CN206806317U - A kind of photo-coupler - Google Patents
A kind of photo-coupler Download PDFInfo
- Publication number
- CN206806317U CN206806317U CN201720683118.8U CN201720683118U CN206806317U CN 206806317 U CN206806317 U CN 206806317U CN 201720683118 U CN201720683118 U CN 201720683118U CN 206806317 U CN206806317 U CN 206806317U
- Authority
- CN
- China
- Prior art keywords
- lead frame
- fin
- photo
- chip
- coupler
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 238000007639 printing Methods 0.000 claims description 13
- 239000000084 colloidal system Substances 0.000 claims description 11
- 238000009413 insulation Methods 0.000 claims description 11
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 5
- 239000003292 glue Substances 0.000 claims description 5
- 239000000463 material Substances 0.000 claims description 5
- 239000000741 silica gel Substances 0.000 claims description 5
- 229910002027 silica gel Inorganic materials 0.000 claims description 5
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims 1
- 229910052760 oxygen Inorganic materials 0.000 claims 1
- 239000001301 oxygen Substances 0.000 claims 1
- 239000003822 epoxy resin Substances 0.000 description 5
- 229920000647 polyepoxide Polymers 0.000 description 5
- 230000000694 effects Effects 0.000 description 3
- 230000003321 amplification Effects 0.000 description 2
- 238000005452 bending Methods 0.000 description 2
- 238000005253 cladding Methods 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 230000017525 heat dissipation Effects 0.000 description 2
- 238000002347 injection Methods 0.000 description 2
- 239000007924 injection Substances 0.000 description 2
- 238000003199 nucleic acid amplification method Methods 0.000 description 2
- 230000003287 optical effect Effects 0.000 description 2
- 238000004806 packaging method and process Methods 0.000 description 2
- 239000000047 product Substances 0.000 description 2
- 239000006173 Good's buffer Substances 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 239000006227 byproduct Substances 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000001746 injection moulding Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000007493 shaping process Methods 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/4911—Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain
- H01L2224/49111—Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain the connectors connecting two common bonding areas, e.g. Litz or braid wires
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
Landscapes
- Photo Coupler, Interrupter, Optical-To-Optical Conversion Devices (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Abstract
The utility model provides a kind of photo-coupler, including：Lead frame and the chip being arranged on the lead frame, also include an at least fin, the fin is arranged on the lead frame of chip periphery, the fin project to lead frame view field in the plane without departing from lead frame, effectively heat caused by chip can be shed in the case where not increasing overall dimensions, overall thermal balanced capacity and heat-sinking capability more preferably, have more preferable reliability in power application.
Description
Technical field
Field of electronic devices is the utility model is related to, further to photo-coupler field, is specially related to a kind of radiating
The good photo-coupler of ability.
Background technology
Photo-coupler (optical coupler, english abbreviation OC), also known as photoisolator, abbreviation optocoupler.Optical coupling
For device using light as media transmission electric signal, it has good buffer action to inputting, exporting electric signal, so, it is in various circuits
In be widely used.It has turned into one of most wide photoelectric device of most species, purposes at present.Photo-coupler is typically by light
Transmitting, light reception and signal amplification three parts composition.The electric signal driving light emitting diode (LED) of input, is allowed to send
The light of certain wavelength, is received by photo-detector and produces photoelectric current, then is exported after further amplification.
Current photo-coupler slide glass lead frame scheme is planar structure, including input output end is in approximately the same plane
Reflective planar structures and input output end in two relatively plane-parallel direct-injection type structures.The structure of this planar structure
To make, the contact area of metal slide glass lead frame and epoxy resin is limited by product size and space, and thermal contact resistance is larger,
The larger application scenario of dissipated power, product operating temperature can be higher, influence properties of product.
Utility model content
Therefore, the utility model provides a kind of heat-sinking capability good photo-coupler.
To reach above-mentioned purpose, a kind of photo-coupler provided by the utility model, including：Housing, it is arranged in housing
Lead frame and the chip being arranged on the lead frame, it is characterised in that：Also include an at least fin, the fin is set
Put on the lead frame of chip periphery, the fin project to lead frame view field in the plane without departing from drawing
Wire frame.
A kind of preferred scheme of the present utility model, also at least provided with a resigning window on the fin.
Another preferred scheme of the present utility model, the resigning window correspond to chip setting.
Another preferred scheme of the present utility model, the fin is by lead frame one bending forming.
Another preferred scheme of the present utility model, the fin are fixed on the lead frames by a heat-conducting glue layer.
Another preferred scheme of the present utility model, the heat-conducting glue layer are layer of silica gel.
Another preferred scheme of the present utility model, in addition to printing opacity insulation colloid, the printing opacity insulation colloid cladding
In the surface of lead frame, chip and fin.
Another preferred scheme of the present utility model, the material of the printing opacity insulation colloid is the epoxy resin or silicon of printing opacity
Glue.
Technical scheme provided by the utility model, has the advantages that：
Fin is set on the lead frame of chip periphery, and project to lead frame view field in the plane
Without departing from lead frame, effectively heat caused by chip can be shed in the case where not increasing overall dimensions, overall thermal balance
Ability and heat-sinking capability more preferably, have more preferable reliability in power application.
Brief description of the drawings
Fig. 1 show the structural representation one of photo-coupler in embodiment；
Fig. 2 show the structural representation two of photo-coupler in embodiment.
Embodiment
To further illustrate each embodiment, the utility model is provided with accompanying drawing.These accompanying drawings are in the utility model discloses
A part for appearance, it can coordinate the associated description of specification to explain the running of embodiment original mainly to illustrate embodiment
Reason.Cooperation refers to these contents, and those of ordinary skill in the art will be understood that other possible embodiments and this practicality are new
The advantages of type.Component in figure is not necessarily to scale, and similar element numbers are conventionally used to indicate similar component.
The utility model is further illustrated in conjunction with the drawings and specific embodiments.
Shown in reference picture 1, Fig. 2, the utility model provides a kind of photo-coupler, including：Housing (not shown), it is arranged on shell
Internal lead frame 10, the chip 20 being arranged on the lead frame 10, fin 30 and printing opacity insulation colloid (not shown),
The housing, lead frame 10, the structure of chip 20 and connected mode are routine techniques in the prior art, are in the art
What technical staff grasped already, it will not be described in detail herein.
The fin 30 is provided with two, and two fin 30 are vertically set on the lead frame 10 of the periphery of chip 20,
And it is provided with resigning window 31.In other embodiments, the angle of fin 30 and lead frame 10 is not limited to be vertically arranged,
Can be inclined to set, if fin 30 project to lead frame 10 view field in the plane without departing from lead frame
10, to ensure not increasing original size.Meanwhile the quantity of fin 30 is also not limited to two, one can also be set
It is or multiple.
In the present embodiment, fin 30 is structure as a whole with lead frame 10, for 10 integral bending forming of lead frame
Into shaping structures are simpler.In other embodiments, fin 30 can also be independent structure, and fin 30 passes through a heat conduction
Glue-line (such as layer of silica gel) is pasted can also reach effect on lead frame 10, and simply the structure is equipped with relatively complicated.
In the present embodiment, fin 30 is provided with resigning window 31, in injection molding packaging, printing opacity insulation colloid can be allowed to encapsulate
When by or injection wherein, the intensity of whole printing opacity insulation colloid can be strengthened, avoid inside from occurring being layered or ftracture.Further
, the position of the corresponding chip 20 of the resigning window 31 is set, and can also effectively reduce fin 30 and light in the photo-coupler is passed
Defeated blocks influence, and quantity, the size and shape of resigning window 31 can set according to concrete condition, will not be described in detail herein.
The material of the printing opacity insulation colloid is the epoxy resin or silica gel of light-permeable, and the printing opacity insulation colloid is coated on
The surface of lead frame 10, chip 20 and fin 30.The cladding mode is prior art, such as dispensing, embedding, no longer in detail
State.
In the present embodiment, the material of housing is preferably lighttight epoxy resin, is such as adulterated in original epoxy resin
Light tight and good heat dissipation effect material, make the housing that there is the function of insulation, radiating and protection.This is prior art, herein
No longer it is described in detail.
In the present embodiment, it should be noted that：Depending on the height of fin can be with concrete condition, in the present embodiment, radiating
The height of piece 30 is arranged below the height dimension of original packaging body, that is to say, that in original size (width and height) portion's production
Fin is set in the case of changing, the characteristics of to reach compact-sized, good heat dissipation effect.
By technical scheme provided by the utility model, fin is set on the lead frame of chip periphery, and projects
To lead frame view field in the plane without departing from lead frame, in the case where not increasing overall dimensions can effectively by
Heat sheds caused by chip, and overall thermal balanced capacity and heat-sinking capability more preferably, have more preferable reliability in power application.
Although specifically showing and describing the utility model with reference to preferred embodiment, those skilled in the art should
This is understood, is not departing from the spirit and scope of the present utility model that appended claims are limited, in form and details
On the utility model can be made a variety of changes, be the scope of protection of the utility model.
Claims (8)
1. a kind of photo-coupler, including：Housing, the lead frame being arranged in housing and the core being arranged on the lead frame
Piece, it is characterised in that：Also include an at least fin, the fin is arranged on the lead frame of chip periphery, described to dissipate
Backing project to lead frame view field in the plane without departing from lead frame.
2. photo-coupler according to claim 1, it is characterised in that：Also at least provided with a resigning window on the fin
Mouthful.
3. photo-coupler according to claim 2, it is characterised in that：The resigning window corresponds to chip setting.
4. photo-coupler according to claim 1, it is characterised in that：The fin is integrally bent into by lead frame
Type.
5. photo-coupler according to claim 1, it is characterised in that：The fin is fixed on by a heat-conducting glue layer to be drawn
On wire frame.
6. photo-coupler according to claim 5, it is characterised in that：The heat-conducting glue layer is layer of silica gel.
7. photo-coupler according to claim 1, it is characterised in that：Also include printing opacity insulation colloid, the printing opacity is exhausted
Edge colloid is coated on the surface of lead frame, chip and fin.
8. photo-coupler according to claim 7, it is characterised in that：The material of the printing opacity insulation colloid is the ring of printing opacity
Oxygen tree fat or silica gel.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720683118.8U CN206806317U (en) | 2017-06-13 | 2017-06-13 | A kind of photo-coupler |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720683118.8U CN206806317U (en) | 2017-06-13 | 2017-06-13 | A kind of photo-coupler |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN206806317U true CN206806317U (en) | 2017-12-26 |
Family
ID=60746063
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201720683118.8U Active CN206806317U (en) | 2017-06-13 | 2017-06-13 | A kind of photo-coupler |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN206806317U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112563257A (en) * | 2020-12-08 | 2021-03-26 | 宁波群芯微电子有限责任公司 | Method for adjusting CTR of automobile optocoupler and optocoupler |
-
2017
- 2017-06-13 CN CN201720683118.8U patent/CN206806317U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112563257A (en) * | 2020-12-08 | 2021-03-26 | 宁波群芯微电子有限责任公司 | Method for adjusting CTR of automobile optocoupler and optocoupler |
| CN112563257B (en) * | 2020-12-08 | 2021-08-10 | 深圳群芯微电子有限责任公司 | Method for adjusting CTR of automobile optocoupler and optocoupler |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20231121 Address after: Room 208-93, Hengye Building, No. 100 Xiangxing Road, Xiang'an Industrial Zone, Xiamen Torch High tech Zone, Xiamen, Fujian Province, 361000 Patentee after: Xiamen Hualian Semiconductor Technology Co.,Ltd. Address before: 361000 Torch Building, Xiamen hi tech Zone, Fujian Province Patentee before: XIAMEN HUALIAN ELECTRONICS Corp.,Ltd. |