CN207651517U - SMD L ED lamp that encapsulation is firm - Google Patents
SMD L ED lamp that encapsulation is firm Download PDFInfo
- Publication number
- CN207651517U CN207651517U CN201721546482.6U CN201721546482U CN207651517U CN 207651517 U CN207651517 U CN 207651517U CN 201721546482 U CN201721546482 U CN 201721546482U CN 207651517 U CN207651517 U CN 207651517U
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- CN
- China
- Prior art keywords
- shell
- encapsulation
- bracket
- firm
- led lamp
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 238000005538 encapsulation Methods 0.000 title claims abstract description 12
- 239000002184 metal Substances 0.000 claims abstract description 17
- 239000000049 pigment Substances 0.000 claims abstract description 9
- 238000005452 bending Methods 0.000 claims description 4
- 230000015572 biosynthetic process Effects 0.000 claims 1
- 239000011248 coating agent Substances 0.000 abstract 2
- 238000000576 coating method Methods 0.000 abstract 2
- 239000000084 colloidal system Substances 0.000 abstract 2
- 230000002349 favourable effect Effects 0.000 abstract 1
- 238000012856 packing Methods 0.000 abstract 1
- 239000004033 plastic Substances 0.000 description 3
- 230000008033 biological extinction Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 239000003292 glue Substances 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000010521 absorption reaction Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000005266 casting Methods 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 230000009466 transformation Effects 0.000 description 1
Abstract
the utility model discloses a SMD L ED lamp that encapsulation is firm, include and irritate the colloid, the inside of encapsulating inlays and is equipped with one and can separate it into regional and lower regional metal support, set up on the metal support be used for with go up the passageway of regional and lower region intercommunication, this passageway separates metal support for positive pole support and negative pole support, electric connection has the L ED chip that is located the colloid inside and light up between positive pole support and the negative pole support, and the outside of encapsulating is provided with the casing, the tip of positive pole support and negative pole support is respectively to the casing of packing down in order to form endocyst structure, the surface coating of casing has black pigment, carries out the integral type embedment through upper end and the lower extreme to the L ED chip, can increase the cohesion between L ED chip and the metal support, has improved the reliability of product to reduce the decay of product and the probability of inefficacy, and the surface coating of casing has black pigment, is favorable to improving the contrast.
Description
Technical field
The utility model is related to LED light technical field, especially a kind of bonded LED lamp that encapsulation is firm.
Background technology
Current bonded LED lamp all uses PLCC (plastic tape lead chip carrier) structure, using PPA plastic rubber material conducts
Packaging body causes the structure humidity resistance poor because of the moisture-absorption characteristics of PPA plastic rubber materials itself, and encapsulating structure is in finished product holder
Embedding is formed again after upper progress die bond bonding wire, and the binding force between embedding glue and holder is poor, after product makes moist using
When high temperature, interiors of products stress increases rapidly so that casting glue is detached from together with LED chip and holder, causes product brightness
Deep fades, or even failure, in addition, the color contrast of general bonded LED lamp is not high, it is in order to improve the contrast, existing
" outer black words spoken by an actor from offstage " two layers of frame structure, black outer housing in technology, is used to be wrapped in white inner housing mostly, not only processing is multiple
It is miscellaneous and of high cost.
Utility model content
For overcome the deficiencies in the prior art, the utility model offer is a kind of encapsulating the firm and higher patch of color contrast
Sheet-shaped LED lamp.
Technical solution adopted by the utility model to solve its technical problems is：
A kind of bonded LED lamp that encapsulation is firm, including：The inside of encapsulating body, encapsulating body can be by its point embedded with one
It is divided into the metallic support in region and lower region, is opened up on the metallic support for by the upper region and lower regional connectivity
Metallic support is divided into positive bracket and negative bracket by channel, the channel, between the positive bracket and negative bracket electrically
Be connected with inside encapsulating body and the LED chip of light upward, the outside of encapsulating body is provided with shell, the positive bracket and
Shell is wrapped up to form interior pack arrangement in the end of negative bracket separately down, and the surface of the shell is coated with black pigment.
The inner cavity of the shell includes in gradually big round platform portion and the flaring being connect with the upper end in round platform portion from the bottom to top
Portion.
A capillary groove along expansion mouth to lower recess, the capillary groove and the encapsulating body are provided in the inner walls
Between have gap.
The capillary groove is loop configuration.
The positive bracket, negative bracket all include metal pins and metal pin, and the LED chip is electrically connected at two
Between a metal pins, metal pin bending package shell is to form interior pack arrangement.
The utility model has the beneficial effects that：The bonded LED lamp of the above structure passes through the top and bottom to LED chip
Integral type embedding is carried out, the binding force between LED chip and metallic support can be increased so that encapsulation is more secured, improves
The reliability of product, to reduce product decaying and failure probability, and the surface of shell be coated with black pigment, black
Pigment extinction is conducive to improve contrast.
Description of the drawings
The utility model is further illustrated with reference to the accompanying drawings and examples：
Fig. 1 is the structural schematic diagram of the utility model.
Specific implementation mode
Referring to Fig.1, a kind of bonded LED lamp that encapsulation is firm, including：The inside of encapsulating body 1, encapsulating body 1 is embedded with one
The metallic support 2 in upper region and lower region can be divided into, opened up on the metallic support 2 for will the upper region with
Metallic support 2 is divided into positive bracket and negative bracket by the channel of lower regional connectivity, the channel, and in the present embodiment, this is logical
Road is electrically connected between the positive bracket and negative bracket positioned at the inside of encapsulating body 1 and light upward by punch forming
LED chip 3, the outside of encapsulating body 1 is provided with shell 4, and the end of the positive bracket and negative bracket is wrapped up separately down
For shell 4 to form interior pack arrangement, the surface of the shell 4 is coated with black pigment.It is right that the bonded LED lamp of the above structure passes through
The top and bottom of LED chip 3 carry out integral type embedding, can increase the binding force between LED chip 3 and metallic support 2, make
It must encapsulate more secured, the reliability of product be improved, to reduce the probability of product brightness decay and failure, and shell 4
Surface be coated with black pigment, black pigment extinction is conducive to improve contrast, and the shell 4 is integrated,
It overcomes previous black outer housing and is wrapped in the problems such as processing existing for two layers of framework of white inner housing is complicated, of high cost.
When LED chip 3 is arranged, an electrode of LED chip 3 is fixed on positive bracket or cathode by way of die bond first
On holder, then by bonding wire another electrode of LED chip 3 is fixed in negative bracket or positive bracket, the installation knot
Structure assembling steps simple and convenient.
The inner cavity of the shell 4 includes in gradually big round platform portion 41 and being connect from the bottom to top with the upper end in round platform portion 41
Expansion mouth 42.The step-like opening that expansion mouth 42 is combined composition shell 4 with round platform portion 41, expands light source luminescent angle.
A capillary groove 43 along expansion mouth 42 to lower recess is provided on 4 inner wall of the shell, the capillary groove 43 is
Loop configuration has gap between the capillary groove 43 and the encapsulating body 1.The capillary groove 43 reduces extraneous moisture to encapsulating body
1 intrusion can be gathered in the annular when steam is entered by the inner wall of shell 4 and the joint of encapsulating body 1 in shell 4
In capillary groove 43, certain moisture-proof role is played, reduces the case where LED chip 3 is made moist and can not be used.
In the present embodiment, the positive bracket, negative bracket are described all including metal pins 44 and metal pin 45
LED chip 3 is electrically connected between two metal pins 44, and the lower end that the bending of metal pin 45 is wrapped in shell 4 forms interior packet
Structure, metal pin 45 is fair with the lower face of shell 4 after bending, and prevents the lower face protrusion of bonded LED lamp, influences to install
It uses.
The preferred embodiments of the present invention have been specifically described above, certainly, the utility model can also use with
The different form of the above embodiment, those skilled in the art under the premise of without prejudice to spirit of that invention made by etc.
Same transformation or corresponding change, should all fall within the protection scope of the present invention.
Claims (5)
1. a kind of bonded LED lamp that encapsulation is firm, which is characterized in that including：The inside of encapsulating body (1), encapsulating body (1) is embedded in
There is a metallic support (2) that can be divided into upper region and lower region, is opened up on the metallic support (2) for will be described
Metallic support (2) is divided into positive bracket and negative bracket, the anode by the channel in upper region and lower regional connectivity, the channel
And light LED chip (3) upward internal positioned at encapsulating body (1), encapsulating body (1) are electrically connected between holder and negative bracket
Outside be provided with shell (4), shell (4) is wrapped up to be wrapped in formation in the end of the positive bracket and negative bracket separately down
The surface of structure, the shell (4) is coated with black pigment.
2. a kind of firm bonded LED lamp of encapsulation as described in claim 1, it is characterised in that：
The inner cavity of the shell (4) includes in gradually big round platform portion (41) and being connect from the bottom to top with the upper end of round platform portion (41)
Expansion mouth (42).
3. a kind of firm bonded LED lamp of encapsulation as claimed in claim 2, it is characterised in that：
A capillary groove (43) along expansion mouth (42) to lower recess, the capillary groove (43) are provided on shell (4) inner wall
There is gap between the encapsulating body (1).
4. a kind of firm bonded LED lamp of encapsulation as claimed in claim 3, it is characterised in that：
The capillary groove (43) is loop configuration.
5. a kind of firm bonded LED lamp of encapsulation as described in claim 1, it is characterised in that：
The positive bracket, negative bracket all include metal pins (44) and metal pin (45), and the LED chip (3) is electrical
It is connected between two metal pins (44), metal pin (45) bending package shell (4) is to form interior pack arrangement.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721546482.6U CN207651517U (en) | 2017-11-17 | 2017-11-17 | SMD L ED lamp that encapsulation is firm |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721546482.6U CN207651517U (en) | 2017-11-17 | 2017-11-17 | SMD L ED lamp that encapsulation is firm |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN207651517U true CN207651517U (en) | 2018-07-24 |
Family
ID=62889219
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201721546482.6U Active CN207651517U (en) | 2017-11-17 | 2017-11-17 | SMD L ED lamp that encapsulation is firm |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN207651517U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110729284A (en) * | 2019-10-28 | 2020-01-24 | 苏州晶台光电有限公司 | Preparation method of outdoor full-color display screen device |
| WO2021120650A1 (en) * | 2019-12-16 | 2021-06-24 | 浙江盾安人工环境股份有限公司 | Air conditioner, and electronic expansion valve and electromagnetic coil structure thereof |
-
2017
- 2017-11-17 CN CN201721546482.6U patent/CN207651517U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110729284A (en) * | 2019-10-28 | 2020-01-24 | 苏州晶台光电有限公司 | Preparation method of outdoor full-color display screen device |
| WO2021120650A1 (en) * | 2019-12-16 | 2021-06-24 | 浙江盾安人工环境股份有限公司 | Air conditioner, and electronic expansion valve and electromagnetic coil structure thereof |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20201105 Address after: No.4 and No.12, Hongxi South Road, Xiangan Industrial Zone, torch hi tech Zone, Xiamen City, Fujian Province Patentee after: Xiamen Xinda Semiconductor Technology Co.,Ltd. Address before: 528400, three, 3, 4, Torch Road 17, Torch Development Zone, Guangdong, Zhongshan Patentee before: GUANGDONG XINDA PHOTOELECTRIC TECHNOLOGY Co.,Ltd. |
|
| TR01 | Transfer of patent right | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20221109 Address after: 361000 Xinda photoelectric complex building, No. 610, Lingdou West Road, Siming District, Xiamen City, Fujian Province Patentee after: XIAMEN XINDECO OPTOELECTRONICS Co.,Ltd. Address before: No.4 and No.12, Hongxi South Road, industrial zone, torch hi tech Zone (Xiang'an), Xiamen City, Fujian Province, 361000 Patentee before: Xiamen Xinda Semiconductor Technology Co.,Ltd. |