CN208240714U - A kind of LED encapsulation structure - Google Patents
A kind of LED encapsulation structure Download PDFInfo
- Publication number
- CN208240714U CN208240714U CN201721930767.XU CN201721930767U CN208240714U CN 208240714 U CN208240714 U CN 208240714U CN 201721930767 U CN201721930767 U CN 201721930767U CN 208240714 U CN208240714 U CN 208240714U
- Authority
- CN
- China
- Prior art keywords
- terminal pad
- led chip
- mounting groove
- isolation part
- positive terminal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Abstract
A kind of LED encapsulation structure; including rack body; positive terminal pad and negative terminal pad are equipped on rack body; the isolation part that protrusion is equipped between positive terminal pad and negative terminal pad is easy to happen fracture because the wire length that LED chip is connect with positive terminal pad is longer; reflection glue is equipped on isolation part and rack body; reflection glue wraps the lead that LED chip is connect with positive terminal pad, can play the role of protection, improve the reliability of product.
Description
Technical field
The utility model relates to a kind of LED encapsulation structures.
Background technique
LED has significant energy conservation and service life advantage as forth generation lighting source.With the development of society, daily life
Lighting energy consumption problem in work becomes increasingly conspicuous, and therefore, the LED lamp with significant power savings advantages is increasingly by the favor of people.
Packed LED chip is to be attached by lead with positive terminal pad at present, because the length of lead is longer, when carrying out for dispensing glue
It waits and is easy to lose in lead, influence properties of product.
Summary of the invention
The technical problem to be solved by the present invention is to provide the LED that the lead of a kind of pair of LED chip plays a protective role
Encapsulating structure.
In order to solve the above-mentioned technical problem, the utility model includes rack body, and positive terminal pad is equipped on rack body
And negative terminal pad, the isolation part of protrusion is equipped between positive terminal pad and negative terminal pad.
Mounting groove is equipped on rack body as a further improvement of the utility model, LED core is equipped in mounting groove
Piece, the isolation part are in the left side of LED chip, and LED chip is connect with positive terminal pad and negative terminal pad respectively by lead.
It is equipped between cell wall on the left of the isolation part and mounting groove as a further improvement of the utility model, and wraps up lead
Reflection glue firmly, the reflection glue are white glue.
It is equipped with Zener on the left of the isolation part and mounting groove between cell wall as a further improvement of the utility model,.
The isolation part is incline structure as a further improvement of the utility model,.
Height of the isolation part close to cell wall one end on the left of mounting groove is higher than as a further improvement of the utility model,
Height close to LED chip one end.
The utility model has the following beneficial effects: it is longer because of the wire length that LED chip is connect with positive terminal pad, it is easy hair
Raw fracture can play the role of protection so reflection glue wraps the lead that LED chip is connect with positive terminal pad, improve
The reliability of product.
Detailed description of the invention
It is next with reference to the accompanying drawings and detailed description that the utility model is described in more detail.
Fig. 1 is the structural schematic diagram of the utility model.
Specific embodiment
As shown in Figure 1, the utility model includes rack body 1, mounting groove 2 is equipped on rack body 1, in mounting groove 2
Interior to be equipped with LED chip 3, in mounting groove 2 and the left and right sides in LED chip 3 is respectively provided with positive terminal pad 4 and negative terminal pad 5,
It is additionally provided with an isolation part 6 in the left side of LED chip 3, height of the isolation part 6 close to 2 left side cell wall one end of mounting groove is high
In the height close to 3 one end of LED chip, LED chip 3 is connect respectively by lead 7 with positive terminal pad 4 and negative terminal pad 5, every
Left side from portion is equipped with Zener 9, and the reflection glue for wrapping lead 7 is equipped between 2 left side cell wall of isolation part 6 and mounting groove
8, the reflection glue 8 is white glue.
Because 7 length of lead that LED chip 3 is connect with positive terminal pad 4 is longer, it is easy to happen fracture, so reflection glue 8 will
The lead 7 that LED chip 3 is connect with positive terminal pad 4 wraps, and can play the role of protection, improves the reliability of product, simultaneously
Because height of the isolation part 6 close to 2 left side cell wall one end of mounting groove is higher than the height close to 3 one end of LED chip, in this way reflection glue
8 form tilt angle with the bottom of mounting groove 2, and LED chip 3 can utilize the silver-plated of mounting groove trough wall surface after being radiated at reflection glue 8
Light is effectively reflected mounting groove 2 by layer, promotes illumination effect.Isolation part 6 is incline structure simultaneously, can be eliminated using admittedly
Colloid extinction when brilliant glue fixes these components of Zener 9.
Claims (4)
1. a kind of LED encapsulation structure, including rack body, it is characterised in that: mounting groove is equipped on rack body, in mounting groove
It is interior to be equipped with LED chip, it is respectively provided with positive terminal pad and negative terminal pad in mounting groove and at left and right sides of LED chip, just
The isolation part of protrusion is equipped between pole pad and negative terminal pad, the isolation part is in the left side of LED chip, and LED chip passes through
Lead is connect with positive terminal pad and negative terminal pad respectively, is equipped on the left of the isolation part and mounting groove between cell wall and is wrapped lead
Reflection glue, the reflection glue be white glue.
2. LED encapsulation structure according to claim 1, it is characterised in that: set between cell wall on the left of the isolation part and mounting groove
There is Zener.
3. LED encapsulation structure according to claim 1, it is characterised in that: the isolation part is incline structure.
4. LED encapsulation structure according to claim 3, it is characterised in that: the isolation part is close to cell wall one on the left of mounting groove
The height at end is higher than the height close to LED chip one end.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721930767.XU CN208240714U (en) | 2017-12-31 | 2017-12-31 | A kind of LED encapsulation structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721930767.XU CN208240714U (en) | 2017-12-31 | 2017-12-31 | A kind of LED encapsulation structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN208240714U true CN208240714U (en) | 2018-12-14 |
Family
ID=64578851
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201721930767.XU Expired - Fee Related CN208240714U (en) | 2017-12-31 | 2017-12-31 | A kind of LED encapsulation structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN208240714U (en) |
-
2017
- 2017-12-31 CN CN201721930767.XU patent/CN208240714U/en not_active Expired - Fee Related
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20181214 Termination date: 20191231 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |