CN207425909U - Anti-static type LED package modules - Google Patents
Anti-static type LED package modules Download PDFInfo
- Publication number
- CN207425909U CN207425909U CN201721511608.6U CN201721511608U CN207425909U CN 207425909 U CN207425909 U CN 207425909U CN 201721511608 U CN201721511608 U CN 201721511608U CN 207425909 U CN207425909 U CN 207425909U
- Authority
- CN
- China
- Prior art keywords
- led chip
- electrode
- package modules
- metal layer
- heat dissipation
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
Abstract
The utility model discloses a kind of anti-static type LED package modules, and including silicon substrate body, cavity is equipped in the silicon substrate body, are also set up on silicon substrate body there are two electrode pin, the lower section of cavity is equipped with heat dissipation copper post；LED chip is provided in the cavity, the P electrode of the LED chip is connected two electrode pins by conducting wire respectively with N electrode, and the lower end of LED chip connects the heat dissipation copper post, and filling colloid is filled in the cavity；The LED chip is configured with the electric discharge device of antistatic in itself, and ground wire is connected in the heat dissipation copper post, one end connection grounding pin of ground wire.The anti-static type LED package modules of the utility model have duplicate protection; the setting of insulating layer, upper metal layer and lower metal layer in LED chip can protect luminescent layer from encapsulation process by electrostatic breakdown; with the ground wire that is connected of heat dissipation copper post can timely conduct static, prevent the breakdown damage in use of LED package modules.
Description
Technical field
The utility model is related to LED field, more particularly to a kind of LED package modules of antistatic.
Background technology
As the high efficiency light source of new century, LED possesses the characteristics of ordinary light source is incomparable, for example, luminous efficiency it is high,
Power consumption is few, service life is long, without stroboscopic, security reliability is strong, be good for the environment, vibration resistance, fast response time, cold light source etc.
Feature is widely used in the fields such as normal lighting, indicator light, signal lamp, display screen, Landscape Lighting.LED productions on current market
Product are most of all not to have anti-static function, has during transport, use by the possibility of electrostatic breakdown, influences service life.
The content of the invention
Goal of the invention：In order to overcome the deficiencies in the prior art, the utility model provides a kind of with antistatic work(
The anti-static type LED package modules of energy.
Technical solution：To achieve the above object, the anti-static type LED package modules of the utility model include silicon substrate body,
Cavity is equipped in the silicon substrate body, is also set up on silicon substrate body there are two electrode pin, the lower section of cavity is equipped with heat dissipation copper post；
LED chip is provided in the cavity, the P electrode of the LED chip is connected two electrodes by conducting wire respectively with N electrode and draws
Foot, and the lower end of LED chip connects the heat dissipation copper post, and filling colloid is filled in the cavity；The LED chip is matched somebody with somebody in itself
The electric discharge device of antistatic is equipped with, and ground wire is connected in the heat dissipation copper post, one end connection grounding pin of ground wire.
Further, the LED chip is partly led from top to bottom including N electrode, n type semiconductor layer, luminescent layer, p-type successively
Body layer, P electrode and silicon substrate are surrounded with insulating materials around the luminescent layer, and are equipped with the outside of insulating materials and N-type
The upper metal layer of semiconductor layer contact and the lower metal layer contacted with p type semiconductor layer, the upper metal layer and lower metal layer
Between have discharge air-gap.
Further, it is additionally provided with second insulating layer on the outside of the upper metal layer and lower metal layer.
Further, the upper end of the filling colloid is spherical shape.
Further, the upper end that the lower end of the LED chip passes through the copper post that radiates described in die bond glue connection.
Further, the material of the filling colloid is epoxy resin.
Advantageous effect：The anti-static type LED package modules of the utility model have duplicate protection, the insulation in LED chip
The setting of layer, upper metal layer and lower metal layer can protect luminescent layer from encapsulation process by electrostatic breakdown, with heat dissipation
Copper post connection ground wire can timely conduct static, prevent the breakdown damage in use of LED package modules.
Description of the drawings
Attached drawing 1 is the structure chart of anti-static type LED package modules.
Specific embodiment
The utility model is further described below in conjunction with the accompanying drawings.
Anti-static type LED package modules as shown in Figure 1 including silicon substrate body 1, are equipped with type in the silicon substrate body 1
Chamber 11 is also set up on silicon substrate body 1 there are two electrode pin 3, and the lower section of cavity 11 is equipped with heat dissipation copper post 4；In the cavity 11
LED chip 2 is provided with, the P electrode 21 of the LED chip 2 is connected two electrode pins 3 by conducting wire respectively with N electrode 22, and
The lower end connection heat dissipation copper post 4 of LED chip 2, the cavity 11 are interior filled with filling colloid 5；The LED chip 2 itself
The electric discharge device of antistatic is configured with, and ground wire 7 is connected in the heat dissipation copper post 4, is grounded 7 one end connection grounding lead
Foot 8.The lower end of the LED chip 2 connects the upper end of the heat dissipation copper post 4 by crystal-bonding adhesive 6.
The LED chip 2 includes N electrode 22, n type semiconductor layer 23, luminescent layer 24, P-type semiconductor successively from top to bottom
Layer 25, P electrode 21 and silicon substrate 210 are surrounded with insulating materials 26 around the luminescent layer 24, and outer with insulating materials 26
Side is equipped with the upper metal layer 27 contacted with n type semiconductor layer 23 and the lower metal layer 28 contacted with p type semiconductor layer 25, described
There is discharge air-gap between upper metal layer 27 and lower metal layer 28.The electric discharge device of LED chip 2 configuration itself can protect LED core
Piece 2 is in transport, its luminescent layer 24 is by electrostatic breakdown in encapsulation process, when generating electrostatic, charge can upper metal layer 27 and under
Discharge air-gap between metal layer 28 discharges, and will not puncture luminescent layer 24.
In order to which upper metal layer 27 and lower metal layer 28 are kept apart with filling colloid 5, the upper metal layer 27 and lower gold
The outside for belonging to layer 28 is additionally provided with second insulating layer 29.
In order to improve light efficiency, the upper end of the filling colloid 5 is spherical shape.
Preferably, the material of the filling colloid 5 is epoxy resin.
The anti-static type LED package modules of the utility model have duplicate protection, insulating layer, upper metal in LED chip
The setting of layer and lower metal layer can protect luminescent layer from, by electrostatic breakdown, being connected in encapsulation process with heat dissipation copper post
Ground wire can timely conduct static, prevent the breakdown damage in use of LED package modules.
The above is only the preferred embodiment of the utility model, it should be pointed out that：For the common skill of the art
For art personnel, on the premise of the utility model principle is not departed from, several improvements and modifications can also be made, these improve and
Retouching also should be regarded as the scope of protection of the utility model.
Claims (6)
1. anti-static type LED package modules, it is characterised in that：Including silicon substrate body (1), type is equipped in the silicon substrate body (1)
Chamber (11) is also set up on silicon substrate body (1) there are two electrode pin (3), and the lower section of cavity (11) is equipped with heat dissipation copper post (4)；Institute
It states and LED chip (2) is provided in cavity (11), P electrode (21) and the N electrode (22) of the LED chip (2) pass through conducting wire respectively
Two electrode pins (3), and the lower end connection heat dissipation copper post (4) of LED chip (2) are connected, is filled in the cavity (11)
There is filling colloid (5)；The LED chip (2) is configured with the electric discharge device of antistatic in itself, and connects on the heat dissipation copper post (4)
It is connected to ground wire (7), one end connection grounding pin (8) of ground wire (7).
2. anti-static type LED package modules according to claim 1, it is characterised in that：The LED chip (2) on to
Under successively include N electrode (22), n type semiconductor layer (23), luminescent layer (24), p type semiconductor layer (25), P electrode (21) and
Silicon substrate (210), is surrounded with insulating materials (26) around the luminescent layer (24), and with the outside of insulating materials (26) be equipped with
The upper metal layer (27) of n type semiconductor layer (23) contact and the lower metal layer (28) contacted with p type semiconductor layer (25), it is described
There is discharge air-gap between upper metal layer (27) and lower metal layer (28).
3. anti-static type LED package modules according to claim 2, it is characterised in that：The upper metal layer (27) is under
Second insulating layer (29) is additionally provided on the outside of metal layer (28).
4. anti-static type LED package modules according to claim 1, it is characterised in that：The upper end of the filling colloid (5)
For spherical shape.
5. anti-static type LED package modules according to claim 1, it is characterised in that：The lower end of the LED chip (2)
The upper end of the heat dissipation copper post (4) is connected by crystal-bonding adhesive (6).
6. anti-static type LED package modules according to claim 1, it is characterised in that：The material of the filling colloid (5)
For epoxy resin.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721511608.6U CN207425909U (en) | 2017-11-14 | 2017-11-14 | Anti-static type LED package modules |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721511608.6U CN207425909U (en) | 2017-11-14 | 2017-11-14 | Anti-static type LED package modules |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN207425909U true CN207425909U (en) | 2018-05-29 |
Family
ID=62305919
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201721511608.6U Expired - Fee Related CN207425909U (en) | 2017-11-14 | 2017-11-14 | Anti-static type LED package modules |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN207425909U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110875064A (en) * | 2018-08-30 | 2020-03-10 | 三星电子株式会社 | Solid state drive device including anti-static structure |
-
2017
- 2017-11-14 CN CN201721511608.6U patent/CN207425909U/en not_active Expired - Fee Related
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110875064A (en) * | 2018-08-30 | 2020-03-10 | 三星电子株式会社 | Solid state drive device including anti-static structure |
| US11576287B2 (en) | 2018-08-30 | 2023-02-07 | Samsung Electronics Co., Ltd. | Solid state drive apparatus including electrostatic prevention structure |
| US11974420B2 (en) | 2018-08-30 | 2024-04-30 | Samsung Electronics Co., Ltd. | Solid state drive apparatus including electrostatic prevention structure |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20180529 Termination date: 20181114 |