CN104538371B - A kind of capsulation body of semiconductor ship of high reliability and low cost - Google Patents
A kind of capsulation body of semiconductor ship of high reliability and low cost Download PDFInfo
- Publication number
- CN104538371B CN104538371B CN201510015604.8A CN201510015604A CN104538371B CN 104538371 B CN104538371 B CN 104538371B CN 201510015604 A CN201510015604 A CN 201510015604A CN 104538371 B CN104538371 B CN 104538371B
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- CN
- China
- Prior art keywords
- base
- pipe cap
- ground metal
- semiconductor chip
- semiconductor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
- H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/161—Cap
- H01L2924/1615—Shape
- H01L2924/16152—Cap comprising a cavity for hosting the device, e.g. U-shaped cap
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Abstract
The invention discloses a kind of capsulation body of semiconductor ship of high reliability and low cost, it is related to technical field of semiconductor encapsulation.Including base, pipe cap and sealing cap glue, the base and pipe cap are made using circuit board raw material, and the pipe cap is hollow closing box, and box one side is provided with groove, and the groove side of pipe cap is connected by sealing cap glue with base；The upper and lower surface of the base is covered with positive ground metal layer and back-side ground metal level, both ends are equipped with front lead and back side lead, the disk mesopore led to during several are additionally provided with the base up and down, the disk mesopore include the metal connecting piece for connecting positive ground metal layer with back-side ground metal level；By conductive adhesive in positive ground metal layer, the bonding pressure point of semiconductor chip is electrically connected semiconductor chip by bonding line and front lead；The semiconductor chip upper surface is covered with Protection glue.The present invention can be by harsh HAST, and cost is cheap, and reliability is high.
Description
Technical field
The present invention relates to technical field of semiconductor encapsulation.
Background technology
Packaging body plays a part of protecting semiconductor chip, semiconductor chip can be isolated from the outside, prevent in air
Corrosion of the impurity to chip circuit cause the decline of electric property.With the development of electronics industry, the application field of chip is got over
Come more extensive, also can more and more higher, packaging pass through HAST to the requirement to environmental suitability（Highly Accelerated
The hot and humid limit accelerated life tests of Temperature/Humidity Stress Test）, it is that current measurement product is reliable
The important indicator of property.Existing capsulation body of semiconductor ship mainly has plastic sealed and ceramic-type, although plastic sealed cost is cheap,
It is when carrying out HAST experiments, due to being encapsulated using capsulation material, causes the product of batch production always to have because water absorption rate is different
Portioned product can not be tested by HAST, have impact on the yield rate of product, reduce the reliability of product.And plastic sealed semiconductor
Although chip packing-body reliability is higher, cost is also higher.
The content of the invention
The technical problems to be solved by the invention are to provide a kind of capsulation body of semiconductor ship of high reliability and low cost, energy
Enough by harsh HAST, cost is cheap, and reliability is high.
In order to solve the above technical problems, the technical solution used in the present invention is：
A kind of capsulation body of semiconductor ship of high reliability and low cost, including base, pipe cap and sealing cap glue, the base and
Pipe cap is made using circuit board raw material, and the pipe cap is hollow closing box, and box one side is provided with groove, and the groove side of pipe cap leads to
Sealing cap glue is crossed to be connected with base；The upper and lower surface of the base is covered with positive ground metal layer and back-side ground metal
Layer, both ends are equipped with front lead and back side lead, the disk mesopore led to during several are additionally provided with the base up and down, the disk
Mesopore includes the metal connecting piece for connecting positive ground metal layer with back-side ground metal level；Semiconductor chip passes through conducting resinl
It is bonded in positive ground metal layer, the bonding pressure point of semiconductor chip is electrically connected by bonding line and front lead；It is described
Semiconductor chip upper surface is covered with Protection glue.
Further technical scheme, the disk mesopore are circular port, and the electricity on circular port both sides is connected using metallization process
Road, added with filler in disk mesopore.
Further technical scheme, the non-recessed face of the pipe cap is covered with metal level.
Further technical scheme, the quantity at least two of the semiconductor chip, lead between the semiconductor chip
Cross bonding line electrical connection.
Further technical scheme, described Protection glue is does not react and the silicon rubber of good waterproof performance with chip.
It is using beneficial effect caused by above-mentioned technical proposal：The present invention is using general circuit board material as former
Material, is fabricated to pipe cap and base, and graphic making is cheap using ripe circuit board machining process, cost；Bottom uses metal
Change through hole to be grounded, and filled up hole using disk mesopore technique, reach the purpose of sealing, ensure passing through for HAST；Using
Sealing cap gemel connection base and pipe cap, avoid moisture from entering package interior, ensure passing through for HAST；Meanwhile semiconductor chip
Upper surface coats one layer of Protection glue, avoids moisture attack semiconductor chip, is further ensured that passing through for HAST；Two kinds of waterproofs are arranged
Apply, further increase the reliability of semiconductor chip.
Brief description of the drawings
Fig. 1 is the structural representation of the embodiment of the present invention 1；
Fig. 2 is the outline drawing of the embodiment of the present invention 1；
Fig. 3 is the structural representation of the embodiment of the present invention 2；
In the accompanying drawings：1st, base, 2, pipe cap, 3, sealing cap glue, 4, front lead, 5, disk mesopore, 6, back side lead, 7, front
Ground metal layer, 8, back-side ground metal level, 9, semiconductor chip, 10, conducting resinl, 11, bonding pressure point, 12, bonding line, 13,
Protection glue, 14, groove, 15, metal level, 16, filler.
Embodiment
The present invention is further detailed explanation with reference to the accompanying drawings and detailed description.
Embodiment 1
As shown in figure 1, a kind of capsulation body of semiconductor ship of high reliability and low cost, including base 1, pipe cap 2 and sealing cap
Glue 3, sealing cap glue 3 are nonconducting jointing materials that sealing can be achieved, and base 1 and pipe cap 2 are made using circuit board raw material.
As shown in Fig. 2 pipe cap 2 is hollow closing box, box one side is provided with groove 14, and the groove side of pipe cap 2 passes through sealing cap glue 3 and base 1
Connection.Base 1 uses the circuit boards of double-level-metal to be made up of raw material, and the dielectric material of its circuit boards can be any
's.I.e. the upper and lower surface of base 1 is covered with positive ground metal layer 7 and back-side ground metal level 8, and both ends are equipped with just
Face lead 4 and back side lead 6, be additionally provided with base 1 it is some up and down in the disk mesopore 5 that leads to, disk mesopore 5 includes front ground connection gold
Belong to the metal connecting piece that layer 7 and back-side ground metal level 8 connect, disk mesopore 5 is circular port, is connected using metallization process circular
The circuit on hole both sides, added with filler 16 in disk mesopore 5, filler 16 can be any material suitable for disk mesopore technique.Partly lead
The ground plane of body chip 9 is bonded in positive ground metal layer 7 by conducting resinl 10, and the bonding pressure point 11 of semiconductor chip 9 is logical
Bonding line 12 is crossed to be electrically connected with front lead 4；Covered with Protection glue 13, Protection glue 13 is and core the upper surface of semiconductor chip 9
Piece does not react and the silicon rubber of good waterproof performance.The non-recessed face of pipe cap 2 is covered with metal level 15.
Embodiment 2
As shown in figure 3, a kind of capsulation body of semiconductor ship of high reliability and low cost, as different from Example 1, base
The quantity of semiconductor chip 9 on 1 is two, is electrically connected between semiconductor chip 9 by bonding line 12.
Claims (4)
1. a kind of capsulation body of semiconductor ship of high reliability and low cost, it is characterised in that including base（1）, pipe cap（2）And envelope
Cap glue（3）, the base（1）And pipe cap（2）Made using circuit board raw material, the base（1）With the pipe cap（2）Adopt
Made of circuit board machining process；The pipe cap（2）For hollow closing box, box one side is provided with groove（14）, pipe cap（2）Groove
While pass through sealing cap glue（3）With base（1）Connection；The base（1）Upper and lower surface be covered with positive ground metal layer
（7）With back-side ground metal level（8）, both ends are equipped with front lead（4）With back side lead（6）, the base（1）On be additionally provided with
The disk mesopore led in above and below several（5）, the disk mesopore（5）Including by positive ground metal layer（7）With back-side ground metal
Layer（8）The metal connecting piece of connection；The disk mesopore（5）In added with filler（16）；Semiconductor chip（9）Pass through conducting resinl（10）
It is bonded in positive ground metal layer（7）On, semiconductor chip（9）Bonding pressure point（11）Pass through bonding line（12）With front lead
（4）Electrical connection；The semiconductor chip（9）Upper surface is covered with Protection glue（13）, Protection glue（13）Not reacted with chip
And the silicon rubber of good waterproof performance.
2. the capsulation body of semiconductor ship of a kind of high reliability and low cost according to claim 1, it is characterised in that described
Disk mesopore（5）For circular port, the circuit on circular port both sides is connected using metallization process.
3. the capsulation body of semiconductor ship of a kind of high reliability and low cost according to claim 1, it is characterised in that described
Pipe cap（2）Non-recessed face covered with metal level（15）.
A kind of 4. capsulation body of semiconductor ship of high reliability and low cost according to claim 1 or 2, it is characterised in that institute
State semiconductor chip（9）Quantity at least two, the semiconductor chip（9）Between pass through bonding line（12）Electrical connection.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510015604.8A CN104538371B (en) | 2015-01-13 | 2015-01-13 | A kind of capsulation body of semiconductor ship of high reliability and low cost |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510015604.8A CN104538371B (en) | 2015-01-13 | 2015-01-13 | A kind of capsulation body of semiconductor ship of high reliability and low cost |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN104538371A CN104538371A (en) | 2015-04-22 |
| CN104538371B true CN104538371B (en) | 2018-01-09 |
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ID=52853874
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510015604.8A Active CN104538371B (en) | 2015-01-13 | 2015-01-13 | A kind of capsulation body of semiconductor ship of high reliability and low cost |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN104538371B (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115986433B (en) * | 2023-03-21 | 2023-08-04 | 成都雷电微力科技股份有限公司 | TR module architecture and process method thereof |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1445831A (en) * | 2002-03-18 | 2003-10-01 | 美新半导体（无锡）有限公司 | Cavity type packaging method of microelectronic circuit |
| CN101908493A (en) * | 2010-07-07 | 2010-12-08 | 天水天光半导体有限责任公司 | Process for producing hybrid integrated circuit |
| CN102194782A (en) * | 2010-03-08 | 2011-09-21 | 瑞萨电子株式会社 | Semiconductor package, substrate, electronic component, and method of mounting semiconductor package |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN202034361U (en) * | 2010-09-15 | 2011-11-09 | 晶诚（郑州）科技有限公司 | Semiconductor packaging structure |
| CN103681593A (en) * | 2013-12-02 | 2014-03-26 | 江苏省宜兴电子器件总厂 | Leadless ceramic chip carrier packaging structure and process for manufacturing same |
| CN103681619B (en) * | 2013-12-18 | 2016-09-07 | 中国电子科技集团公司第五十八研究所 | A kind of silica-based hermetic sealing structure and manufacture method thereof |
| CN104201113B (en) * | 2014-09-04 | 2017-06-16 | 中国电子科技集团公司第五十八研究所 | The hermetic sealing structure and its manufacture method of system in package |
| CN204348705U (en) * | 2015-01-13 | 2015-05-20 | 河北博威集成电路有限公司 | A kind of capsulation body of semiconductor ship of high reliability and low cost |
-
2015
- 2015-01-13 CN CN201510015604.8A patent/CN104538371B/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1445831A (en) * | 2002-03-18 | 2003-10-01 | 美新半导体（无锡）有限公司 | Cavity type packaging method of microelectronic circuit |
| CN102194782A (en) * | 2010-03-08 | 2011-09-21 | 瑞萨电子株式会社 | Semiconductor package, substrate, electronic component, and method of mounting semiconductor package |
| CN101908493A (en) * | 2010-07-07 | 2010-12-08 | 天水天光半导体有限责任公司 | Process for producing hybrid integrated circuit |
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| Publication number | Publication date |
|---|---|
| CN104538371A (en) | 2015-04-22 |
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