CN205810859U - Packaging system - Google Patents
Packaging system Download PDFInfo
- Publication number
- CN205810859U CN205810859U CN201620735302.8U CN201620735302U CN205810859U CN 205810859 U CN205810859 U CN 205810859U CN 201620735302 U CN201620735302 U CN 201620735302U CN 205810859 U CN205810859 U CN 205810859U
- Authority
- CN
- China
- Prior art keywords
- terminal pad
- luminous body
- bonding wire
- packaging system
- negative
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Landscapes
- Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
- Led Device Packages (AREA)
Abstract
A kind of packaging system, including a support, a pair bonding wire, one luminous body and a sealing portion, support is provided with a carrier cup, the inner surface of carrier cup is silver-plated, luminous body is attached at described carrier cup inner surface, between luminous body and this carrier cup non-conductive, support is provided with a positive terminal pad and a negative terminal pad, luminous body is provided with an anode connection terminal and a negative pole connects end, bonding wire is that proof gold is made, a wherein bonding wire in the pair of bonding wire is connected between the anode connection terminal of described luminous body and described positive terminal pad, another bonding wire is connected to the negative pole of described luminous body and connects end and wherein between a negative terminal pad, sealing portion is the epoxy resin layer that the carrier cup to support carries out outer wrapping, make described positive terminal pad, negative terminal pad and bonding wire are positioned at this support.Use luminous physical ability that packaging system of the present utility model encapsulates more resistant to high temperature, can preferably waterproof and moistureproof.
Description
Technical field
This utility model relates to a kind of packaging system, particularly to the packaging system of a kind of Lamp-LED.
Background technology
Install on a highway and safeguard that LED is the most complicated, and the use environment of open air is very severe, therefore for
The quality requirements of LED is the highest.But, current LED easily occur high temperature resistant weak, waterproof poor, humidity resistance is poor and product
The problems such as light decay is big, it addition, LED also can affect driver vehicle while use process can point out driver.
Utility model content
In view of this, it is necessary to provide a kind of packaging system, to solve the problems referred to above.
A kind of packaging system, including a support, a pair bonding wire, a luminous body and a sealing portion, described support is provided with one
Carrier cup, the inner surface of described carrier cup is silver-plated, and described carrier cup inner surface is located at by described luminous body note, this luminous body and this
Between frame cup non-conductive, described support is provided with a positive terminal pad and a negative terminal pad, and described luminous body is provided with an anode connection terminal
And one negative pole connect end, the pair of bonding wire is that proof gold is made, and the wherein bonding wire in the pair of bonding wire is connected to described sending out
Between anode connection terminal and the described positive terminal pad of body of light, another bonding wire is connected to the negative pole of described luminous body and connects end and wherein
Between one negative terminal pad, described sealing portion is the epoxy resin layer that the carrier cup to described support carries out outer wrapping, make described just
Pole pad, described negative terminal pad and the pair of bonding wire are positioned at this support.
Preferably, described positive terminal pad is positioned at the side of described carrier cup, and described negative terminal pad is relative in described carrier cup
Opposite side.
Preferably, described support includes the positive pole pin being electrically connected at described positive terminal pad and is electrically connected at described
One negative pin of negative terminal pad, the outer surface of described positive pole pin and described negative pin is silver-plated.
Preferably, described positive pole pin and described negative pin are respectively equipped with a pincard at neighbouring described carrier cup
Point, described positive pole pin and described negative pin can be plugged in an electrical substrate, described positive pole pin and described negative pin
Stuck point be welded in described electrical substrate.
Preferably, the outside in described sealing portion is provided with an outside glue sealing die strip, is formed in described outside glue sealing die strip
Between, to fill described space with epoxy resin and be formed for described epoxy resin layer, described epoxy resin layer can make described luminous body
Lighting angle is between 30 degree of-40 degree.
Preferably, described luminous body is attached at the inner surface of described support ring by the conductive silver glue of high thermal conductivity, described
The heat that described luminous body produces can quickly be derived by conducting resinl.
Preferably, described epoxy resin layer is by making from mould process for filling colloid, and described epoxy resin layer is sent out for protection
Body of light and the pair of bonding wire.
Preferably, described epoxy resin layer uses the glue sealing of uvioresistant high index of refraction.
Packaging system of the present utility model can quickly derive the heat that luminous body distributes, and described epoxy resin layer uses anti-
The glue sealing of ultraviolet high index of refraction and described outside glue sealing die strip make the lighting angle of described luminous body for for 30-40 degree it
Between, therefore, use luminous physical ability that packaging system of the present utility model encapsulates more resistant to high temperature, can preferably waterproof and moistureproof, separately
Outward, LED can point out driver not interfere with again driver vehicle in use process.
Accompanying drawing explanation
Fig. 1 is the structural representation of the packaging system in this utility model one embodiment.
Fig. 2 is the top view of packaging system in this utility model one embodiment.
Fig. 3 is the internal structure schematic diagram of packaging system in this utility model one embodiment.
Fig. 4 is the structural representation of the outside glue sealing die strip of packaging system in this utility model one embodiment.
Detailed description of the invention
Below in conjunction with the accompanying drawing in this utility model embodiment, to the technical scheme in this utility model embodiment
Be clearly and completely described, it is clear that described embodiment be only a part of embodiment of this utility model rather than
Whole embodiments.Based on the embodiment in this utility model, those of ordinary skill in the art are not making creativeness
The every other embodiment obtained under work premise, broadly falls into the scope of this utility model protection.
It should be noted that when an assembly is considered as " connection " another assembly, and it can be directly to separately
One assembly or may be simultaneously present assembly placed in the middle.
Unless otherwise defined, all of technology used herein and scientific terminology are led with belonging to technology of the present utility model
The implication that the technical staff in territory is generally understood that is identical.At term used in the description of the present utility model it is simply herein
The purpose of specific embodiment is described, it is not intended that in limiting this utility model.Term as used herein " and/or " bag
Include the arbitrary and all of combination of one or more relevant Listed Items.
Please also refer to Fig. 1 to Fig. 3, in this utility model one embodiment, packaging system 100 includes 20, one, a support
Body of light 30, a pair bonding wire 60 and a sealing portion 70.Described sealing portion 70 is for being packaged described luminous body 30.Encapsulated
The packaging system 100 of body of light 30 can be installed on electrical substrate by surface mount technology, such as on pcb board.
Described support 20 is provided with a carrier cup 22, and the inner surface of described carrier cup 22 is silver-plated, and described luminous body 30 is installed
In the inner surface of described carrier cup 22, non-conductive between this luminous body 30 and this carrier cup 22.Described support 20 is in described support
What cup 22 was relative is respectively provided on two sides with positive terminal pad 40 and a negative terminal pad 50.Described luminous body 30 is provided with anode connection terminal
202 and one negative pole connect end 205.A wherein bonding wire 60 in the pair of bonding wire 60 is just being electrically connected at described luminous body 30
Pole connects between end 202 and described positive terminal pad 40, and another bonding wire 60 is connected to the negative pole of described luminous body 30 and connects end 205 He
Wherein between a negative terminal pad 50.The pair of bonding wire 60 is proof gold line.
Described sealing portion 70 is the epoxy resin layer that described support 20 carries out outer wrapping, makes described luminous body 30 and described
A pair bonding wire 60 is positioned at this support 20, protects described luminous body 30, positive terminal pad 202, described negative terminal pad 205 and described one
To bonding wire 60, and can be waterproof and moistureproof.
Described support 20 also includes being electrically connected at described positive terminal pad 40 and extending a positive pole in described sealing portion 70
Pin 206 and be electrically connected at described negative terminal pad 50 and the negative pole that extends along the direction that described positive pole pin 206 extends draws
Foot 208, the outer surface of described positive pole pin 206 and described negative pin 208 is silver-plated.Described positive pole pin 206 and described negative pole
Pin 208 is respectively equipped with a pin stuck point 209 at neighbouring described sealing portion 70.Described positive pole pin 206 and described negative pole draw
Foot 208 can be plugged in electrical substrate, and the pin stuck point 209 of described positive pole pin 206 and described negative pin 208 is connected to institute
State electrical substrate.
Refer to Fig. 4, described epoxy resin layer is by making from mould process for filling colloid.The outside in described sealing portion 70 is provided with
One outside glue sealing die strip 90, formation one space 80 in described outside glue sealing die strip 90, filling epoxy resin in described space 80,
Form the epoxy resin layer of described packaging system 100 from mould after carrying out glue curing again after having filled epoxy resin.Described epoxy
Between resin bed can make the lighting angle of described luminous body 30 spend at 30 degree-40.
Described packaging system 100 being made an indicator panel and is installed on a highway, driver is from described finger
During position beyond display screen 100 meters, driver can find the most described indicator panel；When driver travels to from described indicator panel
During position within 100 meters, the now display font on the invisible described indicator panel of driver, so that described indicator panel sends
Light driver is not produced impact.Described epoxy resin layer uses the glue sealing of uvioresistant high index of refraction, is resistant to purple
Outside line and the inside that can prevent outside moisture from entering described packaging system 100.
Described luminous body 30 is the inner surface that the conductive silver glue by high thermal conductivity is attached at described support ring 22, described in lead
The heat that described luminous body 22 produces can quickly be derived by electricity glue.Described luminous body 30 uses import wafer chip, such as U.S. CREE
The LED chip etc. that the LED chip that company produces, German OSRAM produce, from making light brightness high, light decay is low.
Packaging system 100 of the present utility model can quickly derive the heat that luminous body 30 distributes, described epoxy resin layer
The glue sealing and the described epoxy resin layer that use uvioresistant high index of refraction make the lighting angle of described luminous body 30 for for 30
Between degree-40 degree, therefore, use luminous body 30 that packaging system 100 of the present utility model encapsulates can more resistant to high temperature, can be preferably
Waterproof and moistureproof, it addition, LED can point out driver not interfere with again driver vehicle in use process.
Embodiment of above is only in order to illustrate the technical solution of the utility model and unrestricted, although with reference to above embodiment party
This utility model has been described in detail by formula, it will be understood by those within the art that, can be to of the present utility model
Technical scheme is modified or equivalent the most should not depart from the spirit and scope of technical solutions of the utility model.
Claims (8)
1. a packaging system, including a support, a pair bonding wire, a luminous body and a sealing portion, it is characterised in that: described
Frame is provided with a carrier cup, and the inner surface of described carrier cup is silver-plated, and described luminous body is attached at described carrier cup inner surface, this
Between body of light and this carrier cup non-conductive, described support is provided with a positive terminal pad and a negative terminal pad, and described luminous body is provided with one
Anode connection terminal and a negative pole connect end, and the pair of bonding wire is that proof gold is made, and the wherein bonding wire in the pair of bonding wire is even
Being connected between the anode connection terminal of described luminous body and described positive terminal pad, another bonding wire is connected to the negative pole of described luminous body even
Connecing end and wherein between a negative terminal pad, described sealing portion is the epoxy resin that the carrier cup to described support carries out outer wrapping
Layer, makes described positive terminal pad, described negative terminal pad and the pair of bonding wire be positioned at this support.
2. packaging system as claimed in claim 1, it is characterised in that: described positive terminal pad is positioned at the side of described carrier cup,
Described negative terminal pad is in the relative opposite side of described carrier cup.
3. packaging system as claimed in claim 1, it is characterised in that: described support includes being electrically connected at described positive terminal pad
A positive pole pin and be electrically connected at a negative pin of described negative terminal pad, described positive pole pin and described negative pin
Outer surface is silver-plated.
4. packaging system as claimed in claim 3, it is characterised in that: described positive pole pin and described negative pin are in neighbouring institute
Stating and be respectively equipped with a pin stuck point at carrier cup, described positive pole pin and described negative pin can be plugged in an electrical substrate,
The stuck point of described positive pole pin and described negative pin is welded in described electrical substrate.
5. packaging system as claimed in claim 4, it is characterised in that: the outside in described sealing portion is provided with an outside glue sealing die
Bar, forms a space in described outside glue sealing die strip, fills described space with epoxy resin and be formed for described epoxy resin layer, institute
Stating epoxy resin layer can make the lighting angle of described luminous body be between 30 degree of-40 degree.
6. packaging system as claimed in claim 1, it is characterised in that: the described luminous body conductive silver sticker by high thermal conductivity
Being located at the inner surface of described support ring, the heat that described luminous body produces can quickly be derived by described conducting resinl.
7. packaging system as claimed in claim 1, it is characterised in that: described epoxy resin layer is by from mould process for filling colloid system
Becoming, described epoxy resin layer is used for protecting luminous body and the pair of bonding wire.
8. packaging system as claimed in claim 1, it is characterised in that: described epoxy resin layer uses uvioresistant high index of refraction
Glue sealing.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620735302.8U CN205810859U (en) | 2016-07-13 | 2016-07-13 | Packaging system |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620735302.8U CN205810859U (en) | 2016-07-13 | 2016-07-13 | Packaging system |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN205810859U true CN205810859U (en) | 2016-12-14 |
Family
ID=57510909
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201620735302.8U Expired - Fee Related CN205810859U (en) | 2016-07-13 | 2016-07-13 | Packaging system |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN205810859U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108321289A (en) * | 2018-04-10 | 2018-07-24 | 东莞市虹鼎光电科技有限公司 | A kind of plug-in unit LED matrix |
-
2016
- 2016-07-13 CN CN201620735302.8U patent/CN205810859U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108321289A (en) * | 2018-04-10 | 2018-07-24 | 东莞市虹鼎光电科技有限公司 | A kind of plug-in unit LED matrix |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP2020502779A (en) | QFN surface mount type RGB-LED package module and method of manufacturing the same | |
| CN205810859U (en) | Packaging system | |
| CN105789418A (en) | Jelly and LED packaging structure | |
| CN106206920A (en) | LED encapsulation structure, method for packing and there is the LED of this LED encapsulation structure | |
| CN202231055U (en) | LED (light-emitting diode) support and LED | |
| CN205863213U (en) | A kind of encapsulating structure of LED drive chip | |
| CN209328451U (en) | A kind of plug-in LED advertising lamp | |
| CN104934515B (en) | Flexible light piece and its processing technology apply the lighting device and manufacture method of the lamp piece | |
| CN209180714U (en) | The flexible filament and filament lamp that can be independently formed | |
| CN201262959Y (en) | Patch type LED structure | |
| CN205318776U (en) | LED display device with transparent soft base plate | |
| CN206861325U (en) | A kind of positive emitting neon lamp light bar | |
| CN202474034U (en) | Surface-mounted LED (light emitting diode) device adopting flexible rubbers to protect inner core | |
| CN105448202A (en) | LED display device with transparent and flexible substrate | |
| CN106058031B (en) | A kind of integrated form high power ultraviolet LED heat sink | |
| CN201561317U (en) | LED line lamp | |
| CN205900591U (en) | LAMP347 colloid packaging structure | |
| CN207425909U (en) | Anti-static type LED package modules | |
| CN208400872U (en) | A kind of light emitting diode | |
| CN202736917U (en) | LED packaging structure | |
| CN208027041U (en) | A kind of mosaic display screen epoxy encapsulation structure | |
| CN207705192U (en) | Light-emitting device packaged with L ED chip and IC chip | |
| CN205810857U (en) | Packaging system | |
| CN204118051U (en) | A kind of fixture for sensor package bonding | |
| CN104538371B (en) | A kind of capsulation body of semiconductor ship of high reliability and low cost |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20161214 Termination date: 20180713 |