CN201853744U - LED (light-emitting diode) support, LED and LED illuminating device - Google Patents
LED (light-emitting diode) support, LED and LED illuminating device Download PDFInfo
- Publication number
- CN201853744U CN201853744U CN2010202712722U CN201020271272U CN201853744U CN 201853744 U CN201853744 U CN 201853744U CN 2010202712722 U CN2010202712722 U CN 2010202712722U CN 201020271272 U CN201020271272 U CN 201020271272U CN 201853744 U CN201853744 U CN 201853744U
- Authority
- CN
- China
- Prior art keywords
- led
- bending part
- electrode pin
- pedestal
- led support
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
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- Led Device Packages (AREA)
Abstract
The utility model is applicable to the filed of illumination and provides an LED (light-emitting diode) support, an LED and an LED illuminating device. The LED support comprises a radiating base and an electrode pin, wherein the electrode pin is integrated with the radiating base through injection molding and is provided with a weld line area which is flushed with the upper surface of the radiating base. When the LED is packaged, an LED chip is fixedly arranged on the upper surface of the radiating base, and a weld line is arranged between the LED chip and the electrode pin. As the weld line area of the electrode pin is flushed with the upper surface of the radiating base, the weld point on the LED chip is close to the weld line area of the electrode pin, the required lead wire is short, the bank of the lead wire is very easy to adjust, the difficulty of the weld line is reduced, the quality of the weld line is ensured, and the property of the LED is improved.
Description
Technical field
The utility model belongs to lighting field, relates in particular to a kind of led support, LED and LED lighting device.
Background technology
High-power LED bracket has numerous characteristics such as high heat conduction, high temperature resistant, thermoelectric separation, environmental protection, is widely used in high-power LED encapsulation.During to traditional high-power LED encapsulation bonding wire, be difficult to the bank of pilot, be difficult for welding, bonding wire is of poor quality, and the reliability of made LED is low.
The utility model content
The purpose of the utility model embodiment is to provide a kind of led support, is intended to solve existing LED encapsulation and is difficult for bonding wire, the ropy problem of bonding wire.
The utility model embodiment is achieved in that a kind of led support, comprises cooling base and the electrode pin that is one with described cooling base injection mo(u)lding, and described electrode pin has the wire welding area concordant with the upper surface of described cooling base.
In the utility model embodiment, described electrode pin has a plurality of bendings, stepped arranging.
Another purpose of the utility model embodiment is to provide a kind of LED, and described LED adopts above-mentioned led support.
Another purpose of the utility model embodiment is to provide a kind of LED lighting device, and described LED lighting device has above-mentioned LED.
During packaged LED, led chip is fixedly arranged on the upper surface of cooling base, bonding wire between led chip and electrode pin.Concordant with the upper surface of cooling base because of the wire welding area of electrode pin, the wire welding area of the weld spacing electrode pin on the led chip is near, and required lead is short, is easy to adjust the bank of lead, reduces the bonding wire difficulty, guarantees the bonding wire quality, improves the performance of LED.
Description of drawings
Fig. 1 is the profile of the led support that provides of the utility model embodiment;
Fig. 2 is the cutaway view of the LED that provides of the utility model embodiment.
Embodiment
In order to make the purpose of this utility model, technical scheme and advantage clearer,, the utility model is further elaborated below in conjunction with drawings and Examples.Should be appreciated that specific embodiment described herein only in order to explanation the utility model, and be not used in qualification the utility model.
The utility model embodiment makes the wire welding area of electrode pin concordant with the upper surface of cooling base, and the wire welding area of the weld spacing electrode pin on the led chip is near, during bonding wire, required lead is short, is easy to adjust the bank of lead, reduces the bonding wire difficulty, guarantee the bonding wire quality, improve the performance of LED.
The led support that the utility model embodiment provides comprises cooling base and the electrode pin that is one with described cooling base injection mo(u)lding, and described electrode pin has the wire welding area concordant with the upper surface of described cooling base.
The LED that the utility model embodiment provides adopts above-mentioned led support.
The LED lighting device that the utility model embodiment provides has above-mentioned LED.
Below in conjunction with specific embodiment realization of the present utility model is described in detail.
As shown in Figure 1, the led support that the utility model embodiment provides has cooling base 1, the first pedestal 11 and second pedestal 12 that is made of first pedestal 11 and second pedestal 12 and all is cylindric, and the external diameter of first pedestal 11 is less than the external diameter of second pedestal 12.Cooling base 1 preferred copper material is made, and first pedestal 11 and second pedestal 12 are one-body molded to be the copper post, and the height of copper post is 2～3mm, and the diameter of copper post is 1.5～3.0mm.
Among the utility model embodiment, electrode pin 2 is stepped, constitute by first bending part 21, second bending part 22, the 3rd bending part 23, the 4th bending part 24 and the 5th bending part 25 that join successively, wherein the two ends of second bending part 22 respectively with first bending part 21 and the 3rd bending part 23 vertical connections, one end of the 4th bending part 24 and the 3rd bending part 23 vertical connections, the other end ramp interface of the 5th bending part 25 and the 4th bending part 24 is convenient to LED is welded in environment for use.
Above-mentioned cooling base 1 is an one with electrode pin 2 injection mo(u)ldings, wherein first bending part, 21 upper surfaces are that promptly the upper surface of first pedestal 11 is concordant and expose injected plastics material 3 for the upper surface of wire welding area and cooling base 1 of electrode pin 2, the end of the 5th bending part 25 is concordant with the lower surface of second pedestal 12 and expose injected plastics material 3, the a plurality of bendings of injected plastics material 3 jacketed electrode pins 2 and the side of cooling base 1 make the led support of institute's moulding more firm.Injected plastics material 3 preferred various white thermoplastic macromolecule materials are as PPA (Polyphosphoric Acid, polyphosphoric acids).One LEDs chip has positive and negative two electrodes, correspondingly, needs the pair of positive and negative pin.When led support is provided with the plurality of LEDs chip, correspondingly, need be provided with many to electrode pin in led support.For example, set firmly four LEDs chips, correspondingly, four pairs of electrode pins need be set in led support in led support.
As shown in Figure 2, during packaged LED, led chip 4 is fixedly arranged on the upper surface of cooling base 1, bonding wire between led chip 4 and electrode pin 2.Concordant with the upper surface of cooling base 1 because of the wire welding area of electrode pin 2, the wire welding area of the weld spacing electrode pin on the led chip is near, and required lead 5 is lacked, and is easy to adjust the bank of lead 5, reduces the bonding wire difficulty, guarantees the bonding wire quality, improves the performance of LED.
The above only is preferred embodiment of the present utility model; not in order to restriction the utility model; all any modifications of within spirit of the present utility model and principle, being done, be equal to and replace and improvement etc., all should be included within the protection range of the present utility model.
Claims (10)
1. a led support comprises cooling base and the electrode pin that is one with described cooling base injection mo(u)lding, it is characterized in that described electrode pin has the wire welding area concordant with the upper surface of described cooling base.
2. led support as claimed in claim 1 is characterized in that described electrode pin has a plurality of bendings, stepped arranging.
3. led support as claimed in claim 2, it is characterized in that, described electrode pin is made of first bending part that joins successively, second bending part, the 3rd bending part, the 4th bending part and the 5th bending part, and the upper surface of described first bending part is the wire welding area of described electrode pin.
4. led support as claimed in claim 3, it is characterized in that, the two ends of described second bending part respectively with described first bending part and the 3rd bending part vertical connection, one end of described the 4th bending part and described the 3rd bending part vertical connection, the other end ramp interface of described the 5th bending part and described the 4th bending part.
5. led support as claimed in claim 3, it is characterized in that, described cooling base constitutes by first pedestal with integrated second pedestal of described first pedestal, and described first pedestal and second pedestal all are cylindric, and the external diameter of described first pedestal is less than the external diameter of described second pedestal.
6. led support as claimed in claim 5 is characterized in that, the upper surface of described first bending part is concordant with the upper surface of described first pedestal and expose injected plastics material.
7. led support as claimed in claim 5 is characterized in that, the end of described the 5th bending part is concordant with the lower surface of described second pedestal and expose injected plastics material.
8. led support as claimed in claim 2 is characterized in that, a plurality of bendings of described electrode pin and the side of described cooling base are coated by injected plastics material.
9. a LED is characterized in that, described LED adopts as each described led support of claim 1～8.
10. a LED lighting device is characterized in that, described LED lighting device has LED as claimed in claim 9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010202712722U CN201853744U (en) | 2010-07-26 | 2010-07-26 | LED (light-emitting diode) support, LED and LED illuminating device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010202712722U CN201853744U (en) | 2010-07-26 | 2010-07-26 | LED (light-emitting diode) support, LED and LED illuminating device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201853744U true CN201853744U (en) | 2011-06-01 |
Family
ID=44096128
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2010202712722U Expired - Fee Related CN201853744U (en) | 2010-07-26 | 2010-07-26 | LED (light-emitting diode) support, LED and LED illuminating device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201853744U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102738366A (en) * | 2012-06-06 | 2012-10-17 | 深圳雷曼光电科技股份有限公司 | Light emitting diode (LED) support for surface mounting, manufacturing method and LED lamp |
| CN105591005A (en) * | 2014-10-20 | 2016-05-18 | 深圳市斯迈得光电子有限公司 | Bowl-free LED support structure |
| CN111751979A (en) * | 2020-06-17 | 2020-10-09 | Oppo广东移动通信有限公司 | Housing device and optical focusing device |
-
2010
- 2010-07-26 CN CN2010202712722U patent/CN201853744U/en not_active Expired - Fee Related
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102738366A (en) * | 2012-06-06 | 2012-10-17 | 深圳雷曼光电科技股份有限公司 | Light emitting diode (LED) support for surface mounting, manufacturing method and LED lamp |
| CN105591005A (en) * | 2014-10-20 | 2016-05-18 | 深圳市斯迈得光电子有限公司 | Bowl-free LED support structure |
| CN111751979A (en) * | 2020-06-17 | 2020-10-09 | Oppo广东移动通信有限公司 | Housing device and optical focusing device |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20110601 Termination date: 20170726 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |