CN208422913U - A kind of no pinned optical coupler package structure - Google Patents
A kind of no pinned optical coupler package structure Download PDFInfo
- Publication number
- CN208422913U CN208422913U CN201820993010.3U CN201820993010U CN208422913U CN 208422913 U CN208422913 U CN 208422913U CN 201820993010 U CN201820993010 U CN 201820993010U CN 208422913 U CN208422913 U CN 208422913U
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- China
- Prior art keywords
- conductive metal
- metal frames
- plastic packaging
- modeling layer
- pinned
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Abstract
The utility model provides a kind of no pinned optical coupler package structure, including the conductive metal frames by epoxy resin filling bed of material package, it is lug boss in the middle part of the conductive metal frames, it is provided with infrared LEDs in the conductive metal frames and receives optical chip Sensor, and infrared LEDs and receipts optical chip Sensor are located at the left and right sides of the lug boss, an interior plastic packaging glue modeling layer with translucency is provided among the conductive metal frames, and interior plastic packaging glue modeling layer wraps the infrared LEDs and receives optical chip Sensor, an outer plastic packaging glue modeling layer with infrared light is provided with outside the interior plastic packaging glue modeling layer, and outer plastic packaging glue modeling layer conductive metal frames are carried out it is fully wrapped around.The utility model avoids unnecessary impedance and noise from interfering.
Description
Technical field
The utility model relates to LED encapsulation technology field, especially a kind of no pinned optical coupler package structure, the light
Coupler package structure is applied on power management, such as charger, transformer.
Background technique
Existing technology is mostly to have pinned encapsulation design, and mainstream is divided into vertical up and down and secondary plastic plane at present
Formula.
Shown in Figure 1, vertical encapsulation up and down is designed as combining using (1) a pair of of infrared LEDs with receipts optical chip point
It is not placed in upper and lower bracket both ends, (2) only envelope infrared LEDs chip and portion support with small size silica gel, and (3) are first to have
Plastic packaging glue is packaged cladding and shines and receive light both ends in translucency, and (4) are not again to have the outer plastic packaging glue of reflecting effect (generally
The black epoxy of carbon black) it is packaged.
The encapsulation of secondary plastic plane formula is designed as combining that be placed in one flat with receipts optical chip using (1) a pair of of infrared LEDs
On the formula bracket of face, (2) only envelope infrared LEDs chip and portion support with small size silica gel, and (3) are first moulded with having in translucency
Sealing is packaged cladding and shines and receive light both ends, and (4) are finally to have plastic packaging glue outside infrared light (generally containing TiO2It is white
Color epoxy resin) it is packaged.Existing encapsulation technology is because pin reason causes limitation package dimension that can not reduce, and pin designs
Length will cause unnecessary impedance and noise jamming.
Summary of the invention
In order to overcome the problems referred above, the purpose of the utility model is to provide a kind of no pinned optical coupler package structure, have
Effect reduces optocoupler package dimension, and no pin design avoids unnecessary impedance and noise jamming.
The utility model is realized using following scheme: a kind of no pinned optical coupler package structure, including by asphalt mixtures modified by epoxy resin
Rouge fills the conductive metal frames of bed of material package, is lug boss in the middle part of the conductive metal frames, is provided in the conductive metal frames
Infrared LEDs and receipts optical chip, and infrared LEDs and receipts optical chip are located at the left and right sides of the lug boss, the metal is led
Be provided among coil holder one with translucency interior plastic packaging glue modeling layer, and interior plastic packaging glue modeling layer wrap the infrared LEDs and
Optical chip is received, is provided with a silastic-layer with infrared light outside the interior plastic packaging glue modeling layer, and silastic-layer will be golden
It is fully wrapped around to belong to lead frame progress.
Further, a center projection, and center projection and the lug boss phase are provided in the conductive metal frames
Match.
Further, the center projection includes a rectangular block, is provided with arc at left and right sides of the rectangular block
Block.
The utility model has the beneficial effects that: 1. effectively reduce optical coupler package size without pinned encapsulating structure.
2. avoiding unnecessary impedance and noise jamming without pin design.
3. planar designs carrier center projection can avoid the point discharge problem between conductive metal frames, light can be effectively promoted
Coupler high pressure resistant property.
Detailed description of the invention
Fig. 1 is the schematic diagram of existing vertical optical coupler package structure up and down.
Fig. 2 is the schematic diagram of the section structure of the utility model.
Specific embodiment
The utility model is described further with reference to the accompanying drawing.
It please refers to shown in Fig. 2, the utility model provides a kind of no pinned optical coupler package structure, including by epoxy
Resin fills the conductive metal frames 1 of bed of material package, is lug boss 11 in the middle part of the conductive metal frames 1, in the conductive metal frames 1
It is provided with infrared LEDs 2 and receives optical chip 3, and infrared LEDs 2 and receipts optical chip 3 are located at the left and right two of the lug boss 11
Side is provided with an interior plastic packaging glue modeling layer 4 with translucency among the conductive metal frames 1, what such infrared LEDs 2 issued
Plastic packaging glue modeling layer 4 dissipates outward in light-transmissive；And interior plastic packaging glue modeling layer 4 wraps the infrared LEDs 2 and receives optical chip 3,
It is provided with a silastic-layer 5 with infrared light outside the interior plastic packaging glue modeling layer, and silastic-layer 5 is by conductive metal frames
1 progress is fully wrapped around.It moulds infrared light in interior plastic packaging glue and carries out light gathering reflector between layer 4 and the silastic-layer 5 of outer layer to reach production
The demand of product CTR current transfer ratio (CTR).Encapsulation reaches encapsulation constant voltage insulation simultaneously with the design of distance between back side Ji Dao (PAD)
Property requirements.In the present invention, plastic packaging pattern is the face-up single side cover type of plastic packaging.
In order to avoid the point discharge problem between conductive metal frames, in the present invention, set in the conductive metal frames 1
It is equipped with a center projection 6, and center projection 6 matches with the lug boss 11.Wherein, the center projection 6 includes one rectangular
Block 61 is provided with arc block 62 at left and right sides of the rectangular block 61.Wherein, center projection 6 can be zinc-plated block.
In short, the utility model effectively reduces optocoupler package dimension and avoids unnecessary impedance and noise jamming, and can
The point discharge problem between conductive metal frames is avoided, photo-coupler high pressure resistant property can be effectively promoted.
The above is only the preferred embodiment of the present invention, it is all done according to present utility model application the scope of the patents it is equal
Deng variation and modification, it should all belong to the covering scope of the utility model.
Claims (3)
1. a kind of no pinned optical coupler package structure, it is characterised in that: including the gold by epoxy resin filling bed of material package
Belong to lead frame, be lug boss in the middle part of the conductive metal frames, infrared LEDs are provided in the conductive metal frames and receive light core
Piece, and infrared LEDs and receipts optical chip are located at the left and right sides of the lug boss, are provided with a tool among the conductive metal frames
There is the interior plastic packaging glue modeling layer of translucency, and interior plastic packaging glue modeling layer wraps the infrared LEDs and receives optical chip, the interior plastic packaging
It is provided with a silastic-layer with infrared light outside glue modeling layer, and silastic-layer is wrapped conductive metal frames completely
It wraps up in.
2. a kind of no pinned optical coupler package structure according to claim 1, it is characterised in that: the plain conductor
A center projection is provided in frame, and center projection matches with the lug boss.
3. a kind of no pinned optical coupler package structure according to claim 2, it is characterised in that: the center projection
Including a rectangular block, arc block is provided at left and right sides of the rectangular block.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820993010.3U CN208422913U (en) | 2018-06-26 | 2018-06-26 | A kind of no pinned optical coupler package structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820993010.3U CN208422913U (en) | 2018-06-26 | 2018-06-26 | A kind of no pinned optical coupler package structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN208422913U true CN208422913U (en) | 2019-01-22 |
Family
ID=65105621
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201820993010.3U Active CN208422913U (en) | 2018-06-26 | 2018-06-26 | A kind of no pinned optical coupler package structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN208422913U (en) |
-
2018
- 2018-06-26 CN CN201820993010.3U patent/CN208422913U/en active Active
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