CN101604720B - LED luminous device and manufacturing method thereof - Google Patents
LED luminous device and manufacturing method thereof Download PDFInfo
- Publication number
- CN101604720B CN101604720B CN2009101087641A CN200910108764A CN101604720B CN 101604720 B CN101604720 B CN 101604720B CN 2009101087641 A CN2009101087641 A CN 2009101087641A CN 200910108764 A CN200910108764 A CN 200910108764A CN 101604720 B CN101604720 B CN 101604720B
- Authority
- CN
- China
- Prior art keywords
- chip
- emitting device
- support
- line
- lead
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
- H01L2224/85909—Post-treatment of the connector or wire bonding area
- H01L2224/8592—Applying permanent coating, e.g. protective coating
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
Landscapes
- Led Device Packages (AREA)
Abstract
The invention relates to an LED luminous device, which comprises a support, a chip carrier, a luminous chip arranged on the chip carrier, and at least one pair of pins which is electrically connected with the luminous chip, wherein the support has a hollow cavity; the chip carrier runs through and is embedded into the hollow cavity of the support; a fluorescent adhesive layer covers the luminous chip and a whole conducting wire; the luminous chip is electrically connected with the pins through the conducting wire; the end part of each pin connected with the conducting wire is bent to be close to the luminous chip; and the outer edge of the bottom of the fluorescent adhesive layer is connected with the end part. The invention also provides a manufacturing method for the LED luminous device. Because the fluorescent adhesive layer covers the whole conduction wire, the fluorescent adhesive layer can be formed by injection moulding to realize mass production; moreover, the conducting wire is contained in one material, so phenomena such as rupture, short circuit and the like of the conventional conducting wire are avoided; and the end parts of the pins are close to the luminous chip, so the LED luminous device can reduce the conducting wire consumption and the cost, and improves luminous efficiency, production efficiency, and the reliability of an LED.
Description
Technical field
The present invention relates to LED luminescence technology field, relate in particular to a kind of high-power LED light-emitting device and manufacture method thereof.
Background technology
LED (Light Emitting Diode), promptly light-emitting diode is a kind of semiconductor solid luminescence device.It is to utilize the solid semiconductor chip as luminescent material.When two ends add forward voltage, son and majority that dams that dams of the minority in the semiconductor takes place compoundly, emits superfluous energy and causes photo emissions, directly sends red, orange, yellow, green, blue, blue, purple, white light.Led light source since have high energy-conservation, the life-span long, be beneficial to advantage such as environmental protection, in fact, since LED comes out, the application surface of LED more and more widely, the advantage of its environmental protection and energy saving makes LED be regarded as one of main lighting source of 21 century.
In order to gain a place in illumination market, the white light LEDs of different encapsulated types constantly occurs on market.Along with the extensive application of LED, the requirement of LED increases gradually, and wherein great power LED also receives increasing concern along with the needs of illumination.The heat dissipation problem that how to improve the power of LED and how to solve high-capacity LED always is an important topic of LED exploitation.With regard to lighting module, luminous power, heat dispersion, light extraction efficiency and white purity all are the focuses that the designer was concerned about.
In white light illumination module in the past, all be to send white light by hanging down wavelength chip such as blue light or purple light chip excitation fluorescent material, fluorescent material all is to adopt some glue mode to wrap up chip, and appearance transparent protection glue also adopts a glue mode to form, yet this some glue processing procedure has following weak point: 1) some glue is inhomogeneous, make the variable thickness of fluorescent material parcel chip cause, thereby make its luminous spot inhomogeneous, influenced light extraction efficiency greatly; 2) chip carries out operation because some glue needs one by one, thereby makes production in enormous quantities efficient be subjected to great restriction.
See also Fig. 1; be traditional LED light-emitting device schematic diagram; this LED light-emitting device comprises support 12, copper post 14, luminescence chip 16 and at least one pair of pin 18; support 12 has hollow cavity; copper post 14 runs through and embeds in the hollow cavity of support 12, and luminescence chip 16 is located on the copper post 14, and each pin 18 electrically connects by lead 17 respectively; be coated with fluorescent material 15 on the luminescence chip 16, be coated with transparency protected glue 13 on the fluorescence glue-line 15.
In this LED light-emitting device; because drop is bigger between the pad of chip 16 and the weld zone of support 12; so that bonding wire lead 17 is long; lead 17 is in fluorescent material 15 and the transparency protected glue 13 simultaneously; thereby when fluorescent material 15 and transparency protected glue 13 are heated owing to the different stress that produces of the coefficient of expansion of two glue-lines, make lead 17 very easily occur the fracture and and copper post 14 between phenomenons such as short circuit.In addition, adhesion is not good between this traditional support 12 and copper post 14 and the transparency protected glue 13 (perhaps and fluorescence glue-line 15), and when ambient temperature or work, thereby copper post 14 comes off easily LED was lost efficacy.Further, in this structure, fluorescent material 15 also is not easy to the moulding of molding (Molding) mode, because the mold pressing meeting when molded breaks lead 17, makes its inefficacy.Therefore, how to solve the above problems the problem that becomes a needs solution.
Summary of the invention
In view of this, the embodiment of the invention provides a kind of and is suitable for powerfully, and structure is firm, LED reliability height, LED light-emitting device that cost is low.
And, a kind of mass production, LED method for producing light-emitting device that production efficiency is high are provided.
A kind of LED light-emitting device, it comprises support, chip carrier, at least one pair of pin of being located at the luminescence chip on the chip carrier and electrically connecting with described luminescence chip, described support has hollow cavity, described chip carrier runs through and embeds in the hollow cavity of described support, be coated with the fluorescence glue-line on the described luminescence chip, described luminescence chip and pin electrically connect by lead, described fluorescence glue-line further covers whole described lead, the end that is connected with lead in each pin is bent near luminescence chip, and the bottom outer rim and the described end of described fluorescence glue-line join.
And, a kind of LED method for producing light-emitting device, it comprises the steps:
Prepare and install and fix chip carrier and at least one pair of pin, each pin is prepared end bending of being connected with lead at it, with close luminescence chip after luminescence chip is immobilized;
Rack forming: embed molded support on chip carrier and pin, make support have hollow cavity, chip carrier runs through and embeds in the hollow cavity of support;
Gu it is brilliant: immobilized luminescence chip on chip carrier;
Routing: welding lead makes described lead electrically connect pin and luminescence chip;
The fluorescence glue-line is molded: embed molded fluorescence glue-line on luminescence chip and lead, make the fluorescence glue-line cover luminescence chip and whole lead, and the bottom outer rim of fluorescence glue-line and the end of described pin are joined, obtain required LED light-emitting device.
Compared with prior art, in described LED light-emitting device and manufacture method thereof, because the fluorescence glue-line further covers whole lead, therefore when moulding, lead is covered by in the fluorescent material, can not break lead during mold pressing, thereby can adopt the molded fluorescence glue-line that forms.And each glue material layer of LED light-emitting device can adopt molded method, makes full use of ripe molded technology, realizes large batch of production fully, enhances productivity greatly.And lead is included in a kind of material, can reduce to a great extent owing to the different internal stress that produces of the coefficient of expansion of two glue-lines, thereby avoid phenomenons such as traditional wire fracture and short circuit.Further, the end that is connected with lead in each pin is bent near luminescence chip, has shortened the distance of pin and chip chamber.Like this, can save lead (as: gold thread) consumption, reduce cost, can also strengthen the adhesion of LED light-emitting device, effectively improve the reliability of LED, and the operating efficiency that improves the LED light-emitting device.
Description of drawings
Below in conjunction with accompanying drawing embodiments of the invention are described, wherein:
Fig. 1 is traditional LED light-emitting device generalized section;
Fig. 2 is the LED light-emitting device section decomposing schematic representation that first embodiment of the invention provides;
Fig. 3 is the generalized section of LED light-emitting device among Fig. 1;
Fig. 4 is the support generalized section of LED light-emitting device among Fig. 1;
Fig. 5 is a LED light-emitting device schematic top plan view among Fig. 1, not display chip and on glue-line;
Fig. 6 is the pin schematic diagram of LED light-emitting device among Fig. 1;
Fig. 7 is the LED method for producing light-emitting device schematic flow sheet that first embodiment of the invention provides;
Fig. 8 is the LED light-emitting device generalized section that second embodiment of the invention provides;
Fig. 9 is the LED light-emitting device generalized section that third embodiment of the invention provides;
Figure 10 is the LED light-emitting device generalized section that fourth embodiment of the invention provides.
Embodiment
Below based on accompanying drawing specific embodiments of the invention are further elaborated.Should be appreciated that specific embodiment described herein as just example, and be not intended to limit the scope of the invention.
See also Fig. 2 and Fig. 3, show the LED light-emitting device 10 of first embodiment of the invention, at least one pair of pin 6 that this LED light-emitting device 10 comprises support 5, chip carrier 7, is located at the luminescence chip 4 on the chip carrier 7 and electrically connects with luminescence chip 4.Support 5 has hollow cavity 50, and chip carrier 7 runs through and embeds in the hollow cavity 50 of support 5.Be coated with fluorescence glue-line 2 on this luminescence chip 4, luminescence chip 4 electrically connects by lead 3 (as gold thread) with pin 6.Fluorescence glue-line 2 is gone back coated wire 3, and promptly whole lead 3 all is coated in the fluorescence glue-line 2.
The end face of support 5, i.e. the surface that is covered by fluorescence glue-line 2, this surface is provided with first groove 51 around chip carrier 7, and this groove 51 is as the holddown groove of fluorescence glue-line 2.The bottom outer rim of fluorescence glue-line 2 is outstanding to be stretched in first groove 51, strengthens the adhesion between them.The end face of support 5 is coated with transparent colloid 1, and it mainly covers fluorescence glue-line 2.Transparent colloid 1 is used to encapsulate this fluorescence glue-line 2, luminescence chip 4, also can be used as lens simultaneously, to change rising angle.As shown in Figure 4, first groove 51 has the internal groove side wall 52 of close chip carrier 7 and relative external groove sidevall 53.Preferably, external groove sidevall 53 is higher than internal groove side wall 52, forms a difference in height, can play the effect of auxiliary typing when molding is made thus.Therefore, fluorescence glue-line 2 is not only crossed over luminescence chip 4, but also crosses over the chip carrier 7 and first groove 51.As shown in Figure 5, first groove 51 can be square around shape, certainly, in other embodiments, first groove 51 also can be circular or other shapes around shape, be not limited to this.
The bottom outer rim of transparent colloid 1 further is provided with at least one pair of lug (figure does not show), and first circular groove of this lug and Fig. 5 medium-height trestle matches.In addition, the bottom outer rim of transparent colloid 1 also is provided with a plurality of projections (figure does not show), and accordingly, second groove, 8 outside cell walls of support 5 are further by radially outward being provided with a plurality of grooves 55, as shown in Figure 5.Groove 55 is used to accommodate corresponding projection.The projection of groove 55 and transparent colloid 1 can strengthen the adhesion between transparent colloid 1 and the support 5.Show two pairs of four grooves 55 among the figure, certainly, also be not limited thereto the groove 55 of quantity in the practical application, can increase or reduce its quantity as required.The external groove sidevall that is appreciated that second groove 8 also can be higher than its relative internal groove side wall.
One end of lead 3 is electrically connected with the negative or positive electrode of luminescence chip 4, and the other end stretches in first groove 51 and links to each other with pin 6, guarantees that thus whole lead 3 all is covered by in the fluorescence glue-line 2.Shown in Fig. 3 and 6, pin 6 has an end 61, and this end 61 links to each other with lead 3, and upwards is bent near luminescence chip 4, thereby can shorten the length of lead 3, saves material on the one hand, because common lead 3 adopts the lead (as: gold thread) of expensive material; On the other hand, can make things convenient for whole lead 3 all to be covered by in the fluorescence glue-line 2.This end 61 is inserted in first groove 51, and the bottom outer rim of fluorescence glue-line 2 is outstanding to be stretched in first groove 51 and join with end 61, thereby fluorescence glue-line 2 and pin 6 parts can be combined, and strengthens overall construction intensity and stability.Because pin 6 normally has the contact chip of a step, add the end 61 of bending, make pin 6 be bent into shape with at least two steps, pin end 61 is not higher than chip carrier 7 upper surfaces, make one end (being end 61) can be more near lead 3, the other end is convenient to be connected to external power source or circuit etc.These steps can increase the adhesion between support 5 and the pin 6.Pin 6 also offers at least one through hole 62, and support 5 can flow in the through hole 62 when injection mo(u)lding, thus the adhesion between further reinforced support 5 and the pin 6.Show six through holes 62 among the figure, certainly, also be not limited thereto the through hole 62 of quantity in the practical application, can increase or reduce its quantity as required.
Because lead 3 all is covered by in the fluorescence glue-line 2, thereby be convenient to fluorescence glue-line 2 by molded and shaped (detailed step is consulted the back and described), for example fluorescence glue-line 2 is taken shape in the end face of support 5 by the embedding molding mode, each parts that so just can realize whole LED light-emitting device 10 all adopt the molding mode moulding, can make LED light-emitting device 10 in large quantity, greatly enhance productivity.And, in the forming process, fluorescence glue-line 2 coats whole lead 3, lead 3 can not protrude from outside the fluorescence glue-line 2, and the hook 3 that can not bend during moulding pressing has thus solved existing fluorescence glue-line 2 and be difficult to a difficult problem molded, that lead 3 is pressed down when moulding, and lead 3 ruptures easily, pad disconnects, lead 3 fatigues, and bad phenomenon such as short circuit occurs between the chip carrier 7.The lead 3 of present embodiment all is covered by in the fluorescence glue-line 2, can reduce to a great extent owing to hot swollen shrinkage and other influence that internal stress caused that causes, make lead 3 structures more firm, improve and produce yield, because fluorescence glue-line 2 is not only crossed over luminescence chip 4, but also cross over the chip carrier 7 and first groove 51, thereby effectively increase the reliability of LED light-emitting device 10.
The hollow cavity 50 of support 5 is used to accommodate chip carrier 7, correspondingly respectively on the chamber wall of the hollow cavity 50 of the sidewall of chip carrier 7 and support 5 is provided with mutually nested concaveconvex structure.Concaveconvex structure comprises at least one bulge loop and/or the annular groove on the chamber wall of hollow cavity 50 of the sidewall of being located at chip carrier 7 respectively and support 5, and this bulge loop and annular groove are separately positioned on the circumference of respective wall.Particularly, as shown in Figure 2, chip carrier 7 has bulge loop 71 and annular groove 72 simultaneously, and 5 positions in correspondence of support are provided with annular groove 57 and bulge loop 58, thereby chip carrier 7 can be embedded in the hollow cavity 50 of support 5 securely.And the upper surface of chip carrier 7 can be circle or polygon (as square).In actual applications, as shown in Figure 3, chip carrier 7 comprises support portion 76 and the outward extending radiating part 77 that supports luminescence chip 4, and radiating part 77 can further stretch out hollow cavity 50, so that join with outside secondary heat abstractor.As shown in Figure 2, the lateral edges of radiating part 77 also can be formed with step 78, and the chamber wall of the hollow cavity 50 of support 5 also correspondence has the recess 59 of accommodating this step, with the adhesion of further reinforced support 5 with chip carrier 7.
Owing to be formed with first and second grooves 51 and 8 on the end face of support 5, not only can strengthen the adhesion of fluorescence glue-line 2 and transparent colloid 1 and support, can also improve the impermeable ability between support 5 and fluorescence glue-line 2 and the transparent colloid 1.Similarly, the concaveconvex structure on support 5 and the chip carrier 7 not only can strengthen the adhesion between them, can also improve the impermeable ability of support 5 and chip carrier 7 joints.For example, when using in a humid environment, wet steam is difficult for from these path infiltrations near luminescence chip 4.
Please consult Fig. 7, when the LED light-emitting device 10 of present embodiment is made, adopt following steps in conjunction with Fig. 2-6:
1) preparation of chip carrier and pin and installing and fixing: prepare and install and fix chip carrier 7 and at least one pair of pin 6, each pin 6 is prepared end 61 bendings of being connected with lead 3 at it, with close luminescence chip 4 after luminescence chip 4 is immobilized;
2) rack forming: embed molded support 5 on chip carrier 7 and pin 6, make support 5 have hollow cavity 50, chip carrier 7 runs through and embeds in the hollow cavity 50 of support 5;
3) solid brilliant: immobilized luminescence chip 4 on chip carrier 7;
4) routing: welding lead 3 makes described lead 3 electrically connect pin 6 and luminescence chip 4;
5) the fluorescence glue-line is molded: embed molded fluorescence glue-line 2 on luminescence chip 4 and lead 3, make fluorescence glue-line 2 cover luminescence chip 4 and whole lead 3, and the bottom outer rim of fluorescence glue-line 4 and the end 61 of described pin 6 are joined, obtain required LED light-emitting device 10.
In step 1), as previously mentioned, the sidewall of chip carrier 7 also is provided with concaveconvex structure, and pin 6 is bent into the shape with at least two steps, and has structures such as through hole 62, does not repeat them here.
In step 2) in, support can be selected thermoplastic for use, so that embed moldedly, for example includes but not limited to the PPA material.During moulding, the overall structure that step 1) obtains is put into mould as insert, embed moulding.Forming mould has the support 5 corresponding forming cavities with required formation, makes support 5 have first groove 51 and second groove 8, and the concaveconvex structure on the wall of chamber, and structure such as groove 55 do not repeat them here.
Step 3) and 4) all can adopt tradition ripe solid crystalline substance and routing method.In step 5), equally the forming cavity with the mould of moulding fluorescence glue-line 2 is configured to match with fluorescence glue-line 2 structures, make mould can not be molded into lead 3, and the receiving space of the structure that preceding step forms is set, the integrated structure that will comprise support 5, chip carrier 7, pin 6 etc. embeds moulding as insert by injecting fluorescent material.Thereby in the manufacture method of present embodiment, fluorescence glue-line 2 combines with luminescence chip 4, chip carrier 7, lead 3, support 5 and pin end 61 by mold shaping method and becomes one structure.
In addition, after 2 moulding of fluorescence glue-line, can further support 5, chip carrier 7 and fluorescence glue-line 2 be encapsulated with substratum transparent 1.
See also Fig. 8, be LED light-emitting device 20 schematic diagrames in the second embodiment of the invention.This embodiment LED light-emitting device 20 is similar to the LED light-emitting device 10 among first embodiment substantially, and components identical adopts identical label among Fig. 8 and Fig. 3, and these elements do not repeat them here.Both the main difference part are to have two spaced-apart ring-shaped grooves 73 on the chip carrier 7 simultaneously, and the also corresponding bulge loop 54 with two intervals of inserting scrobicular ring 73 of the internal chamber wall of hollow cavity 50.
See also Fig. 9, be LED light-emitting device 30 schematic diagrames in the third embodiment of the invention.This embodiment LED light-emitting device 30 is similar to the LED light-emitting device 10 among first embodiment substantially, and components identical adopts identical label among Fig. 9 and Fig. 3, and these elements do not repeat them here.Both the main difference part are that support portion 76 marginal surfaces of chip carrier 7 have step 74, and are outside recessed steps, and fluorescence glue-line 2 can bond with step 74, thereby increase the adhesion of fluorescence glue-line 2 and chip carrier 7.
See also Figure 10, be LED light-emitting device 40 schematic diagrames in the fourth embodiment of the invention.This embodiment LED light-emitting device 40 is similar to the LED light-emitting device 10 among first embodiment substantially, components identical adopts identical label among Figure 10 and Fig. 3, both are the main difference part, support portion 76 end faces of chip carrier 7 have the flange 75 around chip 4, perhaps be referred to as margin of optic cup, it is formed on the chip carrier 7 at colloid, can prevent that colloid from outwards overflowing.
Each LED light-emitting device in second to the 4th embodiment can adopt the manufacture method of describing among first embodiment to form equally, main difference is on the partial structurtes on chip carrier and the support different, thereby needs the mould of corresponding construction or increase the formation method of these partial structurtes.And fluorescence glue-line 2 can also adopt traditional some glue mode to make, and be not limited to previously described method except adopting mold shaping method manufacturing.And fluorescence glue-line 2 can bond with flange 75, to strengthen the adhesion of fluorescence glue-line 2 and chip carrier 7.
In the various embodiments described above and manufacture method thereof, because fluorescence glue-line 2 further covers whole lead 3, therefore when moulding, lead 3 is covered by in the fluorescent material, can not break lead 3 during mold pressing, thereby can adopt the molded fluorescence glue-line 2 that forms.And each glue material layer of LED light-emitting device can adopt molded method, makes full use of ripe molded technology, realizes large batch of production fully, enhances productivity greatly.And 3 in lead is included in a kind of material, can reduce to a great extent owing to the different internal stress that produces of the coefficient of expansion of two glue-lines, thereby avoid phenomenons such as 3 fractures of traditional lead and short circuit.Further, the end 61 that is connected with lead in each pin 6 is bent near luminescence chip 4, has shortened the distance of 4 of pin 6 and chips.Like this, can save lead (as: gold thread) consumption, reduce cost, can also strengthen the adhesion of LED light-emitting device, effectively improve the reliability of LED, and the operating efficiency that improves the LED light-emitting device.
The above only is preferred embodiment of the present invention, not in order to restriction the present invention, all any modifications of being done within the spirit and principles in the present invention, is equal to and replaces and improvement etc., all should be included within protection scope of the present invention.
Claims (10)
1. LED light-emitting device, it comprises support, chip carrier, at least one pair of pin of being located at the luminescence chip on the chip carrier and electrically connecting with described luminescence chip, described support has hollow cavity, described chip carrier runs through and embeds in the hollow cavity of described support, be coated with the fluorescence glue-line on the described luminescence chip, described luminescence chip and pin electrically connect by lead, it is characterized in that, described fluorescence glue-line further covers whole described lead, each pin is bent in its end that is connected with lead near luminescence chip, and the bottom outer rim and the described end of described fluorescence glue-line join.
2. LED light-emitting device as claimed in claim 1, it is characterized in that, described support is provided with first groove around described chip carrier, the end that described pin is connected with lead is inserted in described first groove, and outstanding the stretching in described first groove of the bottom outer rim of described fluorescence glue-line joined with described end.
3. LED light-emitting device as claimed in claim 1 is characterized in that described support offers second groove at its edge, and described support is provided with transparent colloid, and described transparent colloid bottom outer rim is given prominence to and stretched into described second groove.
4. LED light-emitting device as claimed in claim 3 is characterized in that, the bottom outer rim of described transparent colloid is provided with a plurality of projections, and the outside cell wall of described second groove is by radially outward being provided with the groove that at least one pair of is used to accommodate respective bump.
5. LED light-emitting device as claimed in claim 1 is characterized in that, correspondingly respectively on the chamber wall of the sidewall of described chip carrier and the hollow cavity of described support is provided with mutually nested concaveconvex structure.
6. LED light-emitting device as claimed in claim 5, it is characterized in that, described concaveconvex structure comprises at least one bulge loop and/or the annular groove on the chamber wall of hollow cavity of the sidewall of being located at chip carrier respectively and described support, and described bulge loop is embedded in the corresponding annular groove.
7. LED light-emitting device as claimed in claim 1 is characterized in that the edge of described chip carrier has flange or step, and described fluorescence glue-line is also bonding with described flange or step.
8. LED light-emitting device as claimed in claim 1 is characterized in that, described bending pins becomes to have the shape of at least two steps.
9. LED method for producing light-emitting device, it comprises the steps:
Prepare and install and fix chip carrier and at least one pair of pin, each pin is prepared end bending of being connected with lead at it, with close luminescence chip after luminescence chip is immobilized;
Rack forming: on chip carrier and pin, embed molded support, make support have hollow cavity, and chip carrier runs through and embeds in the hollow cavity of support;
Gu it is brilliant: immobilized luminescence chip on chip carrier;
Routing: welding lead makes described lead electrically connect pin and luminescence chip;
The fluorescence glue-line is molded: embed molded fluorescence glue-line on luminescence chip and lead, make the fluorescence glue-line cover luminescence chip and whole lead, and the bottom outer rim of fluorescence glue-line and the end of described pin are joined, obtain required LED light-emitting device.
10. LED method for producing light-emitting device as claimed in claim 9 is characterized in that, further comprises the step that described support, chip carrier and fluorescence glue-line is encapsulated with a substratum transparent.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2009101087641A CN101604720B (en) | 2009-07-16 | 2009-07-16 | LED luminous device and manufacturing method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2009101087641A CN101604720B (en) | 2009-07-16 | 2009-07-16 | LED luminous device and manufacturing method thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101604720A CN101604720A (en) | 2009-12-16 |
| CN101604720B true CN101604720B (en) | 2011-08-03 |
Family
ID=41470347
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2009101087641A Active CN101604720B (en) | 2009-07-16 | 2009-07-16 | LED luminous device and manufacturing method thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN101604720B (en) |
Families Citing this family (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102456806A (en) * | 2010-10-26 | 2012-05-16 | 展晶科技(深圳)有限公司 | Packaging structure of light emitting diode |
| TW201218468A (en) * | 2010-10-26 | 2012-05-01 | Bridge Semiconductor Corp | Semiconductor chip assembly with bump/base heat spreader and cavity in bump |
| CN102122697B (en) * | 2011-01-05 | 2012-11-07 | 深圳市天电光电科技有限公司 | Bracket for encapsulating LED |
| CN102403422A (en) * | 2011-11-17 | 2012-04-04 | 深圳市天电光电科技有限公司 | Processing method of LED packaging structure and LED packaging structure |
| CN102655203B (en) * | 2012-03-02 | 2014-08-13 | 广东长盈精密技术有限公司 | LED (light-emitting diode) support and manufacturing method thereof |
| CN102610738A (en) * | 2012-03-22 | 2012-07-25 | 任永斌 | High-power LED (Light Emitting Diode) lamp bead with integrated heat-radiating pad and heat-radiating substrate |
| CN102881807A (en) * | 2012-09-06 | 2013-01-16 | 东莞市光洲电子科技有限公司 | High-power white-light light-emitting diode (LED) and manufacturing method thereof |
| CN103280515B (en) * | 2013-05-27 | 2016-01-13 | 广东深莱特科技股份有限公司 | There is LED device and the manufacture method thereof of dispersive electrode lead-in wire edge stress |
| CN107179099B (en) * | 2017-07-11 | 2023-10-27 | 安费诺(常州)连接系统有限公司 | Sensor structure and manufacturing method thereof |
| CN112815276B (en) * | 2021-02-04 | 2022-11-08 | 谷麦光电科技股份有限公司 | LED packaging structure capable of emitting light obliquely |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201462529U (en) * | 2009-06-24 | 2010-05-12 | 弘凯光电(深圳)有限公司 | LED lighting device |
-
2009
- 2009-07-16 CN CN2009101087641A patent/CN101604720B/en active Active
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201462529U (en) * | 2009-06-24 | 2010-05-12 | 弘凯光电(深圳)有限公司 | LED lighting device |
Also Published As
| Publication number | Publication date |
|---|---|
| CN101604720A (en) | 2009-12-16 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN101604720B (en) | LED luminous device and manufacturing method thereof | |
| CN201363572Y (en) | LED light source module | |
| CN201994337U (en) | LED (Light Emitting Diode) packaging support structure and LED device | |
| CN101276866B (en) | High power LED bracket as well as high power LED made by the same | |
| CN102881812B (en) | Manufacturing method for Light emitting diode packaging structure | |
| CN102881779A (en) | Method for manufacturing light emitting diode packaging structure | |
| CN101097973A (en) | High power LED two-dimension light source | |
| WO2010133772A1 (en) | A light source element and a method for manufacturing | |
| CN201708188U (en) | Ceramic high-power light emitting diode | |
| CN201820755U (en) | Light emitting diode | |
| CN204045628U (en) | A kind of surface-mounted LED light source of many bowls of cup structures | |
| CN201462529U (en) | LED lighting device | |
| CN103489997B (en) | Led | |
| CN209991250U (en) | LED lamp string | |
| CN203218334U (en) | LED bulb lamp packaging structure | |
| CN101949521A (en) | LED integrated light source board and manufacturing method thereof | |
| CN103165763B (en) | Manufacture method of light emitting diode (LED) | |
| KR20140121507A (en) | LED module for flash and method for fabricating the sme | |
| CN103511993A (en) | Manufacturing method of LED lamp and LED lamp | |
| CN202736973U (en) | Three-dimensional cladded and packaged LED chip | |
| CN201887075U (en) | Led | |
| CN201556644U (en) | Rectangular light spot power type LED encapsulating structure | |
| CN201303008Y (en) | Led packaging structure | |
| KR102503855B1 (en) | Micro chips module arranged matrix and Method thereof | |
| CN201628185U (en) | Light emitting diode support and packaging structure thereof |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant |