CN207233727U - A kind of new integrated-semiconductor device - Google Patents
A kind of new integrated-semiconductor device Download PDFInfo
- Publication number
- CN207233727U CN207233727U CN201721226917.9U CN201721226917U CN207233727U CN 207233727 U CN207233727 U CN 207233727U CN 201721226917 U CN201721226917 U CN 201721226917U CN 207233727 U CN207233727 U CN 207233727U
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- lamp plate
- semiconductor device
- screw thread
- column
- bottom plates
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- Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
Abstract
The utility model discloses a kind of new integrated-semiconductor device, its structure includes outer protection lampshade, integrated circuit plate, shine lamp plate, lamp plate is bonded column, electric binding post, swivel bearing, engage screw thread, thermal column, electrical connector, air outlet, wound around coil, amplifier, bulky capacitor, big resistance, photo resistance, PCB bottom plates, control chip, connector lug, positioning hole, triode, thermal column is equipped with connection screw thread cylinder, aluminium copper heat-dissipating cylinder, through hole, outer end cap, a kind of new integrated-semiconductor device of the utility model, by equipped with thermal column, amount of heat in integrated-semiconductor device can quickly be shed, lamp bead and the temperature of lamp plate and outer cover in semiconductor is set to be in relatively low temperature all the time, the service life of lamp bead and lamp plate and outer cover is elongated, the performance of semiconductor devices is more excellent.
Description
Technical field
The utility model is a kind of new integrated-semiconductor device, belongs to integrated-semiconductor device field.
Background technology
Integrated is exactly that some isolated things or element change original dispersity by certain mode and concentrate in together,
Contact is produced, so as to form the process of an organic whole.
Semiconductor devices be electric conductivity between good conductor of electricity and insulator, using semi-conducting material specific electrical properties come
The electronic device of specific function is completed, can be used to produce, control, receive, converting, amplified signal and carrying out energy conversion.
Prior art discloses Application No.：201521098960.2 a kind of semiconductor devices.The semiconductor devices bag
Include：At least one integrated circuit；The integrated circuit die paddle being aligned with least one integrated circuit；Welded with integrated circuit die
There is the outwardly extending solder anchoring at lower region thereof to connect for the adjacent multiple lead frame contacts of disk, each lead frame contact
Piece；A plurality of bonding wiring, every bonding wiring mutually couple corresponding lead frame contact and at least one integrated circuit；With
And around at least one integrated circuit and it is a plurality of bonding wiring encapsulating material, each lead frame contact solder anchoring contact pin with
Side walls collapse is defined between the encapsulating material, the prior art can produce substantial amounts of thermal energy in semiconductor light emitting, if nothing
Method is discharged in time can cause that the material gradual change of lampshade is gradually crisp, and the service life of lamp bead shortens, and influence the use of semiconductor devices.
Utility model content
In view of the deficienciess of the prior art, the utility model aim is to provide a kind of new integrated-semiconductor device, with
Substantial amounts of thermal energy can be produced in semiconductor light emitting by solving the prior art, if can not discharge in time can cause the material of lampshade gradually
Become gradually crisp, the service life of lamp bead shortens, the problem of influencing the use of semiconductor devices.
To achieve these goals, the utility model is to realize by the following technical solutions：A kind of new integrated half
Conductor device, its structure include outer protection lampshade, integrated circuit plate, the lamp plate that shines, lamp plate fitting column, electric binding post, rotation axis
Hold, engage screw thread, thermal column, electrical connector, air outlet, wound around coil, amplifier, bulky capacitor, big resistance, photo resistance, PCB
Bottom plate, control chip, connector lug, positioning hole, triode：
The outer protection lampshade is threadedly secured to the top of thermal column, and the luminous lamp plate is fixed by screws in lamp
Plate is bonded the top of column, and the luminous lamp plate is equipped with two or more and is equidistantly evenly distributed in the appearance of lamp plate fitting column
Face, the luminous lamp plate are bonded the circuit board electrical connection inside column with lamp plate, and the electric binding post is vertically welded in lamp plate fitting
The center of column lower surface, the swivel bearing are movably connected on the position at electric binding post 1/3rd, the engagement screw thread
The equidistant outer surface for being uniformly welded on thermal column, the electrical connector are welded on the bottom of thermal column, and the air outlet is equipped with
Two two or more and with engage screw thread correspond, the air outlet through engagement screw thread outer surface, the PCB bottom plates
The upper surface of integrated circuit plate is fitted in, the positioning hole is equipped with two and is each passed through the lower-left of PCB backplate surfaces
Angle and the lower right corner, the control chip are vertically welded in the center of PCB backplate surfaces, and the photo resistance is equipped with two or more simultaneously
And the front of control chip is horizontally fixed on, the big resistance is vertically welded in the upper left corner of photo resistance, the bulky capacitor peace
It is located at the right side of big resistance and orthogonal with PCB bottom plates, the amplifier is installed on the rear of big resistance and passes through five
A pole is electrically connected with PCB bottom plates, and the wound around coil is horizontally fixed on the right side of amplifier and is electrically connected with PCB bottom plates；
The thermal column be equipped with connection screw thread cylinder, aluminium copper heat-dissipating cylinder, through hole, outer end cap, the connection screw thread cylinder with
Outer protection lampshade is securely screwed together, and the aluminium copper heat-dissipating cylinder is welded on the front of connection screw thread cylinder, described logical
Hole is equipped with two or more and is welded on aluminum bronze through connection screw thread cylinder, the intersection of aluminium copper heat-dissipating cylinder, the outer end cap
The surface of alloy heat-sink cylinder.
Further, the PCB bottom plates are equipped with blue light piece, N-shaped gallium nitride, n-electrode, pedestal, salient point, p-electrode, p-type nitrogen
Change gallium.
Further, together with the surface soldered of integrated circuit plate, the salient point is equipped with two and erects the pedestal
The straight front for being fixed on pedestal upper surface, the p-electrode are fixed by screws in the upper surface of pedestal, the p-type gallium nitride electricity
The top of p-electrode is connected to, the n-electrode is connected to the right end of p-type gallium nitride side by side, and the N-shaped gallium nitride is horizontally fixed on n
The top of electrode and p-type gallium nitride, the blue light piece gemel connection is in the top of N-shaped gallium nitride.
Further, the lamp plate is bonded column, electric binding post, swivel bearing is on same straight line and axle center is total to
Line.
Further, the lamp plate fitting column is divided into six regions, and each region of the lamp plate fitting column is distributed with
The rectangle square formation that ten luminous lamp plates are formed.
Further, the connector lug is horizontally fixed on the right side of control chip and is electrically connected with external power supply.
Further, the triode is installed on the rear of connector lug and passes through Positive Poles, anode pole, earthing pole
Column is electrically connected with PCB bottom plates.
Further, the swivel bearing is equipped with outer sleeve, ball layer, the adapter ring that is electrically connected, banding circle, the swivel bearing branch
Rotary body is supportted, reduces the friction coefficient in its motion process, and ensure its rotating accuracy.
Further, the outer sleeve is welded on the outer surface of ball layer, the installed inside of the ball layer have two with
On ball, it is described be electrically connected adapter ring embedded in ball layer front and with the circuit board electrical connection inside electric binding post, the banding
Lap welding is connected on the center on the inside of ball layer and welds together with the outer surface of electric binding post.
Beneficial effect
A kind of new integrated-semiconductor device of the utility model, is carrying out in use, integrated circuit plate and luminous lamp plate
Luminous energy is converted electrical energy into during work, and discharges heat, the heat of release is remained in inside outer protection lampshade, by through hole
It is passed through in aluminium copper heat-dissipating cylinder, is absorbed and sent by air outlet by aluminium copper heat-dissipating cylinder, the thermal conductivity of copper is good, and aluminium closes
The advantages of golden is cheap, and light-weight, both, which are combined, quickly by heat derives and will not increase semiconductor devices
Weight, by equipped with thermal column, the amount of heat in integrated-semiconductor device can quickly be shed, make lamp in semiconductor
Service life of the temperature of pearl and lamp plate and outer cover all the time in relatively low temperature, lamp bead and lamp plate and outer cover is elongated, semiconductor
The performance of device is more excellent.
Brief description of the drawings
Upon reading the detailed description of non-limiting embodiments with reference to the following drawings, other spies of the utility model
Sign, objects and advantages will become more apparent upon：
Fig. 1 is a kind of structure diagram of new integrated-semiconductor device of the utility model；
Fig. 2 is the structure diagram at the top of a kind of new integrated-semiconductor device PCB bottom plates of the utility model；
Fig. 3 is the structure diagram of mirror-image structure at the top of a kind of new integrated-semiconductor device PCB bottom plates of the utility model；
Fig. 4 is a kind of structure diagram of new integrated-semiconductor device PCB base plate interiors of the utility model；
Fig. 5 is a kind of structure diagram of new integrated-semiconductor device thermal column of the utility model；
Fig. 6 is a kind of structure diagram of new integrated-semiconductor device swivel bearing of the utility model；
Fig. 7 is a kind of structure diagram of new integrated-semiconductor device control chip circuit connection of the utility model；
Fig. 8 is a kind of structure diagram of new integrated-semiconductor device operating circuit of the utility model；
In figure：Outer protection lampshade -1, integrated circuit plate -2, the lamp plate -3 that shines, lamp plate fitting column -4, electric binding post -5, rotation
Shaft holds -6, engagement screw thread -7, thermal column -8, electrical connector -9, air outlet -10, wound around coil -11, amplifier -12, big electricity
Hold -13, big resistance -14, photo resistance -15, PCB bottom plates -16, control chip -17, connector lug -18, positioning hole -19, three
Pole pipe -20, outer sleeve -601, ball layer -602, the adapter ring -603 that is electrically connected, banding circle -604, connection screw thread cylinder -801, aluminium copper
Heat-dissipating cylinder -802, through hole -803, outer end cap -804, blue light piece -1601, N-shaped gallium nitride -1602, n-electrode -1603, pedestal -
1604th, salient point -1605, p-electrode -1606, p-type gallium nitride -1607.
Embodiment
To make the technical means, creative features, achievable purpose and effectiveness that the utility model is realized easy to understand, below
With reference to embodiment, the utility model is expanded on further.
Embodiment one
- Fig. 8 is please referred to Fig.1, the utility model provides a kind of new integrated-semiconductor device technical solution：A kind of new collection
Into semiconductor devices, its structure includes outer protection lampshade 1, integrated circuit plate 2, the lamp plate 3 that shines, lamp plate fitting column 4, electric binding post
5th, swivel bearing 6, engagement screw thread 7, thermal column 8, electrical connector 9, air outlet 10, wound around coil 11, amplifier 12, bulky capacitor
13rd, big resistance 14, photo resistance 15, PCB bottom plates 16, control chip 17, connector lug 18, positioning hole 19, triode 20：
The outer protection lampshade 1 is threadedly secured to the top of thermal column 8, and the luminous lamp plate 3 is fixed by screw
At the top of lamp plate fitting column 4, the luminous lamp plate 3 is equipped with two or more and is equidistantly evenly distributed in lamp plate fitting column 4
Outer surface, the luminous lamp plate 3 is bonded the circuit board electrical connection inside column 4 with lamp plate, and the electric binding post 5 is vertically welded in
The center of 4 lower surface of lamp plate fitting column, the swivel bearing 6 are movably connected on the position at electric binding post 1/5th three, institute
The equidistant outer surface for being uniformly welded on thermal column 8 of engagement screw thread 7 is stated, the electrical connector 9 is welded on the bottom of thermal column 8,
The air outlet 10 is equipped with two two or more and is corresponded with engaging screw thread 7, and the air outlet 10 passes through engagement screw thread 7
Outer surface, the PCB bottom plates 16 are fitted in the upper surface of integrated circuit plate 2, the positioning hole 19 be equipped with two and
The lower left corner and the lower right corner on 16 surface of PCB bottom plates are each passed through, the control chip 17 is vertically welded in 16 surface of PCB bottom plates
Center, the photo resistance 15 are equipped with two or more and are horizontally fixed on the front of control chip 17, and the big resistance 14 hangs down
The straight upper left corner for being welded on photo resistance 15, the bulky capacitor 13 are installed in the right side of big resistance 14 and mutual with PCB bottom plates 16
Perpendicular, the amplifier 12 is installed on the rear of big resistance 14 and is electrically connected by five poles with PCB bottom plates 16, described
Wound around coil 11 is horizontally fixed on the right side of amplifier 12 and is electrically connected with PCB bottom plates 16；
The thermal column 8 is equipped with connection screw thread cylinder 801, aluminium copper heat-dissipating cylinder 802, through hole 803, outer end cap 804, described
Connection screw thread cylinder 801 is securely screwed together with outer protection lampshade 1, and the aluminium copper heat-dissipating cylinder 802 is welded on connection
The front of thread barrel 801, the through hole 803 are equipped with two or more and pass through connection screw thread cylinder 801, aluminium copper heat-dissipating cylinder
802 intersection, the outer end cap 804 are welded on the surface of aluminium copper heat-dissipating cylinder 802, and the PCB bottom plates 16 are equipped with blue light
Piece 1601, N-shaped gallium nitride 1602, n-electrode 1603, pedestal 1604, salient point 1605, p-electrode 1606, p-type gallium nitride 1607, it is described
Together with the surface soldered of integrated circuit plate 2, the salient point 1605 is equipped with two and is fixed on pedestal vertically pedestal 1604
The front of 1604 upper surfaces, the p-electrode 1606 are fixed by screws in the upper surface of pedestal 1604, the p-type gallium nitride
1607 are connected electrically in the top of p-electrode 1606, and the n-electrode 1603 is connected to the right end of p-type gallium nitride 1607, the n side by side
Type gallium nitride 1602 is horizontally fixed on the top of n-electrode 1603 and p-type gallium nitride 1607, and 1601 gemel connection of blue light piece is in n
The top of type gallium nitride 1602, lamp plate fitting column 4, the electric binding post 5, swivel bearing 6 is on same straight line and axis
The heart is conllinear, and the lamp plate fitting column 4 divides to be distributed with ten and shine for six regions, each region of the lamp plate fitting column 4
The rectangle square formation that lamp plate 3 is formed, the connector lug 18 are horizontally fixed on the right side of control chip 17 and are electrically connected with external power supply
Connect, the triode 20 is installed on the rear of connector lug 18 and by Positive Poles, anode pole, ground connection pole and PCB bottoms
Plate 16 is electrically connected, and the swivel bearing 6 is equipped with outer sleeve 601, ball layer 602, the adapter ring 603 that is electrically connected, banding circle 604, the rotation
Shaft holds 6 supporting rotators, reduces the friction coefficient in its motion process, and ensures its rotating accuracy, and the outer sleeve 601 welds
The outer surface of ball layer 602 is connected on, the installed inside of the ball layer 602 has more than two balls, the adapter ring 603 that is electrically connected
Ball layer is welded on embedded in the front of ball layer 602 and with the circuit board electrical connection inside electric binding post 5, the banding circle 604
602 inner side center and weld together with the outer surface of electric binding post 5.
15 common making material of photo resistance described in the utility model is cadmium sulfide, in addition also selenium, aluminium sulfide, sulphur
Change the material such as lead and bismuth sulfide, these making materials have under the light irradiation of specific wavelength, the characteristic that its resistance value reduces rapidly.
This is because the carrier that illumination produces is involved in conduction, make drift motion under the action of extra electric field, electronics marches on towards power supply
Cathode, hole marches on towards the anode of power supply, so that the resistance value of photo-resistor declines rapidly.
Carrying out in use, integrated circuit plate 2 converts electrical energy into luminous energy when working with luminous lamp plate 3, and discharges
Heat, the heat of release are remained in inside outer protection lampshade 1, are passed through by through hole 803 in aluminium copper heat-dissipating cylinder 802, by aluminium
The advantages of copper alloy heat-dissipating cylinder 802 is absorbed and sent by air outlet 10, and the thermal conductivity of copper is good, aluminium alloy be it is cheap,
Light-weight, both, which are combined, quickly by heat derives and will not increase the weight of semiconductor devices.
The outer protection lampshade 1 of the utility model, integrated circuit plate 2, the lamp plate 3 that shines, lamp plate fitting column 4, electric binding post 5,
Swivel bearing 6, engagement screw thread 7, thermal column 8, electrical connector 9, air outlet 10, wound around coil 11, amplifier 12, bulky capacitor 13,
Big resistance 14, photo resistance 15, PCB bottom plates 16, control chip 17, connector lug 18, positioning hole 19, triode 20, overcoat
Cylinder 601, ball layer 602, the adapter ring 603 that is electrically connected, banding circle 604, connection screw thread cylinder 801, aluminium copper heat-dissipating cylinder 802, through hole
803rd, outer end cap 804, blue light piece 1601, N-shaped gallium nitride 1602, n-electrode 1603, pedestal 1604, salient point 1605, p-electrode 1606,
P-type gallium nitride 1607, the component that component is universal standard part or those skilled in the art know, its structure and principle are all this
Technical staff can learn or know by normal experiment method the utility model solves the problems, such as it is existing by technical manual
Technology can produce substantial amounts of thermal energy in semiconductor light emitting, if can not discharge in time can cause the material gradual change of lampshade gradually crisp,
The service life of lamp bead shortens, and influences the use of semiconductor devices, and the utility model is combined with each other by above-mentioned component, can incite somebody to action
Amount of heat in integrated-semiconductor device quickly sheds, and lamp bead and the temperature of lamp plate and outer cover in semiconductor is located all the time
In relatively low temperature, lamp bead and the service life of lamp plate and outer cover are elongated, and the performance of semiconductor devices is more excellent, specifically
As described below:
The connection screw thread cylinder 801 is securely screwed together with outer protection lampshade 1, the aluminium copper heat-dissipating cylinder
802 are welded on the front of connection screw thread cylinder 801, and the through hole 803 is equipped with two or more and passes through connection screw thread cylinder 801, aluminium
The intersection of copper alloy heat-dissipating cylinder 802, the outer end cap 804 are welded on the surface of aluminium copper heat-dissipating cylinder 802.
Embodiment two
- Fig. 8 is please referred to Fig.1, the swivel bearing 6 is equipped with outer sleeve 601, ball layer 602, the adapter ring 603 that is electrically connected, banding circle
604,6 supporting rotator of swivel bearing, reduces the friction coefficient in its motion process, and ensures its rotating accuracy, described
Outer sleeve 601 is welded on the outer surface of ball layer 602, and the installed inside of the ball layer 602 has more than two balls, described
The adapter ring 603 that is electrically connected is welded embedded in the front of ball layer 602 and with the circuit board electrical connection inside electric binding post 5, the banding circle 604
It is connected on the center of the inner side of ball layer 602 and welds together with the outer surface of electric binding post 5.
When electric current accesses electric binding post 5 by electrical connector 9, electric binding post 5 must be electric, stimulates the adapter ring 603 that is electrically connected, makes electricity
Clamping ring 603 produces electrostatic particle, and electrostatic particle promotes the movement of ball in ball layer 602, outer sleeve 601 is proceeded by rotation
Turn, drive electrical connector 9 to proceed by rotation, the lamp plate 3 that then makes entirely to shine, lamp plate are bonded column 4 and rotate, and make semiconductor light emitting
Effect it is more preferable.
The advantages of basic principle and main feature and the utility model of the utility model has been shown and described above, for
For those skilled in the art, it is clear that the utility model is not limited to the details of above-mentioned one exemplary embodiment, and without departing substantially from this
In the case of the spirit or essential attributes of utility model, the utility model can be realized in other specific forms.Therefore, no matter
From the point of view of which point, the present embodiments are to be considered as illustrative and not restrictive, and the scope of the utility model is by institute
Attached claim rather than described above limit, it is intended that will fall in the implication and scope of the equivalency of claim
All changes are embraced therein.Any reference numeral in claim should not be considered as to the involved right of limitation
It is required that.
Moreover, it will be appreciated that although the present specification is described in terms of embodiments, not each embodiment is only wrapped
Containing an independent technical solution, this narrating mode of specification is only that those skilled in the art should for clarity
Using specification as an entirety, the technical solutions in the various embodiments may also be suitably combined, forms those skilled in the art
It is appreciated that other embodiment.
Claims (7)
1. a kind of new integrated-semiconductor device, its structure includes outer protection lampshade (1), integrated circuit plate (2), shine lamp plate
(3), lamp plate fitting column (4), electric binding post (5), swivel bearing (6), engagement screw thread (7), thermal column (8), electrical connector (9),
Air outlet (10), wound around coil (11), amplifier (12), bulky capacitor (13), big resistance (14), photo resistance (15), PCB bottom plates
(16), control chip (17), connector lug (18), positioning hole (19), triode (20), it is characterised in that：
The outer protection lampshade (1) is threadedly secured to the top of thermal column (8), and the luminous lamp plate (3) is consolidated by screw
The top of lamp plate fitting column (4) is scheduled on, the luminous lamp plate (3) is equipped with two or more and is equidistantly evenly distributed in lamp plate patch
The outer surface of zygostyle (4), the luminous lamp plate (3) are bonded the internal circuit board electrical connection of column (4), the electric binding post with lamp plate
(5) center of lamp plate fitting column (4) lower surface is vertically welded in, the swivel bearing (6) is movably connected in electric binding post (5) three
On position at/mono-, the equidistant outer surface for being uniformly welded on thermal column (8) of engagement screw thread (7), the electrical connection
Head (9) is welded on the bottom of thermal column (8), and the air outlet (10) is equipped with two two or more and with engaging screw thread (7) one
One corresponds to, and the air outlet (10) is fitted in integrated circuit plate through the outer surface of engagement screw thread (7), the PCB bottom plates (16)
(2) upper surface, the positioning hole (19) are equipped with two and are each passed through the lower left corner and the right side on PCB bottom plates (16) surface
Inferior horn, the control chip (17) are vertically welded in the center on PCB bottom plates (16) surface, and the photo resistance (15) is equipped with two
Above and the front of control chip (17) is horizontally fixed on, the big resistance (14) is vertically welded in a left side for photo resistance (15)
Upper angle, the bulky capacitor (13) are installed in the right side of big resistance (14) and, the amplifier orthogonal with PCB bottom plates (16)
(12) it is installed on the rear of big resistance (14) and is electrically connected by five poles with PCB bottom plates (16), the wound around coil
(11) it is horizontally fixed on the right side of amplifier (12) and is electrically connected with PCB bottom plates (16)；
The thermal column (8) is equipped with connection screw thread cylinder (801), aluminium copper heat-dissipating cylinder (802), through hole (803), outer end cap
(804), the connection screw thread cylinder (801) is securely screwed together with outer protection lampshade (1), the aluminium copper heat-dissipating cylinder
(802) front of connection screw thread cylinder (801) is welded on, the through hole (803) is equipped with two or more and passes through connection screw thread cylinder
(801), the intersection of aluminium copper heat-dissipating cylinder (802), the outer end cap (804) are welded on aluminium copper heat-dissipating cylinder (802)
Surface.
A kind of 2. new integrated-semiconductor device according to claim 1, it is characterised in that：The PCB bottom plates (16) set
Have blue light piece (1601), N-shaped gallium nitride (1602), n-electrode (1603), pedestal (1604), salient point (1605), p-electrode (1606),
P-type gallium nitride (1607).
A kind of 3. new integrated-semiconductor device according to claim 2, it is characterised in that：The pedestal (1604) and collection
Into circuit board (2) surface soldered together, the salient point (1605) is equipped with and two and is fixed on vertically on pedestal (1604)
The front on surface, the p-electrode (1606) are fixed by screws in the upper surface of pedestal (1604), the p-type gallium nitride
(1607) top of p-electrode (1606) is connected electrically in, the n-electrode (1603) is connected to the right side of p-type gallium nitride (1607) side by side
End, the N-shaped gallium nitride (1602) are horizontally fixed on the top of n-electrode (1603) and p-type gallium nitride (1607), the blue light piece
(1601) gemel connection is in the top of N-shaped gallium nitride (1602).
A kind of 4. new integrated-semiconductor device according to claim 1, it is characterised in that：The lamp plate fitting column (4),
Electric binding post (5), swivel bearing (6) is on same straight line and axle center is conllinear.
A kind of 5. new integrated-semiconductor device according to claim 1, it is characterised in that：The lamp plate fitting column (4)
It is divided into six regions, each region of the lamp plate fitting column (4) is distributed with the rectangle side that ten luminous lamp plates (3) are formed
Battle array.
A kind of 6. new integrated-semiconductor device according to claim 1, it is characterised in that：The connector lug (18) is horizontal
It is fixed on the right side of control chip (17) and is electrically connected with external power supply.
A kind of 7. new integrated-semiconductor device according to claim 1, it is characterised in that：Triode (20) installation
It is electrically connected at the rear of connector lug (18) and by Positive Poles, anode pole, ground connection pole with PCB bottom plates (16).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721226917.9U CN207233727U (en) | 2017-09-22 | 2017-09-22 | A kind of new integrated-semiconductor device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721226917.9U CN207233727U (en) | 2017-09-22 | 2017-09-22 | A kind of new integrated-semiconductor device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN207233727U true CN207233727U (en) | 2018-04-13 |
Family
ID=61863768
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201721226917.9U Expired - Fee Related CN207233727U (en) | 2017-09-22 | 2017-09-22 | A kind of new integrated-semiconductor device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN207233727U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112968024A (en) * | 2021-03-01 | 2021-06-15 | 湖北长江新型显示产业创新中心有限公司 | LED display panel and LED display device |
-
2017
- 2017-09-22 CN CN201721226917.9U patent/CN207233727U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112968024A (en) * | 2021-03-01 | 2021-06-15 | 湖北长江新型显示产业创新中心有限公司 | LED display panel and LED display device |
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Granted publication date: 20180413 Termination date: 20180922 |