CN207938657U - A kind of luminous semiconductor device with heat sinking function - Google Patents
A kind of luminous semiconductor device with heat sinking function Download PDFInfo
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- CN207938657U CN207938657U CN201820418402.7U CN201820418402U CN207938657U CN 207938657 U CN207938657 U CN 207938657U CN 201820418402 U CN201820418402 U CN 201820418402U CN 207938657 U CN207938657 U CN 207938657U
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- heat
- semiconductor device
- radiating substrate
- led chip
- sinking function
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Abstract
The utility model provides a kind of luminous semiconductor device with heat sinking function, including heat-radiating substrate, it is provided with electrode pin on the heat-radiating substrate left and right ends, a LED chip is provided on the heat-radiating substrate, the LED chip is connected with electrode pin, the electrode pin, LED chip, heat-radiating substrate are sealed in colloid, evenly dispersed in the colloid to have multiple insulating particles or the colloid bottom is evenly laid out one layer of insulating particle；The light transmittance of the insulating particle is between 80% ~ 100%.The luminous semiconductor device can improve thermal diffusivity, to improve the service life of product.
Description
Technical field
The utility model is related to LED light technical field, especially a kind of luminous semiconductor device with heat sinking function.
Background technology
1. current packing colloid is that organic and half organic package, the wherein thermal coefficients such as silica gel and epoxy resin are all suitable
It is low, chip cooling is not easy, chip cooling can only carry out unidirectional heat transfer by bottom die bond material, be unique heat dissipation way
Diameter.
2. this kind of organic material is directly contacted with LED chip, heat transfer property is poor, the heat that LED chip is sent out cannot and
When conduct, the temperature difference in the temperature and device of LED chip on radiator is very big, if the temperature of radiator is 85
Degree, then LED chip internal temperature may be more than 125 degree.Such situation causes to work under chip hot soak condition,
Reduce its service life and stability.
3. semiconductor devices central chip area temperature rise can cause luminous efficiency to reduce, if temperature rise to 100 degree,
Luminous efficiency about reduces by 10%, and lighting poor heat radiation device its luminous efficiency in stable state also can be relatively low, reduces emitting semiconductor low consumption
The environmentally friendly savings advantage such as energy high-luminous-efficiency.
Invention content
In order to overcome the problems referred above, the purpose of this utility model is to provide a kind of emitting semiconductor device with heat sinking function
Part improves the thermal diffusivity of luminous semiconductor device, promotes semiconductor device service life.
The utility model is realized using following scheme：A kind of luminous semiconductor device with heat sinking function, including heat dissipation
Substrate is provided with electrode pin on the heat-radiating substrate left and right ends, a LED chip is provided on the heat-radiating substrate, described
LED chip is connected with electrode pin, and the electrode pin, LED chip, heat-radiating substrate are sealed in colloid, the glue
It is evenly dispersed in vivo to have multiple insulating particles or the colloid bottom is evenly laid out one layer of insulating particle, the insulation
The light transmittance of particle is between 80% ~ 100%.
Further, the insulating particle diameter is between 10nm ~ 10um.
Further, the material composition of the insulating particle include but not limited to silica, zirconium oxide, silicon oxide compound,
And silicon compound.
Further, the insulating particle is Transparent color insulating particle.
The beneficial effects of the utility model are：The utility model is provided with heat-radiating substrate, and in packing colloid uniformly
Disperse multiple insulating particles, the heat transfer of such insulating particle allows chip through multi-panel to the hot transmission of progress, more traditional
Unidirectional heat transmits, the utility model for luminescence chip carry out five towards heat transmit, heat dissipation effect can relatively organic envelope originally
2 ~ 10 times of skill upgrading is filled, transparent insulation uniform particle portioning is in can effectively reduce the dizzy problem of light extraction Huang in packaging body, not
Influence luminous flux performance.And the insulating particle, semiconductor devices dielectric properties can be increased.Promote semiconductor devices stable luminescence degree
And product service life.
Description of the drawings
Fig. 1 is the cross-sectional view of the utility model first embodiment.
Fig. 2 is the cross-sectional view of the utility model second embodiment.
Specific implementation mode
The utility model is described further below in conjunction with the accompanying drawings.
Refering to Figure 1, a kind of luminous semiconductor device with heat sinking function of the first embodiment of the utility model,
Including heat-radiating substrate 1, the heat dissipation of LED chip also can help in this way；Electrode is provided on 1 left and right ends of the heat-radiating substrate to draw
Foot 2 is provided with a LED chip 3 on the heat-radiating substrate 1, and the LED chip 3 is connected with electrode pin 2, the electrode pin 2
It is connect with power supply, power supply is provided for LED chip 3.The electrode pin 2, LED chip 3, heat-radiating substrate 1 are sealed in colloid 4
In, evenly dispersed in the colloid 4 to have multiple insulating particles 5, the light transmittance of the insulating particle 5 is between 80% ~ 100%
.The thermal diffusivity of luminous semiconductor device can be improved in this way, effectively reduce center dies junction temperature.Wherein, general insulating particle
30% ~ 80% in colloid is accounted for, can reach thermal connection in this way and shortens organic package conducting path.
In the present invention, 5 diameter of the insulating particle is between 10nm ~ 10um.Such insulating particle can reduce light
Learn refraction and reflection.The material composition of the insulating particle 5 include but not limited to silica, zirconium oxide, silicon oxide compound and
Silicon compound.The insulating particle is Transparent color insulating particle, increases semiconductor devices dielectric properties in this way.
Please refer to shown in Fig. 2, the second embodiment and first embodiment of the utility model difference lies in：The colloid bottom
Portion is evenly laid out one layer of insulating particle 5.The thermal diffusivity that luminous semiconductor device can also be improved in this way, effectively reduces center dies
Junction temperature.
The above is only the preferred embodiment of the present invention, it is all done according to present utility model application the scope of the claims it is equal
Deng variation and modification, it should all belong to the covering scope of the utility model.
Claims (4)
1. a kind of luminous semiconductor device with heat sinking function, it is characterised in that：Including heat-radiating substrate, the heat-radiating substrate is left
It is provided with electrode pin on right both ends, a LED chip, the LED chip and electrode pin phase are provided on the heat-radiating substrate
Connection, the electrode pin, LED chip, heat-radiating substrate be sealed in colloid, in the colloid it is evenly dispersed have it is multiple
The insulating particle or colloid bottom is evenly laid out one layer of insulating particle；The light transmittance of the insulating particle between
80%~100% 。
2. a kind of luminous semiconductor device with heat sinking function according to claim 1, it is characterised in that：The insulation
Particle diameter is between 10nm ~ 10um.
3. a kind of luminous semiconductor device with heat sinking function according to claim 1, it is characterised in that：The insulation
The material composition of particle includes but not limited to silica, zirconium oxide, silicon oxide compound and silicon compound.
4. a kind of luminous semiconductor device with heat sinking function according to claim 1, it is characterised in that：The insulation
Particle is Transparent color insulating particle.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820017241 | 2018-01-05 | ||
| CN2018200172410 | 2018-01-05 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN207938657U true CN207938657U (en) | 2018-10-02 |
Family
ID=63656136
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201820418402.7U Active CN207938657U (en) | 2018-01-05 | 2018-03-27 | A kind of luminous semiconductor device with heat sinking function |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN207938657U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110323321A (en) * | 2019-06-28 | 2019-10-11 | 厦门多彩光电子科技有限公司 | A kind of LED lamp bead and LED lamp |
-
2018
- 2018-03-27 CN CN201820418402.7U patent/CN207938657U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110323321A (en) * | 2019-06-28 | 2019-10-11 | 厦门多彩光电子科技有限公司 | A kind of LED lamp bead and LED lamp |
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