CN208589439U - A kind of plastic packaging plane formula optical coupler package structure three times - Google Patents

Abstract

The utility model provides a kind of plastic packaging plane formula optical coupler package structure three times, including first support and second support, lower section is provided with infrared LEDs at the top of the first support, layer of silica gel is wrapped with outside the infrared LEDs, the layer of silica gel is located at below first support, lower section, which is provided with, at the top of the second support receives optical chip Sensor, the layer of silica gel and receipts optical chip Sensor are also enclosed with one layer of interior plastic packaging glue modeling layer with translucency outside and carry out a plastic packaging, a lens are provided with below the interior plastic packaging glue modeling layer with translucency, the interior plastic packaging glue modeling layer and lens are wrapped with a plastic packaging glue modeling layer with infrared light and carry out secondary plastic；A black plastic packaging bed of material is also wrapped with outside the plastic packaging glue modeling layer with infrared light emission shape and carries out plastic packaging three times, and the black plastic packaging bed of material also wraps up first support and second support.The utility model improves the stabilization of the optocoupler high pressure resistant property of photo-coupler.

Description

A kind of plastic packaging plane formula optical coupler package structure three times

Technical field

The utility model relates to LED encapsulation technology field, especially a kind of plastic packaging plane formula optical coupler package knot three times Structure, which applies on power management, such as charger, transformer.

Background technique

Existing photo-coupler technology is mostly to have pinned encapsulation design, and mainstream is divided into vertical up and down and secondary modeling at present Seal plane formula.

Shown in Figure 1, vertical encapsulation up and down is designed as combining using (1) a pair of of infrared LEDs with receipts optical chip point It is not placed in upper and lower bracket both ends, (2) only envelope infrared LEDs chip and portion support with small size silica gel, and (3) are first to have Plastic packaging glue is packaged cladding and shines and receive light both ends in translucency, and (4) are not again to have the outer plastic packaging glue of reflecting effect (generally The black epoxy of carbon black is packaged.) it is existing up and down vertical encapsulation technology lead frame be easy in the fabrication process Deformation causes built-in electrical insulation apart from unstable and then cause optocoupler high pressure resistant property abnormal.

The encapsulation of secondary plastic plane formula is designed as combining that be placed in one flat with receipts optical chip using (1) a pair of of infrared LEDs On the formula bracket of face, (2) only envelope infrared LEDs chip and portion support with small size silica gel, and (3) are first moulded with having in translucency Sealing is packaged cladding and shines and receive light both ends, and (4) are finally to have plastic packaging glue outside infrared light (generally containing TiO₂It is white Color epoxy resin) it is packaged.Secondary plastic plane formula leads to optocoupler because outer layer plastic packaging glue is relatively also easy to produce light transmission problem for white Component can probability generation current leakage.

Summary of the invention

In order to overcome the problems referred above, the purpose of the utility model is to provide a kind of plastic packaging plane formula optical coupler package knots three times Structure, improves the stabilization of photo-coupler optocoupler high pressure resistant property, and reduces that there is a situation where leakage currents.

The utility model is realized using following scheme: a kind of plastic packaging plane formula optical coupler package structure three times, including the One bracket and second support, first support top lower section are provided with infrared LEDs, silicon are wrapped with outside the infrared LEDs Glue-line, the layer of silica gel are located at below first support, and lower section is provided with receipts optical chip, the layer of silica gel at the top of the second support With receiving it is also enclosed with one layer of interior plastic packaging glue modeling layer with translucency outside optical chip carries out a plastic packaging, it is described with translucency A lens are provided with below interior plastic packaging glue modeling layer, the interior plastic packaging glue modeling layer and lens are wrapped with one and have infrared light Plastic packaging glue modeling layer carry out secondary plastic；And interior plastic packaging glue is moulded layer to plastic packaging glue modeling layer and lens are fully wrapped around；The tool A black plastic packaging bed of material, which is also wrapped with, outside the plastic packaging glue modeling layer for having infrared light emission shape carries out plastic packaging, and the black plastic packaging bed of material three times First support and second support are also wrapped up.

Further, the lens are shaped form lens.

The utility model has the beneficial effects that: bracket becomes when 1. plane formula support Designs can avoid manufacture photo-coupler Shape causes built-in electrical insulation apart from unstable and then cause optocoupler high pressure resistant property abnormal.

2. outermost glue black plastic material can avoid existing plastic packaging plane formula because outer layer plastic packaging glue is that white is relatively also easy to produce Optical issue causes optocoupler assembly can probability generation current leakage.

Detailed description of the invention

Fig. 1 is the schematic diagram of existing optical coupler package structure.

Fig. 2 is the schematic diagram of the section structure of the utility model.

Specific embodiment

The utility model is described further with reference to the accompanying drawing.

It please referring to shown in Fig. 2, the utility model provides a kind of plastic packaging plane formula optical coupler package structure three times, including First support 1 and second support 2, the 1 top lower section of first support are provided with infrared LEDs 3,3 outsourcing of infrared LEDs With layer of silica gel 4, the layer of silica gel 4 is located at 1 lower section of first support, and the 2 top lower section of second support is provided with receipts optical chip 5, such infrared LEDs 3 and receipts optical chip 5 are located at same level, and it is interior that plane formula support Design is avoided that deformation of timbering causes Portion's insulation distance is unstable and then causes optocoupler high pressure resistant property abnormal；One is also enclosed with outside the layer of silica gel 4 and receipts optical chip 5 There is layer the interior plastic packaging glue modeling layer 6 of translucency to carry out a plastic packaging, plastic packaging glue in the light-transmissive that such infrared LEDs 3 issue Layer 6 is moulded to dissipate outward；A lens 7 are provided with below the interior plastic packaging glue modeling layer 6 with translucency, which can increase light The light gathering of coupler.The interior plastic packaging glue modeling layer 6 and lens 7 are wrapped with the plastic packaging glue with infrared light and mould Layer 9 carries out secondary plastic；And interior plastic packaging glue is moulded layer to plastic packaging glue modeling layer 9 and lens are fully wrapped around；It is described that there is infrared light A black plastic packaging bed of material 10 is also wrapped with outside the plastic packaging glue modeling layer 9 of transmitting shape and carries out plastic packaging three times, and the black plastic packaging bed of material 10 will First support 1 and second support 2 also wrap up.Wherein, the plastic packaging glue modeling layer 9 with infrared light makes infrared light in interior Light gathering reflector is carried out between plastic packaging glue modeling layer 6 and the black plastic packaging bed of material 10 of outside to reach the need of product CTR current transfer ratio (CTR) It asks.Wherein, the black plastic packaging bed of material 10 can avoid existing plastic packaging plane formula because outer layer plastic packaging glue for white is relatively also easy to produce light transmission and asks Topic causes optocoupler assembly can probability generation current leakage.

In the present invention, the lens 7 are shaped form lens；The prefocus of photo-coupler can preferably be increased in this way Power.

In short, bracket becomes when the utility model can avoid manufacture photo-coupler using plastic packaging plane formula support Design three times Shape causes built-in electrical insulation apart from unstable and then cause optocoupler high pressure resistant property abnormal.Outermost glue black plastic material can avoid existing Plastic packaging plane formula because outer layer plastic packaging glue be white be relatively also easy to produce light transmission problem cause optocoupler assembly can probability occur leakage current ask Topic.

The above is only the preferred embodiment of the present invention, it is all done according to present utility model application the scope of the patents it is equal Deng variation and modification, it should all belong to the covering scope of the utility model.

Claims (2)

1. a kind of plastic packaging plane formula optical coupler package structure three times, it is characterised in that: including first support and second support, institute It states lower section at the top of first support and is provided with infrared LEDs, be wrapped with layer of silica gel outside the infrared LEDs, the layer of silica gel is located at Below first support, lower section is provided with receipts optical chip at the top of the second support, also wraps up outside the layer of silica gel and receipts optical chip There is one layer of interior plastic packaging glue modeling layer with translucency to carry out a plastic packaging, is set below the interior plastic packaging glue modeling layer with translucency A lens are equipped with, the interior plastic packaging glue modeling layer and lens are wrapped with a plastic packaging glue modeling layer with infrared light and carry out two Secondary plastic packaging；And interior plastic packaging glue is moulded layer to plastic packaging glue modeling layer and lens are fully wrapped around；The modeling with infrared light emission shape It is also wrapped with a black plastic packaging bed of material outside sealing modeling layer and carries out plastic packaging three times, and the black plastic packaging bed of material is by first support and second Frame also wraps up.

2. a kind of plastic packaging plane formula optical coupler package structure three times according to claim 1, it is characterised in that: described Mirror is shaped form lens.