CN112397627B

CN112397627B - Light emitting device

Info

Publication number: CN112397627B
Application number: CN202010796460.5A
Authority: CN
Inventors: 林贞秀; 张育誉; 黄建顺
Original assignee: Lite On Opto Technology Changzhou Co Ltd; Lite On Technology Corp
Current assignee: Lite On Opto Technology Changzhou Co Ltd; Lite On Technology Corp
Priority date: 2019-08-13
Filing date: 2020-08-10
Publication date: 2022-02-08
Anticipated expiration: 2040-08-10
Also published as: CN212725363U; CN112397627A; CN212587505U; CN112397630A; CN112397605A

Abstract

The invention discloses a light-emitting device. The light-emitting device comprises a packaging structure, a first light-emitting chip, a second light-emitting chip, a third light-emitting chip, a first packaging colloid, a second packaging colloid and a third packaging colloid. The first, second and third light emitting chips are disposed in the first, second and third grooves of the body of the package structure and electrically connected to the first, second and third electrode pairs coated by the body, and the first, second and third encapsulant are filled in the first, second and third grooves. The first opening of the first containing groove is larger than the second opening of the second containing groove, and the first opening of the first containing groove is larger than the third opening of the third containing groove.

Description

Light emitting device

Technical Field

The present invention relates to a light emitting device, and more particularly, to a light emitting device suitable for use in a face capture monitoring system or a license plate recognition system.

Background

Most of the existing monitoring systems applied to face capturing or license plate recognition systems use infrared light emitting diodes as sensing light sources. However, the light emitted by the infrared led still falls within a portion of the red range, so that the appearance of the conventional system has red bright spots (erythema phenomenon), which is easy to attract people's attention, and the desired monitoring effect is not achieved or the safety of passers-by is affected.

To eliminate the red spot phenomenon, the industry has tried to package the infrared led and the blue led in a single-cup PLCC6 support, and add phosphor powder in the package glue to form a light emitting device. The blue light emitting diode and the fluorescent powder form white light to neutralize the red spot generated by the red light emitting diode. However, in the design of the light emitting device, the fluorescent powder is also spread on the red light emitting diode, which causes the energy loss of the red light. In addition, the traditional PLCC6 support is designed by bending pins, is large in size and is not beneficial to the miniaturization development of end products.

Disclosure of Invention

The invention discloses a light-emitting device, which is mainly used for solving the problem that the conventional light-emitting device applied to a monitoring system for face snapshot or a recognition system for license plate recognition can cause infrared energy loss because the packaging adhesive doped with fluorescent powder is not only laid on a blue light-emitting diode, but also laid on an infrared light-emitting diode.

One embodiment of the present invention discloses a light emitting device, including: the light emitting diode package structure comprises a package structure, a first light emitting chip, a second light emitting chip, a third light emitting chip, a first package colloid, a second package colloid and a third package colloid. The package structure includes: a first electrode pair, a second electrode pair, a third electrode pair and a body. The body covers the first electrode pair, the second electrode pair and the third electrode pair, and comprises a first containing groove, a second containing groove and a third containing groove which are respectively arranged corresponding to the first electrode pair, the second electrode pair and the third electrode pair and expose the first electrode pair, the second electrode pair and the third electrode pair. The first light-emitting chip, the second light-emitting chip and the third light-emitting chip are respectively arranged in the first accommodating groove, the second accommodating groove and the third accommodating groove and are respectively electrically connected with the first electrode pair, the second electrode pair and the third electrode pair. The first, second and third encapsulant are disposed in the first, second and third receiving grooves respectively and cover the first, second and third light-emitting chips respectively. The first containing groove, the second containing groove and the third containing groove are respectively provided with a first opening, a second opening and a third opening, the area of the first opening is larger than that of the second opening, and the area of the first opening is larger than that of the third opening. The wave band of the light beam emitted by the first light-emitting chip is different from the wave band of the light beam emitted by the second light-emitting chip, and the wave band of the light beam emitted by the first light-emitting chip is different from the wave band of the light emitted by the third light-emitting chip.

Preferably, the first light emitting chip can emit light in an infrared light band.

Preferably, the second light emitting chip and the third light emitting chip can emit light in a blue wavelength band.

Preferably, the second encapsulant and the third encapsulant respectively contain wavelength conversion substances, and light emitted by the second light emitting chip and light emitted by the third light emitting chip respectively pass through the second encapsulant and the third encapsulant, and are partially converted and mixed to form white light.

Preferably, the color temperature of the white light is 2500 kelvin (K) to 6500 kelvin (K).

Preferably, the light emitting device further comprises a lens disposed on the top surface of the body.

Preferably, the light emitting device further includes a reflective filler filled in the first container, the reflective filler is located between the first encapsulant and the first electrode pair, and the reflective filler covers the first electrode pair and covers a side surface of the first light emitting chip.

Preferably, in a top view of the light emitting device, the area of the first opening is 2 times to 3 times that of the second opening, and the area of the first opening is 2 times to 3 times that of the third opening.

Preferably, the body further comprises a first partition wall and a second partition wall, the first partition wall is located between the first containing groove and the second containing groove, the second partition wall is located between the first containing groove and the third containing groove, and the first partition wall and the second partition wall are respectively provided with two bending sections.

Preferably, the height of the first partition wall is equal to the height of the second partition wall.

Preferably, one bending section included in the first partition wall is bent towards the second accommodating groove, and the other bending section is bent towards the first accommodating groove; one bending section included in the second separating wall bends towards the third containing groove, and the other bending section bends towards the first containing groove.

Preferably, the body further comprises a first short wall, a second short wall and a third short wall, and the first short wall, the second short wall and the third short wall are respectively arranged in the first accommodating groove, the second accommodating groove and the third accommodating groove.

Preferably, the body includes an auxiliary short wall, the first electrode pair includes an auxiliary fitting portion, and the auxiliary short wall and the auxiliary fitting portion are fitted to each other and cover a portion of the first electrode pair.

In summary, when the light emitting device of the present invention is applied to a monitoring system for face capture or a light emitting device in an identification system for license plate recognition, since the first, second, and third packaging glues are respectively disposed in the first, second, and third receiving slots, the problem of red light energy loss caused by the fact that the packaging glue with phosphor powder is laid on the red light emitting diode in the conventional monitoring system for face capture or the identification system for license plate recognition is not generated.

For a better understanding of the nature and technical content of the present invention, reference should be made to the following detailed description of the invention and the accompanying drawings, which are provided for illustration purposes only and are not intended to limit the scope of the invention in any way.

Drawings

Fig. 1, fig. 2 and fig. 3 are schematic views of different viewing angles of the light emitting device of the present invention.

Fig. 4 is a partially exploded view of the light emitting device of the present invention.

Fig. 5 is a schematic view illustrating a light emitting device of the present invention without a first encapsulant, a second encapsulant, and a third encapsulant.

Fig. 6 is a top view of fig. 5.

Fig. 7 is a schematic diagram of a first electrode pair, a second electrode pair, and a third electrode pair of a light-emitting device according to the present invention.

Fig. 8 is a top view of fig. 7.

Fig. 9 is a schematic view of another viewing angle of the first electrode pair, the second electrode pair, and the third electrode pair of the light-emitting device of the present invention.

Fig. 10 is a cross-sectional view taken along a section line X of fig. 5.

Fig. 11 is a cross-sectional view taken along section line XI of fig. 5.

Fig. 12 is a cross-sectional view taken along section line XII of fig. 5.

Fig. 13 is a cross-sectional view taken along a section line XIII of fig. 5.

Fig. 14 is a schematic view illustrating another embodiment of a light emitting device without a first encapsulant, a second encapsulant, and a third encapsulant.

Fig. 15 is a schematic plan view of a plurality of first electrode pairs, second electrode pairs, and third electrode pairs of the light-emitting device of the present invention in a manufacturing process.

Detailed Description

In the following description, reference is made to or shown in the accompanying drawings for the purpose of illustrating the general principles of the invention, and not by way of limitation, it is intended that all matter contained in the following description or shown in the accompanying drawings shall be interpreted as illustrative and not in a limiting sense.

Referring to fig. 1 to 6 together, fig. 1, fig. 2 and fig. 3 are schematic views of a light emitting device of the present invention from different viewing angles, fig. 4 is a partially exploded schematic view of the light emitting device of the present invention, fig. 5 is a schematic view of the light emitting device of the present invention without a first encapsulant, a second encapsulant and a third encapsulant, and fig. 6 is a top view of fig. 5.

The light emitting device S includes a package structure S1, a first light emitting chip S2, a second light emitting chip S3, a third light emitting chip S4, a first encapsulant S5, a second encapsulant S6, a third encapsulant S7, and a lens S8. In various embodiments, the light-emitting device S may not have the lens S8.

The package structure S1 includes a body 1, a first electrode pair 3, a second electrode pair 5, and a third electrode pair 7. The body 1 covers the first electrode pair 3, the second electrode pair 5 and the third electrode pair 7, and the first electrode pair 3, the second electrode pair 5 and the third electrode pair 7 are electrically independent. The body 1 comprises a first containing groove 11, a second containing groove 12 and a third containing groove 13, wherein the first containing groove 11, the second containing groove 12 and the third containing groove 13 are arranged in a row and at intervals, and the first containing groove 11 is positioned between the second containing groove 12 and the third containing groove 13. In practical applications, the body 1 may be formed of Epoxy Molding Compound (EMC), but not limited thereto.

The first, second and

third cavities

11, 12 and 13 are disposed corresponding to the first, second and

third electrode pairs

3, 5 and 7, respectively, and a portion of the first electrode pair 3, a portion of the second electrode pair 5 and a portion of the third electrode pair 7 are exposed out of the first, second and

third cavities

11, 12 and 13, respectively, and a portion of the first electrode pair 3, a portion of the second electrode pair 5 and a portion of the third electrode pair 7 are exposed out of a bottom surface 14 of the body 1 (as shown in fig. 3). The first container 11, the second container 12 and the third container 13 respectively have a first opening 111, a second opening 121 and a third opening 131, wherein the area of the first opening 111 is larger than that of the second opening 121, and the area of the first opening 111 is larger than that of the third opening 131. In a preferred application, in a top view of the light emitting device S (as shown in fig. 6), the area of the first opening 111 may be 2 times to 3 times that of the second opening 121 and the third opening 131. Preferably, the second opening 121 and the third opening 131 are equally large.

The first light emitting chip S2, the second light emitting chip S3, and the third light emitting chip S4 are disposed in the first container 11, the second container 12, and the third container 13, respectively, and the first light emitting chip S2, the second light emitting chip S3, and the third light emitting chip S4 are electrically connected to the first electrode pair 3, the second electrode pair 5, and the third electrode pair 7, respectively. The wavelength band of the light beam emitted by the first light emitting chip S2 is different from the wavelength band of the light beam emitted by the second light emitting chip S3, and the wavelength band of the light beam emitted by the first light emitting chip S2 is different from the wavelength band of the light beam emitted by the third light emitting chip S4. For example, the first light emitting chip S2 can emit light in the invisible wavelength band, preferably in the infrared wavelength band, and the second light emitting chip S3 and the third light emitting chip S4 can emit light in the visible wavelength band or in the ultraviolet wavelength band.

In practical applications, the wavelength band to which the light beam emitted from the second light emitting chip S3 belongs may be substantially the same as the wavelength band to which the light beam emitted from the third light emitting chip S4 belongs, i.e., the difference between the wavelength of the light beam emitted from the second light emitting chip S3 and the wavelength of the light beam emitted from the third light emitting chip S4 is not greater than 5 nanometers (nm).

The first encapsulant S5, the second encapsulant S6, and the third encapsulant S7 are disposed in the first container 11, the second container 12, and the third container 13, respectively, and the first encapsulant S5, the second encapsulant S6, and the third encapsulant S7 cover the first light-emitting chip S2, the second light-emitting chip S3, and the third light-emitting chip S4, respectively, and light emitted from the first light-emitting chip S2, the second light-emitting chip S3, and the third light-emitting chip S4 passes through the first encapsulant S5, the second encapsulant S6, and the third encapsulant S7 and is then emitted outward.

In some embodiments, the second encapsulant S6 may include a wavelength conversion material, and the light (preferably blue light or near-ultraviolet light) emitted from the second light emitting chip S3 is partially converted and mixed into white light after passing through the second encapsulant S6, such as white light with a color temperature of 2500 kelvin (K) to 6500 kelvin (K). Similarly, the third encapsulant S7 may contain a wavelength conversion material, and the light (preferably blue light or near-ultraviolet light) emitted by the third light-emitting chip S4 is partially converted and mixed into white light after passing through the third encapsulant S7, such as white light with a color temperature of 2500 kelvin (K) to 6500 kelvin (K). The wavelength converting substance is, for example, a phosphor.

As shown in fig. 4, the top surface S51 of the first encapsulant S5, the top surface S61 of the second encapsulant S6, and the top surface S71 of the third encapsulant S7 may be flush with the top surface 15 of the body 1, and the lens S8 is disposed on the top surface 15 of the body 1, and the lens S8 correspondingly covers the top surface S51 of the first encapsulant S5, the top surface S61 of the second encapsulant S6, and the top surface S71 of the third encapsulant S7. The shape of the lens S8 shown in fig. 4 is only an exemplary shape, and in practical applications, the shape of the lens S8 may vary according to requirements.

The light-emitting device S can be applied to devices such as face snapshot, license plate recognition and the like. Preferably, when the light emitting device S of the present invention is applied to a device for face capture and license plate recognition, the first light emitting chip S2 may be a light emitting diode capable of emitting infrared light (IR) with a wavelength of 750 nanometers (nm), a wavelength of 670 nanometers (nm), a wavelength of 850 nanometers (nm) or a wavelength of 940 nanometers (nm), and a part of light beams emitted by the second light emitting chip S3 and the third light emitting chip S4 may pass through the second encapsulant S6 and the third encapsulant S7 containing phosphor, respectively, to generate white light with a color temperature of 3000K. In different embodiments, the first light emitting chip S2 may also be a Vertical Cavity Surface Emitting Laser (VCSEL) capable of emitting light with a wavelength of 670 nanometers (nm) to increase the irradiation distance of the first light emitting chip S2, the second light emitting chip S3 and the third light emitting chip S4 may be light emitting diodes capable of emitting blue light with a wavelength of 470 nanometers (nm), and the second encapsulant S6 and the third encapsulant S7 may be encapsulant doped with fluorescent particles, so that part of the light beams emitted by the second light emitting chip S3 and the third light emitting chip S4 can be partially converted and mixed into white light after passing through the second encapsulant S6 and the third encapsulant S7.

It should be noted that, as shown in the following table, the package structure S1 may be applied to different fields, and different types of chips and wavelength conversion materials may be disposed in the first container, the second container and the third container of the package structure S1 according to the applied field of the package structure S1.

Referring to fig. 5 to 8, fig. 6 is a schematic top view of fig. 5, fig. 7 is a schematic diagram of a first electrode pair, a second electrode pair and a third electrode pair of a light emitting device (package structure S1) according to the present invention, and fig. 8 is a top view of fig. 7. The first electrode pair 3 includes two first electrode pieces 31, the second electrode pair 5 includes two second electrode pieces 51, and the third electrode pair 7 includes two third electrode pieces 71. The shapes, sizes, etc. of the first electrode sheet 31, the second electrode sheet 51, and the third electrode sheet 71 can be varied according to requirements, and are only an exemplary form.

The two first electrode tabs 31 are coated by the body 1 at intervals, the two second electrode tabs 51 are coated by the body 1 at intervals, the two third electrode tabs 71 are coated by the body 1 at intervals, and the first electrode tabs 31, the second electrode tabs 51 and the third electrode tabs 71 are arranged in the body 1 at intervals.

As shown in fig. 1, 2 and 7, each of the first electrode pads 31 of the first electrode pair 3 may include a plurality of first extending portions 311, and a portion of each of the first extending portions 311 is exposed out of one of the side surfaces 16 of the body 1. Each of the second electrode pads 51 of the second electrode pair 5 may include a plurality of second extending portions 511, and a portion of each of the second extending portions 511 is exposed from one of the side surfaces 16 of the body 1. Each third electrode sheet 71 of the third electrode pair 7 may include at least one third extending portion 711, and a portion of each third extending portion 711 is exposed from one of the side surfaces 16 of the body 1. Each of the first extension portions 311, the second extension portions 511, and the third extension portions 711 may be respectively exposed to three different side surfaces 16 of the body 1. Each of the first extension portions 311, each of the second extension portions 511, and each of the third extension portions 711 exposed from the main body 1 may be used to electrically connect to various external microprocessors, and the microprocessors may independently control the first light emitting chip S2, the second light emitting chip S3, and the third light emitting chip S4.

Referring to fig. 5, fig. 6, fig. 7 and fig. 10, fig. 10 is a cross-sectional view illustrating a light emitting device without a lens, a first encapsulant, a second encapsulant and a third encapsulant. The body 1 can be divided into a peripheral wall 17, a first partition wall 18 and a second partition wall 19, the peripheral wall 17, the first partition wall 18 and the second partition wall 19 are connected to form a first container 11, a second container 12 and a third container, that is, the first partition wall 18 is located between the first container 11 and the second container 12, and the second partition wall 19 is located between the first container 11 and the third container 13. As shown in fig. 10, the height H1 of the first partition wall 18 is higher than the height H2 of the first light emitting chip S2, the height H1 of the first partition wall 18 is also higher than the height H3 of the second light emitting chip S3, the height H4 of the second partition wall 19 is higher than the height H2 of the first light emitting chip S2, and the height H4 of the second partition wall 19 is also higher than the height H5 of the third light emitting chip S4, the first partition wall 18 is used to prevent the light emitted by the first light emitting chip S2 from interfering with the light emitted by the second light emitting chip S3, and the second partition wall 19 is used to prevent the light emitted by the first light emitting chip S2 from interfering with the light emitted by the third light emitting chip S4. In practical applications, the height H1 of the first partition wall 18 may be equal to the height H4 of the second partition wall 19, but not limited thereto. The thickness of the first partition wall 18 and the thickness of the second partition wall 19 may be substantially the same, but not limited thereto.

In the present invention, the first container 11, the second container 12 and the third container 13 are closely arranged, so that the volume of the light emitting device (package structure) can be reduced. As shown in fig. 5 and 6, the first separating wall 18 may further have two bending

sections

181 and 182, and one bending section 181 included in the first separating wall 18 is bent toward the second receiving slot 12, and the other bending section 182 is bent toward the first receiving slot 11. The second separating wall 19 may also have two

curved sections

191, 192, respectively, one of the curved sections 191 included in the second separating wall 19 is bent toward the third accommodating slot 13, and the other curved section 192 is bent toward the first accommodating slot 11. As shown in fig. 6, in the top view of the main body 1, the first receiving slot 11 can be formed by two rectangles a and an octagon B, and in the white, the first receiving slot 11 has a shape with a wider middle and a narrower top and a narrower bottom.

By the design of the first partition wall 18 having two

curved sections

181, 182 and the second partition wall 19 having two

curved sections

191, 192, it is possible to greatly improve the mechanical structural strength of the body 1. More specifically, in the embodiment in which the first partition wall 18 is not provided with the two

bent sections

181 and 182 and the second partition wall 19 is not provided with the two

bent sections

191 and 192, when the light emitting device S is collided by an unexpected external force, both ends of the first partition wall 18 and both ends of the second partition wall 19 are likely to be broken by stress concentration, whereas if the first partition wall 18 is provided with the two

bent sections

181 and 182 and the second partition wall 19 is provided with the two

bent sections

191 and 192, the above problem is unlikely to occur.

Referring to fig. 5, fig. 6, and fig. 10-13, fig. 11 is another cross-sectional view of the light emitting device of the present invention without a lens, a first encapsulant, a second encapsulant, and a third encapsulant. The body 1 may further include a first short wall 20, a second short wall 21 and a third short wall 22, the first short wall 20 is located in the first container 11, the first short wall 20 is disposed on the first electrode sheet 31 of the first electrode pair 3 and is exposed out of a top surface 31A of the first container 11 (as shown in fig. 11), a height H6 of the first short wall 20 is less than a height H1 of the first partition wall 18 (as shown in fig. 10), and a height H6 of the first short wall 20 is less than a height H4 of the second partition wall 19; the second short wall 21 is located in the second container 12, and the second electrode sheet 51 of the second short wall 21 disposed on the second electrode pair 5 is exposed out of a top surface 51A of the second container 12 (as shown in fig. 12), and a height H7 (as shown in fig. 12) of the second short wall 21 is smaller than a height H1 (as shown in fig. 10) of the first partition wall 18; the third short wall 22 is located in the third container 13, and the third electrode sheet 71 of the third short wall 22 disposed on the third electrode pair 7 is exposed on a top surface 71A of the third container 13 (as shown in fig. 13), and a height H8 (as shown in fig. 13) of the third short wall 22 is smaller than a height H4 (as shown in fig. 10) of the second partition wall 19.

As shown in fig. 5, in practical applications, the second light emitting chip S3 can be fixed on one of the second electrode sheets 51, and the second light emitting chip S3 is electrically connected to the other second electrode sheet 51 through a conducting wire, and the conducting wire crosses the second short wall 21; the third light-emitting chip S4 can be fixed on one of the third electrode sheets 71, and the third light-emitting chip S4 is electrically connected to the other third electrode sheet 71 through a conducting wire, wherein the conducting wire crosses the third short wall 22.

In practical applications, in an embodiment where the body 1 is molded (Molding) to cover the first electrode pair 3, the second electrode pair 5, and the third electrode pair 7, the first partition wall 18, the first short wall 20, the second short wall 21, and the third short wall 22 can effectively improve the stability of the body 1 during Molding, enhance the mechanical connection strength between the body 1 and the first electrode pair 3, the second electrode pair 5, and the third electrode pair 7, and reduce the possibility of water vapor intrusion.

As shown in fig. 6 to 8, it is worth mentioning that the surfaces of the first electrode pair 3, the second electrode pair 5 and the third electrode pair 7 may further include a

coating region

312, 512, 712 and an

uncoated region

313, 513, 713, respectively, the

uncoated region

313, 513, 713 is covered by the body 1, and an auxiliary conductive layer S9 (shown as dots in the figures) is disposed on each of the

coating regions

312, 512, 712, the conductivity of the auxiliary conductive layer S9 is higher than the conductivity of the first electrode pair 3, the second electrode pair 5 and the third electrode pair 7, so as to improve the electrical connection efficiency between the first light emitting chip S2 and the first electrode pair 3, between the second light emitting chip S3 and the second electrode pair 5, between the third light emitting chip S4 and the third electrode pair 7. Meanwhile, the auxiliary conductive layer S9 can also be used to reflect the light emitted by the first light emitting chip S2, the second light emitting chip S3 and the third light emitting chip S4, so as to improve the utilization rate of the light beams emitted by the first light emitting chip S2, the second light emitting chip S3 and the third light emitting chip S4. Specifically, the first electrode pair 3, the second electrode pair 5, and the third electrode pair 7 may be copper sheets, and the auxiliary conductive layer S9 may be made of a material including gold, silver, copper, iron, chromium, nickel, platinum, palladium, or any combination thereof.

In practical applications, the areas of the two first electrode sheets 31 of the first electrode pair 3 exposed to the first container 11 may be substantially the coating areas 312 provided with the auxiliary conductive layer S9, the areas of the two second electrode sheets 51 of the second electrode pair 5 exposed to the second container 12 may be substantially the coating areas 512 provided with the auxiliary conductive layer S9, and the areas of the two third electrode sheets 71 of the third electrode pair 7 exposed to the third container 13 may be substantially the coating areas 712 provided with the auxiliary conductive layer S9. Through the arrangement of the auxiliary conductive layer S9, in addition to the electrical connection efficiency between the first light emitting chip S2 and the first electrode pair 3, between the second light emitting chip S3 and the second electrode pair 5, and between the third light emitting chip S4 and the third electrode pair 7, the auxiliary conductive layer S9 can also be used to reflect the light emitted by the first light emitting chip S2, the second light emitting chip S3, and the third light emitting chip S4, so as to improve the utilization rate of the light beams emitted by the first light emitting chip S2, the second light emitting chip S3, and the third light emitting chip S4.

In addition, the surface roughness of the

uncoated regions

313, 513, 713 of each of the first electrode sheet body 31, each of the second electrode sheet body 51, and each of the third electrode sheet body 71 is greater than the surface roughness of the

coated regions

312, 512, 712 of each of the first electrode sheet body 31, each of the second electrode sheet body 51, and each of the third electrode sheet body 71, and the

uncoated regions

313, 513, 713 may serve to reinforce the mechanical connection strength between each of the first electrode sheet body 31, each of the second electrode sheet body 51, and each of the third electrode sheet body 71 and the body 1, respectively. More specifically, in the actual production process of the light-emitting device S of the present invention, before the body 1 covers the first electrode pair 3, the second electrode pair 5 and the third electrode pair 7 by using the injection molding technique, surface roughening (e.g., blast treatment) may be performed prior to the

uncoated regions

313, 513, 713 of each of the first electrode sheet body 31, each of the second electrode sheet bodies 51, and each of the third electrode sheet bodies 71, and an auxiliary conductive layer S9 is formed at the

coated regions

312, 512, 712 of each of the first electrode tab 31, each of the second electrode tab 51, and each of the third electrode tab 71, thus, when the body 1 is subsequently coated with the first electrode pair 3, the second electrode pair 5 and the third electrode pair 7 by using the injection molding technique, the body 1 and the

uncoated regions

313, 513, 713 of each of the second electrode sheet body 51 and each of the third electrode sheet body 71 will have relatively better mechanical coupling strength with each other.

As shown in fig. 7, 8 and 10, in the embodiment in which the main body 1 is formed by injection molding on the two first electrode sheet bodies 31 of the first electrode pair 3, the two second electrode sheet bodies 51 of the second electrode pair 5 and the two third electrode sheet bodies 71 of the third electrode pair 7, in order to enhance the mechanical connection strength between the main body 1, the first electrode sheet bodies 31, the second electrode sheet bodies 51 and the second electrode sheet bodies 51, the second electrode pair 5 and the main body may respectively have the first fitting portion 514 and the second fitting portion 23 that can be fitted into each other, and the third electrode pair 7 and the main body 1 may respectively have the first fitting portion 714 and the second fitting portion 24 that can be fitted into each other. For example, the first engaging portion 514 of each second electrode sheet 51 of the second electrode pair 5 may be a groove, the first engaging portion 714 of each third electrode sheet 71 of the third electrode pair 7 may be a groove, and when the body 1 covers the second electrode pair 5 and the third electrode pair 7 by injection Molding (Molding), a portion of the body 1 (i.e., the second engaging portions 23 and 24) will fill the grooves. Of course, in different embodiments, the first engaging portion 514 of the second electrode pair 5 and the first engaging portion 714 of the third electrode pair 7 may be convex structures such as convex pillars, which is not limited herein.

As shown in fig. 7 and 8, in a preferred embodiment, the engaging portion 514 of the second electrode pair 5 can be a drop-shaped groove, and each second electrode sheet 51 is provided with a drop-shaped groove, the engaging portion 714 of the third electrode pair 7 can be a drop-shaped groove, and each third electrode sheet 71 is provided with a drop-shaped groove; in addition, in the top view of the light emitting device S (as shown in fig. 6), a part of the fitting portion 514 of each second electrode sheet body 51 of the second electrode pair 5 is located in the second accommodating groove 12, and a part of the fitting portion 714 of each third electrode sheet body 71 of the third electrode pair 7 is located in the third accommodating groove 13, so that the mechanical connection strength between each third electrode sheet body 71, each third electrode sheet body 71 and the main body 1 can be further improved.

According to the above, by the design that each of the second electrode sheet bodies 51 is provided with one droplet-shaped groove, and the droplet-shaped grooves of the two second electrode sheet bodies 51 are located at two corners of the second accommodating groove 12, the second encapsulant S6 will be connected to the sidewall of the second accommodating groove 12, and the second encapsulant S6 will also be connected to the embedded portion 23 of the main body 1 filled in the droplet-shaped groove, so that the mechanical connection strength between the corners of the second encapsulant S6 and the main body 1 can be greatly improved. Similarly, by designing the third electrode sheet bodies 71 to have a water-drop-shaped groove, and making the water-drop-shaped grooves of the two third electrode sheet bodies 71 correspondingly located at two corners of the third containing groove 13, the third encapsulant S7, except for being connected to the side wall forming the third containing groove 13, also connects the third encapsulant S7 to the embedded portion 24 of the main body 1 filled in the water-drop-shaped groove, so as to greatly improve the mechanical connection strength between the corners of the third encapsulant S7 and the main body 1, further slow down the intrusion of moisture, and improve the Reliability (Reliability) of the whole light-emitting device S.

Referring to fig. 5 and 11, in practical applications, the main body 1 may further include an auxiliary short wall 25, the auxiliary short wall 25 is located in the first accommodating groove 11, the auxiliary short wall 25 is located above one of the first electrode sheets 31 of the first electrode pair 3, and the auxiliary short wall 25 is embedded with an auxiliary embedding portion 314 of the first electrode pair 3. Specifically, the auxiliary engaging portion 314 of the first electrode sheet 31 may be a groove, and when the main body 1 is formed on the first electrode pair 3 by injection molding, a portion of the auxiliary short wall 25 is engaged with the groove of the first electrode sheet 31, so as to improve the mechanical connection strength between the first electrode pair 3 and the main body 1. In addition, the mechanical connection strength between the reflective filler S10 and the main body 1 can be simultaneously improved by the design of the auxiliary short wall 25.

Fig. 10 to 13 are cross-sectional views of the light emitting device without lens, the first encapsulant, the third encapsulant and the reflective filler at different positions according to the present invention. As shown in fig. 10, in practical applications, an included angle θ 1 between a lateral surface of the first partition wall 18 located in the first accommodating cavity 11 and the vertical surface may be 15 to 25 degrees, and an included angle θ 2 between a lateral surface of the first accommodating cavity 11 and the vertical surface is 15 to 25 degrees, preferably, the included angle θ 1 and the included angle θ 2 may be 21 degrees, so that the first partition wall 18 and the second partition wall 19 are not likely to interfere with the light emitted from the first light emitting chip S2, and the light emitted from the first accommodating cavity 11 of the first light emitting chip S2 can have a good light emitting angle.

In addition, in the embodiment in which the reflective filler S10 is disposed in the first receiving groove 11, the design of making the included angle θ 1 and the included angle θ 2 between 15 degrees and 25 degrees can avoid the problem that the reflective filler S10 overflows to the surface of the first light emitting chip S2 to affect the light emitting efficiency of the first light emitting chip S2 when the reflective filler S10 is formed in the first receiving groove 11.

As shown in fig. 10, an included angle θ 3 between the outer side surface of the second accommodating groove 12 and the vertical surface may be 15 to 20 degrees, and an included angle θ 4 between the outer side surface of the third accommodating groove 13 and the vertical surface may be 15 to 20 degrees. The included angle theta 5 between the inner side surface of the second accommodating groove 12 and the vertical surface can be 5-15 degrees, and the included angle theta 6 between the inner side surface of the third accommodating groove 13 and the vertical surface can be 5-15 degrees.

Preferably, the included angles θ 3 and θ 4 may be 17 degrees, and the included angles θ 5 and θ 6 may be 17 degrees, so that the light emitted from the second light-emitting chip S3 and the third light-emitting chip S4 through the second containing groove 12 and the third containing groove 13 respectively has a better light-emitting angle optical design.

In addition, referring to fig. 6 again, in the embodiment where the second light emitting chip S3 and the third light emitting chip S4 can emit blue light respectively, and the second encapsulant S6 and the third encapsulant S7 are doped with phosphor respectively, in the top view of the light emitting device S, the outer side 12A of the second receiving cavity 12 may be made arc-shaped, and the outer side 13A of the third receiving cavity 13 may be made arc-shaped, so that the light mixing effect of the blue light emitted by the second light emitting chip S3 and the third light emitting chip S4 and the phosphor doped in the second encapsulant S6 and the third encapsulant S7 can be improved.

Referring to fig. 9 and 11 to 13 together, fig. 9 is a schematic view of another view angle of the first electrode pair, the second electrode pair and the third electrode pair of the light emitting device of the present invention, fig. 11 is a schematic cross-sectional view taken along a section line XI of fig. 5, fig. 12 is a schematic cross-sectional view taken along a section line XII of fig. 5, and fig. 13 is a schematic cross-sectional view taken along a section line XIII of fig. 5. The first electrode sheet 31 of the first electrode pair 3, the second electrode sheet 51 of the second electrode pair 5, and the third electrode sheet 71 of the third electrode pair 7 may be respectively formed with a

concave structure

315, 515, 715, and the main body 1 may be correspondingly provided with the auxiliary engaging

portions

26, 27, 28. Specifically, when the main body 1 is formed on the first electrode pair 3, the second electrode pair 5, and the third electrode pair 7 by injection molding, a part of the main body 1 is engaged with the concave structure 315 of each first electrode sheet 31, the concave structure 515 of each second electrode sheet 51, and the concave structure 715 of each third electrode sheet 71, and the engaged parts of the main body 1 and the auxiliary

engaging parts

26, 27, and 28 are the auxiliary

engaging parts

26, 27, and 28. The design of the recessed

structures

315, 515, 715 can enhance the mechanical connection strength between each first electrode sheet 31 of the first electrode pair 3, each second electrode sheet 51 of the second electrode pair 5, and each third electrode sheet 71 of the third electrode pair 7 and the main body 1.

Fig. 14 is a schematic view illustrating another embodiment of a light emitting device without a first encapsulant, a second encapsulant, and a third encapsulant. The biggest difference between this embodiment (as shown in fig. 14) and the previous embodiment (as shown in fig. 5) is that: the light-emitting device S may further include a reflective filler S10. The reflective filler S10 is filled in the first container 11, the reflective filler S10 is located between the first encapsulant S5 and the first electrode pair 3, and the reflective filler S10 covers the first electrode pair 3 and covers the side surface S21 of the first light emitting chip S2. Preferably, the upper surface of the reflective filler S10 is slightly lower than or flush with the upper surface of the first light emitting chip S2. The reflective filler S10 can reflect the light emitted from the first luminescent chip S2, and the reflective filler S10 can make most of the light of the first luminescent chip S2 be emitted from the first opening 111 of the first receiving groove 11, so as to improve the utilization efficiency of the light emitted from the first luminescent chip S2. In practical tests, if the body 1 is made of a material capable of reflecting the light emitted from the first light emitting chip S2, the light emitting efficiency of the first light emitting chip S2 provided with the reflective filler S10 is 10% higher than that of the first light emitting chip S2 not provided with the reflective filler S10. For example, the reflective filler S10 may be, for example: titanium dioxide (TiO2), silicon dioxide (SiO2), or Boron Nitride (BN).

It should be noted that in the embodiment where the reflective filler S10 is disposed in the first receiving groove 11, the first short wall 20 may be annular, and the first short wall 20 and the first electrode sheet 31 therein together form a groove 221, and when the reflective filler S10 is filled in the first receiving groove 11, a portion of the reflective filler S10 is filled in the groove 221, so as to improve the mechanical connection strength between the reflective filler S10 and the main body 1.

Fig. 15 is a schematic top view of a plurality of first electrode pairs, second electrode pairs and third electrode pairs of a light emitting device (package structure) according to the present invention in a manufacturing process. In practical applications, the first electrode pair 3, the second electrode pair 5 and the third electrode pair 7 of the plurality of light emitting devices S (the package structure S1) may be manufactured together, and each of the first electrode sheets 31 may have three first extending portions 311, and the three first extending portions 311 are respectively connected to the first extending portion 311 of the adjacent first electrode sheet 31, the second extending portion 511 of the adjacent second electrode sheet 51 and the third extending portion 711 of the adjacent third electrode sheet 71; that is, each of the first electrode pieces 31 is connected to the adjacent second electrode piece 51 and the adjacent third electrode piece 71 through the three first extending portions 311, so that the second electrode piece 51 or the third electrode piece 71 is prevented from being connected to other electrode pieces and causing an islanding effect. The second extension part 511 of each second electrode tab 51 may be connected to the second extension parts 511 of two adjacent second electrode tabs 51, or the second extension part 511 of each second electrode tab 51 may also be connected to the third extension parts 711 of two third electrode tabs 71; the third extension 711 of each third electrode sheet 71 may be connected to the third extension 711 of the adjacent third electrode sheet 71, or the third extension 711 of each third electrode sheet 71 may also be connected to the second extension 511 of the adjacent second electrode sheet 51, so that the stability of each first electrode sheet 31, each second electrode sheet 51, and each third electrode sheet 71 when the body 1 is formed on each first electrode sheet 31, each second electrode sheet 51, and each third electrode sheet 71 can be greatly improved, and the islanding effect of each first electrode sheet 31 will not occur in the process of forming the body 1. Of course, in practical applications, the connection manner among the first electrode tab bodies 31, the second electrode tab bodies 51, and the third electrode tab bodies 71 is not limited to the above description.

In summary, when the light emitting device of the present invention is applied to a device for face capture and license plate recognition, the light emitting device of the present invention has an advantage of small size compared to the existing light emitting device, and the infrared light emitted by the first light emitting chip of the light emitting device of the present invention is not interfered by the light emitted by the second light emitting chip and the light emitted by the third light emitting chip, and the light emitting device of the present invention has an advantage of better light emitting effect compared to the existing light emitting device.

The above description is only a preferred embodiment of the present invention, and not intended to limit the scope of the present invention, so that equivalent technical changes made by using the contents of the present specification and the drawings are included in the scope of the present invention.

Claims

1. A light-emitting device, comprising:

a package structure, comprising:

a first electrode pair, a second electrode pair and a third electrode pair;

a body covering the first electrode pair, the second electrode pair and the third electrode pair, wherein the body comprises a first accommodating groove, a second accommodating groove and a third accommodating groove, the first accommodating groove is positioned between the second accommodating groove and the third accommodating groove, and the first accommodating groove, the second accommodating groove and the third accommodating groove are respectively arranged corresponding to the first electrode pair, the second electrode pair and the third electrode pair and expose the first electrode pair, the second electrode pair and the third electrode pair;

the first light-emitting chip, the second light-emitting chip and the third light-emitting chip are respectively arranged in the first accommodating groove, the second accommodating groove and the third accommodating groove and are respectively electrically connected with the first electrode pair, the second electrode pair and the third electrode pair; and

a first encapsulant, a second encapsulant and a third encapsulant, which are respectively disposed in the first, second and third receiving slots and respectively cover the first, second and third light-emitting chips;

the first containing groove, the second containing groove and the third containing groove are respectively provided with a first opening, a second opening and a third opening, the area of the first opening is larger than that of the second opening, and the area of the first opening is larger than that of the third opening;

the wavelength band of the light beam emitted by the first light-emitting chip is different from the wavelength band of the light beam emitted by the second light-emitting chip, and the wavelength band of the light beam emitted by the first light-emitting chip is different from the wavelength band of the light emitted by the third light-emitting chip;

the body further comprises a first partition wall and a second partition wall, the first partition wall is located between the first containing groove and the second containing groove, and the second partition wall is located between the first containing groove and the third containing groove;

the body comprises an auxiliary short wall, the first electrode pair comprises an auxiliary embedding part, and the auxiliary short wall and the auxiliary embedding part are mutually embedded and cover part of the first electrode pair.

2. The light-emitting device according to claim 1, wherein the first light-emitting chip is capable of emitting light in an infrared light band.

3. The light-emitting device according to claim 2, wherein the second light-emitting chip and the third light-emitting chip can emit light in a blue light band.

4. The light-emitting device according to claim 3, wherein the second encapsulant and the third encapsulant respectively contain wavelength conversion materials, and light emitted from the second light-emitting chip and the third light-emitting chip respectively passes through the second encapsulant and the third encapsulant, and is partially converted and mixed into white light.

5. The lighting device according to claim 4, wherein the color temperature of the white light is 2500 Kelvin (K) to 6500 Kelvin (K).

6. The lighting device of claim 1, further comprising a lens disposed on the top surface of the body.

7. The light-emitting device according to claim 1, further comprising a reflective filler filled in the first receiving cavity, wherein the reflective filler is located between the first encapsulant and the first electrode pair, and covers the first electrode pair and covers a side surface of the first light-emitting chip.

8. The light-emitting device according to claim 1, wherein in a top view of the light-emitting device, the area of the first opening is 2 times to 3 times that of the second opening, and the area of the first opening is 2 times to 3 times that of the third opening.

9. The light-emitting device according to claim 1, wherein the first partition wall and the second partition wall each have two curved sections.

10. The lighting device as defined in claim 9, wherein the height of the first partition wall is equal to the height of the second partition wall.

11. The light-emitting device according to claim 9, wherein the first partition wall includes one of the curved sections that is bent toward the second receiving groove, and the other curved section that is bent toward the first receiving groove; one bending section included in the second partition wall is bent towards the third containing groove, and the other bending section is bent towards the first containing groove.

12. The light-emitting device according to claim 9, wherein the body further comprises a first short wall, a second short wall and a third short wall, the first short wall, the second short wall and the third short wall are respectively disposed in the first accommodating groove, the second accommodating groove and the third accommodating groove.