CN212060651U - High-voltage-resistance optocoupler packaging structure - Google Patents
High-voltage-resistance optocoupler packaging structure Download PDFInfo
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- CN212060651U CN212060651U CN202021117902.0U CN202021117902U CN212060651U CN 212060651 U CN212060651 U CN 212060651U CN 202021117902 U CN202021117902 U CN 202021117902U CN 212060651 U CN212060651 U CN 212060651U
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Abstract
The utility model provides a high withstand voltage opto-coupler packaging structure, including first pin and second pin, first pin and the setting of second pin are located same horizontal plane about, first pin front end lower surface is provided with infrared LED, first pin front end lower surface is provided with the first silica gel layer that is used for cladding infrared LED and has the light transmissivity; a light receiving chip is arranged on the lower surface of the front end of the second pin, and a second silica gel layer which is used for coating the light receiving chip and has light transmittance is arranged on the lower surface of the light receiving chip; an n-shaped light guide pillar is arranged between the first silica gel layer and the second silica gel layer; the utility model discloses simple structure can reach the medium effect as long distance light transmission in secondary plastic envelope plane formula opto-coupler encapsulation.
Description
Technical Field
The utility model relates to a LED lamp production technical field, especially a high withstand voltage opto-coupler packaging structure.
Background
The existing technology is mostly designed with pin type packaging, and the current mainstream is divided into an up-down vertical type and a secondary plastic packaging plane type.
The vertical package design is that a pair of infrared LED and a light receiving chip are combined and respectively placed at two ends of an upper support and a lower support, the infrared LED chip and part of the supports are only covered by small-volume silica gel, the light emitting and the light receiving ends are firstly packaged and covered by inner plastic package glue with light transmission, and then the package is carried out by outer plastic package glue (generally black epoxy resin containing carbon black) without reflection effect.
The secondary plastic package planar package design is that a pair of infrared LED and a light receiving chip are combined and placed on a planar support, a small volume of silica gel is used for only covering the infrared LED chip and a part of the support, the light emitting and light receiving ends are packaged and covered by the inner plastic package adhesive with light transmittance, and then the outer plastic package adhesive (generally white epoxy resin containing TiO 2) with infrared light reflectivity is used for packaging.
In the conventional packaging technology, because the packaging size (length) meets the requirement of high voltage resistance of a product (generally 3750V-5000V), the end point distance (internal insulation distance) of an internal metal lead frame is designed to be short (generally 0.5mm according to the safety requirement), so that the internal insulation distance needs to be lengthened when a higher voltage-resistant product (more than 8000V) needs to be designed, and the distance between an infrared LED and a light receiving chip is also lengthened; if the distance between the LED and the light receiving chip is lengthened, the light transmission efficiency of the up-and-down vertical optical coupler is reduced in geometric progression, and the secondary plastic-packaged planar light receiving principle is that the LED is reflected by the primary plastic-packaged curved surface to collect light to the surface of the light receiving chip, and the light transmission efficiency is also greatly reduced if the distance between the LED and the light receiving chip is lengthened. In view of the above, the optical coupler is not only a key electrical parameter for high voltage isolation, but also another index parameter for current conversion efficiency (which refers to the ratio of photocurrent output by the light receiving chip when the LED emits light), and the current conversion efficiency is reduced because the distance between the LED and the light receiving chip is only increased if the current industry packaging method is to increase the high voltage isolation efficiency.
Disclosure of Invention
In view of this, the utility model aims at providing a can reach the high withstand voltage opto-coupler packaging structure who is the medium effect of long distance light transmission in secondary plastic envelope plane formula opto-coupler packaging.
The utility model discloses a following method realizes: the utility model provides a high withstand voltage opto-coupler packaging structure which characterized in that: the LED packaging structure comprises a first pin and a second pin, wherein the first pin and the second pin are arranged on the left and right sides of the same horizontal plane, an infrared LED is arranged on the lower surface of the front end of the first pin, and a first silica gel layer which is used for coating the infrared LED and has light transmittance is arranged on the lower surface of the front end of the first pin; a light receiving chip is arranged on the lower surface of the front end of the second pin, and a second silica gel layer which is used for coating the light receiving chip and has light transmittance is arranged on the lower surface of the light receiving chip; and a n-shaped light guide pillar is arranged between the first silica gel layer and the second silica gel layer.
Further, an inner packaging body which is used for wrapping the n-shaped light guide column, the infrared LED and the light receiving chip and has light transmittance is arranged at the front ends of the first pin and the second pin, and an outer packaging body which is used for wrapping the inner packaging body and has light transmittance is arranged between the first pin and the second pin.
Furthermore, the infrared LED is connected with the first pin through a first gold thread, and the light receiving chip is connected with the second pin through a second gold thread.
The beneficial effects of the utility model reside in that: the utility model arranges the inverted-U-shaped light guide column between the first silica gel layer and the second silica gel layer, so that the medium effect of long-distance light transmission can be achieved in the secondary plastic package planar optical coupler package through the action of the inverted-U-shaped light guide column; the utility model discloses simple structure has promoted product effect and quality, can carry out long distance light transmission.
Drawings
Fig. 1 is a schematic structural diagram of the present invention.
Detailed Description
The present invention will be further explained with reference to the accompanying drawings.
Referring to fig. 1, the present invention provides an embodiment: a high-voltage-resistance optocoupler packaging structure comprises a first pin 1 and a second pin 2, wherein the first pin 1 and the second pin 2 are arranged on the left and right sides of the same horizontal plane, an infrared LED3 is arranged on the lower surface of the front end of the first pin 1, and a first silica gel layer 4 which is used for coating an infrared LED3 and has light transmittance is arranged on the lower surface of the front end of the first pin 1; a light receiving chip 5 is arranged on the lower surface of the front end of the second pin 2, and a second silica gel layer 6 which is used for coating the light receiving chip 5 and has light transmittance is arranged on the lower surface of the light receiving chip 5; a reverse-U-shaped light guide pillar 7 is arranged between the first silica gel layer 4 and the second silica gel layer 6. Make to be located same horizontal plane through first pin 1 and second pin 2, planar support design can avoid the support to warp and lead to the internal insulation distance unstable and then lead to the high-voltage resistance characteristic of opto-coupler unusual, and erects U type leaded light post 7 between first silica gel layer 4 and second silica gel layer 6, can effectively promote the light transmission efficiency of LED and receipts light chip.
Referring to fig. 1, in an embodiment of the present invention, the front ends of the first pin 1 and the second pin 2 are provided with an inner package 8 having light transmittance for wrapping the n-shaped light guide pillar 7, the infrared LED3 and the light receiving chip 5, and an outer package 9 having light transmittance for wrapping the inner package 8 is disposed between the first pin 1 and the second pin 2. So that the reverse-U-shaped light guide pillar 7, the infrared LED3 and the light receiving chip 5 are packaged by the interaction of the inner package 8 and the outer package 9.
Referring to fig. 1, in an embodiment of the present invention, the infrared LED3 is connected to the first leads 1 through a first gold wire 10, and the light receiving chip 5 is connected to the second leads 2 through a second gold wire 11.
The material for manufacturing the n-shaped light guide pillar of the present invention can be glass or highly transparent epoxy resin, but is not limited thereto.
In a word, a pair of infrared LEDs and a light receiving chip are combined and placed on a planar support, a first silica gel layer and a second silica gel layer cover the infrared LED chips and the light receiving chip area, and an inverted U-shaped light guide column is placed on the first silica gel layer and the second silica gel layer and fixed; the structure is packaged and coated by the inner plastic package glue with light transmittance, and then the outer plastic package glue with infrared light reflectivity is used for packaging, so that the effect of serving as a medium for long-distance light transmission can be achieved in secondary plastic package planar optical coupler packaging through the function of the inverted-U-shaped light guide column.
The above is only the preferred embodiment of the present invention, and all the equivalent changes and modifications made according to the claims of the present invention should be covered by the present invention.
Claims (3)
1. The utility model provides a high withstand voltage opto-coupler packaging structure which characterized in that: the LED packaging structure comprises a first pin and a second pin, wherein the first pin and the second pin are arranged on the left and right sides of the same horizontal plane, an infrared LED is arranged on the lower surface of the front end of the first pin, and a first silica gel layer which is used for coating the infrared LED and has light transmittance is arranged on the lower surface of the front end of the first pin; a light receiving chip is arranged on the lower surface of the front end of the second pin, and a second silica gel layer which is used for coating the light receiving chip and has light transmittance is arranged on the lower surface of the light receiving chip; and a n-shaped light guide pillar is arranged between the first silica gel layer and the second silica gel layer.
2. The high voltage resistant optical coupler packaging structure according to claim 1, wherein: the front ends of the first pin and the second pin are provided with an inner packaging body which is used for wrapping the reverse U-shaped light guide column, the infrared LED and the light receiving chip and has light transmission, and an outer packaging body which is used for wrapping the inner packaging body and has light transmission is arranged between the first pin and the second pin.
3. The high voltage resistant optical coupler packaging structure according to claim 1, wherein: the infrared LED is connected with the first pin through a first gold thread, and the light receiving chip is connected with the second pin through a second gold thread.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021117902.0U CN212060651U (en) | 2020-06-16 | 2020-06-16 | High-voltage-resistance optocoupler packaging structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021117902.0U CN212060651U (en) | 2020-06-16 | 2020-06-16 | High-voltage-resistance optocoupler packaging structure |
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| CN212060651U true CN212060651U (en) | 2020-12-01 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202021117902.0U Active CN212060651U (en) | 2020-06-16 | 2020-06-16 | High-voltage-resistance optocoupler packaging structure |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115236809A (en) * | 2022-07-14 | 2022-10-25 | 贵州航天凯山石油仪器有限公司 | Miniaturized opto-coupler |
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2020
- 2020-06-16 CN CN202021117902.0U patent/CN212060651U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115236809A (en) * | 2022-07-14 | 2022-10-25 | 贵州航天凯山石油仪器有限公司 | Miniaturized opto-coupler |
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