CN216624317U

CN216624317U - LED packaging structure of anti stress bonding wire technology

Info

Publication number: CN216624317U
Application number: CN202122665722.7U
Authority: CN
Inventors: 刘山; 周金; 吴强
Original assignee: Jiangxi Ruisheng Photoelectric Technology Co ltd
Current assignee: Jiangxi Ruisheng Photoelectric Technology Co ltd
Priority date: 2021-11-03
Filing date: 2021-11-03
Publication date: 2022-05-27
Anticipated expiration: 2031-11-03

Abstract

The utility model discloses an LED packaging structure of an anti-stress wire bonding process, which comprises a bottom base, a protective lampshade, an LED chip and heat-conducting glue, wherein a connecting groove is fixedly connected to the middle position of the top end of the bottom base, lead wires are fixedly connected to two sides of the top end of the connecting groove, the LED chip is arranged at the top end of the connecting groove, electrodes are fixedly connected to two sides of the top end of the LED chip, a connecting piece is fixedly connected to one side of each electrode, the heat-conducting glue is fixedly connected to two sides of the bottom end of the LED chip, and the connecting groove is fixedly connected to the bottom end of the heat-conducting glue. According to the utility model, the protective lampshade is movably connected to the top end of the bottom base, the clamping block at the bottom end of the protective lampshade is inserted into the clamping groove on the bottom base, and the inserting rod movably connected in the bottom base is inserted into the inserting hole on the clamping block, so that the protective lampshade can be fixed on the bottom base, and a stable protection effect is achieved.

Description

LED packaging structure of anti stress bonding wire technology

Technical Field

The utility model relates to the technical field of LED packaging, in particular to an LED packaging structure of an anti-stress wire welding process.

Background

The LED is a fourth generation illumination light source or green light source, and has the characteristics of energy saving, environmental protection, small volume, long service life, and the like, so that the LED is widely applied to various indications, displays, decorations, backlight sources, and general illumination.

The LED packaging structure of the existing anti-stress wire bonding process has the disadvantages of low light-emitting rate, low overall luminous efficiency and no protective measures.

SUMMERY OF THE UTILITY MODEL

The utility model aims to provide an LED packaging structure of an anti-stress wire bonding process, which aims to solve the problems of low light-emitting rate, low overall luminous efficiency, no protective measures and the like in the background art.

In order to achieve the purpose, the utility model provides the following technical scheme: the utility model provides a LED packaging structure of anti stress bonding wire technology, includes bottom base, protective lamp cover, LED chip and heat conduction glue, the intermediate position fixedly connected with spread groove on bottom base top, the both sides fixedly connected with lead wire on spread groove top, the top of spread groove is provided with the LED chip, the both sides fixedly connected with electrode on LED chip top, one side fixedly connected with connecting piece of electrode, the both sides fixedly connected with heat conduction glue of LED chip bottom, the bottom fixedly connected with spread groove of heat conduction glue, the first conducting layer of top fixedly connected with of heat conduction glue, the top fixedly connected with connecting piece of first conducting layer.

Preferably, sliding grooves are fixedly formed in two sides of the inner portion of the bottom base, and a pull rod is movably connected to one side of the outer portion of the bottom base.

Preferably, one side of the pull rod is fixedly connected with a movable block, and the outer part of the movable block is slidably connected with a bottom base.

Preferably, one side fixedly connected with slider of movable block, the outside sliding connection of slider has the spout, one side fixedly connected with spring of movable block, one side fixedly connected with bottom base of spring.

Preferably, one side of the sliding block is fixedly connected with an inserting rod, and one side of the top end of the bottom base is movably connected with a protective lampshade.

Preferably, one side of the protective lampshade is fixedly provided with a through hole, the bottom end of the protective lampshade is fixedly connected with a fixture block, one side of the fixture block is fixedly provided with a jack, and the outside of the jack is movably connected with an inserted rod.

Preferably, a second conducting layer is connected to one side of the electrode, and the electrode is connected with the second conducting layer in a welding mode.

Compared with the prior art, the utility model has the beneficial effects that:

1. according to the LED packaging structure of the anti-stress wire welding process, the two electrodes are arranged on the LED chip, the first conducting layer is arranged on the lower bottom surface of the LED chip through the connecting piece, the first conducting layer is connected with the electrodes through the connecting piece, and one side of each electrode is connected with an external power supply through the second conducting layer. The electrodes are all positioned below the inner part of the LED chip, and no welding point is formed on the upper surface of the LED chip, so that a complete luminous body is formed when the LED chip emits light, and the luminous efficiency is high;

2. according to the LED packaging structure of the anti-stress wire welding process, the top end of the bottom base is movably connected with the protective lampshade, the clamping block at the bottom end of the protective lampshade is inserted into the clamping groove in the bottom base, the inserting rod movably connected in the bottom base is inserted into the inserting hole in the clamping block, the protective lampshade can be fixed on the bottom base to play a role in stable protection, and meanwhile, when an LED chip on the bottom base needs to be maintained and replaced, the pull rod movably connected at one side of the bottom base is pulled to extrude the spring at one side through the movable block, the inserting rod at one side of the movable block is pulled out of the inserting hole in the clamping block, and the protective lampshade can be pulled out of the bottom base;

3. this kind of LED packaging structure of anti stress bonding wire technology, through at accessories such as lead wire, electrode, connecting piece, heat conduction glue, first conducting layer, second conducting layer, the welding of one side of second conducting layer has the electrode to be connected through the first conducting layer of connecting piece and below, the encapsulation that does not need the gold thread can realize LED, greatly reduced manufacturing cost.

Drawings

FIG. 1 is a schematic front view of the present invention;

FIG. 2 is an enlarged view of the structure at A in FIG. 1 according to the present invention;

FIG. 3 is an enlarged view of the structure at B in FIG. 1 according to the present invention;

FIG. 4 is a schematic top view of an LED chip according to the present invention;

fig. 5 is a schematic front view of the protective lampshade of the present invention.

In the figure: 1. a bottom base; 101. a chute; 2. a pull rod; 201. a movable block; 202. a slider; 203. a spring; 204. inserting a rod; 3. a protective lampshade; 301. a through hole; 302. a clamping block; 303. a jack; 4. connecting grooves; 401. a lead wire; 5. an LED chip; 501. an electrode; 502. a connecting member; 6. heat conducting glue; 601. a first conductive layer; 7. a second conductive layer.

Detailed Description

The technical solution in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

Referring to fig. 1-5, an embodiment of the present invention is shown: an LED packaging structure of an anti-stress wire bonding process comprises a bottom base 1, a protective lampshade 3, an LED chip 5 and heat conducting glue 6, wherein sliding grooves 101 are fixedly formed in two sides of the inside of the bottom base 1, a pull rod 2 is movably connected to one side of the outside of the bottom base 1, a movable block 201 is fixedly connected to one side of the pull rod 2, the outside of the movable block 201 is slidably connected with the bottom base 1, a sliding block 202 is fixedly connected to one side of the movable block 201, the outside of the sliding block 202 is slidably connected with the sliding grooves 101, a spring 203 is fixedly connected to one side of the movable block 201, the bottom base 1 is fixedly connected to one side of the spring 203, an insertion rod 204 is fixedly connected to one side of the sliding block 202, and by pulling the pull rod 2 on one side of the bottom base 1, the spring 203 can be extruded by the movable block 201, and the movable block 201 can drive the insertion rod 204 on one side to move;

one side of the top end of the bottom base 1 is movably connected with a protective lampshade 3, and the LED chip 5 at the top end of the bottom base 1 can be safely protected by the protective lampshade 3;

a through hole 301 is fixedly formed in one side of the protective lampshade 3, a clamping block 302 is fixedly connected to the bottom end of the protective lampshade 3, an insertion hole 303 is fixedly formed in one side of the clamping block 302, an insertion rod 204 is movably connected to the outer portion of the insertion hole 303, and the protective lampshade 3 can be fixed on the bottom base 1 by inserting the insertion rod 204 movably connected in the bottom base 1 into the insertion hole 303 in the clamping block 302;

the middle position of the top end of the bottom base 1 is fixedly connected with a connecting groove 4, two sides of the top end of the connecting groove 4 are fixedly connected with leads 401, the connecting groove can be connected with the first conducting layer 601 through the leads 401, and the LED can be packaged without gold wires;

the top of spread groove 4 is provided with LED chip 5, the both sides fixedly connected with electrode 501 on 5 tops of LED chip, one side fixedly connected with connecting piece 502 of electrode 501, the both sides fixedly connected with heat-conducting glue 6 of 5 bottoms of LED chip, the bottom fixedly connected with spread groove 4 of heat-conducting glue 6, the first conducting layer 601 of top fixedly connected with of heat-conducting glue 6, the top fixedly connected with connecting piece 502 of first conducting layer 601, one side connection of electrode 501 is provided with second conducting layer 7,

electrode

501 and 7 welded connection of second conducting layer, the welding of one side of second conducting layer 7 has electrode 501, and first conducting layer 601 through connecting piece 502 and below, lead 401 is connected.

When the embodiment of the application is used: by providing two electrodes 501 on the LED chip 5, and providing a first conductive layer 601 on the lower bottom surface of the LED chip 5 through a connector 502, the first conductive layer 601 is connected to the electrodes 501 through the connector 502, and one side of the electrodes 501 is connected to an external power source through the second conductive layer 7. Make the electrode all be located the inside below of LED chip 5, have protective lampshade 3 through swing joint in bottom base 1 top simultaneously, insert the draw-in groove on the base 1 of bottom through the fixture block 302 of protective lampshade 3 bottom, and swing joint's inserted bar 204 inserts the jack 303 on the fixture block 302 in the base 1 of bottom simultaneously, can fix protective lampshade 3 on bottom base 1, plays the stable guard action.

Claims

1. An LED packaging structure of an anti-stress wire bonding process is characterized by comprising a bottom base (1), a protective lampshade (3), an LED chip (5) and heat-conducting glue (6), the middle position of the top end of the bottom base (1) is fixedly connected with a connecting groove (4), two sides of the top end of the connecting groove (4) are fixedly connected with lead wires (401), the top end of the connecting groove (4) is provided with an LED chip (5), electrodes (501) are fixedly connected with two sides of the top end of the LED chip (5), one side of the electrode (501) is fixedly connected with a connecting piece (502), two sides of the bottom end of the LED chip (5) are fixedly connected with heat-conducting glue (6), the bottom end of the heat-conducting glue (6) is fixedly connected with a connecting groove (4), the top end of the heat-conducting glue (6) is fixedly connected with a first conducting layer (601), the top end of the first conducting layer (601) is fixedly connected with a connecting piece (502).

2. The structure of claim 1, wherein the structure comprises: the bottom base is characterized in that sliding grooves (101) are fixedly formed in two sides of the interior of the bottom base (1), and a pull rod (2) is movably connected to one side of the exterior of the bottom base (1).

3. The structure of claim 2, wherein the wire bonding process is performed in a manner similar to that of the wire bonding process: one side fixedly connected with movable block (201) of pull rod (2), the outside sliding connection of movable block (201) has bottom base (1).

4. The LED package structure of claim 3, wherein the bonding wire process comprises: one side fixedly connected with slider (202) of movable block (201), the outside sliding connection of slider (202) has spout (101), one side fixedly connected with spring (203) of movable block (201), one side fixedly connected with bottom base (1) of spring (203).

5. The LED package structure of claim 4, wherein the bonding wire process comprises: one side fixedly connected with inserted bar (204) of slider (202), one side swing joint on bottom base (1) top has protective lampshade (3).

6. The LED package structure of claim 5, wherein: the fixed through-hole (301) that is provided with in one side of protection lamp shade (3), the bottom fixedly connected with fixture block (302) of protection lamp shade (3), one side of fixture block (302) is fixed and is provided with jack (303), the outside swing joint of jack (303) has inserted bar (204).

7. The structure of claim 1, wherein the structure comprises: one side of the electrode (501) is connected with a second conducting layer (7), and the electrode (501) is connected with the second conducting layer (7) in a welding mode.