CN204290034U - Based on VCSEL array encapsulating structure and the high power VCSEL laser thereof of optics dosing technology - Google Patents
Based on VCSEL array encapsulating structure and the high power VCSEL laser thereof of optics dosing technology Download PDFInfo
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- CN204290034U CN204290034U CN201420681459.8U CN201420681459U CN204290034U CN 204290034 U CN204290034 U CN 204290034U CN 201420681459 U CN201420681459 U CN 201420681459U CN 204290034 U CN204290034 U CN 204290034U
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- 238000005516 engineering process Methods 0.000 title claims abstract description 12
- 230000003287 optical effect Effects 0.000 claims abstract description 60
- 238000005266 casting Methods 0.000 claims abstract description 47
- 239000003292 glue Substances 0.000 claims abstract description 47
- 239000013049 sediment Substances 0.000 claims abstract description 21
- 239000000463 material Substances 0.000 claims description 6
- 229920001875 Ebonite Polymers 0.000 claims description 3
- 229920001971 elastomer Polymers 0.000 claims description 3
- 239000005060 rubber Substances 0.000 claims description 3
- 238000001816 cooling Methods 0.000 abstract description 7
- 230000000694 effects Effects 0.000 abstract description 6
- 238000000034 method Methods 0.000 abstract description 5
- 238000007789 sealing Methods 0.000 abstract description 5
- 230000008569 process Effects 0.000 abstract description 4
- 238000010438 heat treatment Methods 0.000 abstract description 3
- 239000000758 substrate Substances 0.000 description 12
- 230000005855 radiation Effects 0.000 description 5
- 239000004065 semiconductor Substances 0.000 description 5
- 238000007493 shaping process Methods 0.000 description 4
- 230000035699 permeability Effects 0.000 description 3
- 238000007711 solidification Methods 0.000 description 3
- 230000008023 solidification Effects 0.000 description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 3
- 239000000084 colloidal system Substances 0.000 description 2
- 230000008878 coupling Effects 0.000 description 2
- 238000010168 coupling process Methods 0.000 description 2
- 238000005859 coupling reaction Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 239000000428 dust Substances 0.000 description 2
- 238000005538 encapsulation Methods 0.000 description 2
- 230000007613 environmental effect Effects 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000009833 condensation Methods 0.000 description 1
- 230000005494 condensation Effects 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 238000002955 isolation Methods 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 230000001105 regulatory effect Effects 0.000 description 1
- 239000000565 sealant Substances 0.000 description 1
- 230000007480 spreading Effects 0.000 description 1
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Abstract
The utility model provides a kind of VCSEL array encapsulating structure based on optics dosing technology and high power VCSEL laser thereof.In this VCSEL array encapsulating structure, VCSEL array is encapsulated on laser thermal sediment, and has one deck optics casting glue in the surface coverage of VCSEL array, and optics casting glue covers VCSEL array completely.The utility model, by introducing dosing technology in the seal process of VCSEL laser, efficiently solves the sealing problem of VCSEL laser.Further, adjusted by the shape to optics casting glue, kind, in conjunction with different optical windows, greatly can reduce the incident loss in interface between VCSEL chip and optical window, improve the transmitance of laser further.Meanwhile, the optics casting glue of high-termal conductivity has certain heat transfer and cooling effect to optical window simultaneously, avoids the heating of optical window in high power situation.
Description
Technical field
The utility model relates to a kind of VCSEL array encapsulating structure based on optics dosing technology, and the utility model relates to a kind of high power VCSEL laser using this encapsulating structure simultaneously.
Background technology
In field of semiconductor lasers, according to light emission direction and the flat relation of plane of laser chip place epitaxial wafer, laser can be divided into vertical cavity surface emitting laser (Vertical Cavity Surface Emitting Laser is called for short VCSEL) and edge-emission semiconductor laser (Edge Emitting Laser Diode) two classes.
Wherein, vertical cavity surface emitting laser is the semiconductor laser of a kind of light direction perpendicular to epitaxial wafer, the schematic diagram that the structure of vertical cavity surface emitting laser can be shown in Figure 1.High power VCSEL laser, is the two-dimensional array formed along the VCSEL luminous point of epitaxial wafer surface distributed by hundreds and thousands of, thus has very high Optical output power.This high power VCSEL laser has the characteristic of many excellences, comprises high reliability, hot operation stability, optical-quality homogeneous distributes, the drift of wavelength temperature is little, thus becoming the important directions of following high-power semiconductor laser development gradually.
In prior art, the encapsulating structure of VCSEL array as shown in Figure 2 a and 2 b, usually single VCSEL direct chip attachment is had on the heat radiation substrate of high thermal conductivity in one, then the lower surface of heat radiation substrate is welded on heat sink on, heat radiation substrate has good thermal conductivity, and distributed in time by the heat sink heat by VCSEL, realize the cooling of VCSEL.
In the practical application of VCSEL, be subject to the impacts such as condensation, humidity, dust in order to avoid VCSEL chip surface, generally need VCSEL laser to do certain encapsulation process, and undertaken exporting and applying by optical window.Conventional method, general use O type circle or fluid sealant, by the sealing gap between optical window, coated housing, VCSEL chip of laser and laser thermal sediment, and then keep apart the space before VCSEL chip and extraneous air.This encapsulating method, the often very complicated loaded down with trivial details and surface structure that impact is overall.For this reason, the encapsulating structure of a kind of structure is simple, isolation effect is good VCSEL array is provided to provide.
Summary of the invention
Technical problem to be solved in the utility model is to provide a kind of VCSEL array encapsulating structure based on optics dosing technology.
Another technical problem to be solved in the utility model is to provide a kind of high power VCSEL laser using above-mentioned encapsulating structure.
To achieve these goals, the utility model adopts following technical proposals:
A kind of VCSEL array encapsulating structure based on optics dosing technology, comprise VCSEL array and laser thermal sediment, VCSEL array is encapsulated on laser thermal sediment, has one deck optics casting glue in the surface coverage of described VCSEL array, further, described optics casting glue covers described VCSEL array completely.
Wherein more preferably, described optics casting glue uses soft rubber or hard rubber.
Wherein more preferably, the fluorescent material for wavelength convert is added with in described optics casting glue.
Wherein more preferably, described optics casting glue solidify to form optical window.
Wherein more preferably, described optics casting glue solidify to form the halfpace of taper.
Wherein more preferably, described optics casting glue is filled in described VCSEL array and is arranged in the gap between the optical window in described VCSEL array front.
A kind of high power VCSEL laser, comprises above-mentioned VCSEL array encapsulating structure.
Wherein more preferably, the exiting surface front of described VCSEL array is provided with optical window, described optical window is fixed on described laser thermal sediment by coated housing, and, in the gap that described laser thermal sediment, described coated housing and described optical window are formed, be filled with optics casting glue.
Wherein more preferably, described optical window is any one in plane optical window, optical lens, optical prism or guide-lighting cone.
Wherein more preferably, the exit facet of described optical window is coated with anti-reflection film.
The VCSEL array encapsulating structure that the utility model provides, introduces optics casting glue first in the seal process of VCSEL, for covering the surface of VCSEL chip, achieves the effects such as the protection against the tide of VCSEL laser, waterproof and dustproof.Meanwhile, the optics casting glue after solidification can form random geometry by mould, carries out optical shaping to the laser beam of VCSEL outgoing.In addition, in optics casting glue, also can add the fluorescent material for wavelength convert, realize high brightness, different wave length even mixed wavelengths (as white light etc.) optics export.Through the high power VCSEL laser of embedding, under rugged environment, have higher reliability, be thus more suitable for practical application.
Simultaneously, the utility model provides the high power VCSEL laser using above-mentioned encapsulating structure, by using the space between optics casting glue filling VCSEL chip and optical window, achieve the protection against the tide of VCSEL laser, waterproof and dustproof, and pass through the index matching of optics casting glue and optics output window, considerably reduce the incident loss in interface between VCSEL chip and optical window, and further increase the transmitance of laser.And the optics casting glue of high-termal conductivity has certain heat transfer and cooling effect to optical window simultaneously, avoid the heating of optical window in high power situation.
Accompanying drawing explanation
Fig. 1 is the structural representation of vertical cavity surface emitting laser;
Fig. 2 a is the front elevational schematic of the encapsulating structure of single VCSEL chip in prior art;
Fig. 2 b is the schematic perspective view of the encapsulating structure of single VCSEL chip in prior art;
Fig. 3 is the encapsulating structure schematic diagram of optics embedding VCSEL laser;
Fig. 4 is the structural representation of the high power VCSEL laser of optics embedding.
Embodiment
Below in conjunction with the drawings and specific embodiments, the technology contents that the utility model provides is described in detail.
As shown in Figure 3, the VCSEL array encapsulating structure that the utility model provides, comprise VCSEL array 1, substrate 2 and laser thermal sediment 3, VCSEL array 1 is encapsulated on laser thermal sediment 3 by substrate 2.Specifically, the lower surface of substrate 2, on the upper surface of substrate 2, is then welded on laser thermal sediment 3 by VCSEL direct chip attachment.Substrate 2 has good thermal conductivity, the heat of VCSEL array 1 can be conducted in time, realize the cooling of VCSEL array 1 by substrate 2 and laser thermal sediment 3.
In the encapsulating structure that the utility model provides, introducing optics casting glue 4 first, by directly covering on the surface of VCSEL array 1, embedding and solidification one deck optics casting glue 4, meeting the air-tightness requirement of VCSEL laser.Optics casting glue 4 covers VCSEL array 1 completely, and comes at the surface spreading of whole laser thermal sediment 3, thus VCSEL chip of laser is immersed among sealed colloid completely, achieves good air-tightness.This VCSEL array encapsulating structure has excellent waterproof, protection against the tide, dust reduction capability, can adapt to severe operational environment, as the environment of high temperature more than 80 degrees Celsius, relative humidity 100%, can normally work even under water; This encapsulating structure can available protecting VCSEL chip, avoids environmental disruption, has high reliability.The structure of encapsulating structure provided by the utility model is simple, compact, with low cost, and the optics dosing technology used is also extremely simple, easy to implement.
Optics casting glue 4 directly can cover VCSEL array 1 naturally, forms smooth outer surface; Also can passing through outer mold embedding and solidification, forming the optical window of the well-regulated random geometry of tool, for carrying out optical shaping to the laser beam of VCSEL chip outgoing.Such as optics casting glue 4 can be solidified into the halfpace of taper, make it use as optical window simultaneously; When optics casting glue 4 being solidified rear formation and there is the optical window use of regular geometric shapes, save the external optical device of VCSEL laser, be convenient to the optical shaping of VCSEL outgoing beam.In addition, the optical window that optics casting glue 4 also can coordinate other VCSEL to export uses, even if directly fill the space between VCSEL chip and optical window with optics casting glue 4, VCSEL is sealed, the utility model provides an example and is explained, and detailed content vide infra.
In actual use, optics casting glue can need according to concrete application to select different soft rubbers or hard rubber.The different fluorescent material for wavelength convert can also be added in optics casting glue, realize high brightness, the different wave length even optics of mixed wavelengths (as white light etc.) exports, thus enriches the expanded application of VCSEL in commercial lighting field.
The utility model embedding optics casting glue 4 used has high-termal conductivity, high permeability, high temperature tolerance, can adapt to high power optical power output and the hot operation characteristic of VCSEL.In the process of VCSEL array work, the heat of optics casting glue 4 can carry out Conduction cooled by VCSEL surface, substrate 2 and laser thermal sediment 3, is thus unlikely to burn, can meets the requirement of heat radiation aspect.
Below an example of the high power VCSEL laser using above-mentioned encapsulating structure is introduced.As shown in Figure 4, in this high power VCSEL laser, comprise: VCSEL array 1, substrate 2, laser thermal sediment 3, VCSEL array 1 is arranged on laser thermal sediment 3 by substrate 2, the exiting surface front of VCSEL array 1 is provided with optical window 6, optical window 6 is fixed on laser thermal sediment 3 by coated housing 5, thus at laser thermal sediment 3, a gap is formed between optical window 6 and coated housing 5, in order to realize the sealing of VCSEL array 1, be filled with in this gap and there is high-termal conductivity, high permeability, the optics casting glue 4 of high temperature tolerance, VCSEL chip is immersed among sealed colloid completely, achieve good air-tightness, there is waterproof, moistureproof, dust-proof effect.
This optics embedding structure achieves the direct incidence coupling of laser chip to optical window 6, no longer includes the intervention of air.And, when optics casting glue 4 adopts refractive index and the close material of optical window 6, greatly can reduce the incident loss in interface between VCSEL chip and optical window 6, improve the transmitance of laser further.By being coated with anti-reflection film at the exit facet of optical window 6, the interface loss of optical exit can be reduced further.In actual use, optical window 6 can select plane optical window, optical lens, the optical prism also can selecting particular type, light cone etc., to coordinate the optical shaping of light beam.
In addition, because optics casting glue 4 is the materials with high-termal conductivity, high permeability and high temperature tolerance, namely optics casting glue is embedding medium, is also optic delivery medium and heat-conducting medium; Optics casting glue 4 has certain heat transfer and cooling effect to optical window 6 simultaneously, avoids the heating of optical window 6 in high power situation, to adapt to high power optical power output and the hot operation characteristic of VCSEL.In order to strengthen the heat radiation of high power VCSEL laser, in laser thermal sediment 3, being provided with micro-cooling duct 7, cooling for water flowing.
In sum, the utility model introduces optics casting glue first in the encapsulation of high power VCSEL, succinctly efficiently solves the sealing problem of VCSEL laser.Use optics casting glue sealing VCSEL array, the protection against the tide of VCSEL laser, waterproof and dustproof can be realized; Thus make VCSEL laser can adapt to severe operational environment, as the environment of high temperature more than 80 degrees Celsius, relative humidity 100%, work even under water; This encapsulating structure can available protecting VCSEL chip, avoids environmental disruption, has high reliability.
The semiconductor laser of the above-mentioned encapsulating structure of the use that the utility model provides, by using the space between optics casting glue filling VCSEL chip and optical window, the direct incidence coupling of laser chip to optical window can be realized, no longer include the intervention of air, realize the protection against the tide of VCSEL laser, waterproof and dustproof simultaneously, and pass through the index matching of optics casting glue and optics output window, greatly can reduce the incident loss in interface between VCSEL chip and optical window, improve the transmitance of laser further.
The VCSEL array encapsulating structure based on optics dosing technology provided the utility model above and high power VCSEL laser thereof have been described in detail.To those skilled in the art, to any apparent change that it does under the prerequisite not deviating from the utility model connotation, the scope of this patent protection all should be belonged to.
Claims (10)
1. based on a VCSEL array encapsulating structure for optics dosing technology, comprise VCSEL array and laser thermal sediment, VCSEL array is encapsulated on laser thermal sediment, it is characterized in that:
Have one deck optics casting glue in the surface coverage of described VCSEL array, and described optics casting glue covers described VCSEL array completely.
2. VCSEL array encapsulating structure as claimed in claim 1, is characterized in that:
Described optics casting glue uses soft rubber or hard rubber.
3. VCSEL array encapsulating structure as claimed in claim 1, is characterized in that:
The fluorescent material for wavelength convert is added with in described optics casting glue.
4. VCSEL array encapsulating structure as claimed in claim 1, is characterized in that:
Described optics casting glue solidify to form optical window.
5. VCSEL array encapsulating structure as claimed in claim 4, is characterized in that:
Described optics casting glue solidify to form the halfpace of taper.
6. VCSEL array encapsulating structure as claimed in claim 1, is characterized in that:
Described optics casting glue is filled in described VCSEL array and is arranged in the gap between the optical window in described VCSEL array front.
7. a high power VCSEL laser, is characterized in that:
Comprise VCSEL array encapsulating structure as claimed in claim 1.
8. high power VCSEL laser as claimed in claim 7, is characterized in that:
The exiting surface front of described VCSEL array is provided with optical window, described optical window is fixed on described laser thermal sediment by coated housing, further, in the gap that described laser thermal sediment, described coated housing and described optical window are formed, optics casting glue is filled with.
9. high power VCSEL laser as claimed in claim 7 or 8, is characterized in that:
Described optical window is any one in plane optical window, optical lens, optical prism or guide-lighting cone.
10. high power VCSEL laser as claimed in claim 9, is characterized in that:
The exit facet of described optical window is coated with anti-reflection film.
Priority Applications (7)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420681459.8U CN204290034U (en) | 2014-11-10 | 2014-11-10 | Based on VCSEL array encapsulating structure and the high power VCSEL laser thereof of optics dosing technology |
| US15/525,594 US10568690B2 (en) | 2014-11-10 | 2014-12-07 | High power VCSEL laser treatment device with skin cooling function and packaging structure thereof |
| EP14905708.5A EP3219360B1 (en) | 2014-11-10 | 2014-12-07 | High power vcsel laser treatment device with skin cooling function and packaging structure thereof |
| PL14905708T PL3219360T3 (en) | 2014-11-10 | 2014-12-07 | High power vcsel laser treatment device with skin cooling function and packaging structure thereof |
| PT149057085T PT3219360T (en) | 2014-11-10 | 2014-12-07 | High power vcsel laser treatment device with skin cooling function and packaging structure thereof |
| ES14905708T ES2802993T3 (en) | 2014-11-10 | 2014-12-07 | High power VCSEL laser treatment device with skin cooling function and its packaging structure |
| PCT/CN2014/093209 WO2016074300A1 (en) | 2014-11-10 | 2014-12-07 | High power vcsel laser treatment device with skin cooling function and packaging structure thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420681459.8U CN204290034U (en) | 2014-11-10 | 2014-11-10 | Based on VCSEL array encapsulating structure and the high power VCSEL laser thereof of optics dosing technology |
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| Publication Number | Publication Date |
|---|---|
| CN204290034U true CN204290034U (en) | 2015-04-22 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201420681459.8U Active CN204290034U (en) | 2014-11-10 | 2014-11-10 | Based on VCSEL array encapsulating structure and the high power VCSEL laser thereof of optics dosing technology |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104362510A (en) * | 2014-11-10 | 2015-02-18 | 李德龙 | VCSEL array packaging structure based on optical encapsulation process and high-power VCSEL laser device of VCSEL array packaging structure |
| CN108141011A (en) * | 2015-10-01 | 2018-06-08 | 皇家飞利浦有限公司 | Luminaire |
| CN109478767A (en) * | 2016-06-03 | 2019-03-15 | 普林斯顿光电子股份有限公司 | The encapsulation of VCSEL luminaire |
| US10568690B2 (en) | 2014-11-10 | 2020-02-25 | Sanhe Laserconn Tech Co., Ltd. | High power VCSEL laser treatment device with skin cooling function and packaging structure thereof |
-
2014
- 2014-11-10 CN CN201420681459.8U patent/CN204290034U/en active Active
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104362510A (en) * | 2014-11-10 | 2015-02-18 | 李德龙 | VCSEL array packaging structure based on optical encapsulation process and high-power VCSEL laser device of VCSEL array packaging structure |
| US10568690B2 (en) | 2014-11-10 | 2020-02-25 | Sanhe Laserconn Tech Co., Ltd. | High power VCSEL laser treatment device with skin cooling function and packaging structure thereof |
| CN108141011A (en) * | 2015-10-01 | 2018-06-08 | 皇家飞利浦有限公司 | Luminaire |
| CN108141011B (en) * | 2015-10-01 | 2020-09-01 | 通快光电器件有限公司 | Light emitting device |
| CN109478767A (en) * | 2016-06-03 | 2019-03-15 | 普林斯顿光电子股份有限公司 | The encapsulation of VCSEL luminaire |
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| Date | Code | Title | Description |
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| GR01 | Patent grant | ||
| C41 | Transfer of patent application or patent right or utility model | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20151013 Address after: 065000 Langfang city of Hebei province Sanhe Yanjiao Development Zone north loop aeonmed Industrial Park G Building 5 floor Patentee after: Sanhe Laser Technology Co., Ltd. Address before: 100094 Beijing city northwest of Haidian District Wang Tun Dian Industrial Zone No. 9 Building No. 1 hospital 3 Patentee before: Li Delong |