emitting diode, and is simple in structure, and, can make light-emitting diode send uniform light.In addition, epoxy resin has moisture-proof, and therefore insulating properties and high mechanical strength, can prolong the useful life of light-emitting diode; And the mould that the encapsulating structure of making this light-emitting diode is used, it is big to produce lighting angle easily, the light-emitting diode of energy uniformly light-emitting; Simultaneously,, LED support is effectively located, produce the consistency better products by guide pillar and stuck point.
Description of drawings
In order to be easy to explanation, the utility model is done to describe in detail by following preferred embodiment and accompanying drawing.
Fig. 1 is the perspective view of the encapsulating structure of the utility model light-emitting diode.
Fig. 2 is the main TV structure schematic diagram of the encapsulating structure of the utility model light-emitting diode.
Fig. 3 is the plan structure schematic diagram of the encapsulating structure of the utility model light-emitting diode.
Fig. 4 is a perspective view of making the mould that the encapsulating structure of the utility model light-emitting diode uses.
Fig. 5 is the main TV structure schematic diagram of Fig. 4.
Fig. 6 is the plan structure schematic diagram of Fig. 4.
Fig. 7 is the main TV structure schematic diagram of LED support.
Embodiment
Figure 1 shows that the perspective view of the encapsulating structure of the utility model light-emitting diode, consult Fig. 2 and Fig. 3 simultaneously, wherein, Fig. 2 is the main TV structure schematic diagram of the encapsulating structure of the utility model light-emitting diode; Fig. 3 is the plan structure schematic diagram of the encapsulating structure of the utility model light-emitting diode.The encapsulating structure of light-emitting diode comprises LED wafer 10, cathode anchor 11, the anode carrier 12 corresponding with cathode anchor, connect the lead-in wire (not shown) of LED wafer 10 and cathode anchor 11 and anode carrier 12, first encapsulation 13 of encapsulation LED wafer 10 and second encapsulation 14.Wherein, second encapsulation 14 is convexly set in the top of first encapsulation 13.In the present embodiment, first encapsulation 13 has also encapsulated an end of cathode anchor 11 and anode carrier 12.First encapsulation 13 after the moulding and second encapsulation 14 constitute the head of light-emitting diode, and expose the support in first encapsulation, 13 outsides, and promptly the other end of cathode anchor 11 and anode carrier 12 then constitutes the pin of light-emitting diode.In the present embodiment, going between is gold thread.The quantity of cathode anchor 11 and anode carrier 12 is respectively 1, that is, the pin of light-emitting diode is 2.
In other execution mode of the present utility model, the quantity of cathode anchor 11 and anode carrier 12 also can be for a plurality of, that is, the pin of light-emitting diode also can be for a plurality of.
Again, first encapsulation 13 and second encapsulation 14 are transparent epoxide-resin glue.In the present embodiment, epoxide-resin glue is made definite shape, and following several effect is arranged: at first, can protect LED wafer 10 grades not to be subjected to extraneous the erosion; Secondly, take different shapes and material character (mixing or do not mix color dispersing agent), can play lens or diffusing lens function, the angle of divergence of control light; In addition, because the LED wafer refractive index is relevant with air refraction too big, make the cirtical angle of total reflection of LED wafer inside very little easily, the light that its active layer produces has only fraction to be removed, major part is absorbed through repeatedly reflecting in LED wafer inside easily, total reflection easily takes place cause too much light loss, therefore, select for use the epoxy resin of respective indices of refraction to do transition, can improve the light outgoing efficient of LED wafer.
In the utility model, the cross-sectional area of first encapsulation 13 is greater than the cross-sectional area of second encapsulation 14.And the vertical sectional shape of first encapsulation 13 is trapezoidal (consulting Fig. 2), and the vertical sectional shape of second encapsulation 14 is for falling " U " shape.
In other execution mode of the present utility model, the vertical sectional shape of first encapsulation 13 also can be rectangle or square.
The utility model increases the lighting angle of light-emitting diode by the package geometry of first encapsulation 13 and second encapsulation 14, and is simple in structure, and, can make light-emitting diode send uniform light.In addition, epoxy resin has moisture-proof, and therefore insulating properties and high mechanical strength, can prolong the useful life of light-emitting diode.
Figure 4 shows that the perspective view of the mould that the encapsulating structure of making the utility model light-emitting diode is used.Consult Fig. 5 and Fig. 6 simultaneously, wherein, Fig. 5 is the main TV structure schematic diagram of Fig. 4; Fig. 6 is the plan structure schematic diagram of Fig. 4.Mould comprises die holder 20, shaping mould grain 21, guide pillar 22 and stuck point 23.Wherein, shaping mould grain 21 is moulds of light-emitting diode forming.Know clearly it, shaping mould grain 21 is to be used for the mold that embedding forms first encapsulation 13 and second encapsulation 14, that is, be the mold of light-emitting diodes tube head.In the utility model, the quantity of shaping mould grain 21 is a plurality of.
In other execution mode of the utility model, the quantity of shaping mould grain 21 can be one.
Again, in the embodiment, die holder 20 is an iron plate.The shape of cross section of die holder 20 is a strip.Certainly, in other execution mode of the present utility model, the shape of cross section of die holder 20 also can be other shape, is not giving unnecessary details here.Guide pillar 22 is arranged at a side of die holder 20, is used to guide the importing of LED support (consulting Fig. 7).Guide pillar 22 is provided with the guide groove 24 that the guiding LED support enters.
During operation, with LED support by mechanical arm (or hand) and utilize the guiding of the guide groove 24 of the guide pillar 22 on the die holder 20, correct is inserted on the shaping mould grain 21, simultaneously, anode and cathode groups of holders correspondence with light-emitting diode chip for backlight unit extend in the shaping mould grain 21, and the cross rib 30 of LED support is located by each stuck point 23 respectively and is supported.Afterwards, each shaping mould grain 21 is carried out the encapsulating operation, become finished product of LED behind the baking molding by the encapsulating machine.In the present embodiment, finished product of LED pours in the shaping mould grain 21.Therefore, by mould of the present utility model, it is big to produce lighting angle easily, the light-emitting diode of energy uniformly light-emitting; Simultaneously,, LED support is effectively located, improve rate of finished products by guide pillar 22 and stuck point 23.
Claims (10)
1. the encapsulating structure of a light-emitting diode, comprise LED wafer, cathode anchor, the anode carrier corresponding with described cathode anchor, the lead-in wire that connects described LED wafer and described cathode anchor, anode carrier, it is characterized in that: the encapsulating structure of described light-emitting diode also comprises first encapsulation that encapsulates described LED wafer, the top of described first encapsulation also convexes with second encapsulation, and the cross-sectional area of described first encapsulation is greater than the cross-sectional area of described second encapsulation.
2. the encapsulating structure of light-emitting diode according to claim 1 is characterized in that: the vertical sectional shape of described first encapsulation is trapezoidal, rectangle or square.
3. the encapsulating structure of light-emitting diode according to claim 1 and 2 is characterized in that: the vertical sectional shape of described second encapsulation is for falling " U " shape.
4. the encapsulating structure of light-emitting diode according to claim 1, it is characterized in that: described first encapsulation and second encapsulation are epoxide-resin glue.
5. the encapsulating structure of light-emitting diode according to claim 1, it is characterized in that: described first encapsulation and second encapsulation are one-body molded.
6. the encapsulating structure of light-emitting diode according to claim 1, it is characterized in that: the quantity of described cathode anchor and anode carrier is respectively 1.
7. mould that the encapsulating structure of making claim 1 to 6 any described light-emitting diode is used, it comprises die holder, it is characterized in that: have at least one to be used for the shaping mould grain that embedding forms described first encapsulation and second encapsulation on the described die holder.
8. mould according to claim 7 is characterized in that: a side of described die holder is provided with the guide pillar that imports for LED support, and described guide pillar is provided with the guide groove that the guiding LED support enters.
9. mould according to claim 7 is characterized in that: be provided with the stuck point for LED support location between the described shaping mould grain, described stuck point is provided with the groove of the cross rib that is used to hold LED support.
10. mould according to claim 9 is characterized in that: described stuck point is dismountable being arranged on the die holder.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNU2008200933403U CN201204210Y (en) | 2008-04-14 | 2008-04-14 | Encapsulation structure for light emitting diode and forming die for manufacturing the same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNU2008200933403U CN201204210Y (en) | 2008-04-14 | 2008-04-14 | Encapsulation structure for light emitting diode and forming die for manufacturing the same |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201204210Y true CN201204210Y (en) | 2009-03-04 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNU2008200933403U Expired - Fee Related CN201204210Y (en) | 2008-04-14 | 2008-04-14 | Encapsulation structure for light emitting diode and forming die for manufacturing the same |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201204210Y (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117006430A (en) * | 2023-09-28 | 2023-11-07 | 深圳永恒光智慧科技集团有限公司 | Manufacturing method of wide-angle street lamp light source and intelligent street lamp |
-
2008
- 2008-04-14 CN CNU2008200933403U patent/CN201204210Y/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117006430A (en) * | 2023-09-28 | 2023-11-07 | 深圳永恒光智慧科技集团有限公司 | Manufacturing method of wide-angle street lamp light source and intelligent street lamp |
| CN117006430B (en) * | 2023-09-28 | 2023-12-15 | 深圳永恒光智慧科技集团有限公司 | Manufacturing method of wide-angle street lamp light source and intelligent street lamp |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C17 | Cessation of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20090304 Termination date: 20120414 |