CN106328795A - Medical phototherapy pc-LEDs lamp - Google Patents
Medical phototherapy pc-LEDs lamp Download PDFInfo
- Publication number
- CN106328795A CN106328795A CN201610919566.3A CN201610919566A CN106328795A CN 106328795 A CN106328795 A CN 106328795A CN 201610919566 A CN201610919566 A CN 201610919566A CN 106328795 A CN106328795 A CN 106328795A
- Authority
- CN
- China
- Prior art keywords
- light
- led
- red
- leds
- lamp
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000001126 phototherapy Methods 0.000 title claims abstract description 36
- 239000000843 powder Substances 0.000 claims abstract description 121
- 238000000034 method Methods 0.000 claims abstract description 49
- 239000000084 colloidal system Substances 0.000 claims abstract description 14
- 238000001228 spectrum Methods 0.000 claims abstract description 10
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 claims description 129
- 239000002002 slurry Substances 0.000 claims description 103
- 239000000463 material Substances 0.000 claims description 74
- 239000000203 mixture Substances 0.000 claims description 54
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 45
- 239000000741 silica gel Substances 0.000 claims description 45
- 229910002027 silica gel Inorganic materials 0.000 claims description 45
- 239000003292 glue Substances 0.000 claims description 43
- 238000010438 heat treatment Methods 0.000 claims description 42
- 230000000694 effects Effects 0.000 claims description 18
- 230000003595 spectral effect Effects 0.000 claims description 18
- 239000000758 substrate Substances 0.000 claims description 9
- 239000003822 epoxy resin Substances 0.000 claims description 8
- 229920000647 polyepoxide Polymers 0.000 claims description 8
- 238000005304 joining Methods 0.000 claims description 7
- 229920003229 poly(methyl methacrylate) Polymers 0.000 claims description 7
- 239000004926 polymethyl methacrylate Substances 0.000 claims description 7
- 208000037265 diseases, disorders, signs and symptoms Diseases 0.000 claims description 5
- 239000011248 coating agent Substances 0.000 claims description 4
- 238000000576 coating method Methods 0.000 claims description 4
- 201000010099 disease Diseases 0.000 claims description 4
- 238000000295 emission spectrum Methods 0.000 claims description 4
- 230000004071 biological effect Effects 0.000 claims description 3
- 150000004767 nitrides Chemical class 0.000 claims description 3
- 230000008569 process Effects 0.000 claims description 3
- 230000019522 cellular metabolic process Effects 0.000 claims description 2
- 230000004907 flux Effects 0.000 claims description 2
- 238000005286 illumination Methods 0.000 claims description 2
- 230000001737 promoting effect Effects 0.000 claims description 2
- 206010061218 Inflammation Diseases 0.000 claims 1
- 238000001652 electrophoretic deposition Methods 0.000 claims 1
- 238000007590 electrostatic spraying Methods 0.000 claims 1
- 230000002708 enhancing effect Effects 0.000 claims 1
- 230000005284 excitation Effects 0.000 claims 1
- 230000004054 inflammatory process Effects 0.000 claims 1
- 238000010422 painting Methods 0.000 claims 1
- 238000007639 printing Methods 0.000 claims 1
- 238000004528 spin coating Methods 0.000 claims 1
- 238000005507 spraying Methods 0.000 claims 1
- 238000005516 engineering process Methods 0.000 abstract description 9
- 238000004519 manufacturing process Methods 0.000 abstract 1
- 238000001035 drying Methods 0.000 description 79
- 238000007711 solidification Methods 0.000 description 36
- 230000008023 solidification Effects 0.000 description 36
- 230000009471 action Effects 0.000 description 8
- 239000004372 Polyvinyl alcohol Substances 0.000 description 7
- 229910019990 cerium-doped yttrium aluminum garnet Inorganic materials 0.000 description 7
- 229920002120 photoresistant polymer Polymers 0.000 description 7
- 229920002451 polyvinyl alcohol Polymers 0.000 description 7
- 210000004027 cell Anatomy 0.000 description 5
- 238000006243 chemical reaction Methods 0.000 description 5
- 239000011521 glass Substances 0.000 description 5
- 241001062009 Indigofera Species 0.000 description 4
- 230000001276 controlling effect Effects 0.000 description 4
- 229920002521 macromolecule Polymers 0.000 description 4
- -1 polyethylene oxygen ethyl-cinnamic acid Polymers 0.000 description 4
- 238000002360 preparation method Methods 0.000 description 4
- 208000002874 Acne Vulgaris Diseases 0.000 description 3
- UHOVQNZJYSORNB-UHFFFAOYSA-N Benzene Chemical compound C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 description 3
- 206010000496 acne Diseases 0.000 description 3
- 230000008901 benefit Effects 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 239000000839 emulsion Substances 0.000 description 3
- 210000001519 tissue Anatomy 0.000 description 3
- 102000016938 Catalase Human genes 0.000 description 2
- 108010053835 Catalase Proteins 0.000 description 2
- 239000002253 acid Substances 0.000 description 2
- 230000000844 anti-bacterial effect Effects 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 230000017531 blood circulation Effects 0.000 description 2
- 150000001875 compounds Chemical class 0.000 description 2
- 238000001723 curing Methods 0.000 description 2
- 150000002148 esters Chemical class 0.000 description 2
- 238000011049 filling Methods 0.000 description 2
- 239000000499 gel Substances 0.000 description 2
- 230000004060 metabolic process Effects 0.000 description 2
- 238000002156 mixing Methods 0.000 description 2
- 230000005855 radiation Effects 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 238000003786 synthesis reaction Methods 0.000 description 2
- 229920002554 vinyl polymer Polymers 0.000 description 2
- 230000029663 wound healing Effects 0.000 description 2
- KGIGUEBEKRSTEW-UHFFFAOYSA-N 2-vinylpyridine Chemical class C=CC1=CC=CC=N1 KGIGUEBEKRSTEW-UHFFFAOYSA-N 0.000 description 1
- 208000024827 Alzheimer disease Diseases 0.000 description 1
- 206010008190 Cerebrovascular accident Diseases 0.000 description 1
- 102000008186 Collagen Human genes 0.000 description 1
- 108010035532 Collagen Proteins 0.000 description 1
- 208000020401 Depressive disease Diseases 0.000 description 1
- 201000004624 Dermatitis Diseases 0.000 description 1
- 241000196324 Embryophyta Species 0.000 description 1
- 206010023138 Jaundice neonatal Diseases 0.000 description 1
- YJPIGAIKUZMOQA-UHFFFAOYSA-N Melatonin Natural products COC1=CC=C2N(C(C)=O)C=C(CCN)C2=C1 YJPIGAIKUZMOQA-UHFFFAOYSA-N 0.000 description 1
- 201000006346 Neonatal Jaundice Diseases 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- 241000186429 Propionibacterium Species 0.000 description 1
- 206010039966 Senile dementia Diseases 0.000 description 1
- 206010040943 Skin Ulcer Diseases 0.000 description 1
- 208000006011 Stroke Diseases 0.000 description 1
- 229910009372 YVO4 Inorganic materials 0.000 description 1
- 210000001789 adipocyte Anatomy 0.000 description 1
- 150000001336 alkenes Chemical class 0.000 description 1
- 239000002260 anti-inflammatory agent Substances 0.000 description 1
- 230000003110 anti-inflammatory effect Effects 0.000 description 1
- 230000001741 anti-phlogistic effect Effects 0.000 description 1
- 125000000852 azido group Chemical group *N=[N+]=[N-] 0.000 description 1
- 238000005842 biochemical reaction Methods 0.000 description 1
- 210000004556 brain Anatomy 0.000 description 1
- 239000011575 calcium Substances 0.000 description 1
- 239000001506 calcium phosphate Substances 0.000 description 1
- 229910000389 calcium phosphate Inorganic materials 0.000 description 1
- 235000011010 calcium phosphates Nutrition 0.000 description 1
- 238000005266 casting Methods 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- ZCDOYSPFYFSLEW-UHFFFAOYSA-N chromate(2-) Chemical compound [O-][Cr]([O-])(=O)=O ZCDOYSPFYFSLEW-UHFFFAOYSA-N 0.000 description 1
- 229940114081 cinnamate Drugs 0.000 description 1
- 229920001436 collagen Polymers 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- SOCTUWSJJQCPFX-UHFFFAOYSA-N dichromate(2-) Chemical group [O-][Cr](=O)(=O)O[Cr]([O-])(=O)=O SOCTUWSJJQCPFX-UHFFFAOYSA-N 0.000 description 1
- 239000002552 dosage form Substances 0.000 description 1
- 230000002500 effect on skin Effects 0.000 description 1
- 210000004177 elastic tissue Anatomy 0.000 description 1
- 238000004134 energy conservation Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 229910052736 halogen Inorganic materials 0.000 description 1
- 230000008821 health effect Effects 0.000 description 1
- 210000003701 histiocyte Anatomy 0.000 description 1
- 238000001727 in vivo Methods 0.000 description 1
- 230000002757 inflammatory effect Effects 0.000 description 1
- 238000004020 luminiscence type Methods 0.000 description 1
- 208000024714 major depressive disease Diseases 0.000 description 1
- 206010025482 malaise Diseases 0.000 description 1
- 201000003995 melancholia Diseases 0.000 description 1
- DRLFMBDRBRZALE-UHFFFAOYSA-N melatonin Chemical compound COC1=CC=C2NC=C(CCNC(C)=O)C2=C1 DRLFMBDRBRZALE-UHFFFAOYSA-N 0.000 description 1
- 229960003987 melatonin Drugs 0.000 description 1
- 230000003340 mental effect Effects 0.000 description 1
- 150000004702 methyl esters Chemical class 0.000 description 1
- 231100000957 no side effect Toxicity 0.000 description 1
- 230000001473 noxious effect Effects 0.000 description 1
- JRZJOMJEPLMPRA-UHFFFAOYSA-N olefin Natural products CCCCCCCC=C JRZJOMJEPLMPRA-UHFFFAOYSA-N 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 230000000737 periodic effect Effects 0.000 description 1
- 238000000016 photochemical curing Methods 0.000 description 1
- 230000001443 photoexcitation Effects 0.000 description 1
- 239000003504 photosensitizing agent Substances 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 239000011118 polyvinyl acetate Substances 0.000 description 1
- 229920002689 polyvinyl acetate Polymers 0.000 description 1
- HNJBEVLQSNELDL-UHFFFAOYSA-N pyrrolidin-2-one Chemical compound O=C1CCCN1 HNJBEVLQSNELDL-UHFFFAOYSA-N 0.000 description 1
- 230000001105 regulatory effect Effects 0.000 description 1
- 231100000241 scar Toxicity 0.000 description 1
- 230000028327 secretion Effects 0.000 description 1
- 231100000019 skin ulcer Toxicity 0.000 description 1
- 229910019655 synthetic inorganic crystalline material Inorganic materials 0.000 description 1
- WBYWAXJHAXSJNI-VOTSOKGWSA-M trans-cinnamate Chemical compound [O-]C(=O)\C=C\C1=CC=CC=C1 WBYWAXJHAXSJNI-VOTSOKGWSA-M 0.000 description 1
- 239000012780 transparent material Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 238000005303 weighing Methods 0.000 description 1
- 230000037303 wrinkles Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
- H01L33/501—Wavelength conversion elements characterised by the materials, e.g. binder
- H01L33/502—Wavelength conversion materials
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
- H01L33/501—Wavelength conversion elements characterised by the materials, e.g. binder
- H01L33/502—Wavelength conversion materials
- H01L33/504—Elements with two or more wavelength conversion materials
-
- A—HUMAN NECESSITIES
- A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
- A61N—ELECTROTHERAPY; MAGNETOTHERAPY; RADIATION THERAPY; ULTRASOUND THERAPY
- A61N5/00—Radiation therapy
- A61N5/06—Radiation therapy using light
- A61N2005/065—Light sources therefor
- A61N2005/0651—Diodes
-
- A—HUMAN NECESSITIES
- A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
- A61N—ELECTROTHERAPY; MAGNETOTHERAPY; RADIATION THERAPY; ULTRASOUND THERAPY
- A61N5/00—Radiation therapy
- A61N5/06—Radiation therapy using light
- A61N2005/0658—Radiation therapy using light characterised by the wavelength of light used
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
- H01L2933/0041—Processes relating to semiconductor body packages relating to wavelength conversion elements
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Luminescent Compositions (AREA)
Abstract
The invention discloses a manufacturing method of a medical phototherapy pc-LEDs lamp. The method includes the following steps that firstly, red fluorescent powder and colloid are mixed to form uniform powder pulp, then the powder pulp is applied to a structure provided with a blue light or ultraviolet LED chip, and a pc-LEDs device capable of outputting red light or far-infrared light on the blue light or ultraviolet LED chip is obtained. The method for outputting red light or far-infrared light on the blue light or ultraviolet LED chip is obtained. By changing components of the red fluorescent powder and the proportion of the red fluorescent powder to colloid, the intensity and the spectrum (chroma) of red light and the proportion of the red light to blue light are changed. The technology is low in cost, the structure is simple, red light, blue light and far-infrared light distribution is uniform, and the technology is well applied to the medical phototherapy field.
Description
Technical field
The invention belongs to field of photoelectric technology, be specifically related to the coating technology of the pc-LEDs lamp of a kind of medical phototherapy.
Background technology
Phototherapy is called again photoirradiation treatment, and its principle is to utilize photo bio effect, makes human body with the illumination of specific wavelength
Skin or some histiocyte expedite the emergence of long or Developing restraint, thus reach the purpose for the treatment of.Phototherapy is effectively faced as one
Bed treatment means, because of advantages such as its noinvasive is painless, low cost, treatment are convenient, side effect is little, applies the most extensive.
Phototherapy is by absorbing the luminous energy of different wave length, and biological tissue produces a series of biochemical reaction in vivo, from
And reach different curative effects.Red light (600～700nm) makes the catalase activity of human body increase by photochemical effect
Add, accelerate cell metabolism, promote cell synthesis, promote wound healing, can be to multiple disease treatment.Wavelength is left at 635nm
Right HONGGUANG has the features such as purity is high, energy density is uniform.In terms of skin care and treatment significantly, it is referred to as biological activity
Light.HONGGUANG makes cytoactive improve, and enhances metabolism, after can penetrating epiderm skin arrival dermal layer of the skin, by light
Light and heat chemical action, promotes elastic fibers and regenerated collagen fiber and rearranges, thus reaching to alleviate wrinkle of skin, increase
Elastic effect, has traditional skin care to be beyond one's reach effect.Additionally, find that the HONGGUANG of 635nm can also reduce fat according to the study
Fat cell size, has effect of noinvasive fat-reducing.Far-red light (700-760nm) with blood circulation promoting, can strengthen the work of cell
Property.Blue light (425～475nm) promotes the secretion of the melatonin playing regulatory role human body biological periodic, strengthens brain vigor, subtracts
The risk of few senile dementia is simultaneously notable to the treatment of neonatal jaundice disease.Wavelength is that the blue light of 415nm has and quickly suppresses scorching
Effect of disease.Efficiently destroy the propionibacterium in acne forming process, make the acne of inflammatory phase significantly reduce.Purple light and blue light class
Seemingly, the effect of bactericidal antiphlogistic can be played on a small quantity, useful to tissue in right amount.
Compared with conventional fluorescent lamps etc., LED has following significant advantage: (1) is energy-conservation, the electric energy conversion efficiency of white light LEDs
Reach 80%；(2) environmental protection, LED does not produce noxious substance, and glow color is pure, without ultraviolet and infra-red radiation；
(3) life-span is long, and mission reaches more than 50,000 hours, is more than 5 times of fluorescent lamp；(4) cold light source, does not has infrared and far light
Spectrum composition, is a kind of cold light source, can irradiate without phenomenon skin ambustion or tissue occur close to surface, affected part.
Therefore, LED light source has been paid attention to it is considered to be the perfect light source of medical phototherapy by medical institutions.
Summary of the invention
The present invention is obtained by coated red fluorescent material on blue light or UV LED chip has HONGGUANG, far-red light and indigo plant
Light or the LED of ultraviolet light, the LED (pc-LEDs) of this fluorescent material conversion type is different from traditional red chip+indigo plant chip
Multi-chip structure, only needs single blueness or UV LED chip to coordinate the red fluorescence powder of photoexcitation to can be achieved with medical
The output of HONGGUANG, far-red light, blue light or ultraviolet light required for phototherapy, the multiple light such as this technical costs is low, simple in construction, red indigo plant
It is evenly distributed, will have well application in medical phototherapy.
The technical scheme is that the pc-LEDs lamp of a kind of medical phototherapy, it is characterised in that comprise the following steps:
(1), red fluorescence powder is mixed according to a certain percentage with colloid acquisition phosphor slurry；
(2), phosphor slurry is coated on the surface of blue light or UV LED chip light emission direction:
(3), the phosphor slurry of coating is heating and curing；
(4), to the LED being coated with fluorescent material carry out embedding process, be then assembled into LED lamp with one or plurality of LEDs.
In step (1), described colloid is silica gel, epoxy resin, polymethyl methacrylate (PMMA), Merlon
(PC) one or more combinations or in photoresists；Described photosensitive colloid includes following three class negative-working photoresists: the most photosensitive
Agent+film forming dosage form, i.e. photosensitive compounds+macromolecular compound type, wherein photosensitizer is bichromate, chromate, diazotising
One or more combination in compound or azido cpd；Film former is polyvinyl alcohol (PVA), Arabic tree
One or more combination in glue, polyimides or polyvinyl acetate Emulsion；2. the macromolecular compound with photosensitive base
Type, mainly has polyvinyl cinnamate, polyvinyl alcohol Cortex Cinnamomi fork acetas, polyethylene oxygen ethyl-cinnamic acid ester, polyethylene pyrrole
One or more combination in pyrrolidone or polyvinyl alcohol-p-azidobenzoic acid ester (PVAB)；3. SBQ photoresists (poly-second
Enol cyclic ketal styryl pyridinium resin photoresists), SBQ-PVA+ macromolecule Emulsion, SBQ-PVA+ macromolecule Emulsion+the third
One or more combination in olefin(e) acid ester or organic benzene, organic vinylpyridine salt resin photoresists system；Photosensitive colloid is above-mentioned
One class of three apoplexy due to endogenous wind or the combination of multiclass；
In described pc-LEDs lamp, red fluorescence powder used has wider red spectral components (600～760nm),
Wherein can select 635nm wavelength is peak wavelength, and comprises far-red light (700-760nm), its emission spectrum such as accompanying drawing 1.3 institute
Show.Red light (600～700nm) makes the catalase activity of human body increase by photochemical effect, accelerates cell the oldest
Metabolism, promotes cell synthesis, promotes wound healing, can be to multiple disease treatment.Far-red light (700-760nm) can promote blood
Circulation, strengthens the activity of cell.Wherein the HONGGUANG of 635nm wavelength is biological activity light, and beautifying skin and preserving health effect is the most notable.
In described pc-LEDs lamp, selected red fluorescence powder can select peak wavelength at 610nm～720nm model
The different fluorescent material enclosed.These have the fluorescent material of HONGGUANG can be YAGG, YAGG:Ce3+, YAG:Eu2+ and nitride red
Fluorescent material etc. are therein a kind of or their combination.
In described pc-LEDs lamp, its emission spectrum of the red fluorescence powder of selection is wider so that described for medical light
The pc-LEDs light fixture treated has wider red-light spectrum composition (600-760nm), wherein comprises far-red light composition (700-760nm),
According to different fluorescent material and the ratio joining arogel, in the output light of described pc-LEDs lamp, red and far-red light ratio, R/FR
=0.2～20.
Above-mentioned red fluorescence powder used refers to send HONGGUANG under blue (or ultraviolet) LED light excites or containing red
The fluorescent material of light spectral component, when some blue light (or ultraviolet) is converted into the redness required for medical phototherapy by excited fluorescence powder
During composition, the luminous then outgoing of other segment chips the royal purple light providing antiinflammatory to dispel skin ulcer,；When red fluorescence powder increasing proportion
Waiting, blue (ultraviolet) LED light is all converted to HONGGUANG.
Different fluorescent material mixing can obtain wider spectrum, and can produce various spectrum, such as, use ultraviolet LED
Chip combines the blue output that can realize indigo plant+HONGGUANG with red fluorescence powder, arranges by controlling the ratio of fluorescent material blue, red, also may be used
To realize purple+blue+red light output, or the output of different proportion between various light component, single redness can be made up
The deficiency of light-emitting phosphor spectrum.
In described phosphor slurry, fluorescent material is 0.1～0.25 with the ratio joining arogel；Different phosphor concentration, it is possible to real
Red light (600～760nm)/blue light (400～500nm) ratios different in existing emergent light, R/B=0.1～100, when swashing
Encourage chip when being ultraviolet LED, red light (600～760nm)/purple light (320～400nm) ratio in output light, R/V=0.1
～100.Different proportion of red blue light can meet different phototherapy demands.
Described LED is organic LED, inorganic LED or a combination of both；Described LED is single LEDs chip, or
The plurality of LEDs chipset of same substrate, or whole wafer, the difference that can require according to phototherapy, chipset is synthesized not
The structure (array) of similar shape and size；Or the wafer being coated with fluorescent material as required cuts into suitable size and shape
Shape, to meet the requirement of medical phototherapy devices under different situations.
Described fluorescent material conversion type medical phototherapy LED is with existing multi-chip chip portfolio (LED chip blue, red) structure
LED has obvious structure different, and it is fluorescent material conversion type (pc-LED), and this chip-packaging structure is more stable,
Each wave band ratio uniform of different angles, technique is simpler thus obvious cost advantage.
Described fluorescent material conversion type LED is with the single-chip that there is now, single-range blue light phototherapy LED and HONGGUANG light
Treatment LED is different, mixed proportion so that mutually strengthen effect between different-waveband, curative effect faster, have no side effect.Compare red
Phototherapeutic instrument made by light LED chip, blue chip cost is lower, simple and convenient.
In described LED, phosphor slurry can be coated on the light-emitting area of LED chip, it is also possible to by fluorescence
Powder slurry is coated on the surface of the arbitrary exit direction leaving LED chip.
In step (2), phosphor slurry can be coated in LED chip, form fluorescent material and directly contact LED chip
Structure, as shown in accompanying drawing 1.1, this encapsulating structure is compact, simple and easy to do.Phosphor slurry can also be coated in simultaneously
On LED lens hood, as shown in accompanying drawing 1.2, this mode fluorescent material leaves chip heating surface, can preferably dispel the heat, and
Simplification of flowsheet.
Fluorescent material is coated on the lens surface of arbitrary exit direction, and if desired the red blue light of different proportion, the most permissible
Combining with LED chip with the lens being coated with different phosphor concentration ratio, this mode is by more flexible and convenient satisfied difference
The medical phototherapy of the demand requirement to light colour content.
In step (2), carrier fluorescent powder coated in arbitrary exit direction can also be glass substrate, it is also possible to be it
The surface of his transparent material.
In described LED preparation process (2), lid fluorescent material Han different proportion can be coated in chip light outgoing side
In substrates of different, needing to convert substrate to light according to phototherapy different phase, described substrate can be that glass lithographic plate can also
It is various forms of lens.
In described LED preparation process (3), described curing mode can be body of heater heating or the one of Infrared Heating
Plant or depending on multiple combination, required solidification temperature and the time Property requirements according to colloid (such as silica gel, epoxy resin)；Also
Can be photocuring, such as, use Photosetting colloid, photoresists etc..
In described LED preparation process (4), it is coated with the LED silica gel of fluorescent material, epoxy resin, poly-methyl-prop
E pioic acid methyl ester (PMMA), Merlon (PC) carry out embedding, and the effect of embedding can completely cut off air and water, extend chip, device
In the life-span, can reduce simultaneously and shake chip, the infringement of device, embedding structure may also operate as taking out the effect of optical lens, permissible
Preferably heat radiation and raising LED go out light quality.The solidification temperature of its casting glue and time according to different colloids Property requirements
Depending on.
The LED lamp structure assembled in the described LED preparation process (4) can be super flux LED lamp bar, shot-light, bulb lamp,
Down lamp, fluorescent tube lamp, filament lamp, flat lamp, different structures meets different occasion, the different modes needs to phototherapy.
For the red blue light of different proportion to be obtained, can be by controlling the ratio realization of colloid and red fluorescence powder, also
Can control by controlling the coated weight of phosphor slurry, it is also possible to by controlling the kind of different fluorescent material and multiple fluorescence
Ratio when powder is used in mixed way controls.
Use this technology that LED can be made to go out light and contain a certain proportion of HONGGUANG, blue light (or ultraviolet light) and far-red light.
The technology of the present invention is not only suitable for the red-light LED device of red fluorescence powder+blue-light LED chip and prepares, and is also suitable for
UV LED chip+multicolor phosphor (such as RGB three primary colors fluorescent powder) containing red-light LED implementation.
Use the technology of the present invention make LED component, it is provided that 400～500nm royal purple light needed for medical phototherapy and
600～700nm reddish orange light and the far-red light of 700～760nm, the redness of proper proportion, blue light, and it is specific to have other
The spectral component (playing bactericidal action etc. as supplemented a little ultraviolet light) required.Can regulate accurately required spectral region,
Save the energy.
Use the LED component that the technology of the present invention makes, the ratio that fluorescent material can be controlled with join arogel, suitably regulate spectrum
Ratio, thus for different medical phototherapy, such as, make the Phototherapeutic instrument such as skin Caring, manicure；Treatment dermatitis, acne, speckle dispelling, scar of dispelling
Deng；Can also be used for room lighting treatment melancholia and wait some mental sickness.
Accompanying drawing explanation
Accompanying drawing 1.1 is coated in LED schematic diagram after chip surface and embedding silica gel for fluorescent material.Fig. 1 .2 is to be coated with by fluorescent material
Overlay on the schematic diagram of lens hood.Wherein, 1 is LED chip, and 2 is phosphor powder layer, and 3 is filling gel, and 4 is reflection cup, and 5 is lining
The end, 6 is lens hood.
Accompanying drawing 1.3 is the luminescent spectrum figure of the red LED lamp of described nitride red fluorescent powder.
Accompanying drawing 1.4 is the LED luminescence relative spectral figure that red fluorescence powder is corresponding with colloid different proportion.
The light fixture schematic diagram that accompanying drawing 1.5 forms for plurality of LEDs, is coated on lens hood as a example by structure by fluorescent material, wherein
1,2,3 is different proportion or different types of phosphor powder layer.
Detailed description of the invention
Below in conjunction with the accompanying drawings and case study on implementation the invention will be further described:
Embodiment 1
Weigh 0.2g fluorescent material, 1g joins arogel and by both mix homogeneously, deaeration machine evacuation removes bubble and obtains fluorescence
Powder slurry；
Use dotting glue method to be coated in by phosphor slurry on LED chip surface, be dried 2 with drying baker heating (150 DEG C) little
Time, it is thus achieved that phosphor powder layer；
Above-mentioned LED chip is covered lens hood embedding silica gel simultaneously, in drying baker, then heats (120 DEG C) solidification 2 little
Time；
Finally employing one or plurality of LEDs are fabricated to LED lamp；
Record the blue light almost all that light fixture sent and be converted into HONGGUANG, HONGGUANG (600～700nm) and far-red light (700
～760nm) ratio be 6.2:1.Relative spectral figure is shown in accompanying drawing 1.4 (1).
Embodiment 2
Weigh 0.2g fluorescent material, 1.6g joins arogel and by both mix homogeneously, deaeration machine evacuation removes bubble and obtains glimmering
Light powder slurry；
Use dotting glue method to be coated in by phosphor slurry on LED chip surface, be dried 2 with drying baker heating (150 DEG C) little
Time, it is thus achieved that phosphor powder layer；
Above-mentioned LED chip is covered lens hood embedding silica gel simultaneously, in drying baker, then heats (120 DEG C) solidification 2 little
Time；
Finally employing one or plurality of LEDs are fabricated to LED lamp；
Record the HONGGUANG in the spectral component that light fixture is sent (600～700nm) and blue light (400～500nm) ratio is
30.5:1；HONGGUANG (600～700nm) is 8.4:1 with the ratio of far-red light (700～760nm).
Embodiment 3
Weigh 0.2g fluorescent material, 2g joins arogel and by both mix homogeneously, deaeration machine evacuation removes bubble and obtains fluorescence
Powder slurry；
Use dotting glue method to be coated in by phosphor slurry on LED chip surface, be dried 2 with drying baker heating (150 DEG C) little
Time, it is thus achieved that phosphor powder layer；
Above-mentioned LED chip is covered lens hood embedding silica gel simultaneously, in drying baker, then heats (120 DEG C) solidification 2 little
Time；
Finally employing one or plurality of LEDs are fabricated to LED lamp；
Record the HONGGUANG in the spectral component that light fixture is sent (600～700nm) and blue light (400～500nm) ratio is
25.4:1；HONGGUANG (600～700nm) is 9.7:1 with the ratio of far-red light (700～760nm).Relative spectral is shown in accompanying drawing 1.4
(2)。
Embodiment 4
Weigh 0.2g fluorescent material, 3g joins arogel and by both mix homogeneously, deaeration machine evacuation removes bubble and obtains fluorescence
Powder slurry；
Use dotting glue method to be coated in by phosphor slurry on LED chip surface, be dried 2 with drying baker heating (150 DEG C) little
Time, it is thus achieved that phosphor powder layer；
Above-mentioned LED chip is covered lens hood embedding silica gel simultaneously, in drying baker, then heats (120 DEG C) solidification 2 little
Time；
Finally employing one or plurality of LEDs are fabricated to LED lamp；
Record the HONGGUANG in the spectral component that light fixture is sent (600～700nm) and blue light (400～500nm) ratio is
5.9:1；HONGGUANG (600～700nm) is 9.5:1 with the ratio of far-red light (700～760nm).
Embodiment 5
Weigh 0.2g fluorescent material, 4g joins arogel and by both mix homogeneously, deaeration machine evacuation removes bubble and obtains fluorescence
Powder slurry；
Use dotting glue method to be coated in by phosphor slurry on LED chip surface, be dried 2 with drying baker heating (150 DEG C) little
Time, it is thus achieved that phosphor powder layer；
Above-mentioned LED chip is covered lens hood embedding silica gel simultaneously, in drying baker, then heats (120 DEG C) solidification 2 little
Time；
Finally employing one or plurality of LEDs are fabricated to LED lamp.；
Record the HONGGUANG in spectral component (600～700nm) and blue light (400～500nm) ratio is 4.3:1；HONGGUANG
(600～700nm) are 9.7:1 with the ratio of far-red light (700～760nm).Its relative spectral is shown in accompanying drawing 1.4 (3).
Embodiment 6
Weigh 0.2g fluorescent material, 6g joins arogel and by both mix homogeneously, deaeration machine evacuation removes bubble and obtains fluorescence
Powder slurry；
Use dotting glue method to be coated in by phosphor slurry on LED chip surface, be dried 2 with drying baker heating (150 DEG C) little
Time, it is thus achieved that phosphor powder layer；
Above-mentioned LED chip is covered lens hood embedding silica gel simultaneously, in drying baker, then heats (120 DEG C) solidification 2 little
Time；
Finally employing one or plurality of LEDs are fabricated to LED lamp；
Record the HONGGUANG in spectral component (600～700nm) and blue light (400～500nm) ratio is 1.6:1；HONGGUANG
(600～700nm) are 15.3:1 with the ratio of far-red light (700～760nm).
Embodiment 7
Weigh 0.2g fluorescent material, 10g joins arogel and by both mix homogeneously, deaeration machine evacuation removes bubble and obtains fluorescence
Powder slurry；
Use dotting glue method to be coated in by phosphor slurry on LED chip surface, be dried 2 with drying baker heating (150 DEG C) little
Time, it is thus achieved that phosphor powder layer；
Above-mentioned LED chip is covered lens hood embedding silica gel simultaneously, in drying baker, then heats (120 DEG C) solidification 2 little
Time；
Finally employing one or plurality of LEDs are fabricated to LED lamp；
Record the HONGGUANG in spectral component (600～700nm) and blue light (400～500nm) ratio is 1.3:1；HONGGUANG
(600～700nm) are 6.5:1 with the ratio of far-red light (700～760nm).
Embodiment 8
Weigh 0.2g fluorescent material, 15g joins arogel and by both mix homogeneously, deaeration machine evacuation removes bubble and obtains fluorescence
Powder slurry；
Use dotting glue method to be coated in by phosphor slurry on LED chip surface, be dried 2 with drying baker heating (150 DEG C) little
Time, it is thus achieved that phosphor powder layer；
Above-mentioned LED chip is covered lens hood embedding silica gel simultaneously, in drying baker, then heats (120 DEG C) solidification 2 little
Time；
Finally employing one or plurality of LEDs are fabricated to LED lamp；
Record the HONGGUANG in spectral component (600～700nm) and blue light (400～500nm) ratio is 0.4:1；HONGGUANG
(600～700nm) are 2.1:1 with the ratio of far-red light (700～760nm).Its relative spectral is shown in accompanying drawing 1.4 (4).
Embodiment 9
Weigh 0.2g fluorescent material, 17g joins arogel and by both mix homogeneously, deaeration machine evacuation removes bubble and obtains fluorescence
Powder slurry；
Use dotting glue method to be coated in by phosphor slurry on LED chip surface, be dried 2 with drying baker heating (150 DEG C) little
Time, it is thus achieved that phosphor powder layer；
Above-mentioned LED chip is covered lens hood embedding silica gel simultaneously, in drying baker, then heats (120 DEG C) solidification 2 little
Time；
Finally employing one or plurality of LEDs are fabricated to LED lamp；
Record the HONGGUANG in spectral component (600～700nm) and blue light (400～500nm) ratio is 0.2:1；HONGGUANG
(600～700nm) are 1.2:1 with the ratio of far-red light (700～760nm).
Embodiment 10
Weigh 0.2g red fluorescence powder, 0.2g yellow fluorescent powder, 4.4g join arogel and by three's mix homogeneously, and deaeration machine is taken out
Vacuum removal of air bubbles obtains phosphor slurry；
Use dotting glue method to be coated in by phosphor slurry on LED chip surface, be dried 2 with drying baker heating (150 DEG C) little
Time, it is thus achieved that phosphor powder layer；
Above-mentioned LED chip is covered lens hood embedding silica gel simultaneously, in drying baker, then heats (120 DEG C) solidification 2 little
Time；
Finally employing one or plurality of LEDs are fabricated to LED lamp.
Embodiment 11
Weigh 0.1g red fluorescence powder, 0.3g yellow fluorescent powder, 4.4g join arogel and by three's mix homogeneously, and deaeration machine is taken out
Vacuum removal of air bubbles obtains phosphor slurry；
Use dotting glue method to be coated in by phosphor slurry on LED chip surface, be dried 2 with drying baker heating (150 DEG C) little
Time, it is thus achieved that phosphor powder layer；
Above-mentioned LED chip is covered lens hood embedding silica gel simultaneously, in drying baker, then heats (120 DEG C) solidification 2 little
Time；
Finally employing one or plurality of LEDs are fabricated to LED lamp.
Embodiment 12
Weigh 0.3g red fluorescence powder, 0.1g yellow fluorescent powder, 4.4g join arogel and by three's mix homogeneously, and deaeration machine is taken out
Vacuum removal of air bubbles obtains phosphor slurry；
Use dotting glue method to be coated in by phosphor slurry on LED chip surface, be dried 2 with drying baker heating (150 DEG C) little
Time, it is thus achieved that phosphor powder layer；
Above-mentioned LED chip is covered lens hood embedding silica gel simultaneously, in drying baker, then heats (120 DEG C) solidification 2 little
Time；
Finally employing one or plurality of LEDs are fabricated to LED lamp.
Embodiment 13
Weigh 0.1g red fluorescence powder, 0.1g yellow fluorescent powder, 2g join arogel and by three's mix homogeneously, and deaeration machine is taken out very
The empty bubble that removes obtains phosphor slurry；
Use dotting glue method to be coated in by phosphor slurry on LED chip surface, be dried 2 with drying baker heating (150 DEG C) little
Time, it is thus achieved that phosphor powder layer；
Above-mentioned LED chip is covered lens hood embedding silica gel simultaneously, in drying baker, then heats (120 DEG C) solidification 2 little
Time；
Finally employing one or plurality of LEDs are fabricated to LED lamp.
Embodiment 14
Weigh 0.2g fluorescent material, 1g joins arogel and by both mix homogeneously, deaeration machine evacuation removes bubble and obtains fluorescence
Powder slurry；
Use dotting glue method to be coated in by phosphor slurry on LED lens hood, be dried 2 hours with drying baker heating (150 DEG C),
Obtain phosphor powder layer；
Above-mentioned LED chip is covered lens hood embedding silica gel simultaneously, in drying baker, then heats (120 DEG C) solidification 2 little
Time；
Finally employing one or plurality of LEDs are fabricated to LED lamp.
Embodiment 15
Weigh 0.2g fluorescent material, 1.5g joins arogel and by both mix homogeneously, deaeration machine evacuation removes bubble and obtains glimmering
Light powder slurry；
Use dotting glue method to be coated in by phosphor slurry on LED lens hood, be dried 2 hours with drying baker heating (150 DEG C),
Obtain phosphor powder layer；
Above-mentioned LED chip is covered lens hood embedding silica gel simultaneously, in drying baker, then heats (120 DEG C) solidification 2 little
Time；
Finally employing one or plurality of LEDs are fabricated to LED lamp.
Embodiment 16
Weigh 0.2g fluorescent material, 2g joins arogel and by both mix homogeneously, deaeration machine evacuation removes bubble and obtains fluorescence
Powder slurry；
Use dotting glue method to be coated in by phosphor slurry on LED lens hood, be dried 2 hours with drying baker heating (150 DEG C),
Obtain phosphor powder layer；
Above-mentioned LED chip is covered lens hood embedding silica gel simultaneously, in drying baker, then heats (120 DEG C) solidification 2 little
Time；
Finally employing one or plurality of LEDs are fabricated to LED lamp.
Embodiment 17
Weigh 0.2g fluorescent material, 3g joins arogel and by both mix homogeneously, deaeration machine evacuation removes bubble and obtains fluorescence
Powder slurry；
Use dotting glue method to be coated in by phosphor slurry on LED lens hood, be dried 2 hours with drying baker heating (150 DEG C),
Obtain phosphor powder layer；
Above-mentioned LED chip is covered lens hood embedding silica gel simultaneously, in drying baker, then heats (120 DEG C) solidification 2 little
Time；
Finally employing one or plurality of LEDs are fabricated to LED lamp.
Embodiment 18
Weigh 0.2g fluorescent material, 5g joins arogel and by both mix homogeneously, deaeration machine evacuation removes bubble and obtains fluorescence
Powder slurry；
Use dotting glue method to be coated in by phosphor slurry on LED lens hood, be dried 2 hours with drying baker heating (150 DEG C),
Obtain phosphor powder layer；
Above-mentioned LED chip is covered lens hood embedding silica gel simultaneously, in drying baker, then heats (120 DEG C) solidification 2 little
Time；
Finally employing one or plurality of LEDs are fabricated to LED lamp.
Embodiment 19
Weigh 0.2g fluorescent material, 8g joins arogel and by both mix homogeneously, deaeration machine evacuation removes bubble and obtains fluorescence
Powder slurry；
Use dotting glue method to be coated in by phosphor slurry on LED lens hood, be dried 2 hours with drying baker heating (150 DEG C),
Obtain phosphor powder layer；
Above-mentioned LED chip is covered lens hood embedding silica gel simultaneously, in drying baker, then heats (120 DEG C) solidification 2 little
Time；
Finally employing one or plurality of LEDs are fabricated to LED lamp.
Embodiment 20
Weigh 0.2g fluorescent material, 2.5g joins arogel and by both mix homogeneously, deaeration machine evacuation removes bubble and obtains glimmering
Light powder slurry；
Use dotting glue method to be coated in by phosphor slurry on LED lens hood, be dried 2 hours with drying baker heating (150 DEG C),
Obtain phosphor powder layer；
Above-mentioned LED chip is covered lens hood encapsulated epoxy resin simultaneously, in drying baker, then heats (120 DEG C) solidification
2 hours；
Finally employing one or plurality of LEDs are fabricated to LED lamp.
Embodiment 21
Weigh red fluorescence powder material 0.25g Sr2Si5N8:Eu2+、0.25g YAG:Ce3+:Gd3+Join arogel with 3g and incite somebody to action
Three's mix homogeneously, deaeration machine evacuation removes bubble and obtains phosphor slurry；
Use dotting glue method to be coated in by phosphor slurry on LED lens hood, be dried 2 hours with drying baker heating (150 DEG C),
Obtain phosphor powder layer；
Above-mentioned LED chip is covered lens hood embedding silica gel simultaneously, in drying baker, then heats (120 DEG C) solidification 2 little
Time；
Finally employing one or plurality of LEDs are fabricated to LED lamp.
Embodiment 22
Weigh red fluorescence powder material 0.1g Sr2Si5N8:Eu2+、0.4gYAG:Ce3+:Gd3+Arogel is joined and by three with 3g
Mix homogeneously, evacuation removes bubble and obtains phosphor slurry；
Use dotting glue method to be coated in by phosphor slurry on LED lens hood, be dried 2 hours with drying baker heating (150 DEG C),
Obtain phosphor powder layer；
Above-mentioned LED chip is covered lens hood embedding silica gel simultaneously, in drying baker, then heats (120 DEG C) solidification 2 little
Time；
Finally employing one or plurality of LEDs are fabricated to LED lamp.
Embodiment 23
Weigh red fluorescence powder material 0.25g Sr2Si5N8:Eu2+、0.25g YAG:Ce3+:Gd3+Join arogel with 4g and incite somebody to action
Three's mix homogeneously, evacuation removes bubble and obtains phosphor slurry；
Use dotting glue method to be coated in by phosphor slurry on LED lens hood, be dried 2 hours with drying baker heating (150 DEG C),
Obtain phosphor powder layer；
Above-mentioned LED chip is covered lens hood embedding silica gel simultaneously, in drying baker, then heats (120 DEG C) solidification 2 little
Time；
Finally employing one or plurality of LEDs are fabricated to LED lamp.
Embodiment 24
Weigh red fluorescence powder material 0.25g Sr2Si5N8:Eu2+、0.25g YAG:Ce3+:Gd3+Join arogel with 5g and incite somebody to action
Three's mix homogeneously, evacuation removes bubble and obtains phosphor slurry；
Use dotting glue method to be coated in by phosphor slurry on LED lens hood, be dried 2 hours with drying baker heating (150 DEG C),
Obtain phosphor powder layer；
Above-mentioned LED chip is covered lens hood embedding silica gel simultaneously, in drying baker, then heats (120 DEG C) solidification 2 little
Time；
Finally employing one or plurality of LEDs are fabricated to LED lamp.
Embodiment 25
Weigh red fluorescence powder material 0.1g Sr2Si5N8:Eu2+、0.4g YAG:Ce3+:Gd3+Arogel is joined and by three with 5g
Person's mix homogeneously, evacuation removes bubble and obtains phosphor slurry；
Use dotting glue method to be coated in by phosphor slurry on LED lens hood, be dried 2 hours with drying baker heating (150 DEG C),
Obtain phosphor powder layer；
Above-mentioned LED chip is covered lens hood embedding silica gel simultaneously, in drying baker, then heats (120 DEG C) solidification 2 little
Time；
Finally employing one or plurality of LEDs are fabricated to LED lamp.
Embodiment 26
Weigh red fluorescence powder material 0.4g Sr2Si5N8:Eu2+、0.1g YAG:Ce3+:Gd3+Arogel is joined and by three with 2g
Person's mix homogeneously, evacuation removes bubble and obtains phosphor slurry；
Use dotting glue method to be coated in by phosphor slurry on LED chip surface, be dried 2 with drying baker heating (150 DEG C) little
Time, it is thus achieved that phosphor powder layer；
Above-mentioned LED chip is covered lens hood embedding silica gel simultaneously, in drying baker, then heats (120 DEG C) solidification 2 little
Time；
Finally employing one or plurality of LEDs are fabricated to LED lamp.
Embodiment 27
Weigh red fluorescence powder material 0.25g Sr2Si5N8:Eu2+、0.25gYAG:Ce3+:Gd3+Join arogel with 4.5g and incite somebody to action
Three's mix homogeneously, evacuation removes bubble and obtains phosphor slurry；
Use dotting glue method to be coated in by phosphor slurry on LED chip surface, be dried 2 with drying baker heating (150 DEG C) little
Time, it is thus achieved that phosphor powder layer；
Above-mentioned LED chip is covered lens hood embedding silica gel simultaneously, in drying baker, then heats (120 DEG C) solidification 2 little
Time；
Finally employing one or plurality of LEDs are fabricated to LED lamp.
Embodiment 28
Weigh red fluorescence powder material 0.1g Sr2Si5N8:Eu2+、0.4gYAG:Ce3+:Gd3+Arogel is joined and by three with 4.5g
Person's mix homogeneously, evacuation removes bubble and obtains phosphor slurry；
Use dotting glue method to be coated in by phosphor slurry on LED chip surface, be dried 2 with drying baker heating (150 DEG C) little
Time, it is thus achieved that phosphor powder layer；
Above-mentioned LED chip is covered lens hood embedding silica gel simultaneously, in drying baker, then heats (120 DEG C) solidification 2 little
Time；
Finally employing one or plurality of LEDs are fabricated to LED lamp.
Embodiment 29
Weigh 0.5g fluorescent material, 2.5g joins arogel and by both mix homogeneously, evacuation removes bubble and obtains phosphor
Slurry；
Use dotting glue method to be coated in by phosphor slurry on packaged LED glass or shroud surface, heat with drying baker
(150 DEG C) are dried 2 hours, it is thus achieved that phosphor powder layer；
By above-mentioned LED chip embedding silica gel, in drying baker, then heat (120 DEG C) solidify 2 hours；
Finally employing one or plurality of LEDs are fabricated to LED lamp.
Embodiment 30
Weigh 0.5g fluorescent material, 3.5g joins arogel and by both mix homogeneously, deaeration machine evacuation removes bubble and obtains glimmering
Light powder slurry；
Use dotting glue method to be coated in by phosphor slurry on packaged LED glass or shroud surface, heat with drying baker
(150 DEG C) are dried 2 hours, it is thus achieved that phosphor powder layer；
By above-mentioned LED chip embedding silica gel, in drying baker, then heat (120 DEG C) solidify 2 hours；
Finally employing one or plurality of LEDs are fabricated to LED lamp.
Embodiment 31
Weigh 0.5g fluorescent material, 5g joins arogel and by both mix homogeneously, deaeration machine evacuation removes bubble and obtains fluorescence
Powder slurry；
Use dotting glue method to be coated in by phosphor slurry on packaged LED glass or shroud surface, heat with drying baker
(150 DEG C) are dried 2 hours, it is thus achieved that phosphor powder layer；
By above-mentioned LED chip encapsulated epoxy resin, in drying baker, then heat (120 DEG C) solidify 2 hours；
Finally employing one or plurality of LEDs are fabricated to LED lamp.
Embodiment 32
Weigh 0.5g fluorescent material, 2.5g joins arogel and by both mix homogeneously, removes bubble with deaeration machine evacuation and obtains
Phosphor slurry；Weigh 0.5g fluorescent material, 3.5g joins arogel and by both mix homogeneously, deaeration machine evacuation removes bubble and obtains
Phosphor slurry；Weigh 0.5g fluorescent material, 5g joins arogel and by both mix homogeneously, evacuation removes bubble and obtains phosphor
Slurry；
Dispensing method is used to be coated in by phosphor slurry respectively on three substrate lens of ready-made LED lamp, with being dried
Case heating (150 DEG C) is dried 2 hours, it is thus achieved that phosphor powder layer；
By above-mentioned LED chip embedding silica gel, in drying baker, then heat (120 DEG C) solidify 2 hours；
Finally it is assembled into LED lamp.
Embodiment 33
Weigh red fluorescence powder material 0.25g Sr2Si5N8:Eu2+、0.25g YAG:Ce3+:Gd3+Join arogel with 5g and incite somebody to action
Three's mix homogeneously, deaeration machine evacuation removes bubble and obtains phosphor slurry；Weigh red fluorescence powder material 0.4g
Sr2Si5N8:Eu2+、0.1gYAG:Ce3+:Gd3+Joining arogel and by three's mix homogeneously with 5g, deaeration machine evacuation removes bubble and obtains
Obtain phosphor slurry；Weigh red fluorescence powder material 0.1g Sr2Si5N8:Eu2+、0.4gYAG:Ce3+:Gd3+Arogel is joined also with 5g
By three's mix homogeneously, deaeration machine evacuation removes bubble and obtains phosphor slurry；
Dispensing method is used to be coated in by phosphor slurry respectively on three substrate lens of ready-made LED lamp, with being dried
Case heating (150 DEG C) is dried 2 hours, it is thus achieved that phosphor powder layer；
By above-mentioned LED chip embedding silica gel, in drying baker, then heat (120 DEG C) solidify 2 hours；
Finally it is assembled into LED lamp.
Embodiment 34
Weigh red fluorescence powder material 0.25g Sr2Si5N8:Eu2+、0.25g YAG:Ce3+:Gd3+Join arogel with 5g and incite somebody to action
Three's mix homogeneously, deaeration machine evacuation removes bubble and obtains phosphor slurry；Weigh red fluorescence powder material 0.1g
Sr2Si5N8:Eu2+、0.4gYAG:Ce3+:Gd3+Joining arogel and by three's mix homogeneously with 5g, deaeration machine evacuation removes bubble and obtains
Obtain phosphor slurry；Weigh 0.5g fluorescent material, 5g joins arogel and by both mix homogeneously, evacuation removes bubble and obtains fluorescent material
Slurry；
Dispensing method is used to be coated in by phosphor slurry respectively on three substrate lens of ready-made LED lamp, with being dried
Case heating (150 DEG C) is dried 2 hours, it is thus achieved that phosphor powder layer；
By above-mentioned LED chip embedding silica gel, in drying baker, then heat (120 DEG C) solidify 2 hours；
Finally it is assembled into LED lamp.
Embodiment 35
Weigh 0.5g fluorescent material, 2.5ml photoresists (mix with PVA solution and ADC solution and join) and both are mixed all
Even；
Using dotting glue method to be coated in by phosphor slurry on LED chip surface, exposure 0.75ms also develops；
Above-mentioned LED chip is covered lens hood, encapsulated epoxy resin, in drying baker, then heats (120 DEG C) solidification 2 little
Time；
Finally employing one or plurality of LEDs are fabricated to LED lamp.
Embodiment 36
Weigh 0.5g red fluorescence powder Sr2Si5N8:Eu2+Arogel is joined and by both mix homogeneously, deaeration machine evacuation with 5g
Remove bubble and obtain phosphor slurry；
Use dotting glue method to be coated in by phosphor slurry on UV LED chip surface, be dried with drying baker heating (150 DEG C)
2 hours, it is thus achieved that phosphor powder layer；
Above-mentioned UV LED chip is covered lens hood, embedding silica gel, in drying baker, then heats (120 DEG C) solidification 2 little
Time, can obtain sending existing HONGGUANG also has the LED of ultraviolet；
Finally employing one or plurality of LEDs are fabricated to LED lamp.
Embodiment 37
Weigh 0.5g red fluorescence powder Y2O3: Eu, 5g join arogel and by both mix homogeneously, and deaeration machine evacuation removes gas
Bubble obtains phosphor slurry；
Use dotting glue method to be coated in by phosphor slurry on UV LED chip surface, be dried with drying baker heating (150 DEG C)
2 hours, it is thus achieved that phosphor powder layer；
Above-mentioned UV LED chip is covered lens hood, embedding silica gel, in drying baker, then heats (120 DEG C) solidification 2 little
Time, can obtain sending existing HONGGUANG also has the LED of ultraviolet；
Finally employing one or plurality of LEDs are fabricated to LED lamp.
Embodiment 38
Weigh 0.25g red fluorescence powder Sr2Si5N8:Eu2+, blue colour fluorescent powder 0.25g YVO4:Ce3+Join arogel with 5g and incite somebody to action
Both mix homogeneously, evacuation removes bubble and obtains phosphor slurry；
Use dotting glue method to be coated in by phosphor slurry on UV LED chip surface, be dried with drying baker heating (150 DEG C)
2 hours, it is thus achieved that phosphor powder layer；
Above-mentioned UV LED chip is covered lens hood, embedding silica gel, in drying baker, then heats (120 DEG C) solidification 2 little
Time, can obtain sending existing HONGGUANG and blue light also has the LED of ultraviolet；
Finally employing one or plurality of LEDs are fabricated to LED lamp.
Embodiment 39
Weigh 0.25g Sr2Si5N8:Eu2+Red fluorescence powder, 0.25gYVO4:Ce3+Blue colour fluorescent powder and 2.5ml's is photosensitive
Glue (PVA solution and the mixing of ADC solution are joined), and will both mix homogeneously；
Using dotting glue method to be coated in by phosphor slurry on LED chip surface, exposure 0.75ms also develops；
Above-mentioned LED chip is covered lens hood, embedding silica gel, in drying baker, then heats (120 DEG C) solidify 2 hours；
Finally employing one or plurality of LEDs are fabricated to LED lamp.
Embodiment 40
Weighing 0.2g fluorescent material and 1.6g silica gel joins arogel mix homogeneously, deaeration machine evacuation removes bubble and obtains fluorescence
Powder slurry；
Use dotting glue method to be coated on wafer by phosphor slurry, be dried 2 hours with drying baker heating (150 DEG C), it is thus achieved that
Phosphor powder layer, is then cut into needing the dimensional structure of size；
The wafer of above-mentioned well cutting is covered lens hood, injects embedding filling gel, in drying baker, then heat (120
DEG C) solidify 2 hours；
Finally adopt one or plurality of LEDs is fabricated to LED lamp.
Embodiment 41
Weigh 0.5g burst of ultraviolel halogen calcium phosphate fluoressent powder Ca10F2P6O24: Mn:Sb:Cl and 3g joins arogel and both is mixed
Closing uniformly, deaeration machine evacuation removes bubble and obtains phosphor slurry；
Use dotting glue method to be coated in by phosphor slurry on UV LED chip surface, be dried with drying baker heating (150 DEG C)
2 hours, it is thus achieved that phosphor powder layer；
Above-mentioned UV LED chip is covered lens hood, embedding silica gel, in drying baker, then heats (120 DEG C) solidification 2 little
Time；
Finally employing one or plurality of LEDs are fabricated to LED lamp.
Embodiment 42
Weigh yellowish red color phosphor material powder 0.2gYAG:Ce3+:Gd3+Join arogel and by both mix homogeneously with 1.5g, take out true
The empty bubble that removes obtains phosphor slurry；
Use dotting glue method to be coated in by phosphor slurry on LED lens hood, be dried 2 hours with drying baker heating (150 DEG C),
Obtain phosphor powder layer；
Above-mentioned LED chip is covered lens hood, injects embedding silica gel, in drying baker, then heat (120 DEG C) solidification 2 little
Time；
Finally employing one or plurality of LEDs are fabricated to LED lamp.
Claims (10)
1. the pc-LEDs lamp of a medical phototherapy, it is characterised in that comprise the following steps:
(1), red fluorescence powder is mixed according to a certain percentage with colloid acquisition phosphor slurry；
(2), phosphor slurry is coated on the surface of blue light (or ultraviolet) LED chip light emission direction:
(3), the phosphor slurry of coating is heating and curing；
(4), to the LED being coated with fluorescent material carry out embedding process, be then assembled into LED lamp with one or plurality of LEDs.
The pc-LEDs lamp of a kind of medical phototherapy the most according to claim 1, it is characterised in that: in step (1), described
Colloid is epoxy resin, silica gel, polymethyl methacrylate (PMMA), Merlon (PC), or one in photosensitive colloid or
Person's multiple combination.
The pc-LEDs lamp of a kind of medical phototherapy the most according to claim 1, it is characterised in that: in step (1), used
Its emission spectrum main peak of red fluorescence powder may be selected near 635nm, and there is wider spectral component, both comprised with
635nm wavelength is the biological activity light of main raising cytoactive, contains again the different-waveband scope promoting different cellular metabolisms
Red color light component.Original a small amount of blue light (or purple light) that the chip do not changed by fluorescent material sends can regulate cell biological week
Phase, suppress inflammation, with HONGGUANG complementation cell activity enhancing.
The pc-LEDs lamp of a kind of medical phototherapy the most according to claim 1, it is characterised in that: in step (1), used
Red fluorescence powder refer to excite in blue (or ultraviolet) LED light lower to send HONGGUANG or the fluorescence containing red-light spectrum composition
Powder；Red fluorescence powder used can select peak wavelength at the different fluorescent material of 610nm～720nm scope.These have red
The fluorescent material of light is YAGG, YAGG:Ce3+、YAG:Eu2+Therein with nitride red fluorescent powder a kind of or their combination；
Or the fluorescent material that red fluorescence powder mixes by a certain percentage with other color fluorescence powder.
The pc-LEDs lamp of a kind of medical phototherapy the most according to claim 1, it is characterised in that: in step (1), used
Its emission spectrum of red fluorescence powder wider so that the described pc-LEDs light fixture for medical phototherapy has wider HONGGUANG light
Spectrum composition (600-760nm), wherein comprises far-red light composition (700-760nm), according to different fluorescent material and the ratio joining arogel
Example, in the output light of described pc-LEDs lamp, red and far-red light ratio, R/FR=0.2～20.
The pc-LEDs lamp of a kind of medical phototherapy the most according to claim 1, it is characterised in that: in step (1), described
In phosphor slurry, fluorescent material is 0.1～0.25 with the ratio joining arogel；Different fluorescent material and the ratio joining arogel, it is possible to realize
Red light (600～760nm)/blue light (400～500nm) ratios different in emergent light, R/B=0.1～100；Work as excitation
When chip is ultraviolet LED, output light in red light (600～760nm)/purple light (320～400nm) ratio, R/V=0.1～
100。
The pc-LEDs lamp of a kind of medical phototherapy the most according to claim 1, it is characterised in that: in step (2), permissible
Phosphor slurry is coated on the light-emitting area of LED chip, it is also possible to phosphor slurry is coated in and leaves appointing of LED chip
On the surface of one exit direction.
The pc-LEDs lamp of a kind of medical phototherapy the most according to claim 1, it is characterised in that: in step (2), described
Painting method can be spraying, electrostatic spraying, electrophoretic deposition, printing, spin coating, irrigates, impregnate or point one or more group of glue
Close.
The pc-LEDs lamp of a kind of medical phototherapy the most according to claim 1, it is characterised in that: in step (2), described
LED be organic LED, inorganic LED or a combination of both；Described LED is single LEDs chip, or same substrate is many
LEDs chipset, or whole wafer.
The pc-LEDs lamp of a kind of medical phototherapy the most according to claim 1, it is characterised in that: in step (4), coating
The LED silica gel of fluorescent material, epoxy resin, polymethyl methacrylate (PMMA), Merlon (PC) is had to carry out embedding；Assemble
LED lamp structure be super flux LED lamp bar, shot-light, bulb lamp, Down lamp, fluorescent tube lamp, filament lamp, flat lamp.Different fitting structures, can
For body local phototherapy, different body parts are irradiated；Can be used for indoor phototherapy illumination, treat the spirit such as depression
Disease.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610919566.3A CN106328795A (en) | 2016-10-21 | 2016-10-21 | Medical phototherapy pc-LEDs lamp |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610919566.3A CN106328795A (en) | 2016-10-21 | 2016-10-21 | Medical phototherapy pc-LEDs lamp |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN106328795A true CN106328795A (en) | 2017-01-11 |
Family
ID=57818198
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610919566.3A Pending CN106328795A (en) | 2016-10-21 | 2016-10-21 | Medical phototherapy pc-LEDs lamp |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN106328795A (en) |
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106848041A (en) * | 2017-03-23 | 2017-06-13 | 电子科技大学 | A kind of LED light source for aquaculture |
| CN109192844A (en) * | 2018-08-30 | 2019-01-11 | 合肥工业大学智能制造技术研究院 | One kind is repaired and regenerated LED light emitting device and application for retina cell |
| CN109307200A (en) * | 2017-07-28 | 2019-02-05 | 松下知识产权经营株式会社 | Light bath |
| CN109731234A (en) * | 2019-01-18 | 2019-05-10 | 深圳市深紫源光学有限公司 | A kind of Portable ultraviolet phototherapy instrument |
| CN110016334A (en) * | 2019-04-28 | 2019-07-16 | 电子科技大学 | The enhanced quantum dot fluorescence powder of forward scattering for pc-LEDs encapsulation |
| CN110531554A (en) * | 2019-08-29 | 2019-12-03 | 合肥工业大学智能制造技术研究院 | Promote display light source module group, display screen and the application of retina cell and optic element growth and reparation |
| CN112397630A (en) * | 2019-08-13 | 2021-02-23 | 光宝光电(常州)有限公司 | Light emitting device |
| WO2021102628A1 (en) * | 2019-11-25 | 2021-06-03 | Ipc Works Limited | Light filter and the method thereof |
| US11322663B2 (en) | 2019-08-13 | 2022-05-03 | Lite-On Opto Technology (Changzhou) Co., Ltd. | Lighting device |
Citations (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2857977Y (en) * | 2005-11-28 | 2007-01-17 | 黄煜炜 | Portable multifunctional phototherapy unit |
| CN201015679Y (en) * | 2006-12-21 | 2008-02-06 | 万象新 | Implement for beautifying and soothing skin |
| CN101559258A (en) * | 2009-05-08 | 2009-10-21 | 天津滨海华医光电技术有限公司 | Multi-wavelength output semiconductor laser treatment instrument |
| CN201469124U (en) * | 2009-07-20 | 2010-05-19 | 陈鸿文 | Shower head structure with functions of hairdressing and medical irradiation |
| CN102151366A (en) * | 2011-05-06 | 2011-08-17 | 台山市隆达光电科技有限公司 | Red light LED (Light Emitting Diode) lamp with cosmetic effect |
| CN203291398U (en) * | 2013-03-22 | 2013-11-20 | 北京德麦特捷康科技发展有限公司 | Photodynamic therapeutic instrument for skin disease |
| CN203342206U (en) * | 2013-04-23 | 2013-12-18 | 深圳市冲华光电科技有限公司 | Portable LED phototherapy instrument |
| CN203694418U (en) * | 2013-12-21 | 2014-07-09 | 中山市比森塑料电子制品有限公司 | Phototherapy device |
| US20140303547A1 (en) * | 2013-03-01 | 2014-10-09 | Klox Technologies Inc. | Phototherapeutic device, method and use |
| CN104821614A (en) * | 2015-03-06 | 2015-08-05 | 中山智芯电子科技有限公司 | Mobile power supply with spectrum cosmetic function |
| CN104906694A (en) * | 2014-03-12 | 2015-09-16 | 无锡太福光电科技有限公司 | Multi-wavelength integrated LED optical therapeutic instrument |
| CN105405954A (en) * | 2015-10-23 | 2016-03-16 | 电子科技大学 | LED lamp used for plant illumination |
-
2016
- 2016-10-21 CN CN201610919566.3A patent/CN106328795A/en active Pending
Patent Citations (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2857977Y (en) * | 2005-11-28 | 2007-01-17 | 黄煜炜 | Portable multifunctional phototherapy unit |
| CN201015679Y (en) * | 2006-12-21 | 2008-02-06 | 万象新 | Implement for beautifying and soothing skin |
| CN101559258A (en) * | 2009-05-08 | 2009-10-21 | 天津滨海华医光电技术有限公司 | Multi-wavelength output semiconductor laser treatment instrument |
| CN201469124U (en) * | 2009-07-20 | 2010-05-19 | 陈鸿文 | Shower head structure with functions of hairdressing and medical irradiation |
| CN102151366A (en) * | 2011-05-06 | 2011-08-17 | 台山市隆达光电科技有限公司 | Red light LED (Light Emitting Diode) lamp with cosmetic effect |
| US20140303547A1 (en) * | 2013-03-01 | 2014-10-09 | Klox Technologies Inc. | Phototherapeutic device, method and use |
| CN203291398U (en) * | 2013-03-22 | 2013-11-20 | 北京德麦特捷康科技发展有限公司 | Photodynamic therapeutic instrument for skin disease |
| CN203342206U (en) * | 2013-04-23 | 2013-12-18 | 深圳市冲华光电科技有限公司 | Portable LED phototherapy instrument |
| CN203694418U (en) * | 2013-12-21 | 2014-07-09 | 中山市比森塑料电子制品有限公司 | Phototherapy device |
| CN104906694A (en) * | 2014-03-12 | 2015-09-16 | 无锡太福光电科技有限公司 | Multi-wavelength integrated LED optical therapeutic instrument |
| CN104821614A (en) * | 2015-03-06 | 2015-08-05 | 中山智芯电子科技有限公司 | Mobile power supply with spectrum cosmetic function |
| CN105405954A (en) * | 2015-10-23 | 2016-03-16 | 电子科技大学 | LED lamp used for plant illumination |
Cited By (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106848041A (en) * | 2017-03-23 | 2017-06-13 | 电子科技大学 | A kind of LED light source for aquaculture |
| CN109307200A (en) * | 2017-07-28 | 2019-02-05 | 松下知识产权经营株式会社 | Light bath |
| CN109192844A (en) * | 2018-08-30 | 2019-01-11 | 合肥工业大学智能制造技术研究院 | One kind is repaired and regenerated LED light emitting device and application for retina cell |
| CN109731234A (en) * | 2019-01-18 | 2019-05-10 | 深圳市深紫源光学有限公司 | A kind of Portable ultraviolet phototherapy instrument |
| CN110016334A (en) * | 2019-04-28 | 2019-07-16 | 电子科技大学 | The enhanced quantum dot fluorescence powder of forward scattering for pc-LEDs encapsulation |
| CN110016334B (en) * | 2019-04-28 | 2022-06-10 | 电子科技大学 | Method for improving light emitting efficiency of pc-LEDs by using forward scattering enhanced quantum dot fluorescent powder |
| CN112397630A (en) * | 2019-08-13 | 2021-02-23 | 光宝光电(常州)有限公司 | Light emitting device |
| US11322663B2 (en) | 2019-08-13 | 2022-05-03 | Lite-On Opto Technology (Changzhou) Co., Ltd. | Lighting device |
| CN110531554A (en) * | 2019-08-29 | 2019-12-03 | 合肥工业大学智能制造技术研究院 | Promote display light source module group, display screen and the application of retina cell and optic element growth and reparation |
| WO2021035783A1 (en) * | 2019-08-29 | 2021-03-04 | 合肥工业大学智能制造技术研究院 | Display light source module for promoting growth and repair of retinal cells and visual neurons, display screen, and application |
| WO2021102628A1 (en) * | 2019-11-25 | 2021-06-03 | Ipc Works Limited | Light filter and the method thereof |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN106328795A (en) | Medical phototherapy pc-LEDs lamp | |
| CN106848041B (en) | A kind of preparation method of the LED light source for aquaculture | |
| CN105405954A (en) | LED lamp used for plant illumination | |
| JP2016518149A (en) | Quantum dot light emitting diodes for phototherapy | |
| CN104465963B (en) | Light-emitting device, LED light source for plant cultivation and plant factor | |
| CN102939069B (en) | By using lightening compositions and guiding light radiation to carry out the method for tooth-whitening | |
| CN102203505B (en) | Illumination device | |
| JP2016511672A (en) | Phototherapy device, method and use | |
| US20210268304A1 (en) | Spontaneous emission type photo conversion substance for light therapy, and the functional patch and functional mask pack comprising the same | |
| CN107808919B (en) | A kind of LED white light source device | |
| RU2008108009A (en) | METHOD OF PHOTODYNAMIC THERAPY FOR TREATMENT OF CELLULITE AND COSMETIC USE | |
| CN105870304A (en) | LED light source with adjustable wavelength | |
| CN110349941A (en) | Full-spectrum LED plant illumination light source | |
| CN207055742U (en) | A kind of LED light source and LED beauty appliances for beautifying skin | |
| CN107249313A (en) | The method of milk of the production with high content natural complex D | |
| WO2024109769A1 (en) | Fluorescent composition, fluorescent film and light source | |
| CN202070020U (en) | Light-emitting diode (LED) photodynamic therapeutic instrument | |
| KR101075411B1 (en) | White color led apparatus for light treatment | |
| JP2022515455A (en) | LED lighting device with additional functions | |
| CN201710824U (en) | Phototherapy type skin care device | |
| CN105749428B (en) | A kind of free form surface formula Neonatal jaundice phototherapy illuminator | |
| US20050261751A1 (en) | Tanning device | |
| CN109404747A (en) | One kind having multispectral health-care lamp | |
| RU2693632C1 (en) | Light-emitting diode light source with biologically adequate radiation spectrum | |
| CN109786538A (en) | A kind of imitative natural light LED Healthy Lighting device and preparation method thereof |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20170111 |