CN202797076U - Packaging structure capable of achieving all-angle luminescence of LED chip - Google Patents
Packaging structure capable of achieving all-angle luminescence of LED chip Download PDFInfo
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- CN202797076U CN202797076U CN 201220449295 CN201220449295U CN202797076U CN 202797076 U CN202797076 U CN 202797076U CN 201220449295 CN201220449295 CN 201220449295 CN 201220449295 U CN201220449295 U CN 201220449295U CN 202797076 U CN202797076 U CN 202797076U
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Abstract
The utility model discloses a packaging structure capable of achieving all-angle luminescence of an LED chip. The packaging structure comprises the LED chip and is characterized by further comprising a transparent base material, an electrode, a first adhesive layer, a second adhesive layer and a protective adhesive layer, wherein the transparent base material is used for bearing the LED chip in the front, the electrode is used for being electrically connected with the outside and arranged in the front of the base material as well, the first adhesive layer is arranged between the base material and the LED chip, the second adhesive layer is used for covering the LED chip, and the protective adhesive layer is used for being coated on the outer side of the second adhesive layer for protection. The LED chip is coated by the first and second adhesive layers completely, and the first and second adhesive layers and the protective adhesive layer are transparent; and the electrode is electrically connected with the LED chip. The packaging structure has the advantages that all-angle luminescence of the LED can be achieved, simultaneously, the structure is simple, the LED chip can be protected fully, and the processing technology is easy to implement.
Description
Technical field
The utility model relates to the encapsulating structure of led chip, is specifically related to the emitting led chip-packaging structure of a kind of full angle.
Background technology
The LED light-emitting diode is known as the most efficient artificial lighting technology by the whole world, is nowadays all extensively adopting the LED illumination to notebook, TV are backlight again from various indicator lights, street lamp, Colour lamp for fastival and holiday.Because its high energy efficiency, people generally believe that replacing traditional bulb, fluorescent lamp with the LED lamp is a kind of way of very environmental protection.
Since before the power of led chip lower, so existing encapsulating structure all with light reflection and pool a branch of Unidirectional light with increase one party to luminous intensity, but this method can produce light absorption and block, and causes the loss of LED luminosity.Along with the development of technology, the power of led chip improves greatly, can realize the luminous of full angle now, does not still now still have the encapsulating structure that can realize that full angle is luminous.
The utility model content
Be to solve the deficiencies in the prior art, the purpose of this utility model be to provide a kind of can the emitting led chip-packaging structure of full angle.
In order to realize above-mentioned target, the utility model adopts following technical scheme:
The emitting led chip-packaging structure of full angle, comprise: led chip, it is characterized in that, also comprise: be used for being arranged at the transparent base material of the above-mentioned led chip of its positive carrying, equally above-mentioned base material front the electrode that is used for being electrically connected with the external world, be arranged on the first glue-line between above-mentioned base material and the led chip, be used for covering above-mentioned led chip the second glue-line, be used for being coated in the protection glue-line that plays a protective role outside above-mentioned the second glue-line; Above-mentioned led chip is wrapped up fully by above-mentioned the first glue-line and the second glue-line, and above-mentioned the first glue-line, the second glue-line, protection glue-line are all transparent, and above-mentioned electrode is electrically connected with the led chip formation.
Further, above-mentioned electrode is electrically connected with above-mentioned led chip formation by the gold thread that is embedded in above-mentioned the second glue-line and the protection glue-line.
Further, above-mentioned electrode part by above-mentioned the second glue-line or/and the protection glue-line covers, part is exposed the front at above-mentioned base material.Above-mentioned electrode is metal electrode.
Further, above-mentioned the first glue-line is fluorescent glue, and above-mentioned the second glue-line is fluorescent glue, and above-mentioned protection glue-line is transparent colloid.
Further, above-mentioned base material is that transparent resin material is made.Particularly, above-mentioned base material is that transparent PET or PC material made, and above-mentioned base material is sheet material.
Usefulness of the present utility model is: the full angle that can realize led chip is luminous, and structure is easy to realize adequately protecting again led chip simultaneously.
Description of drawings
Fig. 1 is the structural representation of a preferred embodiment of the emitting led chip-packaging structure of full angle of the present utility model.
The implication of Reference numeral among the figure: the 1-LED chip, the 2-base material, the 3-electrode, 4-the first glue-line, 5-the second glue-line, 6-protects glue-line, 7-gold thread.
Embodiment
Below in conjunction with the drawings and specific embodiments the utility model is done concrete introduction.
As shown in Figure 1, the emitting led chip-packaging structure of full angle mainly comprises: led chip 1, base material 2, electrode 3, the first glue-line 4, the second glue-line 5 and protection glue-line 6.
Wherein, base material 2 is as the carrier of carrying led chip 1, and led chip 1 is arranged on the front of base material 2, and some circuit also can be set in the front of corresponding base material 2 or other are in order to install the structure of led chip.As a kind of preferred version, base material 2 is sheet material, and makes for transparent resin material, and particularly, base material 2 is made for transparent PET or PC material.The base material 2 of sheet material is convenient to fixed L ED chip 1.Be provided with the first glue-line 4 between led chip 1 and the base material 2, its role is to, with the front location of led chip 1 at base material 2.
Be coated with the second glue-line 5 on the led chip 1, led chip 1 is wrapped up fully by the first glue-line 4 and the second glue-line 5.The effect of the second glue-line 5 is to cover led chip 1, and it is protected, and need to prove, before applying the second glue-line 5, should first gold thread 7 be arranged, in a single day because set the second glue-line 5, led chip 1 namely has been isolated from the outside.
The second glue-line 5 outer side covers have the protection glue-line 6 that plays a protective role.Protective layer 6 is mainly used to the electrode 3 protecting gold thread 7 and be arranged on equally base material 2 fronts, is metal electrode as preferred electrode 3.The main usefulness of electrode 3 is to make led chip 1 can be connected in the extraneous power supply circuits; because electrode 3 parts need to be exposed to the front of base material 2; another is convenient for can fixed electrode 3; we need colloid that it is covered or are fixing; it is played fixation can be protective layer 6, also can be the second glue-line 5; certainly as preferred, also they all contact with electrode 3 and jointly play fixation.
As a kind of preferred version, the first glue-line 4 and the second glue-line 5 are fluorescent glue, and protection glue-line 6 is transparent colloid.
More than show and described basic principle of the present utility model, principal character and advantage.The technical staff of the industry should understand, and above-described embodiment does not limit the utility model in any form, and all employings are equal to replaces or technical scheme that the mode of equivalent transformation obtains, all drops in the protection range of the present utility model.
Claims (10)
1. the emitting led chip-packaging structure of full angle, comprise: led chip, it is characterized in that, also comprise: be used for being arranged at the transparent base material of the above-mentioned led chip of its positive carrying, equally above-mentioned base material front the electrode that is used for being electrically connected with the external world, be arranged on the first glue-line between above-mentioned base material and the led chip, be used for covering above-mentioned led chip the second glue-line, be used for being coated in the protection glue-line that plays a protective role outside above-mentioned the second glue-line; Above-mentioned led chip is wrapped up fully by above-mentioned the first glue-line and the second glue-line, and above-mentioned the first glue-line, the second glue-line, protection glue-line are all transparent, and above-mentioned electrode is electrically connected with the led chip formation.
2. the emitting led chip-packaging structure of full angle according to claim 1 is characterized in that, above-mentioned electrode is electrically connected with above-mentioned led chip formation by the gold thread that is embedded in above-mentioned the second glue-line and the protection glue-line.
3. the emitting led chip-packaging structure of full angle according to claim 1 is characterized in that, above-mentioned electrode part by above-mentioned the second glue-line or/and the protection glue-line covers, part is exposed the front at above-mentioned base material.
4. the emitting led chip-packaging structure of full angle according to claim 1 is characterized in that, above-mentioned electrode is metal electrode.
5. the emitting led chip-packaging structure of full angle according to claim 1 is characterized in that, above-mentioned the first glue-line is fluorescent glue.
6. the emitting led chip-packaging structure of full angle according to claim 1 is characterized in that, above-mentioned the second glue-line is fluorescent glue.
7. the emitting led chip-packaging structure of full angle according to claim 1 is characterized in that, above-mentioned protection glue-line is transparent colloid.
8. according to claim 1 to the emitting led chip-packaging structure of 7 each described full angles, it is characterized in that above-mentioned base material is that transparent resin material is made.
9. the emitting led chip-packaging structure of full angle according to claim 8 is characterized in that, above-mentioned base material is that transparent PET or PC material made.
10. the emitting led chip-packaging structure of full angle according to claim 9 is characterized in that, above-mentioned base material is sheet material.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201220449295 CN202797076U (en) | 2012-09-05 | 2012-09-05 | Packaging structure capable of achieving all-angle luminescence of LED chip |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201220449295 CN202797076U (en) | 2012-09-05 | 2012-09-05 | Packaging structure capable of achieving all-angle luminescence of LED chip |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202797076U true CN202797076U (en) | 2013-03-13 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201220449295 Expired - Fee Related CN202797076U (en) | 2012-09-05 | 2012-09-05 | Packaging structure capable of achieving all-angle luminescence of LED chip |
Country Status (1)
| Country | Link |
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| CN (1) | CN202797076U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102856475A (en) * | 2012-09-05 | 2013-01-02 | 苏州金科信汇光电科技有限公司 | Full-angle luminous LED (light-emitting diode) chip encapsulation structure |
-
2012
- 2012-09-05 CN CN 201220449295 patent/CN202797076U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102856475A (en) * | 2012-09-05 | 2013-01-02 | 苏州金科信汇光电科技有限公司 | Full-angle luminous LED (light-emitting diode) chip encapsulation structure |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| ASS | Succession or assignment of patent right |
Owner name: WANG YU Free format text: FORMER OWNER: SUZHOU JINKE XINHUI PHOTOELECTRIC TECHNOLOGY CO., LTD. Effective date: 20140929 |
|
| C41 | Transfer of patent application or patent right or utility model | ||
| COR | Change of bibliographic data |
Free format text: CORRECT: ADDRESS; FROM: 215000 SUZHOU, JIANGSU PROVINCE TO: 215131 SUZHOU, JIANGSU PROVINCE |
|
| TR01 | Transfer of patent right |
Effective date of registration: 20140929 Address after: Xiangcheng District Juxian road Suzhou City, Jiangsu province 215131 king friendway six 21 2103 Patentee after: Wang Yu Address before: 215000 Jiangsu high tech Zone in Suzhou City, Tong An Zhen Hua Jin Road No. 255 Building 5 Patentee before: Suzhou Jinke Xinhui Photoelectric Technology Co.,Ltd. |
|
| ASS | Succession or assignment of patent right |
Owner name: SUZHOU HANKE SAM LIGHTING TECHNOLOGY CO., LTD. Free format text: FORMER OWNER: WANG YU Effective date: 20141215 |
|
| C41 | Transfer of patent application or patent right or utility model | ||
| COR | Change of bibliographic data |
Free format text: CORRECT: ADDRESS; FROM: 215131 SUZHOU, JIANGSU PROVINCE TO: 215000 SUZHOU, JIANGSU PROVINCE |
|
| TR01 | Transfer of patent right |
Effective date of registration: 20141215 Address after: Two building No. 189, No. 215000, Kunlun Road, Suzhou hi tech Development Zone, Jiangsu, China Patentee after: Suzhou Hunk Shan Mu lighting Co., Ltd Address before: Xiangcheng District Juxian road Suzhou City, Jiangsu province 215131 king friendway six 21 2103 Patentee before: Wang Yu |
|
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20130313 Termination date: 20180905 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |