CN117838073A

CN117838073A - PPG module, manufacturing method thereof and electronic equipment

Info

Publication number: CN117838073A
Application number: CN202211213008.7A
Authority: CN
Inventors: 王雅楠; 丁才华; 郭学平; 白亮; 朱建伟
Original assignee: Honor Device Co Ltd
Current assignee: Honor Device Co Ltd
Priority date: 2022-09-30
Filing date: 2022-09-30
Publication date: 2024-04-09
Also published as: WO2024066953A1

Abstract

The embodiment of the application relates to the technical field of electronic equipment, and provides a PPG module, a manufacturing method thereof and electronic equipment, which can solve the problem that the number of devices which can be arranged in the PPG module in the related technology is limited. This PPG module includes: the circuit board, and set up in light emitting component, photoelectric sensor, first device and the separation stop portion on the first surface of circuit board, separate the stop portion and be used for sheltering from light, and at least some are located light emitting component with between the photoelectric sensor, first device embedding separate the inside of stop portion. The method and the device can be used for electronic equipment such as a smart watch.

Description

PPG module, manufacturing method thereof and electronic equipment

Technical Field

The application relates to the technical field of electronic equipment, in particular to a PPG module, a manufacturing method thereof and electronic equipment.

Background

PPG (Photoplethysmography) technology is a non-invasive detection method for detecting blood volume changes in living tissue by means of photoelectric means, which can be used to detect target parameters such as heart rate, blood pressure, blood oxygen saturation, etc. At present, a PPG module manufactured based on a PPG technology is integrated on electronic equipment such as an intelligent watch and a wrist band, so as to achieve the purpose of continuous monitoring. Among them, how to design and manufacture the PPG module has become an important issue in the industry.

The PPG module in the related art comprises a first sub-board, a second sub-board, a light-emitting element, a photoelectric sensor, a baffle part and a device, wherein the light-emitting element, the photoelectric sensor and the baffle part are arranged on the first sub-board, and the baffle part is arranged between the light-emitting element and the photoelectric sensor. The second sub-board is laminated with the first sub-board, and the device is arranged on the second sub-board.

In the PPG module in the related art, the baffle part occupies a certain area on the first sub-board, so that the layout space of other devices can be extruded, the area utilization rate on the first sub-board is lower, and the number of devices which can be arranged by the PPG module is limited.

Disclosure of Invention

The embodiment of the application provides a PPG module, a manufacturing method thereof and electronic equipment, which are used for solving the problem that the number of devices which can be arranged in the PPG module in the related technology is limited.

In order to achieve the above purpose, the embodiments of the present application adopt the following technical solutions:

in a first aspect, an embodiment of the present application provides a PPG module, including: the circuit board, and set up in light emitting component, photoelectric sensor, first device and the separation stop portion on the first surface of circuit board, separate the stop portion and be used for sheltering from light, and at least some are located light emitting component with between the photoelectric sensor, first device embedding separate the inside of stop portion.

Through adopting above-mentioned technical scheme, through the inside with first device embedding separation blade portion, the region that is covered by separation blade portion on the first surface of circuit board can be fully utilized to first device like this to be favorable to improving the area utilization of the first surface of circuit board, make can vacate more areas on the circuit board and arrange more devices, thereby increased the number that can arrange the device in the PPG module.

In some embodiments, the first device comprises at least one of a first chip, a first passive device, and a magnetic piece that can generate magnetic attraction force; wherein the first passive device comprises at least one of an inductance, a resistance, and a capacitance.

By adopting the technical scheme, the area of the first surface covered by the baffle part can be utilized to the maximum extent, so that more space can be vacated on the second surface of the circuit board to arrange more devices.

In some embodiments, the first device comprises a plurality of first chips, at least a portion of the plurality of first chips being bare chips.

Through adopting above-mentioned technical scheme, separate the effect that keeps off the portion and can play the protection to the bare chip, the encapsulation has been saved to the bare chip to be favorable to reduce cost.

In some embodiments, the first chip and the first passive device are disposed at an edge region of the first surface.

By adopting the technical scheme, the probability of position interference between the first chip and the first passive device and the light-emitting element or the photoelectric sensor in the central area of the first surface is reduced.

In some embodiments, the magnetic member is disposed in a central region of the first surface.

By adopting the technical scheme, the electronic device can be kept balanced more easily during wireless charging, and is not easy to deviate.

In some embodiments, the number of the photoelectric sensors and the number of the light emitting elements are all multiple, and the multiple light emitting elements and the multiple photoelectric sensors are alternately arranged along the circumferential direction of the circuit board to form a first array; the inner side of the first array is provided with one photoelectric sensor and a plurality of magnetic pieces, and the plurality of magnetic pieces are distributed around the photoelectric sensors positioned on the inner side of the first array.

By adopting the technical scheme, the magnetic part can more fully utilize the gap between the photoelectric sensor positioned at the inner side of the first array and the first array, and the electronic device can be more easily balanced during wireless charging.

In some embodiments, at least one of the first chips is an analog front-end processing chip, and the analog front-end processing chip is electrically connected with the light emitting element and the photoelectric sensor, and is used for driving the light emitting element to emit light, and converting a photocurrent signal emitted by the photoelectric sensor into a voltage signal.

By adopting the technical scheme, the path length of the electric connection between the analog front-end processing chip and the light-emitting element and the photoelectric sensor can be shortened.

In some embodiments, the height of the first device is less than the height of the barrier.

Through adopting above-mentioned technical scheme, can make first device imbed completely to separate the inside of keeping off portion, avoid first device to stretch out the upper surface (be close to the side surface of back lid) that separates the keeping off portion and cause the increase of the thickness of PPG module.

In some embodiments, the PPG module further comprises a second device, the second device having a height that is less than the thickness of the circuit board, and the second device being embedded inside the circuit board.

Through adopting above-mentioned technical scheme, can make the inside of second device complete embedding to reduce the occupation of second device to the surface space of circuit board, can also avoid the increase of PPG module thickness that the surface of circuit board was stretched out to the second device caused moreover.

In some embodiments, the second device is an analog front-end processing chip, and the analog front-end processing chip is electrically connected with the light-emitting element and the photoelectric sensor, and is used for driving the light-emitting element to emit light, and converting a photocurrent signal emitted by the photoelectric sensor into a voltage signal.

In some embodiments, the second device is disposed on the same circuit board as the first device.

By adopting the technical scheme, the structure of the circuit board can be more compact, thereby being beneficial to reducing the thickness of the PPG module.

In some embodiments, the material of the barrier is an epoxy molding compound.

By adopting the technical scheme, the heat dissipation effect of embedding the first device into the baffle part is better than that of air, so that the temperature of the first device can be effectively controlled not to be too high.

In a second aspect, an embodiment of the present application provides an electronic device, including a housing, and a PPG module in the first aspect, where the PPG module is disposed in the housing.

The technical effects obtained by the electronic device in the embodiment of the present application are the same as those obtained by the PPG module in the first aspect, and are not described herein again.

In a third aspect, an embodiment of the present application provides a method for manufacturing a PPG module, including: disposing a first device on a first surface of a wiring board; providing a barrier on the first surface for shielding light such that the first device is embedded within the barrier and at least a portion of the barrier is located between a first region and a second region of the first surface; the light emitting element is disposed in the first region, and the photosensor is disposed in the second region.

The manufacturing method of the PPG module in the embodiment of the present application is the same as the technical effect obtained by the PPG module in the first aspect, and will not be described herein.

In some embodiments, a blocking portion for blocking light is provided on the first surface so that the first device is embedded inside the blocking portion, including: placing the circuit board in a die cavity of a lower die; closing the upper die and the lower die to form a containing cavity for containing the first device between the upper die and the circuit board; and injecting a shading material into the accommodating cavity to cover the first device, and demolding after the shading material is cooled to form the barrier part.

By adopting the technical scheme, the baffle part can be manufactured into various shapes by adjusting the shape of the cavity of the upper die, so as to meet the requirement of embedding the first devices with different shapes. Meanwhile, after the separation part is formed, the separation part does not need to be greatly machined, so that the damage of subsequent machining to the circuit board is reduced.

In some embodiments, after placing the circuit board in the cavity of the lower mold, before closing the upper mold with the lower mold, further comprising: and respectively covering protective layers for contacting with the upper die on the first area and the second area.

By adopting the technical scheme, the upper die can be prevented from being directly contacted with the first area and the second area of the circuit board to damage the circuit board.

In some embodiments, before disposing the first device on the first surface of the circuit board, further comprising: embedding a second device in the circuit board; the height of the second device is smaller than the thickness of the circuit board.

In some embodiments, embedding a second device inside the wiring board includes: embedding the second device on the first dielectric layer to expose the conductive part of the second device from the surface of the first dielectric layer; a second dielectric layer is arranged on the first dielectric layer in a lamination mode, the second dielectric layer covers the second device, and a circuit electrically connected with the conductive part is manufactured on the second dielectric layer; the circuit board comprises the first dielectric layer and the second dielectric layer.

By adopting the technical scheme, the influence on the circuit inside the circuit board is relatively small.

In some embodiments, embedding the second device on the first dielectric layer such that the conductive portion of the second device is exposed from the surface of the first dielectric layer includes: a containing groove penetrating through the first dielectric layer is formed in the first dielectric layer; laminating a bearing film bonded with the second device on the first dielectric layer, so that the second device is positioned in the accommodating groove; wherein, one side of the second device provided with the conductive part is adhered to the bearing film; filling an insulating material into the accommodating groove from a notch on one side of the accommodating groove facing away from the bearing film; and separating the bearing film from the second device, so that the conductive part of the second device is exposed from the surface of the first dielectric layer.

By adopting the technical scheme, the gap between the accommodating groove and the second device can be eliminated by filling the insulating material in the accommodating groove, so that the second device can be prevented from shaking in the accommodating groove. The bearing film adhered with the second device is arranged on the first dielectric layer in a laminated mode, and therefore the conductive part of the second device can be located at the notch of the containing groove, and the circuit on the subsequent second dielectric layer is convenient to electrically connect with the conductive part.

Drawings

Fig. 1 is a schematic structural diagram of a PPG module in the related art;

fig. 2 is a schematic structural diagram of a smart watch according to some embodiments of the present application;

fig. 3 is a schematic connection diagram of the PPG module and the rear cover in the first embodiment of the present application;

fig. 4 is a block diagram of a PPG module in some embodiments of the present application;

FIG. 5 is a cross-sectional view of section A-A of FIG. 3;

FIG. 6 is a top view of FIG. 3 with the rear cover and barrier removed;

fig. 7 is a schematic connection diagram of the PPG module and the rear cover in the second embodiment of the present application;

FIG. 8 is a top view of FIG. 7 with the rear cover and barrier removed;

fig. 9A is a schematic connection diagram of the PPG module and the rear cover in the third embodiment of the present application;

FIG. 9B is a top view of FIG. 9A with the rear cover and barrier removed;

Fig. 10 is a flowchart illustrating a PPG module according to some embodiments of the present disclosure;

FIG. 11A is a schematic diagram illustrating a manufacturing process of a PPG module according to some embodiments of the present disclosure;

FIG. 11B is a second schematic diagram of a manufacturing process of the PPG module according to some embodiments of the present disclosure;

FIG. 11C is a third schematic diagram illustrating a manufacturing process of the PPG module according to some embodiments of the present application;

fig. 11D is a schematic diagram of a manufacturing process of PPG module according to some embodiments of the present disclosure;

fig. 11E is a schematic diagram of a manufacturing process of PPG module according to some embodiments of the present disclosure;

fig. 11F is a schematic diagram of a manufacturing process of PPG module according to some embodiments of the present disclosure;

FIG. 11G is a schematic diagram of a manufacturing process of a PPG module according to some embodiments of the present disclosure;

fig. 12A is a schematic diagram illustrating a manufacturing process of the PPG module according to other embodiments of the present disclosure;

fig. 12B is a schematic diagram of a second manufacturing process of the PPG module according to other embodiments of the present disclosure;

fig. 12C is a schematic diagram of a third manufacturing process of the PPG module according to other embodiments of the present disclosure;

fig. 12D is a schematic diagram of a manufacturing process of the PPG module according to other embodiments of the present disclosure;

fig. 12E is a schematic diagram of a manufacturing process of PPG module according to other embodiments of the present disclosure;

Fig. 12F is a schematic diagram of a manufacturing process of the PPG module according to other embodiments of the present disclosure;

fig. 12G is a schematic diagram of a PPG module manufacturing process according to other embodiments of the present disclosure;

fig. 12H is a schematic diagram eight of a manufacturing process of the PPG module according to other embodiments of the present disclosure;

fig. 12I is a schematic diagram illustrating a manufacturing process of the PPG module according to other embodiments of the present disclosure;

fig. 12J is a schematic view illustrating a manufacturing process of the PPG module according to other embodiments of the present disclosure;

fig. 12K is a schematic diagram of a PPG module manufacturing process according to other embodiments of the present application.

Detailed Description

In the present embodiments, the terms "first," "second," and the like are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include one or more such feature.

The heart operation can reveal many very valuable information of the human body including its health status, life style, even emotional status and early onset of heart disease, etc. In conventional medical devices, monitoring heart rate and heart activity is accomplished by measuring electrophysiological signals and Electrocardiogram (ECG), which requires electrodes to be connected to the body to measure signals of induced electrical activity in heart tissue, which is inconvenient and costly. Thus, PPG technology has been developed.

The PPG technology is a noninvasive detection method for detecting the change of the blood volume in living tissues by photoelectric means, and the principle is as follows: when the light emitting element emits a light beam with a certain wavelength to irradiate the skin surface of a measured part (such as a wrist), the contraction and expansion of a blood vessel can influence the transmission of light during each heartbeat. When light passes through skin tissue and then reflects to the photosensor, the illumination will be attenuated to some extent. The absorption of light by tissues such as muscles, bones, veins and other connective tissues is substantially unchanged (provided that the measured site does not move significantly), but the arteries are different, and the absorption of light naturally changes due to the pulsations of blood in the arteries. When the photoelectric sensor converts light into an electric signal, the obtained signal can be divided into a Direct Current (DC) signal and an Alternating Current (AC) signal just because the absorption of light by an artery is changed and the absorption of light by other tissues is basically unchanged. The AC signal is extracted, and the characteristics of blood flow of a human body can be obtained by matching with a certain algorithm, so that target parameters such as heart rate, blood pressure, blood oxygen saturation and the like can be obtained.

The PPG technology is used for measuring target parameters such as heart rate, blood pressure, blood oxygen saturation and the like through a PPG module, and the PPG module is integrated on electronic equipment such as an intelligent watch and a wrist band at present so as to achieve the purpose of continuous monitoring. Among them, how to design and manufacture the PPG module has become an important issue in the industry.

As shown in fig. 1, fig. 1 is a schematic structural diagram of a PPG module in the related art, which includes a first sub-board 101, a second sub-board 102, a light emitting element 21, a photoelectric sensor 22, a barrier 3, and a device 23.

The first sub-board 101 and the second sub-board 102 are stacked, and are electrically connected through solder joints, and the first sub-board 101 is disposed on a side of the second sub-board 102 close to the rear cover 220 of the electronic device housing, that is, the first sub-board 101 is located on an upper side of the second sub-board 102 in fig. 1.

The light emitting element 21 and the photoelectric sensor 22 are disposed on the upper surface of the first sub-board 101 (i.e., a side surface close to the rear cover 220), the barrier portion 3 is adhered to the upper surface of the first sub-board 101 and the rear cover 220 by an adhesive layer, and the barrier portion 3 is disposed between the light emitting element 21 and the photoelectric sensor 22 for shielding light, so as to prevent light channeling between the light emitting element 21 and the photoelectric sensor 22.

The device 23 is disposed on a lower surface of the second sub-board 102 (i.e., a surface of the second sub-board 102 facing away from the rear cover 220), wherein the device 23 includes a chip 231, a protective cap 232, a passive device 233, a magnetic member 234 (such as a magnet), an elevating plate 235 (serving to connect a flexible circuit board), and the like.

In the PPG module of the related art, since the barrier portion 3 occupies a certain area on the first sub-board 101, the layout space of the other devices 23 is squeezed, so that the area utilization rate of the surface of the first sub-board 101, which is close to the rear cover 220, is low, and the number of devices 23 in which the PPG module can be arranged is limited.

In order to solve the technical problem, the application provides a PPG module, a manufacturing method thereof and electronic equipment, and the area utilization rate of a first surface (a surface close to a rear cover) of a circuit board 1 is improved by embedding some devices on the circuit board 1 into the inside of a barrier part 3.

The electronic device in the embodiment of the application can be electronic devices with PPG modules, such as an intelligent watch and an intelligent bracelet. The structure of the PPG module in the embodiment of the present application and the electronic device in the embodiment of the present application will be specifically described below by taking the smart watch as an example, and other electronic devices may be specifically set with reference to the structure of the PPG module in the embodiment of the smart watch, which is not described herein again.

Fig. 2 is a schematic structural diagram of a smart watch according to some embodiments of the present application, as shown in fig. 2. The smart watch includes a case 200, a wrist strap 300 connected to the case 200, and a PPG module 100, a battery assembly 410, a circuit board 420 (also referred to as a motherboard), and a display panel 430 disposed in the case 200. Along the thickness direction Z of the housing 200, the PPG module 100 and the circuit board 420 are respectively disposed on two opposite sides of the battery assembly 410, and the display panel 430 is disposed on one side of the circuit board 420 away from the battery assembly 410.

The display panel 430 is used for displaying images, videos, and the like. The display panel 430 may be a liquid crystal display (liquid crystal display; LCD) display panel, an organic light emitting diode (organic light emitting diode; OLED) display panel, a flexible light emitting diode (flex light emitting diode; FLED) display panel, a quantum dot light emitting diode (quantum dot light emitting diodes; QLED) display panel, etc., which are not particularly limited herein.

In some embodiments, as shown in fig. 2, the case 200 has a circular frame shape, and the side of the case 200 is provided with a fitting structure (not shown) for mounting the wrist band 300, and the wrist band 300 can be reliably connected to the case 200 by the fitting structure on the side wall of the case 200 to reliably wear the smart watch to the hand of the user. Of course, the housing 200 is not limited to be circular, and in other embodiments, the housing 200 is generally rectangular, and four corners of the housing 200 are rounded to provide the smart watch with better appearance.

In some embodiments, the wrist strap 300 is removably connected to the housing 200. This allows the user to conveniently replace the wrist band 300. For example, the user can purchase various types of wrist bands 300 and replace the wrist bands 300 according to the use situation to improve the convenience of use. For example, a user may use a more formal wrist strap 300 in a formal occasion and use a leisure style wrist strap 300 in a recreational occasion.

In some embodiments, as shown in fig. 2, the case 200 includes a front case 210 and a rear cover 220, the rear cover 220 is detachably connected to the front case 210, the PPG module 100 is fixedly connected to the rear cover 220, and the battery assembly 410, the circuit board 420, and the display panel 430 are fixed in the front case 210.

During the assembly of the smart watch, the PPG module 100 and the back cover 220 may be assembled together to form a back cover 220 assembly; assembling the battery assembly 410, the circuit board 420, and the display panel 430 with the front case 210 to form a front case 210 assembly; and then the rear cover 220 assembly is assembled with the front case 210 assembly to complete the assembly of the smart watch. By disassembling the rear cover 220 assembly and the front case 210 assembly of the smart watch, disassembly and maintenance of internal components in the smart watch, such as the PPG module 100, the battery pack 410, etc., can be greatly facilitated.

As shown in fig. 2, the wrist strap 300 is connected to the sidewall of the front case 210, but not limited thereto, and if the sidewall of the rear cover 220 has a sufficient space, the wrist strap 300 may be connected to the sidewall of the rear cover 220.

In some embodiments, as shown in fig. 2, a motor 440 is further disposed within the housing 200, and the motor 440 is disposed between a side wall of the housing 200 (such as a side wall of the front case 210) and the battery assembly 410. Of course, the position of the motor 440 is not limited to be disposed between the side wall of the housing 200 and the battery assembly 410, and may be disposed in other spaces of the housing 200, which is not particularly limited herein.

The motor 440 is used to generate a vibration alert. Specifically, the motor 440 may be used for incoming call vibration alerting as well as for touch vibration feedback. For example, touch operations acting on different applications (e.g., photographing, audio playing, etc.) may correspond to different vibration feedback effects. The motor 440 may also correspond to different vibration feedback effects by the touch operations applied to different areas of the display panel 430. Different application scenarios (such as time reminding, receiving information, alarm clock, game, etc.) can also correspond to different vibration feedback effects.

Fig. 3 is a schematic connection diagram of the PPG module 100 and the rear cover 220 according to the first embodiment of the present application, and fig. 3 is a B-B cross-sectional view of fig. 6 when the barrier 3 and the rear cover 220 are provided. The PPG module 100 includes a circuit board 1, a light emitting element 21 disposed on a first surface 11 (an upper surface of the circuit board 1 shown in the drawing) of the circuit board 1, a photosensor 22, a first device 4, and a barrier 3.

As shown in fig. 3, the Light Emitting element 21 may be an LED (Light-Emitting Diode), and specifically, the Light Emitting element 21 may be one of a red LED, an infrared LED, a blue LED, and a green LED. The number of the light emitting elements 21 may be one or plural, and is not particularly limited.

The photosensor 22 is a device that converts a light signal into an electrical signal, and operates on the principle that when light is irradiated onto the photosensor 22, the photosensor 22 absorbs energy of photons to generate a photocurrent.

As shown in fig. 3, the photosensor 22 may be a photodiode (also referred to as a photodiode; english paraphrased: photodiode; english abbreviated: PD). However, the photosensor 22 is not limited thereto, and may be a phototransistor or the like, as the case may be. The number of the photosensors 22 may be one or a plurality of photosensors, and is not particularly limited.

The blocking part 3 is used for blocking light, and at least a part of the blocking part is positioned between the light-emitting element 21 and the photoelectric sensor 22, so that the light emitted by the light-emitting element 21 is prevented from directly irradiating the photoelectric sensor 22, and thus, the light channeling between the light-emitting element 21 and the photoelectric sensor 22 is prevented.

The barrier 3 may be partially located between the light emitting element 21 and the photosensor 22, for example, as shown in fig. 5, fig. 5 is a cross-sectional view A-A of fig. 3, and the barrier 3 covers the first surface 11 and leaves an opening at a position corresponding to the light emitting element 21 and the photosensor 22. Of course, the barrier 3 may be entirely located between the light emitting element 21 and the photosensor 22, that is, the barrier 3 forming the periphery of the array by the light emitting element 21 and the photosensor 22 in fig. 5 may be omitted.

As shown in fig. 3, the barrier 3 and the rear cover 220 are bonded, but the present invention is not limited thereto, and the barrier 3 and the rear cover 220 may be connected by a snap fit, an insertion, or the like.

The rear cover 220 is provided with light windows at positions corresponding to the light emitting elements 21 and the photoelectric sensors 22, respectively, the rear cover 220 may be partially transparent at the light windows, and the light windows may be transparent to light, although the present invention is not limited thereto, and the rear cover 220 may be entirely transparent. By such a design, the light emitted from the light emitting element 21 can be emitted outside the housing 200 through the light window, and the light outside the housing 200 can be emitted to the photosensor 22 through the light window.

The first means 4 are embedded inside the barrier 3. Wherein, as shown in fig. 3, the first device 4 may be entirely embedded inside the barrier 3. However, the first device 4 may be partially embedded in the barrier 3, and may be specific according to the actual situation.

As shown in fig. 3, the PPG module 100 further includes an elevating board 6 disposed on the second surface 12 of the circuit board 1, where the elevating board 6 is soldered to the circuit board 1, and the second surface 12 (i.e. the lower surface of the circuit board 1 in the drawing) is disposed opposite to the first surface 11.

The elevation plate 6 is electrically connected to the battery pack 410 and the circuit board 420 through a flexible circuit board 420 (not shown in the drawing), so that the PPG module 100 is electrically connected to the battery pack 410 and the circuit board 420. Of course, the raised plate 6 may not be provided according to actual situations, and the second surface 12 of the circuit board 1 may be directly electrically connected to the battery assembly 410 and the circuit board 420 through the flexible circuit board 420.

In the PPG module 100 in this embodiment of the present application, the first device 4 is embedded into the barrier portion 3, so that the first device 4 can fully utilize the area covered by the barrier portion 3 on the first surface 11 of the circuit board 1, thereby being beneficial to improving the area utilization rate of the first surface 11 of the circuit board 1, and more devices can be arranged on the circuit board 1 by freeing up more area, so that the number of devices that can be arranged in the PPG module 100 is increased.

The type of first device 4 is not unique and in some embodiments, as shown in fig. 3, the first device 4 includes a first chip 41. Since the first chip 41 is generally designed into a sheet shape, the occupied area of the first chip 41 on the circuit board 1 is relatively larger than that of a columnar device, by embedding the first chip 41 into the inside of the barrier 3, the area of the first surface 11 covered by the barrier 3 can be utilized to the maximum extent, and simultaneously embedding the first chip 41 into the inside of the barrier 3, so that the number of other kinds of chips arranged on the second surface 12 of the circuit board 1 can be reduced, and the second surface 12 of the circuit board 1 can vacate more space to arrange more devices.

The first chip 41 included in the first device 4 may be one of a wireless charging chip, a capacitive sensor, an accelerometer, an analog front end processing chip, an operational amplifier, an ADC converter, and an analog switch.

Specifically, as shown in fig. 4, fig. 4 is a block diagram of the PPG module 100 according to some embodiments of the present application. The analog front end processing chip (AFE) includes a first terminal L1, a second terminal L2, a third terminal L3, and a fourth terminal L4, the first terminal L1 is connected with the light emitting element 21, the second terminal L2 is connected with the Main Control Unit (MCU), the second terminal L3 is connected with the photoelectric sensor 22, the fourth terminal L4 is connected with the operational amplifier through the analog switch, and the ADC converter is connected between the operational amplifier and the main control unit. The main control unit is disposed on the circuit board 420.

In some embodiments, as shown in fig. 4, the analog front-end processing chip is used to drive the light-emitting element 21 to emit light, and convert the photocurrent signal emitted by the photosensor 22 into a voltage signal. The analog front-end processing chip comprises a driver, a transimpedance amplifier (TIA for short) and a filter. The driver is connected between the terminal first terminal L1 and the terminal second terminal L2, and the trans-set amplifier and the filter are connected between the terminal second terminal L3 and the terminal fourth terminal L4. The driver is used for driving the light-emitting element 21 to emit light, the transimpedance amplifier is used for converting a photocurrent signal emitted by the photoelectric sensor 22 into a voltage signal, and the filter is used for filtering clutter in the voltage signal.

The analog switch is used for switching and on-off of two lines between the filter and the operational amplifier. The operational amplifier is used for amplifying the voltage signal output by the analog front end processing chip. The ADC converter is used for converting an analog signal of the output of the operational amplifier into a digital signal; the main control unit acquires the target detection parameters according to the input digital signals.

The accelerometer is connected with the main control unit and is used for detecting the motion state of a user wearing the intelligent watch and the gesture of the intelligent watch. The capacitive sensor is connected with the main control unit and is used for detecting whether the intelligent watch is worn. The wireless charging chip is connected with the main control unit and the battery assembly 410, the wireless charging chip is used for charging the battery assembly 410, the main control unit can control the charging state of the wireless charging chip, for example, after the battery assembly 410 is full, the main control unit can cut off the connection between the battery assembly 410 and the wireless charging chip so as to stop charging.

In some embodiments, as shown in fig. 5 and 6, fig. 6 is a top view of fig. 3 with the rear cover 220 and the barrier 3 removed. The first device 4 includes a plurality of first chips 41, and a part of the first chips 41 are bare chips (abbreviated as DIE in english).

As illustrated in fig. 6, the first device 4 includes 3 first chips 41, which are a first chip 41a, a first chip 41b, and a first chip 41c, respectively, wherein the first chips 41b and 41c are bare chips.

Of course, it is also possible to provide each of the first chips 41 embedded in the barrier section 3 as a bare chip 41, that is, the first chips 41a, 41b, 41c are bare chips in fig. 6.

By arranging at least a part of the first chips 41 embedded in the barrier 3 as bare chips, the barrier 3 can protect the bare chips, and the bare chips are omitted from packaging, thereby being beneficial to reducing cost.

In some embodiments, as shown in fig. 3 and 6, at least one first chip 41 of the plurality of first chips 41 included in the first device 4 is an analog front end processing chip, that is, the analog front end processing chip is disposed on the first surface 11 and is embedded in the barrier portion 3. Compared with the setting of the analog front end processing chip on the second surface 12, the setting of the analog front end processing chip on the first surface 11 and the embedding of the analog front end processing chip into the inside of the barrier 3 can make the analog front end processing chip and the light emitting element 21 and the photoelectric sensor 22 all set on the same surface of the circuit board 1, thus, the path length of the electric connection of the analog front end processing chip and the light emitting element 21 and the photoelectric sensor 22 can be shortened, thereby the connection between the analog front end processing chip and the light emitting element 21 and the photoelectric sensor 22 is more convenient, and the length of the circuit is saved.

As shown in fig. 6, the first device 4 includes 3 first chips 41, which are a first chip 41a, a first chip 41b, and a first chip 41c, respectively, wherein the first chip 41a is an analog front end processing chip. Of course, two of the first chips 41a, 41b, 41c may be analog front end processing chips, for example, the first chips 41a, 41b are all analog front end processing chips, and the number of analog front end processing chips may be specifically set according to an actual scheme.

In some embodiments, as shown in fig. 6, the first chip 41 is disposed at an edge region of the first surface 11. In this way, the occupation of the first chip 41 on the central area of the first surface 11 can be reduced, and the probability of the first chip 41 interfering with the light emitting element 21 or the photoelectric sensor 22 in the central area of the first surface 11 is reduced, so that the optimized layout of the light emitting element 21 and the photoelectric sensor 22 is facilitated.

The light emitting elements 21 and the photosensors 22 may be arranged in a manner that, as shown in fig. 6, the number of the photosensors 22 and the number of the light emitting elements 21 are plural, and the plurality of light emitting elements 21 and the plurality of photosensors 22 are alternately arranged along the circumferential direction of the circuit board 1 to form a first array, and one photosensor 22 is disposed inside the first array.

As illustrated in fig. 6, the photosensors 22 are photodiodes, the number of the photosensors 22 is four, PD1, PD2, PD3, and PD4 are respectively, the light emitting element 21 is an LED, the number of the light emitting element 21 is three, LED1, LED2, and LED3 are respectively provided at the center of the first surface 11, PD2, PD3, PD4, and LED1, LED2, and LED3 are alternately arranged around PD1 to form a first array, specifically, adjacent two of PD2, PD3, and PD4 are spaced apart by 120 ° in the circumferential direction of the wiring board 1, adjacent two of LED1, LED2, and LED3 are also spaced apart by 120 ° in the circumferential direction of the wiring board 1, and LED1 is provided between PD2, PD3, LED2 is provided between PD3, PD4, and LED3 is provided between PD2, PD 4.

In some embodiments, as shown in fig. 3 and 6, the first device 4 includes a first passive device 42, the first passive device 42 including at least one of an inductance, a resistance, and a capacitance. Since the number of first passive devices 42 is relatively large in the circuit of the PPG module 100, by embedding a large number of first passive devices 42 in the barrier 3, the number of other passive devices arranged on the second surface 12 of the wiring board 1 can be reduced, so that the second surface 12 of the wiring board 1 can make more space for arranging more devices.

In some embodiments, as shown in fig. 6, the first passive devices 42 are disposed at an edge region of the first surface 11. In this way, the occupation of the first passive device 42 on the central area of the first surface 11 can be reduced, and the probability of the first passive device 42 interfering with the light emitting element 21 or the photosensor 22 in the central area of the first surface 11 is reduced, so that the optimized layout of the light emitting element 21 and the photosensor 22 is facilitated.

In some embodiments, as shown in fig. 3 and 6, the first device 4 includes a magnetic member 43, such as a magnet, that can create a magnetic attraction force. The magnetic piece 43 can be attracted with a charging base of the smart watch to charge and position the smart watch. Since the magnetic member 43 is disposed on the first surface 11 and is embedded in the blocking portion 3, the magnetic member 43 is closer to the rear cover 220, and the magnetic member 43 is closer to the charging base, so that the magnetic force attraction effect between the magnetic member 43 and the smart watch is ensured.

In some embodiments, as shown in fig. 6, the magnetic member 43 is disposed in a central region of the first surface 11. By the design, the magnetic force applied to the intelligent watch during charging acts on the central area of the intelligent watch, so that the intelligent watch is easier to keep balanced and is not easy to deviate.

In some embodiments, as shown in fig. 6, a plurality of magnetic elements 43 (4 are shown) are disposed in the first array, and the plurality of magnetic elements 43 are arranged around the photosensor 22 (i.e., PD1 in the figure) located inside the first array. By adopting the design, the magnetic piece 43 can more fully utilize the gap between the photoelectric sensor 22 positioned at the inner side of the first array and the first array, is not easy to interfere with the photoelectric sensor 22 and the light-emitting element 21 in position, and can further lead the magnetic force born by the intelligent watch to be more uniform during wireless charging, thereby leading the intelligent watch to be easier to keep balance.

It should be noted that: the first device 4 may include the first chip 41, the first passive device 42 and the magnetic element 43 (as shown in fig. 6), so that embedding the first device 4 inside the barrier 3 allows the circuit board 1 to make more area for layout of the device, and the effective layout area of the circuit board 1 is > 200mm ² . Of course, the first device 4 may include only one of the first chip 41, the first passive device 42, and the magnetic member 43, and may include any two of the first chip 41, the first passive device 42, and the magnetic member 43, which is not particularly limited herein.

In some embodiments, as shown in fig. 3, the height of the first device 4 is less than the height of the barrier 3. By such design, the first device 4 can be completely embedded into the barrier portion 3, so that the thickness of the PPG module 100 is prevented from being increased due to the fact that the first device 4 extends out of the upper surface (the surface close to the rear cover 220) of the barrier portion 3.

In some embodiments, as shown in fig. 3, the material of the barrier portion 3 is an epoxy molding compound. Since the thermal conductivity (about 0.97W/mK) of the epoxy molding compound is greater than that of air (0.023-0.26W/mK), the heat dissipation effect of embedding the first device 4 into the barrier portion 3 is better than that of air, and therefore the temperature of the first device 4 can be effectively controlled not to be too high.

Fig. 7 and 8 show a schematic connection diagram of the PPG module 100 and the rear cover 220 according to the second embodiment of the present application, fig. 7 is a C-C cross-sectional view of fig. 8 when the barrier 3 and the rear cover 220 are provided, and fig. 8 is a top view of fig. 7 after the rear cover 220 and the barrier 3 are removed. The main difference between the structure of the PPG module 100 in the second embodiment and the structure of the PPG module 100 in the first embodiment is that: the second surface 12 of the circuit board 1 is provided with devices, such as a second chip 71, in addition to the raised plate 6, and the second chip 71 may be one of a wireless charging chip, a capacitive sensor, an accelerometer, an analog front end processing chip, an operational amplifier, an ADC converter, and an analog switch. When the second chip 71 is a wireless charging chip, the second chip 71 is encapsulated by the encapsulation layer 72, and the material of the encapsulation layer 72 can be epoxy plastic package material, so as to ensure heat dissipation of the wireless charging chip 71 and no interference by surrounding devices.

As for the arrangement of the barrier 3, the first device 4, the light emitting element 21, and the photosensor 22 in the second embodiment, reference may be made specifically to the arrangement in the first embodiment, and the description thereof will be omitted.

Fig. 9A and 9B show a schematic connection diagram of the PPG module 100 and the rear cover 220 according to the third embodiment of the present application, fig. 9A is a D-D cross-sectional view of fig. 9B when the barrier 3 and the rear cover 220 are provided, and fig. 9B is a top view of fig. 9A after the rear cover 220 and the barrier 3 are removed. The main difference between the PPG module 100 of the third embodiment and the PPG module 100 of the first embodiment is that: the PPG module 100 in the third embodiment further includes a second device 5, the height of the second device 5 is smaller than the thickness of the circuit board 1, and the second device 5 is embedded inside the circuit board 1.

By making the height of the second device 5 smaller than the thickness of the circuit board 1, the second device 5 can be completely embedded into the circuit board 1, which not only can avoid the increase of the thickness of the PPG module 100 caused by the fact that the second device 5 extends out of the surface (such as the second surface 12) of the circuit board 1, but also can fully utilize the space inside the circuit board 1, thereby reducing the occupation of the surface space of the circuit board 1 by the second device 5, so that the surface of the circuit board 1 can vacate more area (such as the second surface 12 of the circuit board 1 can be vacated completely) to arrange more devices.

In addition, if the first surface 11 of the circuit board 1 and the interior of the circuit board 1 are sufficient to arrange the devices of the PPG module 100, as shown in fig. 9A, the second surface 12 of the circuit board 1 may also be arranged without arranging the devices, so that the devices arranged on the second surface 12 of the circuit board 1 may be prevented from increasing the thickness of the PPG module 100, thereby being beneficial to reducing the thickness of the PPG module 100.

In some embodiments, as shown in fig. 9A, the second device 5 is an analog front-end processing chip, that is, the analog front-end processing chip is embedded inside the wiring board 1. Compared with the analog front end processing chip arranged on the second surface 12, the analog front end processing chip is embedded into the circuit board 1, so that the distance from the analog front end processing chip to the first surface 11 is closer, the path length of the electrical connection between the analog front end processing chip and the light emitting element 21 and the electrical connection between the analog front end processing chip and the photoelectric sensor 22 are shortened, the electrical connection between the analog front end processing chip and the light emitting element 21 and the electrical connection between the analog front end processing chip and the photoelectric sensor 22 are facilitated, and the length of a circuit are saved.

One analog front end processing chip may be embedded in the circuit board 1, or a plurality of analog front end processing chips (two analog front end processing chips shown in fig. 9A) may be embedded in the circuit board 1, depending on the actual situation.

In some embodiments, as shown in fig. 9A, the second device 5 is disposed on the same wiring board 1 as the first device 4. Compared with the structure that the second device 5 and the first device 4 are respectively arranged on the two circuit boards 1 which are arranged in a laminated mode, the second device 5 and the first device 4 are arranged on the same circuit board 1, so that the structure of the circuit board 1 is more compact, a welding spot structure between the two circuit boards 1 which are arranged in a laminated mode is omitted, and the thickness of the PPG module 100 is reduced.

As for the arrangement of the barrier 3, the first device 4, the light emitting element 21, and the photosensor 22 in the third embodiment, reference may be made specifically to the arrangement in the first embodiment, and the description thereof will be omitted.

In order to better illustrate the thinner thickness of the PPG module 100 in the embodiment of the present application, the thicknesses of the PPG module 100 in the second embodiment and the third embodiment of the present application and the PPG module in the related art are compared as follows:

as shown in fig. 1, the dimension h1=0.58 mm between the top end of the barrier portion 3 and the bottom surface of the first sub-board 101, the thickness h2=0.6 mm of the second sub-board, and the height h3=0.4 mm of the protective cover 232, and since the welding point between the first sub-board 101 and the second sub-board 102 also has a certain height, the thickness of the whole PPG module is greater than 1.58mm.

As shown in fig. 7, the height h1=0.4 mm of the barrier 3, the thickness h2=0.4 mm of the wiring board 1, and the height h3=0.6 mm of the overhead board 6. The thickness of the PPG module 100 in the second embodiment of the present application is 1.4mm, which is at least 0.18mm thinner than that of the PPG module in the related art.

As shown in fig. 9A, the height h1=0.4 mm of the barrier portion 3, the thickness h2=0.4 mm of the circuit board 1, the height of the solder joint disposed on the second surface 12 of the circuit board 1 is 0.2mm when the second surface 12 is connected to the flexible circuit board, and the thickness of the PPG module 100 in the third embodiment of the present application is 1mm, which is at least 0.58mm thinner than the thickness of the PPG module in the related art.

As shown in fig. 10 and 11A to 11G, fig. 10 is a flowchart illustrating the manufacturing process of the PPG module 100 in some embodiments of the present application, and fig. 11A to 11G are schematic diagrams illustrating the manufacturing process of the PPG module 100 in some embodiments of the present application. The manufacturing method of the PPG module 100 comprises the following steps:

s1, as shown in fig. 11A and 11B, the first device 4 is provided on the first surface 11 of the wiring board 1 (the upper surface of the wiring board 1 shown in the drawings).

As shown in fig. 11A, the first surface 11 of the circuit board 1 is provided with pads at corresponding positions, and as shown in fig. 11B, the first device 4 may be electrically connected to the pads on the first surface 11 through a Surface Mount Technology (SMT).

S2, as shown in fig. 11C and 11D, a barrier portion 3 for shielding light is provided on the first surface 11 such that the first device 4 is embedded inside the barrier portion 3, and at least a part of the barrier portion 3 is located between the first region 111 and the second region 112 of the first surface 11.

The first area 111 and the second area 112 are reserved arrangement areas for the light emitting element 21 and the photoelectric sensor 22 on the circuit board 1.

S3, as shown in fig. 11E, the light emitting element 21 is provided in the first region 111, and the photosensor 22 is provided in the second region 112.

As shown in fig. 11E, the light emitting element 21 may be adhered to the first region 111, and then electrically connected to the pad on the first surface 11 by wire bonding; likewise, the photosensor 22 may be bonded to the second region 112 and then electrically connected to the pads on the first surface 11 by wire bonding.

In addition to electrically connecting the light emitting element 21 and the photoelectric sensor 22 to the wiring board 1 in the above-described manner, the light emitting element 21 and the photoelectric sensor 22 may be electrically connected to pads on the first surface 11 by a surface mounting process.

In some embodiments, after S3, further comprising: s4, as shown in fig. 11F, devices such as the raised plate 6 and the second chip 71 are provided on the second surface 12 of the circuit board 1, so as to make full use of the space on the circuit board 1.

In some embodiments, after S4, further comprising: s5, as shown in fig. 11G, the barrier 3 is bonded to the rear cover 220. Thus, the PPG module 100 and the back cover 220 form a back cover 220 assembly, so as to be combined with the front case 210 assembly to form the smart watch.

According to the manufacturing method of the PPG module 100, the baffle part 3 is arranged on the first surface 11, so that the first device 4 is embedded into the baffle part 3, and therefore, the first device 4 can fully utilize the area covered by the baffle part 3 on the first surface 11 of the circuit board 1, the area utilization rate of the first surface 11 of the circuit board 1 is improved, more devices can be arranged on the second surface 12 of the circuit board 1 by freeing more space, the number of devices which can be arranged in the PPG module 100 is increased, devices in the PPG module 100 can be arranged on the same circuit board 1, and as the structure of one circuit board 1 is compact, welding spots for welding a plurality of sub-boards together are omitted, the thickness of the whole PPG module 100 can be reduced, and the light and thin PPG module 100 is facilitated.

The manner in which the first device 4 is embedded in the inside of the barrier 3 in S2 is not unique, and in some embodiments, the barrier 3 may be molded by a mold so that the first device 4 is embedded in the inside of the barrier 3. The method comprises the following steps: a blocking portion 3 for blocking light is provided on the first surface 11 so that the first device 4 is embedded inside the blocking portion 3, including:

S21, as shown in fig. 11C, the wiring board 1 is placed in the cavity of the lower mold 510.

S22, as shown in fig. 11C, the upper mold 520 and the lower mold 510 are closed, and a housing chamber 521 for housing the first device 4 is formed between the upper mold 520 and the wiring board 1.

As shown in fig. 11C, the upper mold 520 is provided with an injection channel 522 and an exhaust channel 523, and the injection channel 522 is used for injecting material into the accommodating cavity 521. The exhaust passage 523 serves to exhaust the gas in the accommodating chamber 521. The number of the accommodating chambers 521 corresponds to the number of the first devices 4, and the plurality of accommodating chambers 521 are communicated with each other, so that it can be ensured that the plurality of accommodating chambers 521 can be filled with the subsequent light shielding material.

S23, a light shielding material is injected into the accommodating cavity 521 to cover the first device 4, and the mold is released after the light shielding material is cooled to form the barrier portion 3 (as shown in fig. 11D).

The baffle part 3 is molded by a mold so that the first device 4 is embedded into the baffle part 3, and thus, the baffle part 3 can be manufactured into various shapes by adjusting the cavity shape of the upper mold 520 so as to meet the requirements of embedding the first device 4 with different shapes. Meanwhile, after the separation part 3 is formed, the separation part 3 does not need to be greatly processed, so that the damage to the circuit board 1 caused by subsequent processing is reduced.

In some embodiments, after the circuit board 1 is placed in the cavity of the lower mold 510, before the upper mold 520 is closed with the lower mold 510, as shown in fig. 11C, further comprising: the first region 111 and the second region 112 are covered with a protective layer 530 for contact with the upper mold 520, respectively. In this way, the upper die 520 can be prevented from directly contacting the first region 111 and the second region 112 of the circuit board 1 to damage the circuit board 1, thereby ensuring that the subsequent light emitting element 21 and the photoelectric sensor 22 can be smoothly mounted in the first region 111 and the second region 112.

As shown in fig. 11C, the protective layer 530 may be a protective pad with elasticity, such as a rubber pad, a silicone pad, etc., and in addition, the protective layer 530 may be a protective adhesive layer.

The barrier 3 may be molded by the following means in addition to the mold: a light shielding layer is provided on the first surface 11 of the wiring board 1 to cover the first device 4. The shielding layer is provided with avoiding openings at positions corresponding to the first region 111 and the second region 112 to form the barrier portion 3. The avoiding opening may be formed by laser cutting, or may be formed by a photolithography process, which is not particularly limited herein.

As shown in fig. 12A to 12K, fig. 12A to 12K are schematic views illustrating a manufacturing process of the PPG module 100 according to other embodiments of the present application. The main difference between the manufacturing method of the PPG module 100 shown in fig. 12A to 12K and the manufacturing method of the PPG module 100 shown in fig. 11A to 11G is that:

before the first device 4 is disposed on the first surface 11 of the circuit board 1, the method further includes: s0, as shown in fig. 12A to 12G, the second device 5 is embedded in the circuit board 1.

Wherein embedding the second device 5 inside the circuit board 1 may be achieved by, in some embodiments, embedding the second device 5 inside the circuit board 1, comprising:

S01, as shown in fig. 12A to 12E, the second device 5 is embedded in the first dielectric layer 13, and the conductive portion 51 of the second device 5 is exposed from the surface of the first dielectric layer 13 (the upper surface of the first dielectric layer 13 shown in fig. 12E).

The first dielectric layer 13 may be provided with a circuit or may not be provided with a circuit, which is not particularly limited herein.

When a line is provided on the first dielectric layer 13, the second device 5 may be embedded in a portion of the first dielectric layer 13 where no line is provided. The process of fabricating the circuit on the first dielectric layer 13 is as follows.

As shown in fig. 12A, a first dielectric layer 13 covered with a conductive layer 14 is provided; the conductive layer 14 may cover opposite surfaces of the first dielectric layer 13 (i.e., an upper surface and a lower surface of the first dielectric layer 13 in the drawing), or may cover one surface of the first dielectric layer 13, which is not specifically limited herein; the conductive layer 14 may be a copper layer or other conductive metal layer, and is not particularly limited herein.

As shown in fig. 12B, the conductive layer 14 covered on the first dielectric layer 13 is made into a circuit; the circuit may be formed by a photolithography process or by laser engraving, and is not particularly limited herein. As shown in fig. 12B, when the opposite surfaces of the first dielectric layer 13 have the wiring, a via hole may be provided on the first dielectric layer 13 to electrically connect the wiring on the opposite surfaces of the first dielectric layer 13.

S02, as shown in fig. 12F and 12G, the second dielectric layer 15 is stacked on the first dielectric layer 13, the second device 5 is covered with the second dielectric layer 15, and a wiring electrically connected to the conductive portion 51 is formed on the second wiring board 1.

The circuit board 1 includes a first dielectric layer 13 and a second dielectric layer 15, where the second dielectric layer 15 and the first dielectric layer 13 may be separately disposed, as shown in fig. 12F and 12G, or may be integrally formed, for example, the second dielectric layer 15 may be integrally formed with the first dielectric layer 13 through thermal compression.

The number of the second dielectric layers 15 may be one, as shown in fig. 12G, or may be multiple, and is not particularly limited herein. When the second dielectric layer 15 is a plurality of layers (for example, two layers), the plurality of second dielectric layers 15 may be integrally formed by thermal compression.

In this embodiment, the second device 5 is embedded in the circuit board 1 by sequentially disposing a plurality of stacked dielectric layers, and such embedding has relatively less influence on the circuit inside the circuit board 1 than the manner of directly grooving and embedding on the circuit board 1, for example, the embedding of the second device 5 in the first dielectric layer 13 has no influence on the circuit arrangement on the second dielectric layer 15.

In some embodiments, as shown in fig. 12F and 12G, after the second dielectric layer 15 is stacked on the first dielectric layer 13, the method further includes: at least one third dielectric layer 16 (two third dielectric layers 16 are shown in fig. 12G) is further laminated on the side of the first dielectric layer 13 facing away from the second dielectric layer 15, so as to meet the requirement of circuit arrangement. The circuit board 1 further includes a third dielectric layer 16, where the third dielectric layer 16 may be integrally formed with the first dielectric layer 13 through thermal compression.

In some embodiments, embedding the second device 5 on the first dielectric layer 13 such that the conductive portion 51 of the second device 5 is exposed from the surface of the first dielectric layer 13 includes:

as shown in fig. 12C, the accommodating groove 131 penetrating the first dielectric layer 13 is opened in the first dielectric layer 13.

The accommodating groove 131 may be formed by laser cutting or cutting by a cutter, and is not particularly limited herein. The specific number of the accommodating grooves 131 may be equal to the number of the second devices 5, for example, if the number of the second devices 5 is two, two accommodating grooves 131 need to be opened on the first dielectric layer 13.

S012, as shown in fig. 12D, the carrier film 600 to which the second device 5 is bonded is laminated on the first dielectric layer 13, and the second device 5 is positioned in the accommodating groove 131.

The side of the second device 5, on which the conductive portion 51 is provided, is adhered to the carrier film 600, and the carrier film 600 may be adhered to the first dielectric layer 13, so that the carrier film 600 and the first dielectric layer 13 are connected together, and are not easy to relatively move.

S013, as shown in fig. 12E, the insulating material is filled in the accommodation groove 131 from the side notch of the accommodation groove 131 facing away from the carrier film 600.

The insulating material may be the same as the material of the first dielectric layer 13, for example, when the material of the first dielectric layer 13 is a resin, the insulating material is also a resin. When filling the accommodating groove 131, the resin may flow into the accommodating groove 131 by hot pressing, and then thermally harden the resin by hot pressing at high temperature, thereby filling the accommodating groove 131.

Of course, the insulating material is not limited to resin, and may be other insulating materials that can be melted by heating, and is not particularly limited herein.

As shown in fig. 12E, the carrier film 600 is separated from the second device 5, and the conductive portion 51 of the second device 5 is exposed from the surface of the first dielectric layer 13.

In this embodiment, the accommodating groove 131 is filled in the accommodating groove 131 by the insulating material, so that a gap between the accommodating groove 131 and the second device 5 can be eliminated, and thus the second device 5 can be prevented from rattling in the accommodating groove 131. By laminating the carrier film 600 to which the second device 5 is bonded on the first dielectric layer 13, and bonding the side of the second device 5 provided with the conductive portion 51 to the carrier film 600, after the insulating material is filled into the accommodating groove 131, the conductive portion 51 of the second device 5 may be located at the notch of the accommodating groove 131, so that the conductive portion 51 is exposed from the surface of the first dielectric layer 13, so that the electrical connection between the electrical circuit on the subsequent second dielectric layer 15 and the conductive portion 51 is facilitated.

Of course, the accommodating groove 131 does not need to penetrate through the first dielectric layer 13, or the second device 5 is not required to be adhered to the carrier film 600, and the second device 5 is directly placed in the accommodating groove 131, so that the second device 5 is embedded in the first dielectric layer 13.

The manufacturing process of the PPG module 100 shown in fig. 12H to 12K can be specifically described with reference to fig. 11B to 11G, and will not be described herein.

Features of the PPG module in the embodiment of the method for manufacturing the PPG module that are the same as or similar to those of the PPG module in the embodiment of the product can be specifically referred to the description of the PPG module in the embodiment of the product, and are not repeated herein. In the description of the present specification, a particular feature, structure, material, or characteristic may be combined in any suitable manner in one or more embodiments or examples.

The different line types of section lines in the drawings of the present application are mainly used for distinguishing different parts, and should not be construed as limiting the materials of the parts.

Finally, it should be noted that: the above embodiments are only for illustrating the technical solution of the present application, and are not limiting thereof; although the present application has been described in detail with reference to the foregoing embodiments, it should be understood by those of ordinary skill in the art that: the technical scheme described in the foregoing embodiments can be modified or some technical features thereof can be replaced by equivalents; such modifications and substitutions do not depart from the spirit and scope of the corresponding technical solutions.

Claims

1. The utility model provides a PPG module which characterized in that includes: the circuit board, and set up in light emitting component, photoelectric sensor, first device and the separation stop portion on the first surface of circuit board, separate the stop portion and be used for sheltering from light, and at least some are located light emitting component with between the photoelectric sensor, first device embedding separate the inside of stop portion.

2. The PPG module of claim 1, wherein,

the first device comprises at least one of a first chip, a first passive device, and a magnetic member that can generate magnetic attraction force; wherein the first passive device comprises at least one of an inductance, a resistance, and a capacitance.

3. The PPG module of claim 2, wherein,

the first device comprises a plurality of first chips, and at least a part of the first chips are bare chips.

4. A PPG module according to claim 2 or 3, wherein,

the first chip and the first passive device are arranged in the edge area of the first surface.

5. The PPG module according to any one of claims 2 to 4, wherein,

the magnetic piece is arranged in the central area of the first surface.

6. The PPG module of claim 5, wherein,

the number of the photoelectric sensors and the number of the light-emitting elements are multiple, and the multiple light-emitting elements and the multiple photoelectric sensors are alternately arranged along the circumferential direction of the circuit board so as to form a first array;

the inner side of the first array is provided with one photoelectric sensor and a plurality of magnetic pieces, and the plurality of magnetic pieces are distributed around the photoelectric sensors positioned on the inner side of the first array.

7. The PPG module according to any one of claims 3 to 6, wherein,

at least one first chip is an analog front end processing chip, and the analog front end processing chip is electrically connected with the light emitting element and the photoelectric sensor and is used for driving the light emitting element to emit light and converting a photocurrent signal emitted by the photoelectric sensor into a voltage signal.

8. The PPG module according to any one of claims 1 to 7, wherein,

the height of the first device is smaller than the height of the barrier.

9. The PPG module according to any one of claims 1 to 8, wherein,

the PPG module further comprises a second device, the height of the second device is smaller than the thickness of the circuit board, and the second device is embedded into the circuit board.

10. The PPG module of claim 9, wherein,

the second device is an analog front end processing chip, and the analog front end processing chip is electrically connected with the light emitting element and the photoelectric sensor, and is used for driving the light emitting element to emit light and converting a photocurrent signal emitted by the photoelectric sensor into a voltage signal.

11. The PPG module according to claim 9 or 10, wherein,

the second device and the first device are arranged on the same circuit board.

12. The PPG module according to any one of claims 1 to 11, wherein,

the material of the baffle part is epoxy plastic packaging material.

13. An electronic device comprising a housing, and the PPG module of any one of claims 1-12 disposed in the housing.

14. The manufacturing method of the PPG module is characterized by comprising the following steps:

disposing a first device on a first surface of a wiring board;

providing a barrier on the first surface for shielding light such that the first device is embedded within the barrier and at least a portion of the barrier is located between a first region and a second region of the first surface;

The light emitting element is disposed in the first region, and the photosensor is disposed in the second region.

15. The method of claim 14, wherein,

providing a barrier for blocking light on the first surface such that the first device is embedded inside the barrier, comprising:

placing the circuit board in a die cavity of a lower die;

closing the upper die and the lower die to form a containing cavity for containing the first device between the upper die and the circuit board;

and injecting a shading material into the accommodating cavity to cover the first device, and demolding after the shading material is cooled to form the barrier part.

16. The method of claim 15, wherein,

after the circuit board is placed in the die cavity of the lower die, before the upper die and the lower die are matched, the method further comprises:

and respectively covering protective layers for contacting with the upper die on the first area and the second area.

17. The method for manufacturing a PPG module according to any one of claims 14 to 16, wherein,

before the first device is disposed on the first surface of the circuit board, the method further includes: embedding a second device in the circuit board; the height of the second device is smaller than the thickness of the circuit board.

18. The method of claim 17, wherein,

embedding a second device inside the circuit board, comprising:

embedding the second device on the first dielectric layer to expose the conductive part of the second device from the surface of the first dielectric layer;

a second dielectric layer is arranged on the first dielectric layer in a lamination mode, the second dielectric layer covers the second device, and a circuit electrically connected with the conductive part is manufactured on the second dielectric layer; the circuit board comprises the first dielectric layer and the second dielectric layer.

19. The method of claim 18, wherein,

embedding the second device on the first dielectric layer to expose the conductive portion of the second device from the surface of the first dielectric layer, comprising:

a containing groove penetrating through the first dielectric layer is formed in the first dielectric layer;

laminating a bearing film bonded with the second device on the first dielectric layer, so that the second device is positioned in the accommodating groove; wherein, one side of the second device provided with the conductive part is adhered to the bearing film;

Filling an insulating material into the accommodating groove from a notch on one side of the accommodating groove facing away from the bearing film;

and separating the bearing film from the second device, so that the conductive part of the second device is exposed from the surface of the first dielectric layer.