CN207938644U - A kind of packaged light source structure for realizing LED week light - Google Patents
A kind of packaged light source structure for realizing LED week light Download PDFInfo
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- CN207938644U CN207938644U CN201820419239.6U CN201820419239U CN207938644U CN 207938644 U CN207938644 U CN 207938644U CN 201820419239 U CN201820419239 U CN 201820419239U CN 207938644 U CN207938644 U CN 207938644U
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- lead frame
- plate lead
- packaged
- light source
- packing colloid
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Abstract
The utility model is related to a kind of packaged light source structures for realizing LED week light, plate lead frame including areflexia cover board, it is provided with a LED chip on the plate lead frame, the electrode pin of the LED chip is connect with the plate lead frame, and the plate lead frame is wrapped in bowl formula package support；It is mixed with radiating insulating particle in the bowl formula package support, the plate lead frame, LED chip are packaged in a packing colloid, a reflecting layer is provided at the top of the packing colloid, the reflecting layer is located on the bowl slot of the bowl formula package support, evenly dispersed in the packing colloid to have multiple radiating insulating particles, the light transmittance of the radiating insulating particle is between 80% ~ 100%.The utility model can realize shining for LED week light, improve luminous effect.
Description
Technical field
The utility model is related to technical field of semiconductor encapsulation, especially a kind of packaged light source knot for realizing LED week light
Structure.
Background technology
Existing LED package supports are by metal lead wire frame（Leadframe）With epoxy resin filler material（EMC）It constitutes, and
Predominantly reflection cup type design.Background technology there are the shortcomings that：The light emitting angle of LED package of existing reflection cup type is about
120 degree, full light cannot be carried out and shone, and be limited to reflection cap is designed as fixed light emitting angle, such as Fig. 1（It is i.e. existing
Plate lead frame in LED package supports carries reflective patch, and light emitting angle can only be in bowl slot for such reflection cap
120 degree or so）：If there is different light emitting angle demands, LED package supports need to redesign die sinking again.
Invention content
In view of this, the utility model is to provide a kind of packaged light source structure for realizing LED week light, it can realize that LED is complete
Period-luminosity shines, and improves luminous effect, and without the use of reflective patch, reduce production cost.
The utility model is realized using following scheme：A kind of packaged light source structure for realizing LED week light, including areflexia
The plate lead frame of cover board is provided with a LED chip on the plate lead frame, and the electrode of the LED chip draws
Foot is connect with the plate lead frame, and the plate lead frame is wrapped in bowl formula package support；The bowl
Radiating insulating particle is mixed in formula package support, the plate lead frame, LED chip are packaged in a packing colloid
In, a reflecting layer is provided at the top of the packing colloid, the reflecting layer is located at the bowl slot of the bowl formula package support
On, it is evenly dispersed in the packing colloid to there is multiple radiating insulating particles, the light transmittance of the radiating insulating particle to be situated between
In 80% ~ 100%.
Further, the packing colloid is epoxy resin filler material or siloxy resin filler material.
Further, the radiating insulating particle includes but not limited to silica, zirconium oxide, silicon oxide compound and silicon
Compound.
Further, the radiating insulating particle diameter is between 10nm ~ 10um.
The utility model eliminates reflective patch on plate lead frame, and one is provided at the top of packing colloid
Reflecting layer, the reflecting layer are located on the bowl slot of the bowl formula package support；The reflecting layer at top in this way can realize week
Light shines, and improves luminous effect, and without the use of reflective patch, reduce production cost, and can increase and shine uniformly
Property；In addition, radiating insulating particle in packing colloid, increases the heat conductivity of packaged light source structure in this way, make chip can be with
Through multi-panel to hot transmission is carried out, to improve thermal diffusivity.
Description of the drawings
Fig. 1 is existing LED package supports schematic diagram.
Fig. 2 is the utility model embodiment structural schematic diagram.
Specific implementation mode
The utility model is described further below in conjunction with the accompanying drawings.
Fig. 2 is referred to, the present embodiment provides a kind of packaged light source structures for realizing LED week light, including areflexia cover board
Plate lead frame 1, be provided with a LED chip 2 on the plate lead frame 1, the electrode of the LED chip 2 draws
Foot is connect with the plate lead frame 1, and the plate lead frame 1 is wrapped in bowl formula package support 3；The bowl
Radiating insulating particle 31 is mixed in cup type package support 3, the plate lead frame 1, LED chip 2 are packaged in an envelope
It fills in colloid 4, the top of the packing colloid 4 is provided with a reflecting layer 41, and the reflecting layer 41 is located at bowl formula encapsulation
On the bowl slot 32 of holder 3, such packaged light source structure can pass through 41 structure of reflecting layer to adjust light emitting angle, reach full light
It shines；It is evenly dispersed in the packing colloid 4 to there is multiple radiating insulating particles 31, the light of the radiating insulating particle to penetrate
Rate is between 80% ~ 100%, and the radiating insulating particle diameter is between 10nm ~ 10um.It is mixed in the bowl formula package support 3
It is evenly dispersed in radiating insulating particle 31 and packing colloid 4 to have multiple radiating insulating particles 31, packaged light source can be improved in this way
The thermal diffusivity of structure effectively reduces the LED chip junction temperature at center.
In addition, packing colloid 4 described in the utility model is epoxy resin filler material or siloxy resin filler material.Institute
It includes but not limited to silica, zirconium oxide, silicon oxide compound and silicon compound to state radiating insulating particle 31.
In short, the utility model eliminates reflective patch on plate lead frame, and set at the top of packing colloid
It is equipped with a reflecting layer, the reflecting layer is located on the bowl slot of the bowl formula package support；The reflecting layer at top can be real in this way
Existing week light shines, and improves luminous effect, and without the use of reflective patch, reduce production cost, and can increase hair
Optical uniformity；In addition, radiating insulating particle in packing colloid, increases the heat conductivity of packaged light source structure, makes core in this way
Piece can penetrate multi-panel to hot transmission is carried out, to improve thermal diffusivity.
The above is only the preferred embodiment of the present invention, it is all done according to present utility model application the scope of the claims it is equal
Deng variation and modification, it should all belong to the covering scope of the utility model.
Claims (4)
1. a kind of packaged light source structure for realizing LED week light, it is characterised in that：Plate lead frame including areflexia cover board
Frame is provided with a LED chip, the electrode pin of the LED chip and the plate conducting wire on the plate lead frame
Frame connects, and the plate lead frame is wrapped in bowl formula package support；It is mixed in the bowl formula package support
Radiating insulating particle, the plate lead frame, LED chip are packaged in a packing colloid, the top of the packing colloid
Portion is provided with a reflecting layer, and the reflecting layer is located on the bowl slot of the bowl formula package support, in the packing colloid
Even to be dispersed with multiple radiating insulating particles, the light transmittance of the radiating insulating particle is between 80% ~ 100%.
2. a kind of packaged light source structure for realizing LED week light according to claim 1, it is characterised in that：The encapsulation
Colloid is epoxy resin filler material or siloxy resin filler material.
3. a kind of packaged light source structure for realizing LED week light according to claim 1, it is characterised in that：The heat dissipation
Insulating particle includes but not limited to silica, zirconium oxide, silicon oxide compound and silicon compound.
4. a kind of packaged light source structure for realizing LED week light according to claim 1, it is characterised in that：The heat dissipation
Insulating particle diameter is between 10nm ~ 10um.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2018200174609 | 2018-01-05 | ||
| CN201820017460 | 2018-01-05 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN207938644U true CN207938644U (en) | 2018-10-02 |
Family
ID=63656144
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201820419239.6U Active CN207938644U (en) | 2018-01-05 | 2018-03-27 | A kind of packaged light source structure for realizing LED week light |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN207938644U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110323321A (en) * | 2019-06-28 | 2019-10-11 | 厦门多彩光电子科技有限公司 | A kind of LED lamp bead and LED lamp |
-
2018
- 2018-03-27 CN CN201820419239.6U patent/CN207938644U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110323321A (en) * | 2019-06-28 | 2019-10-11 | 厦门多彩光电子科技有限公司 | A kind of LED lamp bead and LED lamp |
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